Semiconductor PCB laser splitting cutting machine

Abstract

The utility model discloses a semiconductor PCB laser splitting and cutting machine, and relates to the field of PCB machining, the semiconductor PCB laser splitting and cutting machine comprises a cutting machine body, a laser device is arranged in the cutting machine body, and a galvanometer used for controlling the direction of laser beams emitted by the laser device and a CCD visual positioning device used for positioning MARK points on a PCB are installed in the cutting machine body. An X-axis linear motor moving platform used for driving the galvanometer to move along the X axis and a Z-axis lifting platform used for driving the galvanometer to ascend and descend along the Z axis are arranged in the cutting machine body, and a Y-axis linear motor moving platform used for driving the working platform to move along the Y axis is arranged in the cutting machine body. The CCD visual positioning device is used for automatically recognizing mark points on the PCB in the cutting process for positioning, scribing and laser cutting, material deformation or alignment deviation is compensated, and the cutting precision of the PCB is improved.

Description

Technical Field

[0001] This application relates to the field of PCB board processing, and in particular to a semiconductor PCB laser depaneling and cutting machine. Background Technology

[0002] Semiconductor PCB laser depaneling machines are precision equipment designed specifically for semiconductor packaging and printed circuit board (PCB) processing. They are mainly used to cut assembled whole boards into independent units. The core technology is to use the high energy density of lasers to achieve non-contact cutting. They are suitable for high-precision and high-reliability electronic manufacturing scenarios, and are widely used in semiconductor packaging, high-density PCBs, flexible circuit boards (FPCs) and other fields.

[0003] Traditional laser PCB cutting for semiconductors suffers from poor cutting accuracy due to laser field lens distortion, resulting in slow and inefficient splitting and splicing. Furthermore, the high heat generated by the laser cutting source during the cutting process can easily lead to mechanical stress and microcracks, further complicating the cutting accuracy and causing product scrap. Moreover, the cutting and splicing positions are prone to deformation and misalignment, making it impossible to achieve high-precision processing and thus reducing the overall quality of PCB processing. Utility Model Content

[0004] To improve the cutting accuracy of PCB boards, this application provides a semiconductor PCB laser depaneling and cutting machine.

[0005] The semiconductor PCB laser depaneling and cutting machine provided in this application adopts the following technical solution:

[0006] A semiconductor PCB laser depaneling and cutting machine includes a cutting machine body, a working platform is provided on one side of the surface of the cutting machine body, a laser is provided inside the cutting machine body, and a positioning seat is fixed on one side of the surface of the cutting machine body;

[0007] The cutting machine body is equipped with a galvanometer for controlling the direction of the laser beam emitted by the laser and a CCD vision positioning device for positioning the MARK points on the PCB board. The cutting machine body is also equipped with an X-axis linear motor moving platform for driving the galvanometer to move along the X-axis and a Z-axis lifting platform for driving the galvanometer to rise and fall along the Z-axis. The cutting machine body is also equipped with a Y-axis linear motor moving platform for driving the working platform to move along the Y-axis. An automatic feeding mechanism is provided on one side of the surface of the cutting machine body for automatically ejecting the cut PCB board.

[0008] By adopting the above technical solution, the CCD vision positioning device automatically identifies the mark points on the PCB board during the cutting process to locate and scribe laser cutting, compensating for material deformation or alignment deviation, and improving the cutting accuracy of the PCB board. At the same time, the galvanometer is linked with the X-axis linear motor moving platform, the Y-axis linear motor moving platform and the Z-axis lifting platform to cut the PCB board, which improves the speed and the ability to handle complex paths, ensures the perpendicularity of the PCB board cutting surface, improves the cutting quality of the PCB board, and automatically ejects the PCB board after cutting using an automatic unloading mechanism.

[0009] Preferably, the automatic feeding mechanism includes a drive box fixed to one side of the surface of the cutting machine body, an electric push rod is provided inside the drive box, and the telescopic end of the electric push rod passes through the inner wall of the drive box and is fixed to a drive seat that is slidably disposed on one side of the positioning seat surface.

[0010] By adopting the above technical solution, the electric actuator provides power to the drive seat, enabling the drive seat to slide on the surface of the positioning seat.

[0011] Preferably, a driving block is slidably disposed at the end of the driving seat away from the positioning seat, a driving rod is fixedly disposed at the end of the driving block away from the driving seat, and limiting plates are fixedly disposed on both sides of the surface of the cutting machine body, and a limiting groove for the sliding of the driving rod is opened on one side of the surface of the limiting plate.

[0012] By adopting the above technical solution, the drive seat provides power to the drive block, which in turn drives the drive block to move. The drive block then drives the drive rod to move, and the limit groove allows the drive rod to rise and fall simultaneously during the movement.

[0013] Preferably, a drive frame is fixedly provided at the end of the drive rod away from the drive block, a push block is fixedly provided at the end of the drive frame away from the drive rod, and a protective sleeve is fixedly provided on the surface of the push block.

[0014] By adopting the above technical solution, the movement of the drive rod provides power to the drive frame, the drive frame drives the push block to move, pushes out the cut PCB board, and the protective sleeve prevents the PCB board from being scratched when it is pushed out.

[0015] Preferably, a photoelectric sensor for detecting the operating status of the PCB is fixed on the side of the limiting plate away from the driving block.

[0016] By adopting the above technical solution, the operating status of the PCB is detected by a photoelectric sensor. When the photoelectric sensor detects that the PCB is far away from the push block, the photoelectric sensor controls the electric push rod to start working, so that the electric push rod drives the push block to push the PCB out.

[0017] Preferably, the protective sleeve is made of silicone.

[0018] By adopting the above technical solution, the protective sleeve is made of silicone material, which allows the pusher to adapt to the local warping of the PCB board caused by the heat deformation during cutting, thus preventing the PCB board from failing to push out.

[0019] Preferably, a collection component for collecting the cut PCB board is provided on one side of the surface of the cutting machine body;

[0020] The collection assembly includes a collection box fixed to one side of the surface of the cutting machine body, an outlet plate fixed to the side of the collection box near the working platform, and a collection drawer inserted into the side of the collection box away from the working platform.

[0021] By adopting the above technical solution, the PCB board is automatically imported into the collection drawer through the export board, and the collection drawer is detachably installed on one side of the surface of the collection box, which enables quick replacement of the collection drawer.

[0022] Preferably, the inner surface of the collection drawer is provided with an EVA foam layer.

[0023] By adopting the above technical solution, the EVA foam layer can be set to protect the PCB board inside the collection drawer.

[0024] In summary, this application includes at least one of the following beneficial technical effects:

[0025] 1. The CCD vision positioning device automatically identifies the mark points on the PCB board during the cutting process to locate and scribe laser cutting lines, compensating for material deformation or alignment deviations and improving the cutting accuracy of the PCB board. At the same time, the galvanometer is linked with the X-axis linear motor moving platform, the Y-axis linear motor moving platform, and the Z-axis lifting platform to cut the PCB board, improving speed and the ability to handle complex paths, and ensuring the perpendicularity of the PCB board cutting surface, thus improving the cutting quality of the PCB board.

[0026] 2. The pusher can automatically guide the cut PCB board into the collection drawer, realizing automatic feeding of the PCB board, which helps to improve the automation of the device. The EVA foam layer inside the collection drawer can effectively prevent damage to the PCB board. Attached Figure Description

[0027] Figure 1 This is a three-dimensional structural diagram of the present application;

[0028] Figure 2 For the axis of this application Figure 1 Enlarged view of point A in the middle;

[0029] Figure 3 This is a schematic diagram of the internal hardware structure of the cutting machine body in this application;

[0030] Figure 4This is a partial three-dimensional structural diagram of the present application. Figure 1 ;

[0031] Figure 5 For this application Figure 4 Enlarged view of point B in the middle;

[0032] Figure 6 For this application Figure 4 Enlarged view of point C in the middle;

[0033] Figure 7 This is a partial three-dimensional structural diagram of the present application. Figure 2 ;

[0034] Figure 8 For this application Figure 7 Enlarged view of point D in the middle;

[0035] Figure 9 For this application Figure 7 Enlarged diagram of point E in the middle.

[0036] Reference numerals: 1. Cutting machine body; 11. Laser; 12. Galvanometer; 13. CCD vision positioning device; 14. X-axis linear motor moving platform; 15. Y-axis linear motor moving platform; 16. Z-axis lifting platform; 17. Dust collection device;

[0037] 2. Safety door; 3. Work platform;

[0038] 4. Automatic feeding mechanism; 41. Drive box; 42. Electric push rod; 43. Drive base; 431. Sliding column; 432. Guide block; 44. Drive block; 441. Sliding sleeve; 45. Limit plate; 451. Limit groove; 452. Photoelectric sensor; 46. Drive rod; 47. Drive frame; 48. Push block; 481. Protective sleeve;

[0039] 5. Collection components; 51. Collection box; 52. Collection drawer; 521. Insert block; 522. Handle; 53. Outlet plate;

[0040] 6. Positioning seat; 61. Drive space; 62. Guide groove;

[0041] 7. Micro switch. Detailed Implementation

[0042] The following is in conjunction with the appendix Figures 1-9 This application will be described in further detail.

[0043] This application discloses a semiconductor PCB laser depaneling and cutting machine.

[0044] Reference Figures 1-3A semiconductor PCB laser depaneling and cutting machine includes a cutting machine body 1, which has a built-in computer system. Users can easily use the software built into the system to draw cutting patterns. A safety door 2 is installed on one side of the surface of the cutting machine body 1. A work platform 3 is set on one side of the surface of the cutting machine body 1. The work platform 3 is 300mm*300mm (side length). A laser 11 is set inside the cutting machine body 1. The laser 11 is a 20W ultraviolet laser generator.

[0045] Laser 11 emits ultraviolet light with a wavelength of 355nm and uses the principle of cold processing to perform photochemical decomposition on the PCB board to achieve material cutting, avoiding thermal damage.

[0046] Reference Figures 1-3 The cutting machine body 1 is equipped with a galvanometer 12 for controlling the direction of the laser beam emitted by the laser 11 and a CCD vision positioning device 13 for positioning the MARK points on the PCB board. The galvanometer 12 consists of two orthogonal reflectors (X-axis and Y-axis) and a servo motor. The CCD vision positioning device 13 is based on machine vision technology. It acquires PCB images through an industrial camera CCD, calculates the coordinates of the MARK points through image processing algorithms, and makes the error ≤ ±0.05mm. It is linked with the CNC system to adjust the laser path to achieve a cutting accuracy of ±0.1mm.

[0047] After the laser beam is reflected by the galvanometer 12, the direction of the laser beam is quickly changed by controlling the angle of the two reflectors, realizing scanning motion in a two-dimensional plane. The CCD vision positioning device 13 captures the Mark point on the PCB board, i.e. the positioning reference point, calculates the deviation between the actual position and the program-set position, and automatically adjusts the laser cutting path (closed-loop feedback) through software to compensate for the positioning error in the PCB board processing.

[0048] Reference Figures 1-3 The cutting machine body 1 is equipped with an X-axis linear motor moving platform 14 for driving the galvanometer 12 to move along the X-axis and a Z-axis lifting platform 16 for driving the galvanometer 12 to rise and fall along the Z-axis. The Z-axis lifting platform 16 is fixedly connected to the galvanometer 12 and the CCD vision positioning device 13. The cutting machine body 1 is also equipped with a Y-axis linear motor moving platform 15 for driving the working platform 3 to move along the Y-axis. The linear motors on the X-axis linear motor moving platform 14 and the Y-axis linear motor moving platform 15 achieve non-contact linear motion through the principle of electromagnetic induction: the primary coil is energized to generate a traveling wave magnetic field, and the secondary permanent magnet is driven by the Lorentz force. The Z-axis lifting platform 16 drives the lead screw and nut pair through the rotation of the motor to achieve vertical lifting and lowering of the Z-axis.

[0049] The galvanometer 12, in conjunction with the X-axis linear motor moving platform 14 and the Y-axis linear motor moving platform 15, is able to draw complex cutting paths on the PCB surface and complete the board separation without mechanical contact. The galvanometer 12 guides the laser 11 to emit a laser beam for scribing and cutting by swinging.

[0050] Reference Figures 1-3 The cutting machine body 1 is equipped with a dust collection device 17, which is a smoke purifier. The smoke purifier includes a universal suction arm, a high-temperature resistant suction hose, a dust hood with an airflow regulating valve, a flame arrestor, a flame-retardant high-efficiency filter, a pulse backflushing device, a pulse solenoid valve, a differential pressure gauge, a cleanroom, an activated carbon filter, a dust collection drawer assembly, flame-retardant sound-absorbing cotton, Korean-style casters with brakes, a fan, a motor, and an electrical control box. The high-temperature resistant suction hose is positioned near the PCB board cutting location to effectively remove smoke and dust during the PCB board cutting process, providing a pollution-free cutting environment for the PCB board. The dust collection device 17 uses a centrifugal fan with an airflow of 1800 m³ / h. 3 / h, equipped with HEPA 13 grade filter element, 50mm inner diameter of vacuum hose, with an adjustable universal vacuum cover at the end, and the distance from the cutting point is ≤50mm.

[0051] By installing a dust extraction device 17 on the cutting machine body 1, a pollution-free cutting environment is provided for the cutting machine body 1 to cut PCB boards.

[0052] It should be noted that the galvanometer 12, the X-axis linear motor moving platform 14, the Y-axis linear motor moving platform 15, and the Z-axis lifting platform 16 are all electrically connected to the CNC system built into the cutting machine body 1, and multi-axis linkage control is realized through the CNC system.

[0053] By placing the PCB board onto the work platform 3, the Y-axis linear motor moving platform 15 transports the PCB board to the center position of the galvanometer 12. The CCD vision positioning device 13 captures the MARK points on the PCB board for automatic positioning. Then, the cutting software in the computer performs line editing and positioning operations. The galvanometer 12 swings to guide the laser 11 to emit a laser beam for scribing and cutting. The scribing and cutting drawing file is adjusted in the software to change the rotation direction. After processing, it is sent to the galvanometer 12, X-axis linear motor moving platform 14, and Y-axis linear motor moving platform 15 to cut the PCB board in conjunction, increasing the cutting accuracy. The Z-axis lifting platform 16 changes the position of the galvanometer 12 and the CCD vision positioning device 13, thereby changing the focus of the laser and the industrial camera CCD. This makes the cutting accuracy of the CCD vision positioning device 13 linked to the PCB board cutting within ±0.01mm, thus achieving precision processing. The laser-cut shape is complete, and the thermal effect is small, protecting the components.

[0054] Reference Figures 1-8A positioning seat 6 is fixedly provided on one side of the surface of the cutting machine body 1. An automatic feeding mechanism 4 for automatically ejecting the cut PCB board is provided on one side of the surface of the cutting machine body 1. The automatic feeding mechanism 4 includes a drive box 41 fixedly provided on one side of the surface of the cutting machine body 1. An electric push rod 42 is provided inside the drive box 41. The fixed end of the electric push rod 42 is fixedly provided on the inner wall of the drive box 41. The telescopic end of the electric push rod 42 penetrates through the inner wall of the drive box 41. A drive seat 43 is fixedly provided on the telescopic end of the electric push rod 42. A drive space 61 is opened on one side of the surface of the positioning seat 6. Microswitches 7 are fixedly installed on both sides of the inner wall of the drive space 61. The contacts of the microswitches 7 face the surface of the drive seat 43, so that the surface of the drive seat 43 can press the contacts of the microswitches 7. The surface of the drive seat 43 abuts against the inner wall of the drive space 61, so that the drive seat 43 can slide stably inside the drive space 61. Guide blocks 432 are fixed on both sides of the surface of the drive seat 43. Guide grooves 62 are opened on both sides of the inner wall of the drive space 61. The surface of the guide blocks 432 abuts against the inner wall of the guide grooves 62, so that the guide blocks 432 can slide stably inside the guide grooves 62.

[0055] The electric actuator 42 provides power to the drive base 43. The telescopic end of the electric actuator 42 drives the drive base 43 to reciprocate, so that the drive base 43 can press the contacts of the two micro switches 7, and the micro switches 7 control the operating state of the electric actuator 42.

[0056] Reference Figures 1-8 A drive block 44 is provided at the end of the drive seat 43 away from the positioning seat 6. A sliding column 431 is symmetrically fixed inside the drive seat 43. A sliding sleeve 441 is symmetrically fixed on the side of the drive block 44 near the surface of the drive seat 43. The sliding sleeve 441 is fitted on the surface of the sliding column 431. The surface of the sliding column 431 abuts against the inner surface of the sliding sleeve 441, so that the sliding sleeve 441 slides stably along the surface of the sliding column 431. A drive rod 46 is fixed at the end of the drive block 44 away from the drive seat 43. The drive rod 46 is cylindrical in shape. Limiting plates 45 are fixed on both sides of the surface of the cutting machine body 1. A limiting groove 451 for sliding the drive rod 46 is opened on one side of the surface of the limiting plate 45. The limiting groove 451 is composed of two semi-circular grooves, two strip grooves and one inclined groove. The diameter of the drive rod 46 is the same as the diameter of the semi-circular groove. The surface of the drive rod 46 abuts against the inner wall of the limiting groove 451, so that the drive rod 46 can slide stably inside the limiting groove 451.

[0057] The drive seat 43 provides power to the drive block 44, enabling the drive block 44 to slide within the limiting groove 451, thereby driving the drive rod 46 to move.

[0058] Reference Figures 1-7A photoelectric sensor 452 for detecting the operating status of the PCB is fixed on the side of the limiting plate 45 away from the driving block 44. A driving frame 47 is fixed on the end of the driving rod 46 away from the driving block 44. A push block 48 is fixed on the end of the driving frame 47 away from the driving rod 46. A protective sleeve 481 is fixed on the surface of the push block 48 near the photoelectric sensor 452. The protective sleeve 481 covers the surface of the push block 48 near the working platform 3 and the surface near the photoelectric sensor 452. The photoelectric sensor 452 is installed at an angle of 15 degrees on one side of the surface of the limiting plate 45.

[0059] The drive rod 46 provides power to the drive frame 47, causing the drive frame 47 to move. The drive frame 47 drives the push block 48 to move, and the push block 48 drives the protective sleeve 481 to move, pushing out the PCB board on the surface of the work platform 3.

[0060] It should be noted that the user needs to install the controller inside the drive box 41, connect the controller, electric actuator 42, photoelectric sensor 452 and two micro switches 7 to the power supply respectively, connect the electric actuator 42 to the controller, and connect the controller to the photoelectric sensor 452 and the two micro switches 7.

[0061] When the drive seat 43 moves to the drive space 61 away from the inner wall of the drive box 41, the drive seat 43 presses the contact of the micro switch 7 away from the drive box 41, causing the electric push rod 42 to change from the extended mode to the retracted mode, causing the telescopic end of the electric push rod 42 to retract. When the drive seat 43 moves to the drive space 61 close to the inner wall of the drive box 41, the drive seat 43 presses the contact of the micro switch 7 close to the drive box 41, causing the electric push rod 42 to stop running.

[0062] When the photoelectric sensor 452 detects that the PCB board passes under the pusher block 48 and gradually moves away from the pusher block 48, the photoelectric sensor 452 drives the electric push rod 42 to start working, causing the telescopic end of the electric push rod 42 to start extending.

[0063] Reference Figures 1-9 A collection component 5 for collecting the cut PCB board is provided on one side of the surface of the cutting machine body 1. The collection component 5 includes a collection box 51 fixed on one side of the surface of the cutting machine body 1. A collection drawer 52 is inserted into the surface of the collection box 51 away from the working platform 3. Insert blocks 521 are fixed on both sides of the surface of the collection drawer 52. The surface of the insert block 521 away from the collection box 51 is cross-shaped. The insert block 521 is slidably disposed on the surface of the collection box 51 away from the working platform 3. The surface of the insert block 521 abuts against the inner surface of the collection box 51. A handle 522 is fixed in the middle of the surface of the collection drawer 52 away from the collection box 51.

[0064] By pulling the handle 522, the collection drawer 52 is powered, enabling it to be quickly pulled out from the side of the collection box 51 away from the work platform 3.

[0065] Reference Figures 1-7 A guide plate 53 is fixed on one side of the collection box 51 near the working platform 3. The surface of the guide plate 53 is inclined, and the highest point of the inclined surface of the guide plate 53 is on the same horizontal line as the surface of the working platform 3. The lowest point of the inclined surface of the guide plate 53 is on the same vertical line as the surface of the collection box 51 and the inner surface of the collection drawer 52 near the working platform 3. The inner surface of the collection drawer 52 is provided with an EVA foam layer. The distance between the lowest point of the inclined surface of the guide plate 53 and the inner surface of the collection drawer 52 is 5-10mm. The angle between the highest point of the inclined surface of the guide plate 53 and the horizontal plane of the collection box 51 is 35°. The surface roughness Ra≤1.6μm ensures that the PCB board slides smoothly.

[0066] Push block 48 pushes the PCB board onto the surface of the output board 53, causing the PCB board to slide from the highest point of the slope on the surface of the output board 53 to the lowest point of the slope. Then the PCB board slides into the inside of the collection drawer 52, where the EVA foam layer inside the collection drawer 52 cushions the PCB board.

[0067] It should be noted that: the photoelectric sensor 452 adopts the E3Z-LS63 through-beam series, the electric actuator 42 adopts the DYTZ-500 series, and the micro switch 7 adopts the TZ-1105 series.

[0068] The reflective surface of galvanometer 12 and the filter need to be blown and cleaned daily, and deeply cleaned every 20 hours, using anhydrous ethanol for one-way wiping; the HEPA filter element needs to be replaced every 100 hours (or when the pressure difference is ≥2500Pa), and the old filter element needs to be sealed when replacing; the micro switch 7 and photoelectric sensor 452 need to be checked for response function daily, and the sensing accuracy needs to be calibrated weekly.

[0069] It should be added that: the sliding column 431 is made of SUJ2 bearing steel, the guide block 432 is made of copper alloy, the sliding sleeve 441 is made of engineering plastic, the drive rod 46 is made of alloy steel, the protective sleeve 481 is made of silicone, the working platform 3 and the guide plate 53 are made of phenolic resin, and the remaining structures, except for the cutting machine body 1, laser 11, galvanometer 12, CCD vision positioning device 13, X-axis linear motor moving platform 14, Y-axis linear motor moving platform 15, Z-axis lifting platform 16, safety door 2 and the above structures, are all made of aluminum alloy.

[0070] The push block 48 is initially positioned above the surface of the work platform 3.

[0071] The implementation principle of a semiconductor PCB laser depaneling and cutting machine according to an embodiment of this application is as follows: When using this application, firstly, the PCB board is placed on the surface of the working platform 3, and the Y-axis linear motor moving platform 15 is started. The Y-axis linear motor moving platform 15 drives the working platform 3 to move linearly along the Y-axis, and the PCB board is transported to the position below the center of the galvanometer 12. The CCD vision positioning device 13 is started, and the CCD vision positioning device 13 captures the MARK points on the PCB board to achieve automatic positioning. Then, the cutting software in the computer of the cutting machine body 1 is used to perform line editing and positioning operations.

[0072] The laser beam emitted by the laser 11 is guided by the swinging galvanometer 12 to perform scribing and cutting. The scribing and cutting drawing file is adjusted in the software to change the rotation direction. After processing, it is sent to the galvanometer 12 and the X-axis linear motor moving platform 14 and Y-axis linear motor moving platform 15 to cut the PCB board, which increases the cutting accuracy. By activating the Z-axis lifting platform 16, the Z-axis lifting platform 16 drives the galvanometer 12 and the CCD vision positioning device 13 to move up and down, changing the position of the galvanometer 12 and the CCD vision positioning device 13, thereby changing the focus of the laser and the camera. This makes the cutting accuracy of the PCB board separation by the CCD vision positioning device 13 within ±0.1mm of the cutting machine body, thus achieving precision processing. The laser-cut shape is complete and the thermal effect is small, protecting the components.

[0073] The dust collection device 17 is activated to remove the smoke and dust generated during the cutting process. Under specific conditions, the user can adjust the output power of the laser 11 and the cutting speed according to their needs to control the cutting depth and color. The greater the output power of the laser 11 and the slower the cutting speed, the deeper the cutting depth and color; conversely, the shallower the cutting depth and color.

[0074] After the PCB board is cut, the Y-axis linear motor moving platform 15 moves the cut PCB board out, so that the PCB board passes through the photoelectric sensor 452. When the photoelectric sensor 452 detects that the PCB board passes under the push block 48 and gradually moves away from the push block 48, the photoelectric sensor 452 drives the electric push rod 42 to start working, so that the telescopic end of the electric push rod 42 starts to extend.

[0075] The telescopic end of the electric push rod 42 drives the drive seat 43 to move closer to the collection box 51. The drive seat 43 drives the drive block 44 to move closer to the collection box 51. The drive block 44 drives the drive rod 46 to slide inside the limiting groove 451, so that the drive rod 46 moves horizontally and downwards at the same time. After the surface of the drive rod 46 comes into contact with the surface of the limiting groove 451 near the collection box 51, the surfaces of the push block 48 and the protective sleeve 481 come into contact with the surface of the work platform 3. The drive rod 46 drives the drive frame 47 to move closer to the collection box 51. The drive frame 47 drives... Push block 48 approaches collection box 51, thereby pushing out the PCB board located on the surface of work platform 3, so that the PCB board is located at the highest point of the inclined surface of guide plate 53, allowing the PCB board to slide freely onto the EVA foam layer inside collection drawer 52. Then, the user pulls handle 522 to move handle 522 away from collection box 51. Handle 522 moves collection drawer 52 away from collection box 51, thereby pulling collection drawer 52 out from one side of the surface of collection box 51, quickly replacing collection drawer 52 and preventing damage from collisions of multiple batches of PCB boards.

[0076] When the PCB board is pushed onto the surface of the ejector board 53, the surface of the drive seat 43 contacts the inner wall of the drive space 61 near the collection box 51. The surface of the drive seat 43 presses the contact of the micro switch 7 near the collection box 51. The micro switch 7 controls the telescopic end of the electric push rod 42 to retract, causing the telescopic end of the electric push rod 42 to drive the drive seat 43 away from the collection box 51. The transmission principle of the push block 48 and the drive seat 43 is the same as above, but in the opposite direction. When the drive seat 43 moves to contact the inner wall of the drive space 61 away from the collection box 51, the surface of the drive seat 43 presses the contact of the micro switch 7 near the drive box 41, causing the micro switch 7 near the drive box 41 to control the electric push rod 42 to stop running.

[0077] The above are merely optional embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A semiconductor PCB laser dicing saw, characterized by: The machine includes a cutting machine body (1), a working platform (3) is provided on one side of the surface of the cutting machine body (1), a laser (11) is provided inside the cutting machine body (1), and a positioning seat (6) is fixed on one side of the surface of the cutting machine body (1). The cutting machine body (1) is equipped with a galvanometer (12) for controlling the direction of the laser beam emitted by the laser (11) and a CCD vision positioning device (13) for positioning the MARK point on the PCB board. The cutting machine body (1) is equipped with an X-axis linear motor moving platform (14) for driving the galvanometer (12) to move along the X-axis and a Z-axis lifting platform (16) for driving the galvanometer (12) to rise and fall along the Z-axis. The cutting machine body (1) is equipped with a Y-axis linear motor moving platform (15) for driving the working platform (3) to move along the Y-axis. An automatic feeding mechanism (4) for automatically pushing out the cut PCB board is provided on one side of the surface of the cutting machine body (1).

2. A semiconductor PCB laser dicing and cutting machine according to claim 1, characterized in that: The automatic feeding mechanism (4) includes a drive box (41) fixed on one side of the surface of the cutting machine body (1). An electric push rod (42) is provided inside the drive box (41). The telescopic end of the electric push rod (42) passes through the inner wall of the drive box (41) and is fixed with a drive seat (43) that is slidably disposed on one side of the surface of the positioning seat (6).

3. A semiconductor PCB laser dicing and cutting machine according to claim 2, characterized in that: A drive block (44) is slidably provided at one end of the drive seat (43) away from the positioning seat (6), and a drive rod (46) is fixedly provided at one end of the drive block (44) away from the drive seat (43). Limiting plates (45) are fixedly provided on both sides of the surface of the cutting machine body (1), and a limiting groove (451) for sliding of the drive rod (46) is provided on one side of the surface of the limiting plate (45).

4. The semiconductor PCB laser dicing machine of claim 3, wherein: A drive frame (47) is fixedly provided at one end of the drive rod (46) away from the drive block (44), and a push block (48) is fixedly provided at one end of the drive frame (47) away from the drive rod (46). A protective sleeve (481) is fixedly provided on the surface of the push block (48).

5. The semiconductor PCB laser dicing machine of claim 3, wherein: A photoelectric sensor (452) for detecting the operating status of the PCB is fixed on the side of the limiting plate (45) away from the driving block (44).

6. A semiconductor PCB laser dicing machine according to claim 4, wherein: The protective sleeve (481) is made of silicone.

7. The semiconductor PCB laser dicing machine of claim 1, wherein: The surface of the cutting machine body (1) is provided with a collection component (5) for collecting the cut PCB board; The collecting component (5) includes a collecting box (51) fixed on one side of the surface of the cutting machine body (1), a guide plate (53) fixed on the side of the collecting box (51) near the working platform (3), and a collecting drawer (52) inserted on the side of the collecting box (51) away from the working platform (3).

8. A semiconductor PCB laser dicing saw according to claim 7, wherein: The inner surface of the collection drawer (52) is provided with an EVA foam layer.

Images