Heat dissipation structure and electronic equipment

Abstract

The utility model discloses a heat dissipation structure and electronic equipment, including shell, heat dissipation subassembly and fan subassembly, the shell is formed with holding cavity and first air inlet, holding cavity and first air inlet intercommunication, holding cavity is at least used for holding first and second piece to be cooled, first air inlet is used for intercommunication with shell outside. The heat dissipation assembly is arranged on the shell and is in heat conduction connection with the first piece to be subjected to heat dissipation. The fan assembly is connected to at least one of the shell and the heat dissipation assembly and provided with a second air inlet, a third air inlet and a first air outlet, the second air inlet is communicated with the containing cavity, the third air inlet is used for being communicated with the exterior of the shell, and the first air outlet faces the heat dissipation assembly. According to the technical scheme of the embodiment of the utility model, the number of parts is reduced, and the heat dissipation cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation structure and electronic device. Background Technology

[0002] Currently, most electronic devices are equipped with multiple fans for heat dissipation. For example, in server equipment, dual fans are needed to dissipate heat from two components to be cooled. For instance, one of the two components to be cooled may include the main chip and / or circuit board, and the other may include the hard drive. Each component to be cooled needs to use a separate fan for heat dissipation. However, this heat dissipation method not only has a large number of components and complex assembly, but also has a high heat dissipation cost. Utility Model Content

[0003] This utility model provides a heat dissipation structure and electronic device, which aims to reduce the number of components and lower heat dissipation costs.

[0004] In a first aspect, embodiments of the present invention provide a heat dissipation structure, comprising:

[0005] The housing has a receiving cavity and a first air inlet. The receiving cavity is connected to the first air inlet. The receiving cavity is used to receive at least a first heat-dissipating component and a second heat-dissipating component. The first air inlet is used to communicate with the outside of the housing.

[0006] A heat dissipation assembly is disposed in the housing and is thermally connected to the first component to be cooled; and

[0007] A fan assembly, connected to at least one of the housing and the heat dissipation assembly, has a second air inlet, a third air inlet, and a first air outlet. The second air inlet communicates with the accommodating cavity, the third air inlet communicates with the outside of the housing, and the first air outlet faces the heat dissipation assembly.

[0008] Optionally, the heat dissipation assembly includes a base and a plurality of heat dissipation fins. The base is disposed on the housing. The first heat dissipation component is thermally connected to one side of the base. The plurality of heat dissipation fins are disposed on the other side of the base. A gap is formed between the plurality of heat dissipation fins. The first air outlet faces the plurality of heat dissipation fins.

[0009] Optionally, the housing includes a bottom plate and a side plate that surrounds the bottom plate to form an accommodating cavity. The base is connected to the side plate and spaced apart from the bottom plate. The first heat-dissipating component and the second heat-dissipating component are located between the heat dissipation assembly and the bottom plate. The bottom plate or the side plate is provided with the first air inlet.

[0010] Optionally, the fan assembly is disposed on the side of the substrate away from the first heat-dissipating component, and the substrate is provided with a first ventilation hole, which is connected to the accommodating cavity and the second air inlet respectively.

[0011] Optionally, the heat dissipation assembly and the fan assembly are located in the receiving cavity;

[0012] The side plate is provided with a second ventilation hole, which is set between the gaps of the plurality of heat dissipation fins.

[0013] Optionally, the heat dissipation structure further includes a cover, which is located on the side of the heat dissipation component and the fan component away from the base plate and connected to the side plate. The cover is provided with a plurality of third ventilation holes, which are provided corresponding to the fan component.

[0014] Optionally, the heat dissipation structure further includes:

[0015] The structural component is capable of dividing the accommodating cavity into a first sub-cavity and a second sub-cavity. The first sub-cavity is connected to the first air inlet, and the second sub-cavity is connected to the second air inlet. The structural component is provided with a fourth ventilation hole. The first sub-cavity is connected to the second sub-cavity through the fourth ventilation hole. The second heat-dissipating component is disposed in the first sub-cavity, and the first heat-dissipating component is disposed in the second sub-cavity.

[0016] Optionally, the first heat sink component includes a first circuit board, the first circuit board comprising:

[0017] The circuit board body is connected to the housing and / or the heat dissipation assembly;

[0018] The chip is disposed on the main body of the circuit board, and the chip is thermally connected to the heat dissipation component.

[0019] Optionally, the first heat-dissipating component includes at least one of the following: a first circuit board, a chip; and / or,

[0020] The second heat-dissipating component includes at least one of the following: hard disk, second circuit board, and chip.

[0021] Secondly, embodiments of the present invention provide an electronic device, including the heat dissipation structure described in the first aspect.

[0022] The heat dissipation structure and electronic device provided in this embodiment of the utility model achieve heat dissipation by thermally connecting the heat dissipation component to the first heat-dissipating component. The second air inlet of the fan component is connected to the accommodating cavity. When the fan component is working, air from outside the housing can enter the accommodating cavity through the first air inlet and exchange heat with the second heat-dissipating component. Then, the air is drawn in by the fan component through the second air inlet. The third air inlet of the fan component is connected to the outside of the housing, allowing the fan component to draw in air from outside the housing through the third air inlet. This air, together with the air drawn in through the second air inlet, is blown out towards the heat dissipation component through the first air outlet. The temperature of the two air streams decreases after convergence, and the air blown towards the heat dissipation component after convergence can exchange heat with the heat dissipation component. In this way, heat dissipation of the first and second heat-dissipating components can be achieved using the same fan component, eliminating the need for separate fan components for each component. This reduces the number of fan components required and helps to reduce heat dissipation costs. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of a heat dissipation structure provided in an embodiment of this utility model;

[0025] Figure 2 This is an exploded view of a heat dissipation structure provided in an embodiment of the present utility model;

[0026] Figure 3 A top view of a heat dissipation structure provided in an embodiment of this utility model;

[0027] Figure 4 for Figure 3 A cross-sectional view of the heat dissipation structure along the AA direction;

[0028] Figure 5 This is a schematic diagram of the structure of a fan assembly provided in an embodiment of the present utility model.

[0029] Explanation of key figure labels:

[0030] 10. Housing; 10a. Receiving cavity; 101. First sub-cavity; 102. Second sub-cavity; 10b. First air inlet; 11. Base plate; 12. Side plate; 12a. Second ventilation hole; 121. First side plate; 122. Second side plate; 20. Heat dissipation assembly; 21. Base; 21a. First ventilation hole; 22. Heat dissipation fins; 30. Fan assembly; 30a. Second air inlet; 30b. Third air inlet; 30c. First air outlet; 40. Cover; 40a. Third ventilation hole;

[0031] 201, First heat sink component; 2011, First circuit board; 20111, Circuit board body; 20112, Chip; 202, Second heat sink component; 2021, Hard disk; 203, Structural component; 2031, Second circuit board; 203a, Fourth ventilation hole. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0033] Please see Figures 1 to 4 This utility model discloses a heat dissipation structure, including a housing 10, a heat dissipation assembly 20, and a fan assembly 30. The housing 10 has a receiving cavity 10a and a first air inlet 10b, which communicate with each other. The receiving cavity 10a is used to accommodate at least a first heat-dissipating component 201 and a second heat-dissipating component 202. The first air inlet 10b communicates with the outside of the housing 10. The heat dissipation assembly 20 is disposed on the housing 10 and is thermally connected to the first heat-dissipating component 201.

[0034] Combination Figure 5 As shown, the fan assembly 30 is connected to at least one of the housing 10 and the heat dissipation assembly 20. The fan assembly 30 has a second air inlet 30a, a third air inlet 30b and a first air outlet 30c. The second air inlet 30a communicates with the accommodating cavity 10a, the third air inlet 30b is used to communicate with the outside of the housing 10, and the first air outlet 30c faces the heat dissipation assembly 20.

[0035] Understandably, by thermally connecting the heat dissipation component 20 to the first heat-dissipating component 201, the heat dissipation component 200 can dissipate heat from the first heat-dissipating component 201. The second air inlet 30a of the fan assembly 30 is connected to the accommodating cavity 10a. When the fan assembly 30 is working, air outside the housing 10 can enter the accommodating cavity 10a through the first air inlet 10b and exchange heat with the second heat-dissipating component 202. Then, the air is drawn in by the fan assembly 30 through the second air inlet 30a. The third air inlet 30b of the fan assembly 30 is connected to the outside of the housing 10, allowing the fan assembly 30 to also draw in air from outside the housing 10. Air is drawn in through the third air inlet 30b and converges with the air drawn in through the second air inlet 30a before being blown out through the first air outlet 30c toward the heat dissipation component 20. The temperature decreases after the two streams of air converge and are blown toward the heat dissipation component 20, allowing for heat exchange with the heat dissipation component 20. In this way, the heat dissipation of the first heat-dissipating component 201 and the second heat-dissipating component 202 can be achieved using the same fan component 30, eliminating the need for separate fan components for each component. This reduces the number of fan components required, which helps to reduce heat dissipation costs and power consumption of the heat dissipation structure.

[0036] In some embodiments, the first heat-dissipating component 201 includes at least one of the following: a first circuit board 2011 and a chip 20112. The second heat-dissipating component 202 includes at least one of the following: a hard disk 2021, a second circuit board, and a chip.

[0037] In one example, the first heat-dissipating component 201 includes a first circuit board 2011, the first circuit board 2011 includes a circuit board body 20111, the circuit board body 20111 is connected to the housing 10 and / or the heat dissipation component 20, and the circuit board body 20111 is thermally connected to the heat dissipation component 20, so that the heat of the circuit board body 20111 can be transferred to the heat dissipation component 20.

[0038] In another exemplary embodiment, the first heat-dissipating component 201 includes a first circuit board 2011. The first circuit board 2011 includes a circuit board body 20111 and a chip 20112. The circuit board body 20111 is connected to the housing 10 and / or the heat dissipation assembly 20. The chip 20112 is disposed on the circuit board body 20111, and at least the chip 20112 is thermally connected to the heat dissipation assembly 20, allowing the heat from the chip 20112 to be transferred to the heat dissipation assembly 20. For example, the heat dissipation assembly 20 is located on the side of the chip 20112 opposite to the circuit board body 20111. The circuit board body 20111 can be connected to the heat dissipation assembly 20 via fasteners, allowing the chip 20112 to be thermally connected to the heat dissipation assembly 20, and allowing the heat from the chip 20112 to be transferred to the heat dissipation assembly 20.

[0039] In another exemplary embodiment, the first heat sink 201 includes a first circuit board 2011, the first circuit board 2011 includes a circuit board body 20111 and a resistor, the circuit board body 20111 is connected to the housing 10 and / or the heat sink assembly 20, the resistor is disposed on the circuit board body 20111 and is thermally connected to the heat sink assembly 20, and the heat of the resistor can be transferred to the heat sink assembly 20.

[0040] For example, the heat dissipation component 20 can directly contact the first heat-dissipating component 201 to achieve a thermally conductive connection. Alternatively, a thermally conductive component, such as thermally conductive adhesive, can be provided between the heat dissipation component 20 and the first heat-dissipating component 201, and the heat dissipation component 20 and the first heat-dissipating component 201 can be thermally connected through the thermally conductive component. For example, the chip 20112 can directly contact the heat dissipation component 20 to achieve a thermally conductive connection between the chip 20112 and the heat dissipation component 20, so that the heat of the chip 20112 can be transferred to the heat dissipation component 20.

[0041] In one exemplary embodiment, the second heat-dissipating component 202 includes a hard disk 2021. A hard disk tray may be provided within the accommodating cavity 10a, and the hard disk 2021 is mounted on the hard disk tray. The hard disk 2021 can be electrically connected to the circuit board body. Air from outside the housing 10 enters the accommodating cavity 10a through the first air inlet 10b, exchanges heat with the hard disk 2021, and then flows to the fan assembly 30. It then enters the fan assembly 30 through the second air inlet 30a and converges with the air from outside the housing 10 entering the fan assembly 30 through the third air inlet 30b.

[0042] In another exemplary embodiment, the second heat-dissipating component 202 includes a second circuit board 2031, which at least includes a circuit board body. The circuit body of the second circuit board 2031 is connected to the housing 10. Air from outside the housing 10 enters the accommodating cavity 10a through the first air inlet 10b. After heat exchange between the air and the circuit body of the second circuit board 2031, the air flows to the fan assembly 30, enters the fan assembly 30 through the second air inlet 30a, and converges with the air from outside the housing 10 entering the fan assembly 30 through the third air inlet 30b.

[0043] For ease of explanation, the embodiments of this application mainly take the first heat-dissipating component 201 including a chip 20112 and the second heat-dissipating component 202 including a hard disk 2021 as examples.

[0044] like Figure 2 and 4As shown, in some embodiments, the heat dissipation assembly 20 includes a base 21 and a plurality of heat dissipation fins 22. The base 21 is disposed on the housing 10. The first heat-dissipating component 201 is thermally connected to one side of the base 21, and the plurality of heat dissipation fins 22 are disposed on the other side of the base 21. Gaps are formed between the plurality of heat dissipation fins 22, and the first air outlet 30c faces the plurality of heat dissipation fins 22. It can be understood that the base 21 is thermally connected to the first heat-dissipating component 201, and the base 21 is provided with a plurality of heat dissipation fins 22. The base 21 can transfer the heat of the first heat-dissipating component 201 to the plurality of heat dissipation fins 22. The plurality of heat dissipation fins 22 can increase the contact area between the heat dissipation assembly 20 and the air, thereby improving the heat dissipation efficiency of the heat dissipation assembly 20.

[0045] Specifically, the first air outlet 30c faces multiple heat dissipation fins 22, and the air blown out by the first air outlet 30c can flow through the gaps between the multiple heat dissipation fins 22, so that the air can exchange heat with the multiple heat dissipation fins 22, thereby achieving heat dissipation of the first heat dissipation component 201.

[0046] like Figure 1 , Figure 2 and Figure 4 As shown, in some embodiments, the housing 10 includes a base plate 11 and a side plate 12 that surrounds the base plate 11 to form an accommodating cavity 10a. A base 21 is connected to the side plate 12 and spaced apart from the base plate 11. A first heat-dissipating component 201 and a second heat-dissipating component 202 are located between the heat dissipation assembly 20 and the base plate 11. The base plate 11 or the side plate 12 is provided with a first air inlet 10b. It can be understood that the base 21 is connected to the side plate 12 and spaced apart from the base plate 11. While serving as part of the heat dissipation assembly 20, the base 21 can also protect the components inside the housing 10 and facilitate the installation of the components.

[0047] For example, the first heat sink 201 includes a chip 20112, which is disposed on the circuit board body 20111. The substrate 21 is located on the side of the chip 20112 away from the circuit board body 20111. The circuit board body 20111 is connected to the substrate 21 by fasteners to realize the installation of the first circuit board 2011.

[0048] For example, the base plate 11 is a square plate, and the side plate 12 may include two first side plates 121 spaced apart along a first direction, and two second side plates 122 spaced apart along a second direction. The two first side plates 121 and the two second side plates 122 surround the outer periphery of the base plate 11 and form an accommodating cavity 10a. The first direction may be as follows: Figure 1 As shown in the Y0-Y1 direction, the second direction can be as follows: Figure 1 As shown in the X0-X1 direction. The base 21 is a square plate, and the base 21 can be connected to two first side plates 121 and two second side plates 122 respectively.

[0049] like Figure 4 As shown, in some embodiments, the fan assembly 30 is disposed on the side of the substrate 21 opposite to the first heat-dissipating component 201. The substrate 21 is provided with a first ventilation hole 21a, which connects to the accommodating cavity 10a and the second air inlet 30a. It is understood that the fan assembly 30 is directly disposed on the substrate 21, facilitating its installation. Simultaneously, the first air outlet 30c is closer to the multiple heat dissipation fins 22, improving heat dissipation efficiency. The first ventilation hole 21a connects the fan assembly 30 and the accommodating cavity 10a, allowing air flowing through the accommodating cavity 10a to flow from the first ventilation hole 21a to the second air inlet 30a and then into the fan assembly 30.

[0050] Understandably, the fan assembly 30 is mounted on the base 21, and multiple heat dissipation fins 22 are at least corresponding to the first heat dissipation component 201. The fan assembly 30 and the first heat dissipation component 201 are misaligned, so that the heat of the first heat dissipation component 201 can be quickly transferred to the multiple heat dissipation fins 22 through the base 21, and it is also more convenient for the fan assembly 30 to draw the air flowing through the accommodating cavity 10a into the second air inlet 30a.

[0051] For example, the fan assembly 30 includes a main body and a fan disposed within the main body. The main body forms a second air inlet 30a, a third air inlet 30b and a first air outlet 30c. The main body can be connected to the base 21 by fasteners to realize the installation of the fan assembly 30.

[0052] Of course, in other embodiments, the fan assembly 30 may also be located on the side of the side plate 12 away from the receiving cavity 10a. By forming a second air outlet in the side plate 12 that connects the receiving cavity 10a and the second air inlet 30a, the air flowing through the receiving cavity 10a can flow from the second air outlet to the second air inlet 30a and enter the fan assembly 30. The specific arrangement can be adjusted according to the actual situation.

[0053] like Figure 1 , Figure 2 and Figure 4As shown, in some embodiments, the heat dissipation assembly 20 and the fan assembly 30 are located in the accommodating cavity 10a. The side plate 12 is provided with a second ventilation hole 12a, which is set corresponding to the gaps between the plurality of heat dissipation fins 22. It can be understood that the heat dissipation assembly 20 and the fan assembly 30 are located in the accommodating cavity 10a. The side plate 12 includes the heat dissipation assembly 20 and the fan assembly 30, and the side plate 12 is provided with a second ventilation hole 12a corresponding to the gaps between the plurality of heat dissipation fins 22, which facilitates the flow of air between the plurality of heat dissipation fins 22. The air blown out by the first air outlet 30c flows through the gaps between the plurality of heat dissipation fins 22 and then flows out of the housing 10 through the second ventilation hole 12a, which helps the air to exchange heat with the plurality of heat dissipation fins 22 and improves the heat dissipation efficiency.

[0054] For example, there may be one or more second ventilation holes 12a. When there are multiple second ventilation holes 12a, the multiple ventilation holes can be respectively configured to correspond to the gaps between multiple heat dissipation fins 22. Figure 1 As shown, at least one first side plate 121 is provided with a plurality of second ventilation holes 12a, so that air flowing through the gaps between the plurality of heat dissipation fins 22 can flow from the plurality of second ventilation holes 12a to the outside of the housing 10.

[0055] like Figures 1 to 4 As shown, the heat dissipation structure further includes a cover 40, which is located on the side of the heat dissipation assembly 20 and the fan assembly 30 away from the base plate 10 and connected to the side plate 12. The cover 40 is provided with multiple third ventilation holes 40a, which are provided corresponding to the fan assembly 30. It can be understood that the cover 40 can protect the heat dissipation assembly 20 and the fan assembly 30. At the same time, the cover 40 can also form an air duct between itself and the base 21, so that the air blown out of the first air outlet 30c of the fan assembly 30 toward the multiple heat dissipation fins 22 can flow through the gaps between the multiple heat dissipation fins 22 and then flow out of the housing 10 through the second ventilation hole 12a. This is beneficial for the air blown out of the fan assembly 30 to exchange heat with the multiple heat dissipation fins 22 and improve the heat dissipation efficiency. In addition, the cover 40 is provided with a number of third ventilation holes 40a corresponding to the fan assembly 30. This not only facilitates the flow of air from outside the housing 10 through the third ventilation holes 40a to the third air inlet 30b of the fan assembly 30, but also prevents external objects from entering the fan assembly 30, thus avoiding accidental injury or affecting the normal operation of the fan assembly 30.

[0056] For example, the third air inlet 30b is disposed facing the cover 40, and the third air inlet 30b and a plurality of third ventilation holes 40a are disposed correspondingly to improve the efficiency of airflow from outside the housing 10 to the third air inlet 30b and into the fan assembly 30, thereby improving heat dissipation efficiency.

[0057] like Figure 4 and Figure 5As shown, in some embodiments, the second air inlet 30a and the third air inlet 30b of the fan assembly 30 are arranged opposite each other, which helps to converge the air entering the fan assembly 30 from the second air inlet 30a and the third air inlet 30b, thereby reducing the temperature of the converged air.

[0058] Furthermore, the second air inlet 30a and the third air inlet 30b are located on opposite sides of the fan assembly 30 along a third direction, and the first air outlet 30c is located on one or both sides of the fan assembly 30 along a first direction, with the third direction perpendicular to the first direction. The first direction can be as follows: Figure 1 As shown in the Y0-Y1 direction, the third direction can be as follows: Figure 1 The Z0-Z1 direction is shown in the figure.

[0059] Of course, in other embodiments, the second air inlet 30a and the third air inlet 30b may also be located on adjacent sides of the fan assembly 30, and the specific location may be adjusted according to the actual situation.

[0060] like Figure 5 As shown, in some embodiments, the fan assembly 30 has a mounting portion that divides the second air inlet 30a into multiple sub-air inlets. The multiple sub-air inlets are arranged in a circumferential manner, and each sub-air inlet extends in a circumferential manner, thereby improving the efficiency of air passing through the accommodating cavity 10a entering the fan assembly 30 from the second air inlet 30a and improving heat dissipation efficiency.

[0061] like Figure 2 and Figure 4 As shown, in some embodiments, the heat dissipation structure further includes a structural member 203, which can divide the accommodating cavity 10a into a first sub-cavity 101 and a second sub-cavity 102. The first sub-cavity 101 is connected to the first air inlet 10b, and the second sub-cavity 102 is connected to the second air inlet 30a. The structural member 203 is provided with a fourth ventilation hole 203a, through which the first sub-cavity 101 is connected to the second sub-cavity 102. The second heat-dissipating component 202 is disposed in the first sub-cavity 101 and the first heat-dissipating component 201 is disposed in the second sub-cavity 102. Understandably, the structural component 203 divides the accommodating cavity 10a into a first sub-cavity 101 and a second sub-cavity 102. When the second air inlet 30a is connected to the second sub-cavity 102, the fourth ventilation hole 203a can be opened in the structural component 203 so that the air outside the housing 10 enters the first sub-cavity 101 from the first air inlet 10b and exchanges heat with the second heat dissipation component 202. Then, the air flows from the fourth ventilation hole 203a to the second sub-cavity 102 and from the second sub-cavity 102 to the second air inlet 30a and enters the fan assembly 30.

[0062] For example, such as Figure 2 and Figure 4As shown, structural component 203 includes a second circuit board 2031, which includes a circuit board body. The second circuit board 2031 is located on the side of the circuit board body 20111 of the first circuit board 2011 opposite to the chip 20112. The second circuit board 2031 is electrically connected to the circuit board body 20111 of the first circuit board 2011. The second circuit board 2031 divides the accommodating cavity 10a into a first sub-cavity 101 and a second sub-cavity 102. The second heat sink 202 is disposed in the first sub-cavity 101, and the first air inlet 10b communicates with the first sub-cavity 101. The second circuit board 2031 is provided with a fourth ventilation hole 203a.

[0063] For example, the second circuit board 2031 is provided with a fourth ventilation hole 203a, and the location of the fourth ventilation hole 203a can be set according to the arrangement requirements on the second circuit board 2031.

[0064] like Figure 2 and Figure 4 As shown, in some embodiments, the fourth ventilation hole 203a is located on the side of the second heat-dissipating component 202 away from the first air inlet 10b. It can be understood that the location of the fourth ventilation hole 203a on the side of the second heat-dissipating component 202 away from the first air inlet 10b ensures that after air from outside the housing 10 enters the first sub-cavity 101 through the first air inlet 10b, the air flows through the second heat-dissipating component 202 and then through the fourth ventilation hole 203a to the second sub-cavity 102, ensuring more thorough heat exchange between the air and the second heat-dissipating component 202 and improving heat dissipation.

[0065] For example, the first air inlet 10b is correspondingly arranged with the second heat-dissipating component 202, so that the air outside the housing 10 enters the accommodating cavity 10a from the first air inlet 10b and continues to flow toward the second heat-dissipating component 202 along its flow direction, which helps the air to exchange heat with the second heat-dissipating component 202.

[0066] This application also discloses an electronic device, which includes a heat dissipation structure as described in any of the embodiments above. It is understood that the electronic device including the heat dissipation structure described above also possesses all of its technical effects, namely, it can utilize the same fan assembly 30 to dissipate heat from both the first heat-dissipating component 201 and the second heat-dissipating component 202, eliminating the need for separate fan assemblies for each component, thus reducing the number of fan assemblies required and lowering heat dissipation costs.

[0067] For example, electronic devices include, but are not limited to, at least one of the following: server devices, smart home devices, etc.

[0068] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A heat dissipation structure, characterized in that, include: The housing has a receiving cavity and a first air inlet. The receiving cavity is connected to the first air inlet. The receiving cavity is used to receive at least a first heat-dissipating component and a second heat-dissipating component. The first air inlet is used to communicate with the outside of the housing. A heat dissipation component is disposed in the housing and is thermally connected to the first heat dissipation component; as well as A fan assembly, connected to at least one of the housing and the heat dissipation assembly, has a second air inlet, a third air inlet, and a first air outlet. The second air inlet communicates with the accommodating cavity, the third air inlet communicates with the outside of the housing, and the first air outlet faces the heat dissipation assembly.

2. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation assembly includes a base and a plurality of heat dissipation fins. The base is disposed on the housing. The first heat dissipation component is thermally connected to one side of the base. The plurality of heat dissipation fins are disposed on the other side of the base. A gap is formed between the plurality of heat dissipation fins. The first air outlet faces the plurality of heat dissipation fins.

3. The heat dissipation structure according to claim 2, characterized in that, The housing includes a bottom plate and a side plate that surrounds the bottom plate to form an accommodating cavity. The base is connected to the side plate and spaced apart from the bottom plate. The first heat-dissipating component and the second heat-dissipating component are located between the heat dissipation assembly and the bottom plate. The bottom plate or the side plate is provided with the first air inlet.

4. The heat dissipation structure according to claim 3, characterized in that, The fan assembly is located on the side of the substrate away from the first heat-dissipating component. The substrate is provided with a first ventilation hole, which is connected to the accommodating cavity and the second air inlet.

5. The heat dissipation structure according to claim 4, characterized in that, The heat dissipation component and the fan component are located in the accommodating cavity; The side plate is provided with a second ventilation hole, which is set between the gaps of the plurality of heat dissipation fins.

6. The heat dissipation structure according to claim 5, characterized in that, The heat dissipation structure also includes a cover, which is located on the side of the heat dissipation component and the fan component away from the base plate and connected to the side plate. The cover is provided with a plurality of third ventilation holes, which are provided corresponding to the fan component.

7. The heat dissipation structure according to any one of claims 1-6, characterized in that, The heat dissipation structure also includes: The structural component is capable of dividing the accommodating cavity into a first sub-cavity and a second sub-cavity. The first sub-cavity is connected to the first air inlet, and the second sub-cavity is connected to the second air inlet. The structural component is provided with a fourth ventilation hole. The first sub-cavity is connected to the second sub-cavity through the fourth ventilation hole. The second heat-dissipating component is disposed in the first sub-cavity, and the first heat-dissipating component is disposed in the second sub-cavity.

8. The heat dissipation structure according to any one of claims 1-6, characterized in that, The first heat sink component includes a first circuit board, which includes: The circuit board body is connected to the housing and / or the heat dissipation assembly; The chip is disposed on the main body of the circuit board, and the chip is thermally connected to the heat dissipation component.

9. The heat dissipation structure according to any one of claims 1-6, characterized in that, The first heat-dissipating component includes at least one of the following: a first circuit board, a chip; and / or, The second heat-dissipating component includes at least one of the following: hard disk, second circuit board, and chip.

10. An electronic device, characterized in that, The electronic device includes a heat dissipation structure as described in any one of claims 1-9.

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