Welding carrier

Abstract

The utility model provides a welding carrier which comprises a carrier body used for installing a circuit board. The supporting frame is arranged on the first surface of the carrier body; a containing cavity is formed between the supporting frame and the carrier body. One end of the supporting assembly is adjustably arranged on the supporting frame, and the other end of the supporting assembly is located in the containing cavity; under the action of external force, the position of the supporting assembly in the containing cavity can be adjusted in the height direction of the carrier body. The pressing piece is arranged on the second surface of the carrier body, and the pressing piece is used for pressing the circuit board and is matched with the supporting assembly to fix the circuit board; wherein the first surface and the second surface are two opposite surfaces of the carrier body. According to the welding carrier, through cooperation of the supporting assembly and the pressing piece, the circuit board is fixed to the carrier body, relative displacement between the circuit board and the carrier body is avoided, the installation stability of the circuit board is effectively guaranteed, follow-up welding operation is facilitated, the height of the supporting assembly is adjustable, the service life of electrical elements is effectively guaranteed, and the practicability is high. And meanwhile, the welding spot form cannot be influenced.

Description

Technical Field

[0001] This application relates to the field of circuit board mounting technology, and more particularly to a welding carrier. Background Technology

[0002] Printed circuit boards (PCBs) are core components of modern electronic devices, used for mechanical support and electrical connection elements, and are widely used in a variety of technical fields.

[0003] With the development of circuit boards, the layout density of circuit boards is getting higher and higher, and the demand for laying out heavy components is becoming stronger. When soldering circuit boards, the inversion of heavy components can easily cause damage to the circuit boards. Existing circuit board carriers may damage the circuit boards when supporting heavy components, and cannot guarantee the shape of the solder joints of heavy components.

[0004] Therefore, there is an urgent need for a carrier that can support heavy components on circuit boards without damaging the heavy components or affecting the shape of the solder joints. Utility Model Content

[0005] This application provides a welding carrier to solve the technical problems of traditional carriers easily damaging components and affecting the shape of solder joints when mounting circuit boards.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solution: This application provides a welding carrier for fixing a circuit board for welding operations, comprising: a carrier body for mounting the circuit board; a support frame disposed on a first surface of the carrier body; a receiving cavity formed between the support frame and the carrier body; a support assembly, one end of which is adjustablely disposed on the support frame, and the other end located within the receiving cavity; wherein, under the action of external force, the support assembly can adjust its position within the receiving cavity along the height direction of the carrier body; and a clamping member disposed on a second surface of the carrier body, the clamping member being used to clamp the circuit board and cooperating with the support assembly to fix the circuit board; wherein, the first surface and the second surface are two opposing surfaces of the carrier body.

[0007] Based on this solution, the circuit board is fixed to the carrier body by the cooperation of the support component and the clamping component, which avoids relative displacement between the circuit board and the carrier body, effectively ensuring the installation stability of the circuit board and facilitating subsequent soldering operations. In addition, the height of the support component is adjustable, which effectively ensures the service life of electrical components and does not affect the shape of the solder joints.

[0008] In one possible implementation, the support component makes elastic contact with the circuit board.

[0009] Based on this solution, on the one hand, it avoids damage to the surface of electrical components when the support components come into contact with them, thus not affecting the solder joint shape and effectively ensuring the service life of the circuit board. On the other hand, it can play a buffering and protective role and improve the controllability of the support components in the height direction.

[0010] In one possible implementation, the vehicle body includes a frame structure and a mounting section; the mounting section is located in the central region of the frame structure and is used to mount a circuit board; a clamping member is disposed in the frame structure and has a clamping part; under the action of external force, the bottom surface of the clamping part can be attached to the circuit board.

[0011] Based on this solution, the circuit board can be effectively balanced under force on the carrier body, which is beneficial to improving the stability of the circuit board.

[0012] In one possible implementation, the mounting section includes a mounting base plate; the mounting base plate has a plurality of first cutouts, which can be used to avoid electrical components in the circuit board; wherein, a support frame is disposed on the mounting base plate.

[0013] Based on this solution, after the circuit board is placed on the mounting plate, a portion of the first cutout can be used to avoid electrical components, while another portion of the first cutout can be used for heat flow of the circuit board, maintaining thermal balance on both sides of the circuit board.

[0014] In one possible implementation, the mounting part includes a mounting groove and a second cutout; the mounting groove is formed by the recess of the inner frame edge of the frame structure, and the circuit board is laid around the mounting groove; the second cutout is formed by the enclosure of the mounting groove, and the second cutout is used to avoid the wall surface of the circuit board; wherein, the groove depth of the mounting groove is greater than or equal to the thickness of the circuit board; the support frame is set in the frame structure.

[0015] Based on this solution, while meeting the support requirements for electrical components, the structure can be effectively simplified and manufacturing costs can be saved by setting a second hollow section.

[0016] In one possible implementation, the support frame includes a clearance portion, and a receiving cavity is formed between the clearance portion and the mounting portion.

[0017] Based on this solution, the clearance portion can be adjusted according to the structural form of the electrical components, thereby improving the compatibility between the support frame and the electrical components.

[0018] In one possible implementation, the support assembly includes a connector and an elastic element. The connector is adjustablely disposed on the support frame, and the elastic element is disposed at the end of the connector and located within the receiving cavity. The connector can move along the height direction of the carrier body under the action of an external force to adjust the position of the elastic element in the receiving cavity.

[0019] Based on this solution, the structure of the support components is effectively simplified by setting up connectors and elastic components.

[0020] In one possible implementation, the connector is a bolt; the head of the bolt is located outside the receiving cavity, and the tail of the bolt passes through the support frame and is provided with an elastic element.

[0021] Based on this solution, bolt production costs are low and the production process is simple. By setting bolts to cooperate with elastic components, the cost of support components can be effectively reduced.

[0022] In one possible implementation, the support assembly includes a spring and a protective layer, the spring being threaded to the support frame, the protective layer being disposed at the end of the spring and located within a receiving cavity, and the spring extending along the height direction of the carrier body.

[0023] Based on this solution, the configuration of the support components is quite flexible and can be adapted to the specific type of the actual circuit board or the specific type of the vehicle body.

[0024] In one possible implementation, the support frame corresponds one-to-one with the support components; or the support frame corresponds to multiple support components.

[0025] Based on this solution, the support components can be flexibly set according to the number and size of electrical components, thereby improving the adaptability of the welding carrier.

[0026] In one possible implementation, the frame structure is provided with mounting holes; the clamping member also includes a guide portion located on one side of the clamping member; under the action of external force, the guide portion can move within the mounting holes to make the clamping member fit against the circuit board.

[0027] Based on this solution, the connection between the clamping component and the carrier body is effectively simplified by using the connection hole and guide part to cooperate.

[0028] In one possible implementation, the clamping element further includes a pressure cap, with the guide portion and the pressure cap located on opposite sides of the clamping portion, and the pressure cap used to insert or pull the guide portion into or out of the mounting hole.

[0029] Based on this solution, by setting a pressure cap, it is convenient to align the guide part with the mounting hole, and the clamping operation is simplified.

[0030] In one possible implementation, the guide is threaded to the mounting hole; or the guide is interference-fitted to the mounting hole.

[0031] Based on this solution, the connection relationship between the guide and the mounting hole can be flexibly set.

[0032] In one possible implementation, the number of clamping elements is at least two, and the at least two clamping elements are located on opposite sides of the circuit board.

[0033] Based on this solution, it can be ensured that the clamping force is applied evenly to the circuit board. Attached Figure Description

[0034] Figure 1A One of the schematic diagrams illustrating the installation of a welding carrier and a circuit board provided in this application embodiment;

[0035] Figure 1B This is one of the structural schematic diagrams of a welding carrier provided in the embodiments of this application;

[0036] Figure 2A A second schematic diagram illustrating the installation of a welding carrier and a circuit board, provided as an embodiment of this application;

[0037] Figure 2B This is a second schematic diagram of a welding carrier provided in an embodiment of this application;

[0038] Figure 3 A top view of another welding carrier provided in the embodiments of this application;

[0039] Figure 4 This is a schematic diagram of another welding carrier provided in an embodiment of this application;

[0040] Figure 5 This is a schematic diagram of a support frame provided in an embodiment of this application;

[0041] Figure 6A A perspective view of a support component provided in an embodiment of this application;

[0042] Figure 6B An installation cross-sectional view of a support component provided in an embodiment of this application;

[0043] Figure 7 This is a simplified structural diagram of another support component provided in an embodiment of this application;

[0044] Figure 8A This is a schematic diagram showing the positional relationship between the first type of support frame, support assembly, and electrical components provided in the embodiments of this application;

[0045] Figure 8B This is a schematic diagram showing the positional relationship between the second type of support frame, support assembly, and electrical components provided in the embodiments of this application;

[0046] Figure 8C This is a schematic diagram showing the positional relationship between the third type of support frame, support assembly, and electrical components provided in the embodiments of this application;

[0047] Figure 8D This is a schematic diagram showing the positional relationship between the fourth type of support frame, support assembly, and electrical components provided in the embodiments of this application;

[0048] Figure 9 A cross-sectional view of the installation of a clamping member provided in an embodiment of this application;

[0049] Figure 10 A perspective view of a clamping member provided for an embodiment of this application;

[0050] Figure 11 A cross-sectional view of the installation of another clamping member provided in an embodiment of this application;

[0051] Figure 12 This is a perspective view of another clamping component provided in an embodiment of this application.

[0052] Illustration markings:

[0053] 100 - Welding carrier;

[0054] 10-Vehicle body; 101-First surface; 102-Second surface; 103-Frame structure; 104-Mounting part; 104a-Mounting base plate; 104b-First hollow part; 104c-Mounting groove; 104d-Second hollow part; 105-Mounting hole; 106-Third hollow part;

[0055] 20-Support frame; 20a-Receiving cavity; 201-Apartment clearance; 202-Mounting end;

[0056] 30-Support assembly; 301-Connector; 301a-Adjusting part; 302-Elastic element; 303-Spring; 304-Protective layer;

[0057] 40 - Clamping part; 401 - Clamping section; 402 - Guide section; 402a - Protrusion; 403 - Clamping cap;

[0058] 50-Support;

[0059] 60 - Signage Department;

[0060] 200 - Circuit board; 210 - Electrical components. Detailed Implementation

[0061] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. To facilitate a clear description of the technical solutions of the embodiments of this application, the use of terms such as "first," "second," etc., in the embodiments of this application is for illustrative purposes and to distinguish the objects being described. There is no particular order between them, nor does it indicate a specific limitation on the number of devices in the embodiments of this application, and they do not constitute any limitation on the embodiments of this application.

[0062] The following is combined Figure 1A , Figure 1B , Figure 2A and Figure 2BThe welding carrier 100 provided in the embodiments of this application will be described.

[0063] Figure 1A One of the schematic diagrams illustrating the installation of a welding carrier and a circuit board provided in this application embodiment; Figure 1B This is one of the structural schematic diagrams of a welding carrier provided in the embodiments of this application; Figure 2A A second schematic diagram illustrating the installation of a welding carrier and a circuit board, provided as an embodiment of this application; Figure 2B This is a second schematic diagram of a welding carrier provided in an embodiment of this application.

[0064] Combination Figure 1A , Figure 1B , Figure 2A and Figure 2B As shown, this application provides a welding carrier 100, which includes a carrier body 10, a support frame 20, a support assembly 30, and a clamping member 40.

[0065] The carrier body 10 is used to mount the circuit board 200, thereby facilitating the soldering operation of the circuit board 200. The carrier body 10 may have a mounting area, in which the circuit board 200 is placed.

[0066] A support frame 20 is disposed on the first surface 101 of the carrier body 10, and a receiving cavity 20a is formed between the support frame 20 and the carrier body 10. It is worth noting that electrical components 210 for electrical connection or communication are typically mounted on the surface of the circuit board 200. These electrical components 210 typically protrude from the surface of the circuit board 200. The support frame 20 is used to avoid the electrical components 210, and the receiving cavity 20a is used to accommodate the electrical components 210. The support frame 20 can be in the form of a frame structure, or a mesh or cover structure.

[0067] For example, when the support frame 20 is a mesh structure, the receiving cavity 20a formed by the mesh structure and the carrier body 10 can be square. This square receiving cavity 20a is used to accommodate the electrical component 210, and the volume of the square receiving cavity 20a is larger than the size of the electrical component 210. Alternatively, when the support frame 20 is a cover structure, the cover structure can be a sphere or an ellipsoid, etc. When the cover structure is a sphere, the radius of the sphere should be greater than the height of the electrical component 210.

[0068] It is worth noting that the structure of the support frame 20 can be adapted to the shape of the electrical components 210 in the actual circuit board 200, and the setting method is relatively flexible. When setting the support frame 20, the support frame 20 needs to ensure that there is no interference between it and the electrical components 210, so as to avoid damage to the electrical components 210. Under the premise of ensuring the installation stability of the circuit board 200, the service life of the circuit board 200 can be effectively guaranteed.

[0069] The support assembly 30 is adjustable at one end in the support frame 20 and at the other end in the receiving cavity 20a. Under the action of external force, the position of the support assembly 30 in the receiving cavity 20a can be adjusted along the height direction of the carrier body 10.

[0070] Specifically, the support assembly 30 includes a first end and a second end disposed opposite to each other. The first end is located on the support frame 20 and outside the receiving cavity 20a, while the second end is located inside the receiving cavity 20a. Under the action of an external force, the first end can move relative to the support frame 20, thereby adjusting the position of the second end in the receiving cavity 20a. Thus, after the circuit board 200 is installed, the electrical components 210 on the circuit board 200 are located inside the receiving cavity 20a. By adjusting the position of the second end, it moves towards the circuit board 200 until it contacts the electrical components 210 on the circuit board 200, and the second end abuts against the surface of the electrical components 210, thereby supporting the surface of the electrical components 210. It should be emphasized that different sizes of electrical components 210 may be installed in different circuit boards 200 depending on the usage requirements, including small-volume electrical components 210 and large-volume electrical components 210. When the electrical component 210 is large, and during soldering of the circuit board 200, placing the electrical component 210 upside down on the carrier body 10 can easily cause its weight to affect the connection between it and the circuit board 200, thus affecting the quality of the circuit board 200. By providing a support component 30 on the support frame 20, and by adjusting the distance between the support component 30 and the electrical component 210 along the height direction of the carrier body 10, the electrical component 210 is effectively supported, preventing it from falling off and ensuring the stability of the circuit board 200. This also prevents damage to the electrical component 210. Since the position of the support component 30 is adjustable, it does not affect the soldering configuration.

[0071] It is worth noting that the manner in which the external force is applied corresponds to the connection method between the first end and the support frame 20. For example, when the first end is threadedly connected to the support frame 20, the external force is a rotational force, and the support assembly 30 adjusts its distance from the electrical component 210 by rotating. Alternatively, when the first end is slidably connected to the support frame 20, the external force is a pushing force, and the support assembly 30 adjusts its distance from the electrical component 210 by sliding. Or, when the first end and the support frame 20 are interference-fitted, the external force is a pushing force, and the support assembly 30 adjusts its distance from the electrical component 210 by pushing. Of course, the above connection methods are only examples, and the connection method between the support assembly 30 and the support frame 20 can also be other methods.

[0072] The clamping member 40 is disposed on the second surface 102 of the carrier body 10. The second surface 102 and the first surface 101 are the two opposite surfaces of the circuit board 200, that is, the clamping member 40 and the support assembly 30 are respectively disposed on the two opposite surfaces of the carrier body 10. The clamping member 40 is used to clamp the circuit board 200 and cooperates with the support assembly 30 to fix the circuit board 200 on the carrier body 10.

[0073] Specifically, the support component 30 supports the circuit board 200 by supporting the electrical component 210, and its force is directed from bottom to top. The clamping force of the clamping member 40 on the circuit board 200 is directed from top to bottom. Thus, the welding carrier 100 provided in this embodiment can balance the force on the circuit board 200, and through the cooperation of the support component 30 and the clamping member 40, fix the circuit board 200 to the carrier body 10, avoiding relative displacement between the circuit board 200 and the carrier body 10, effectively ensuring the installation stability of the circuit board 200, facilitating subsequent welding operations, and the height of the support component 30 is adjustable, effectively ensuring the service life of the electrical component 210, while not affecting the shape of the solder joint.

[0074] In some possible implementations, the support component 30 makes elastic contact with the circuit board 200. Specifically, after the circuit board 200 is installed, the support component 30 makes elastic contact with the electrical components 210 on the circuit board 200. This avoids damage to the surface of the electrical components 210 when the support component 30 contacts the surface of the electrical components 210, does not affect the solder joint morphology, and effectively ensures the service life of the circuit board 200. On the other hand, it can also play a buffering and protective role, and improve the controllability of the support component 30 in the height direction.

[0075] See also Figure 2B As shown, the vehicle body 10 may include a frame structure 103 and a mounting section 104.

[0076] The frame structure 103 can be a frame with four sides. The mounting part 104 is located in the central area of ​​the frame structure 103, and the mounting part 104 is used to mount the circuit board 200. That is, the circuit board 200 is mounted after the frame structure 103 and is located in the central area of ​​the frame structure 103. In this way, it can effectively ensure that the circuit board 200 is subjected to force balance on the carrier body 10, which is beneficial to improving the stability of the circuit board 200.

[0077] In this implementation, the clamping member 40 is disposed on the frame structure 103, and the clamping member 40 is provided with a clamping part 401. Under the action of external force, the bottom surface of the clamping part 401 can be attached to the circuit board 200. Specifically, after the clamping part 401 is clamped, a part of the clamping part 401 is attached to the frame structure 103, and another part is attached to the circuit board 200, thereby clamping the circuit board 200 and the frame structure 103 together through the clamping part 401.

[0078] See also Figure 2B As shown, in one possible implementation, the mounting part 104 includes a mounting base plate 104a, on which a plurality of first cutouts 104b are formed. These first cutouts 104b can be used to avoid electrical components 210 in the circuit board 200. The number of first cutouts 104b can be greater than the number of electrical components 210. Thus, after the circuit board 200 is placed on the mounting plate, some of the first cutouts 104b can be used to avoid the electrical components 210, while other parts of the first cutouts 104b can be used for heat dissipation of the circuit board 200, maintaining thermal balance on both sides of the circuit board 200.

[0079] Specifically, when setting the mounting base plate 104a, a groove can be directly excavated in the central area of ​​the vehicle body 10 to form the base plate structure, and multiple first hollow portions 104b are opened on the base plate structure to obtain the mounting base plate 104a. The multiple first hollow portions 104b may or may not have a positional relationship. For example, the multiple first hollow portions 104b may be arranged in an ordered manner, such as an array, or they may be arranged in a random manner. Similarly, the multiple first hollow portions 104b may have a size relationship, or they may not have a size relationship. For example, the opening areas of the multiple first hollow portions 104b may be the same, or they may have different opening areas. When the opening areas of multiple first hollow parts 104b are different, in order to ensure the structural strength of the mounting base plate 104a, multiple first hollow parts 104b with larger opening areas are distributed in a dispersed manner.

[0080] In this implementation, the support frame 20 is mounted on the mounting base plate 104a. This allows the receiving cavity 20a to correspond to the electrical component 210. The two ends of the support frame 20 can be located on either side of the electrical component 210, effectively simplifying the size of the support frame 20 and reducing production costs.

[0081] In some possible implementations, the ratio between the sum of the opening areas of the plurality of first cutout portions 104b and the area of ​​the mounting base plate 104a is a preset value. For example, a preset value of one-quarter means that the total opening area of ​​the plurality of first cutout portions 104b is one-quarter of the area of ​​the mounting base plate 104a. Alternatively, a preset value of one-sixth means that the opening area of ​​the plurality of first cutout portions 104b is one-sixth of the area of ​​the mounting base plate 104a. Specifically, the specific value of the preset value can be adaptively adjusted according to the size and thickness of the mounting base plate 104a. It is worth noting that the size of the mounting base plate 104a can be the same as the size of the circuit board 200 to be mounted, or the size of the mounting base plate 104a can be slightly larger than the size of the circuit board 200 to allow for mounting tolerances.

[0082] The following is combined Figure 3 and Figure 4 The structure of another type of mounting section will be described.

[0083] Figure 3 This is a top view of another welding carrier provided in an embodiment of this application; Figure 4 This is a schematic diagram of another welding carrier provided in the embodiments of this application.

[0084] Combination Figure 3 and Figure 4 As shown, in this implementation, the mounting part 104 may include a mounting groove 104c and a second hollowed-out part 104d.

[0085] The mounting groove 104c can be formed by a downward recess of the inner frame edge of the frame structure 103, with the circuit board 200 arranged around it. Specifically, the depth of the mounting groove 104c can be greater than or equal to the thickness of the circuit board 200 to better accommodate it. The width of the mounting groove 104c can be adaptively adjusted according to the actual size of the circuit board 200 and the number and weight of the electrical components 210 on it. The thickness of the circuit board 200 refers to the thickness of a single board, excluding the dimensions of the electrical components 210. The width of the mounting groove 104c is the distance it extends towards the center of the frame structure 103.

[0086] The second cutout 104d is formed by the mounting groove 104c and serves to avoid the wall surface of the circuit board 200. The sides of the circuit board 200 are positioned behind the mounting groove 104c, and the downward-facing wall surface of the circuit board 200 is completely exposed in the installed state. The two ends of the support frame 20 are mounted on the frame structure 103, and the support frame 20 also enhances the overall strength of the frame structure 103. This implementation provides a mounting portion 104 suitable for situations where the number of electrical components 210 is relatively small. While meeting the support requirements for the electrical components 210, the second cutout 104d effectively simplifies the structure of the carrier body 10, avoids the slotting process of creating multiple first cutout portions 104b, and saves manufacturing costs.

[0087] In other words, the shape of the mounting part 104 can be flexibly adjusted according to the structure of the circuit board 200 to improve the adaptability of the welding carrier 100.

[0088] The following is combined Figure 4 and Figure 5 An exemplary structure of the support frame 20 is described.

[0089] Figure 5 This is a schematic diagram of a support frame provided in an embodiment of this application.

[0090] Combination Figure 4 and Figure 5 As shown, the support frame 20 includes a clearance portion 201 and two mounting ends 202. The clearance portion 201 is located between the two mounting ends 202. The support frame 20 is mounted on the carrier body 10 via the two mounting ends 202. The clearance portion 201 is spaced a predetermined distance away from the two mounting ends 202 in a direction away from the carrier body 10, so as to form a receiving cavity 20a between the clearance portion 201 and the mounting portion 104. The predetermined distance is adaptively adjusted according to the size of the electrical component 210.

[0091] In this implementation, the support frame 20 can be a beam with a right-angle structure, and the clearance portion 201 can include two opposing right-angle structures. The mounting end 202 also includes connecting holes, through which the support frame 20 can be installed on the carrier body 10 by means of a threaded connection.

[0092] Of course, in other possible implementations, the support frame 20 can be directly set as a gate shape, and the carrier body 10 can be provided with a connection hole, into which the gate-shaped support frame 20 can be inserted. The connection hole can be a blind hole, which on the one hand ensures the structural strength of the carrier body 10, and on the other hand avoids interference between the support frame 20 and the circuit board 200.

[0093] By providing the clearance part 201, the clearance part 201 can be adjusted according to the shape adaptability of the electrical component 210, thereby improving the compatibility between the support frame 20 and the electrical component 210.

[0094] The following is combined Figure 6A and Figure 6B An exemplary structure of the support component 30 is described.

[0095] Figure 6A This is a perspective view of a support component provided in an embodiment of this application. Figure 6B This is a cross-sectional view of the installation of a support component provided in an embodiment of this application.

[0096] See Figure 6A and Figure 6B As shown, in some possible implementations, the support assembly 30 may include a connector 301 and an elastic member 302. One end of the connector 301 is adjustablely disposed on the support frame 20, and the elastic member 302 is disposed at the other end of the connector 301 and is located within the receiving cavity 20a.

[0097] Specifically, under the action of an external force, the connector 301 can move along the height direction of the carrier body 10 towards and away from the carrier body 10, thereby adjusting the position of the elastic member 302 in the receiving cavity 20a. For example, when the connector 301 moves towards the carrier body 10, the elastic member 302 is closer to the carrier body 10; or, when the connector 301 moves away from the carrier body 10, the elastic member 302 is further away from the carrier body 10. By providing the connector 301 and the elastic member 302, the structure of the support assembly 30 is effectively simplified.

[0098] In one example, after the circuit board 200 is installed on the carrier body 10, the electrical component 210 is located within the receiving cavity 20a, and the elastic member 302 is not in contact with the electrical component 210, so the support assembly 30 cannot provide support for the electrical component 210. In this state, by adjusting the position of the connector 301 along the height direction of the carrier body 10, the elastic member 302 is moved towards the electrical component 210 until the elastic member 302 makes elastic contact with the electrical component 210, so that the support assembly 30 can provide elastic support for the electrical component 210.

[0099] In this implementation, the connection between the connector 301 and the support frame 20 can be either threaded or sliding. Of course, in other possible implementations, the connection between the connector 301 and the support frame 20 can also be other connection methods.

[0100] In one possible implementation, the connector 301 can be a bolt, the relief portion 201 of the support frame 20 is provided with a threaded hole, and the tail of the bolt is located on the side of the support frame 20 away from the receiving cavity 20a. That is, the head of the bolt is located inside the receiving cavity 20a, and the tail of the bolt is located outside the receiving cavity 20a. The elastic element 302 can be provided at the head of the bolt.

[0101] In this way, under the action of rotational force, the head of the bolt can drive the elastic element 302 to elastically contact the electrical component 210. The threaded connection is simple and easy to operate, and the distance between the elastic element 302 and the electrical component 210 is highly controllable, which will not affect the weld point. While ensuring the support effect, it can also effectively control the fit.

[0102] In this implementation, the connector 301 may further include an adjusting part 301a, which is disposed at the tail of the bolt and can be an adjusting groove. This allows the position of the connector 301 within the receiving cavity 20a to be controlled via the adjusting part 301a, simplifying operation.

[0103] Specifically, the connector 301 is made of a rigid material, while the elastic element 302 can be made of a flexible, high-temperature resistant material. This way, after the circuit board 200 is installed on the welding carrier 100, the welding carrier 100 and the circuit board 200 are placed together in a high-temperature environment without damaging the elastic element 302, effectively ensuring its service life. The connection between the elastic element 302 and the bolt head can be a fusion connection, where the elastic element 302 is fused to the bolt head in an environment above its melting point. It is worth noting that the elastic element 302 can be a cylindrical structure, and the diameter of the cylindrical structure is only slightly different from the size of the bolt head, or the diameter of the cylindrical structure is the same as the size of the bolt head. This effectively avoids a large dimensional difference between the elastic element 302 and the bolt, which could affect the stability of the elastic element 302 in the elastic support.

[0104] In this implementation, bolts are inexpensive and have a simple manufacturing process. By setting bolts to cooperate with elastic element 302, the cost of support component 30 can be effectively reduced.

[0105] The following is combined Figure 7 Another exemplary structure of the support component 30 is described.

[0106] Figure 7 This is a simplified structural diagram of another support component provided in an embodiment of this application.

[0107] Combination Figure 7As shown, the support assembly 30 includes a spring 303 and a protective layer 304. The spring 303 is connected to the support frame 20 through a spiral hole. The protective layer 304 is disposed at the end of the spring 303 and located in the receiving cavity 20a. The spring 303 extends along the height direction of the carrier body 10.

[0108] In this implementation, the spring 303 can be a type of spring with low elasticity and strong support. The support frame 20 can be provided with a helical hole, and the spring 303 is rotatably disposed in the helical hole. Furthermore, a protective layer 304 is provided at the end of the spring 303 located in the receiving cavity 20a. This protective layer 304 can be an adhesive layer or an elastic layer heat-fused to the wall surface of the spring 303. The protective layer 304 effectively ensures that it will not damage the surface of the electrical component 210 when it is in contact with the electrical component 210. Thus, elastic contact between the support assembly 30 and the electrical component 210 can be achieved by rotating the spring 303, making the operation simple.

[0109] It should be emphasized that the threaded hole in the above implementation is a through hole, and an internal thread is formed on the support frame 20 to match the external thread on the bolt. In this implementation, the diameter of the helical hole is small, the extension method of the helical hole is the same as the extension method of the spring wire in the spring 303, and the diameter of the helical hole matches the diameter of the spring wire.

[0110] In this way, the setting of the support component 30 is more flexible and can be adapted to the specific type of the actual circuit board 200 or the specific type of the vehicle body 10.

[0111] The following example uses the mounting section 104, including the mounting base plate 104a, and combines it with... Figures 8A to 8D The quantitative relationship between the support frame 20 and the support assembly 30 is described.

[0112] Figure 8A This is a schematic diagram showing the positional relationship between the first type of support frame, support assembly, and electrical components provided in the embodiments of this application; Figure 8B This is a schematic diagram showing the positional relationship between the second type of support frame, support assembly, and electrical components provided in the embodiments of this application; Figure 8C This is a schematic diagram showing the positional relationship between the third type of support frame, support assembly, and electrical components provided in the embodiments of this application; Figure 8D This is a schematic diagram showing the positional relationship between the fourth type of support frame, support assembly, and electrical components provided in the embodiments of this application.

[0113] in, Figure 8A and Figure 8B The diagram shows the state where the support frame 20 and the support assembly 30 are set up in a one-to-one correspondence. Figure 8C and Figure 8D The diagram shows the corresponding configuration of the support frame 20 and multiple support components 30.

[0114] See Figure 8A As shown, in this implementation, the electrical component 210 passes through the first hollow portion 104b and is located in the receiving cavity 20a. The size of the electrical component 210 is not much different from the size of the receiving cavity 20a, and a support assembly 30 supports one electrical component 210.

[0115] See Figure 8B As shown, in this implementation, the size of the electrical component 210 differs significantly from the size of the receiving cavity 20a. The support assembly 30 is positioned corresponding to the electrical component 210, with one support assembly 30 supporting one electrical component 210.

[0116] See Figure 8C As shown, in this implementation, the electrical component 210 is relatively large, and the support frame 20 is also adapted to be relatively long. Two support components 30 are set, which are located at both ends of the electrical component 210, to meet the support force requirements.

[0117] See Figure 8D As shown, in this implementation, a support frame 20 contains two electrical components 210. By providing a support assembly 30 for each of the two electrical components 210, the supporting forces between the two electrical components 210 do not interfere with each other. At the same time, for electrical components 210 of different sizes, the height of the support assembly 30 can be adjusted independently, making operation convenient.

[0118] In other words, the support assembly 30 can be flexibly set according to the number and volume of electrical components 210, thereby improving the adaptability of the welding carrier 100.

[0119] It is worth noting that when one support component 30 supports one electrical component 210, the central axis of the support component 30 can coincide with the central axis of the electrical component 210, thereby ensuring stable force distribution. When two support components 30 support one electrical component 210, the two support components 30 can be symmetrical about the central axis of the electrical component 210 to ensure balanced force distribution. Of course, the positional relationship between the support frame 20, support component 30, and electrical component 210 provided in this embodiment can also be any other relationship besides the four mentioned above. The specific positional relationship between the support frame 20, support component 30, and electrical component 210 can be adaptively adjusted according to the structure of the carrier body 10 and the distribution of the electrical component 210.

[0120] The following is combined Figure 2A , Figure 2B , Figure 9 and Figure 10 The installation relationship between the clamping component 40 and the frame structure 103 is described.

[0121] Figure 9 This is an installation cross-sectional view of a clamping component provided in an embodiment of this application; Figure 10 This is a three-dimensional schematic diagram of a clamping component provided in an embodiment of this application.

[0122] Combination Figure 2A , Figure 2B , Figure 9 and Figure 10 As shown, the frame structure 103 may include mounting holes 105.

[0123] The clamping member 40 also includes a guide portion 402, located on one side of the clamping member 401. Under the action of an external force, the guide portion 402 can move within the mounting hole 105 to make the clamping member 401 fit against the circuit board 200. Specifically, the mounting hole 105 can extend along the height direction of the carrier body 10. In this implementation, the specific form of the external force corresponds to the engagement method of the mounting hole 105 and the guide portion 402. For example, the mounting hole 105 and the guide portion 402 are threadedly connected. In this implementation, the external force can be a rotational force, which reduces the distance between the clamping member 401 and the carrier body 10 and the circuit board 200 by rotating the clamping member 401. Alternatively, the mounting hole 105 and the guide portion 402 are slidably connected. In this implementation, the external force can be a pushing force, which gradually moves the clamping member 401 closer to the carrier body 10 and the circuit board 200 by pushing the clamping member 401.

[0124] By using the connection hole to cooperate with the guide part 402, the connection relationship between the clamping part 40 and the carrier body 10 is effectively simplified.

[0125] The following is combined Figure 2A , Figure 2B , Figure 11 and Figure 12 Another clamping element 40 will be introduced.

[0126] Figure 11 This is an installation cross-sectional view of another clamping component provided in an embodiment of this application; Figure 12 This is a perspective view of another clamping component provided in the embodiments of this application.

[0127] Combination Figure 2A , Figure 2B , Figure 11 and Figure 12 As shown, the clamping member 40 may also include a clamping cap 403, which and the guide portion 402 are located on opposite sides of the clamping member 401, respectively. The clamping cap 403 is used to insert or pull the guide portion 402 into or out of the mounting hole 105.

[0128] During the clamping process of the circuit board 200, the user can align the guide part 402 with the mounting hole 105 using the clamping cap 403, and gradually reduce the distance between the clamping part 401 and the circuit board 200 by applying external force to the clamping cap 403. In this way, by setting the clamping cap 403, it is convenient to align the guide part 402 with the mounting hole 105, and the clamping operation is simplified.

[0129] In this implementation, the guide portion 402 may further include a protrusion 402a, which is located at the end where the guide portion 402 connects to the clamping portion 401. The protrusion 402a may have an external thread, and the mounting hole 105 may have an internal thread. The protrusion 402a and the mounting hole 105 may be threadedly connected. By tightening the pressure cap 403, the clamping portion 401 can be pressed against the circuit board 200. When the pressure cap 403 is rotated in the opposite direction, the clamping force of the clamping portion 401 on the circuit board 200 can be reduced. After the clamping force is eliminated, the circuit board 200 can be disassembled.

[0130] Alternatively, the protrusion 402a can be a smooth cylindrical structure, and the mounting hole 105 can be a cylindrical hole. The diameter of the guide portion 402 is smaller than the diameter of the mounting hole 105, which facilitates guiding. The diameter of the hole in the protrusion 402a is slightly larger than the diameter of the hole in the mounting hole 105, which facilitates an interference fit between the two. Through pressure, the protrusion 402a can be gradually pressed into the mounting hole 105, and when the pressure cap 403 is pulled, the clamping force of the clamping portion 401 on the circuit board 200 can be reduced.

[0131] In this way, the connection relationship between the guide part 402 and the mounting hole 105 can be flexibly set.

[0132] In some feasible implementations, the number of clamping elements 40 is at least two, and at least two clamping elements 40 are located on opposite sides of the circuit board 200. This ensures that the clamping force is applied evenly to the circuit board 200.

[0133] For example, when there are two clamping members 40, the two clamping members 40 can be arranged on both sides of the circuit board 200 along the length direction, and the two clamping members 40 are staggered along the length direction of the circuit board 200.

[0134] Alternatively, when there are four clamping members 40, the four clamping members 40 can be located at the four corners of the circuit board 200.

[0135] It should be emphasized that, since the mounting hole 105 is formed on the frame structure 103, the mounting hole 105 can be a blind hole or a through hole, and the setting is relatively flexible. However, regardless of the form of the mounting hole 105, in the implementation of the mounting part 104 including the second hollow part 104d, the mounting position of the support frame 20 should avoid the mounting hole 105 to ensure the structural strength of the frame structure 103.

[0136] See also Figure 2A and Figure 2B As shown, the welding carrier 100 may further include a third cutout portion 106, which is formed on the frame structure 103. By providing the third cutout portion 106, it is convenient to place and remove the circuit board 200. The number of third cutout portions 106 can be one or two. When there are two third cutout portions 106, the two third cutout portions 106 can be located on both sides of the mounting portion 104.

[0137] See also Figure 1A and Figure 1B As shown, in some possible implementations, the welding carrier 100 may further include supports 50, which are disposed on the first surface 102 of the carrier body 10 and are used to support the carrier body 10. Specifically, there may be four supports 50, which may be located at the four corners of the carrier body 10. In this way, the four supports 50 can stably support the carrier body 10, facilitating welding operations. It is worth noting that the height of the supports 50 should be greater than the height of the support frame 20 so that the supports 50 can effectively support the carrier body 10.

[0138] See also Figure 2A , Figure 2B and Figure 3 As shown, in some possible implementations, the welding carrier 100 may also include a marking section 60 for indicating direction. When performing welding operations on the circuit board 200, the welding direction of the circuit board can be determined by the marking section 60.

[0139] The embodiments described above are merely specific embodiments of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made based on the technical solution of this application should be included within the scope of protection of this application.

Claims

1. A welding carrier for holding a circuit board for performing welding operations on the circuit board, characterized in that, include: The carrier body (10) is used to mount the circuit board; A support frame (20) is disposed on the first surface (101) of the vehicle body (10); a receiving cavity (20a) is formed between the support frame (20) and the vehicle body (10); A support assembly (30) is adjustable at one end in the support frame (20) and at the other end in the receiving cavity (20a); wherein, under the action of external force, the support assembly (30) can adjust its position in the receiving cavity (20a) along the height direction of the vehicle body (10); A clamping member (40) is disposed on the second surface (102) of the vehicle body (10). The clamping member (40) is used to clamp the circuit board and cooperates with the support assembly (30) to fix the circuit board. The first surface (101) and the second surface (102) are two opposing surfaces of the vehicle body (10).

2. The welding carrier according to claim 1, characterized in that, The support component (30) is in elastic contact with the circuit board.

3. The welding carrier according to claim 2, characterized in that, The vehicle body (10) includes a frame structure (103) and a mounting section (104); The mounting part (104) is located in the central region of the frame structure (103), and the mounting part (104) is used to mount the circuit board; The clamping member (40) is disposed on the frame structure (103), and the clamping member (40) is provided with a clamping part (401); under the action of external force, the bottom surface of the clamping part (401) can be attached to the circuit board.

4. The welding carrier according to claim 3, characterized in that, The mounting part (104) includes a mounting base plate (104a); The mounting base plate (104a) is provided with a plurality of first cutouts (104b), which can be used to avoid electrical components in the circuit board; wherein, the support frame (20) is disposed on the mounting base plate (104a).

5. The welding carrier according to claim 3, characterized in that, The mounting part (104) includes a mounting groove (104c) and a second hollow part (104d); The mounting groove (104c) is formed by the recess of the inner frame edge of the frame structure (103), and the circuit board is arranged around the mounting groove (104c). The second cutout (104d) is formed by the enclosure of the mounting groove (104c), and the second cutout (104d) is used to avoid the wall surface of the circuit board; The mounting groove (104c) has a groove depth greater than or equal to the thickness of the circuit board; the support frame (20) is disposed on the frame structure (103).

6. The welding carrier according to claim 3, characterized in that, The support frame (20) includes a clearance portion (201), and the receiving cavity (20a) is formed between the clearance portion (201) and the mounting portion (104).

7. The welding carrier according to claim 6, characterized in that, The support assembly (30) includes a connector (301) and an elastic member (302). The connector (301) is adjustablely disposed on the support frame (20), and the elastic member (302) is disposed at the end of the connector (301) and located within the receiving cavity (20a). The connector (301) can move along the height direction of the carrier body (10) under the action of external force to adjust the position of the elastic member (302) in the receiving cavity (20a).

8. The welding carrier according to claim 7, characterized in that, The connector (301) is a bolt; the head of the bolt is located outside the receiving cavity (20a), and the tail of the bolt passes through the support frame (20) and is provided with the elastic element (302).

9. The welding carrier according to claim 6, characterized in that, The support assembly (30) includes a spring (303) and a protective layer (304). The spring (303) is threadedly connected to the support frame (20). The protective layer (304) is disposed at the end of the spring (303) and located in the receiving cavity (20a). The spring (303) extends along the height direction of the vehicle body (10).

10. The welding carrier according to claim 2, characterized in that, The support frame (20) corresponds one-to-one with the support assembly (30); or The support frame (20) corresponds to a plurality of the support components (30).

11. The welding carrier according to claim 3, characterized in that, The frame structure (103) is provided with mounting holes (105); The clamping member (40) further includes a guide portion (402), which is located on one side of the clamping portion (401). Under the action of external force, the guide portion (402) can move within the mounting hole (105) so that the clamping portion (401) fits against the circuit board.

12. The welding carrier according to claim 11, characterized in that, The clamping member (40) further includes a pressure cap (403), the guide portion (402) and the pressure cap (403) are respectively located on opposite sides of the clamping portion (401), and the pressure cap (403) is used to insert or pull the guide portion (402) into or out of the mounting hole (105).

13. The welding carrier according to claim 12, characterized in that, The guide portion (402) is threadedly connected to the mounting hole (105); or The guide portion (402) is interference-fitted with the mounting hole (105).

14. The welding carrier according to claim 1, characterized in that, The number of clamping members (40) is at least two, and at least two of the clamping members (40) are located on opposite sides of the circuit board.

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