Circuit board and electronic equipment

Abstract

The utility model relates to a circuit board and electronic equipment. The circuit board comprises a circuit board body, the circuit board body is provided with a welding area, and the welding area is used for welding a first audio power amplification chip or a second audio power amplification chip; the first bonding pad is located in the welding area, and the first bonding pad is used for being welded to input and output pins of a first audio power amplification chip; the second bonding pad is located in the welding area, and the second bonding pad is used for being welded to a communication pin of a second audio power amplification chip. Due to the fact that the circuit board is provided with the first bonding pad and the second bonding pad, any one of the first audio power amplification chip and the second audio power amplification chip which are different in control mode can be welded, and the compatibility of the circuit board is improved. Moreover, when the audio power amplification chip welded on the circuit board is damaged, the first audio power amplification chip or the second audio power amplification chip can be selected for replacement, so that the maintenance difficulty of the circuit board is reduced.

Description

Technical Field

[0001] This disclosure relates to the field of audio technology, and more particularly to a circuit board and electronic device. Background Technology

[0002] Currently, audio power amplifier chips are used to amplify input audio signals to drive audio playback devices. However, because different audio power amplifier chips may have different control methods, and a circuit board can only solder one type of audio power amplifier chip, poor compatibility issues arise. Utility Model Content

[0003] To overcome the problems existing in the related technologies, this disclosure provides a circuit board and an electronic device.

[0004] According to a first aspect of this disclosure, a circuit board is provided, the circuit board comprising:

[0005] The circuit board body has a soldering area for soldering a first audio power amplifier chip or a second audio power amplifier chip.

[0006] A first pad is located in the soldering area and is used to solder to the input / output pins of the first audio power amplifier chip.

[0007] The second pad, located in the soldering area, is used to solder to the communication pin of the second audio power amplifier chip.

[0008] In some embodiments of this disclosure, the communication pins of the second audio power amplifier chip include a first communication pin and a second communication pin; the second pad includes:

[0009] The first sub-pad is used to solder to the first communication pin of the second audio power amplifier chip;

[0010] The second sub-pad is used to solder to the second communication pin of the second audio power amplifier chip.

[0011] In some embodiments of this disclosure, the input / output pins of the first audio power amplifier chip are general purpose input / output pins; and / or, the first communication pin of the second audio power amplifier chip is a clock signal pin, and the second communication pin of the second audio power amplifier chip is a data signal pin.

[0012] In some embodiments of this disclosure, the circuit board further includes:

[0013] A first conductive line is disposed on the circuit board body. The first end of the first conductive line is electrically connected to the first pad, and the second end of the first conductive line is used to be electrically connected to the input / output pin of the control chip.

[0014] The second conductive line is disposed on the circuit board body. The first end of the second conductive line is electrically connected to the second pad, and the second end of the second conductive line is used to electrically connect to the communication pin of the control chip.

[0015] In some embodiments of this disclosure, the circuit board further includes:

[0016] The third pad is located in the welding area and is used to weld to the inverting input pin of the first audio power amplifier chip or the second audio power amplifier chip.

[0017] A fourth pad, located in the soldering area, is used to solder to the in-phase input pin of the first audio power amplifier chip or the second audio power amplifier chip; and / or,

[0018] The fifth pad, located in the soldering area, is used to solder to the inverting output pin of the first audio power amplifier chip or the second audio power amplifier chip.

[0019] The sixth pad is located in the soldering area and is used to solder to the in-phase output pin of the first audio power amplifier chip or the second audio power amplifier chip.

[0020] In some embodiments of this disclosure, the circuit board further includes:

[0021] A third conductive line is disposed on the circuit board body. The first end of the third conductive line is electrically connected to the third pad, and the second end of the third conductive line is used to be electrically connected to the first pin of the codec.

[0022] A fourth conductive line is disposed on the circuit board body. The first end of the fourth conductive line is electrically connected to the fourth pad, and the second end of the fourth conductive line is used to electrically connect to the second pin of the codec; and / or,

[0023] A fifth conductive line is disposed on the circuit board body. The first end of the fifth conductive line is electrically connected to the fifth pad, and the second end of the fifth conductive line is used to electrically connect to the first pin of the speaker.

[0024] A sixth conductive line is disposed on the circuit board body. The first end of the sixth conductive line is electrically connected to the sixth pad, and the second end of the sixth conductive line is used to electrically connect to the second pin of the speaker.

[0025] In some embodiments of this disclosure, the third conductive line and the fourth conductive line are electrically connected to the codec via a first filter circuit; and / or, the fifth conductive line and the sixth conductive line are electrically connected to the speaker via a second filter circuit.

[0026] In some embodiments of this disclosure, the circuit board further includes:

[0027] The seventh pad is located in the soldering area and is used to solder to the power supply pin of the first audio power amplifier chip or the second audio power amplifier chip.

[0028] The eighth pad is located in the soldering area and is used to solder to the power supply pin of the first audio power amplifier chip or the second audio power amplifier chip.

[0029] The ninth pad is located in the soldering area and is used to solder to the ground pin of the first audio power amplifier chip or the second audio power amplifier chip.

[0030] In some embodiments of this disclosure, the circuit board further includes:

[0031] A seventh conductive line is disposed on the circuit board body. The first end of the seventh conductive line is electrically connected to the seventh pad, and the second end of the seventh conductive line is used to be electrically connected to the output pin of the power supply.

[0032] The eighth conductive line is disposed on the circuit board body. The first end of the eighth conductive line is electrically connected to the ninth pad, and the second end of the eighth conductive line is used for grounding connection.

[0033] In some embodiments of this disclosure, the circuit board further includes:

[0034] The tenth pad is located in the soldering area and is used to solder to the boost pin of the first audio power amplifier chip or the second audio power amplifier chip.

[0035] The eleventh pad is located in the soldering area and is used to solder to the first capacitor pin of the first audio power amplifier chip or the second audio power amplifier chip.

[0036] The twelfth pad is located in the soldering area and is used to solder to the second capacitor pin of the first audio power amplifier chip or the second audio power amplifier chip.

[0037] In some embodiments of this disclosure, the circuit board includes:

[0038] The ninth conductive line has a first end that is electrically connected to the tenth pad and a second end that is used to be electrically connected to an inductor.

[0039] The tenth conductive line has a first end that is electrically connected to the eleventh pad and a second end that is electrically connected to the first end of the flying capacitor.

[0040] The eleventh conductive line has its first end electrically connected to the twelfth pad and its second end electrically connected to the second end of the flying capacitor.

[0041] According to a second aspect of this disclosure, an electronic device is provided, the electronic device including the circuit board as described above.

[0042] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0043] The circuit board includes a circuit board body, a first solder pad, and a second solder pad. Both the first and second solder pads are located in the soldering area of ​​the circuit board body. The first solder pad is used to solder the input / output pins of a first audio power amplifier chip, and the second solder pad is used to solder the communication pins of a second audio power amplifier chip. Because the circuit board has both the first and second solder pads, it can solder either the first or second audio power amplifier chip with different control methods, thus improving the circuit board's compatibility. Furthermore, when an audio power amplifier chip soldered to the circuit board is damaged, either the first or second audio power amplifier chip can be selected for replacement, thereby reducing the difficulty of circuit board repair.

[0044] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0045] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0046] Figure 1 This is a schematic diagram of the circuit board structure provided in an exemplary embodiment of the present disclosure;

[0047] Figure 2 This is a schematic diagram of the structure of a circuit board provided in another exemplary embodiment of this disclosure;

[0048] Figure 3 This is a schematic diagram of the structure of a circuit board provided in another exemplary embodiment of this disclosure;

[0049] Figure 4 This is a schematic diagram of the structure of an audio power amplifier circuit provided in an exemplary embodiment of the present disclosure;

[0050] Figure 5 This is a system block diagram of an electronic device provided in an exemplary embodiment of the present disclosure.

[0051] In the picture:

[0052] 10-Circuit board body; 11-Soldering area; 12-First conductive line; 13-Second conductive line; 131-First sub-conductive line; 132-Second sub-conductive line; 14-Third conductive line; 15-Fourth conductive line; 16-Fifth conductive line; 17-Sixth conductive line; 18-Seventh conductive line; 19-Eighth conductive line; 1a-Tenth conductive line; 1b-Eleventh conductive line; 20-Control chip; 30-First filter circuit; 40-Second filter circuit; 50-Audio power amplifier chip; 60-Peripheral devices; 400-Electronic equipment; 402-Processing component; 404-Memory; 406 - Power supply components; 408 Multimedia components; 410 Audio components; 412 Input / output interfaces; 414 Sensor components; 416 Communication components; 420 Processor; P1-First pad; P2-Second pad; P21-First sub-pad; P22-Second sub-pad; P3-Third pad; P4-Fourth pad; P5-Fifth pad; P6-Sixth pad; P7-Seventh pad; P71-Third sub-pad; P72-Fourth sub-pad; P8-Eighth pad; P9-Ninth pad; P11-Eleventh pad; P12-Twelfth pad; P13-Thirteenth pad; P14-Fourteenth pad; P91-... Five pads; P92 - Sixth pad; CF - Flying capacitor; C1 - First capacitor; C2 - Second capacitor; C3 - Third capacitor; C4 - Fourth capacitor; C5 - Fifth capacitor; C6 - Sixth capacitor; C7 - Seventh capacitor; C8 - Eighth capacitor; C9 - Ninth capacitor; C10 - Tenth capacitor; C11 - Eleventh capacitor; C12 - Twelfth capacitor; R1 - First resistor; R2 - Second resistor; R3 - Third resistor; R4 - Fourth resistor; R5 - Fifth resistor; R6 - Sixth resistor; R7 - Seventh resistor; R8 - Eighth resistor; R9 - Ninth resistor; R10 - Tenth resistor; FB1 - First ferrite bead; FB2 - Second ferrite bead Beads; GPIO - General Purpose Input / Output Pin; SCL - Clock Signal Pin; SDA - Data Signal Pin; INN - Inverting Input Pin; INP - Non-Inverting Input Pin; VON - Inverting Output Pin; VOP - Non-Inverting Output Pin; VDD1 - First Power Supply Pin; VDD2 - Second Power Supply Pin; PVDD - Power Supply Pin; GND1 - First Ground Pin; GND2 - Second Ground Pin; C1P - First Capacitor Pin; C1N - Second Capacitor Pin; C2P - Third Capacitor Pin; C2N - Fourth Capacitor Pin; CO - Codec; SPK - Speaker; VSYS - Power Supply; GND - Ground. Detailed Implementation

[0053] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this invention as detailed in the appended claims. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0054] Currently, control chips are electrically connected to various functional chips via pads and conductive lines on circuit boards, enabling different functions of electronic devices. For example, a control chip can be electrically connected to an RF transceiver chip via pads on the circuit board, allowing it to receive and transmit RF signals for communication within the electronic device. A control chip can also be electrically connected to an audio power amplifier chip via pads on the circuit board, amplifying low-power audio signals to drive audio playback devices such as speakers or headphones.

[0055] There are generally two types of audio power amplifier chips: a first audio power amplifier chip controlled by general purpose input / output (GPIO) pins and a second audio power amplifier chip controlled based on the IIC communication protocol. However, because the circuit board only has one type of solder pad for soldering audio power amplifier chips, it can only solder either the first or second audio power amplifier chip, and is not compatible with either the first or second audio power amplifier chip. Therefore, the circuit board has a poor compatibility problem.

[0056] Based on this, the present disclosure provides a circuit board including a first pad and a second pad. Since the first pad is used to solder a first audio power amplifier chip, and the second pad is used to solder a second audio power amplifier chip, the problem of incompatibility between the circuit board and either the first or second audio power amplifier chip is avoided, thereby improving the circuit board's compatibility. Furthermore, when the audio power amplifier chip soldered to the circuit board is damaged, either the first or second audio power amplifier chip can be selected for replacement, thus reducing the difficulty of circuit board repair.

[0057] An exemplary embodiment of this disclosure provides a circuit board, such as Figure 1As shown, the circuit board includes a circuit board body 10, a first pad P1, and a second pad P2. The circuit board body 10 has a soldering area 11 for soldering a first audio power amplifier chip or a second audio power amplifier chip. The first pad P1 is located in the soldering area 11 and is used to solder to the input / output pins of the first audio power amplifier chip. The second pad P2 is located in the soldering area 11 and is used to solder to the communication pins of the second audio power amplifier chip.

[0058] In this embodiment, the circuit board includes a circuit board body, a first solder pad, and a second solder pad. Both the first and second solder pads are located in the soldering area of ​​the circuit board body. The first solder pad is used to solder the input / output pins of the first audio power amplifier chip, and the second solder pad is used to solder the communication pins of the second audio power amplifier chip. Because the circuit board has both the first and second solder pads, it can solder either the first or second audio power amplifier chip with different control methods, thereby improving the circuit board's compatibility. Furthermore, when an audio power amplifier chip soldered to the circuit board is damaged, either the first or second audio power amplifier chip can be selected for replacement, thus reducing the difficulty of circuit board repair.

[0059] For example, the circuit board can be the motherboard of an electronic device.

[0060] In one embodiment, such as Figure 2 As shown, the communication pins of the second audio power amplifier chip include a first communication pin and a second communication pin. The second pad P2 includes a first sub-pad P21 and a second sub-pad P22. The first sub-pad P21 is used to solder to the first communication pin of the second audio power amplifier chip, and the second sub-pad P22 is used to solder to the second communication pin of the second audio power amplifier chip.

[0061] In this embodiment, corresponding first sub-pads and second sub-pads are respectively set on the circuit board for the first communication pin and the second communication pin of the second audio power amplifier chip, so that the second audio power amplifier chip can communicate through the first sub-pad and the second sub-pad to improve the reliability of the circuit board.

[0062] In one embodiment, the input / output pins of the first audio power amplifier chip are general purpose input / output pins.

[0063] In this embodiment, by transmitting high and low level signals to the general-purpose input / output pins of the first audio power amplifier chip, functions such as turning the first audio power amplifier chip on and off, setting the audio signal input source, and setting the gain can be realized, thereby reducing the complexity of controlling the audio power amplifier chip.

[0064] In one embodiment, the first communication pin of the second audio power amplifier chip is a clock signal (Serial ClockLine, SCL) pin, and the second communication pin of the second audio power amplifier chip is a data signal (Serial Data Line, SDA) pin.

[0065] In this embodiment, by transmitting corresponding signals to the clock signal pin and data signal pin of the second audio power amplifier chip, functions such as turning the second audio power amplifier chip on and off, setting the audio signal input terminal, setting the gain, and providing status feedback can be realized, thereby improving the reliability of the audio power amplifier chip control.

[0066] For example, the clock signal pin and data signal pin transmit signals through the clock signal line and data signal line, respectively. This not only enables the functions of general-purpose input / output pins but also allows for more complex configuration and control of the audio power amplifier chip. Furthermore, test points can be set on the clock signal line and data signal line for electrical connection to test equipment to test the second audio power amplifier chip.

[0067] In one embodiment, such as Figure 3 As shown, the circuit board also includes a first conductive line 12 and a second conductive line 13. The first conductive line 12 is disposed on the circuit board body 10, with its first end electrically connected to the first pad P1 and its second end electrically connected to the input / output pins of the control chip 20. The second conductive line 13 is disposed on the circuit board body 10, with its first end electrically connected to the second pad P2 and its second end electrically connected to the communication pins of the control chip 20.

[0068] In this embodiment, the first pad and the input / output pins of the control chip are electrically connected via a first conductive line. This allows the control chip to transmit high and low level signals to the first audio power amplifier chip via the first conductive line to control the first audio power amplifier chip, thereby reducing the complexity of controlling the first audio power amplifier chip. The second pad and the communication pins of the control chip are electrically connected via a second conductive line. This allows the control chip to communicate with the second audio power amplifier chip via the second conductive line, thereby improving the reliability of controlling the second audio power amplifier chip.

[0069] For example, the control chip 20 can be a system on chip (SOC), i.e., the main chip of an electronic device, or a microcontroller unit (MCU).

[0070] For example, after the audio power amplifier chip is soldered onto the circuit board body 10, when the control chip 20 cannot read the information of the second audio power amplifier chip via communication, the soldered audio power amplifier chip is the first audio power amplifier chip, and the control chip 20 controls the first audio power amplifier chip through the first conductive line 12 and the first pad P1. When the control chip 20 can read the information of the second audio power amplifier chip via communication, the soldered audio power amplifier chip is the second audio power amplifier chip, and the control chip 20 communicates with the second audio power amplifier chip through the second conductive line 13 and the second pad P2.

[0071] For example, in an audio power amplifier chip that has both input / output pins and communication pins, the input / output pins are soldered to the first pad P1, and the communication pins are soldered to the second pad P2. The control chip 20 preferentially communicates with the audio power amplifier chip via the second conductive line 13 and the second pad P2. When the control chip 20 cannot read information from the second audio power amplifier chip via communication, it controls the audio power amplifier chip via the first conductive line 12 and the first pad P1.

[0072] For example, the circuit board may be provided with corresponding pads for soldering to the communication pins and input / output pins of the control chip 20, respectively.

[0073] For example, the second pad P2 includes a first sub-pad P21 and a second sub-pad P22. The communication pins of the control chip 20 include clock signal pins and data signal pins. The second conductive line 13 includes a first sub-conductive line 131 and a second sub-conductive line 132. The first end of the first sub-conductive line 131 is electrically connected to the first sub-pad P21, and the second end of the first sub-conductive line 131 is electrically connected to the clock signal pin. The first end of the second sub-conductive line 132 is electrically connected to the second sub-pad P22, and the second end of the second sub-conductive line 132 is electrically connected to the data signal pin. Wherein, the first sub-conductive line 131 is a clock signal line, and the second conductive line 132 is a data signal line.

[0074] For example, the circuit board also includes a first resistor, a second resistor, and a third resistor. The first end of the first resistor is electrically connected to the input / output pins of both the audio power amplifier chip and the control chip 20, and the second end of the first resistor is electrically connected to ground. The first end of the second resistor is electrically connected to the clock signal pins of both the audio power amplifier chip and the control chip 20, the second end of the second resistor is electrically connected to the second end of the third resistor and the control pin of the control chip 20, and the first end of the third resistor is electrically connected to the data signal pins of both the audio power amplifier chip and the control chip. Corresponding pads may be provided on the circuit board for soldering the first, second, and third resistors.

[0075] In one embodiment, the circuit board further includes a third pad P3 and a fourth pad P4. The third pad P3 is located in the soldering area 11 and is used to solder to the inverting input pin of the first audio power amplifier chip or the second audio power amplifier chip. The fourth pad P4 is located in the soldering area 11 and is used to solder to the non-inverting input pin of the first audio power amplifier chip or the second audio power amplifier chip.

[0076] In this embodiment, since the audio signal is transmitted in a differential form, it has strong anti-interference ability. By soldering the third and fourth pads to the inverting input pin and the non-inverting input pin of the audio power amplifier chip, respectively, differential audio signals can be transmitted to the audio power amplifier chip to improve the reliability of the circuit board.

[0077] In one embodiment, the circuit board further includes a third conductive line 14 and a fourth conductive line 15. The third conductive line 14 is disposed on the circuit board body 10, with its first end electrically connected to a third pad P3 and its second end electrically connected to a first pin of the codec CO. The fourth conductive line 15 is disposed on the circuit board body 10, with its first end electrically connected to a fourth pad P4 and its second end electrically connected to a second pin of the codec CO.

[0078] In this embodiment, the third pad and the first pin of the codec are electrically connected via a third conductive line, enabling the codec to transmit an inverted audio signal to the inverting input pin of the audio power amplifier chip via the third conductive line and the third pad. The fourth pad and the second pin of the codec are electrically connected via a fourth conductive line, enabling the codec to transmit a non-inverting audio differential signal to the non-inverting input pin of the audio power amplifier chip via the fourth conductive line and the fourth pad. Because the encoder can transmit differential audio signals to the audio power amplifier chip via the third and fourth conductive lines, the audio signal can be transmitted effectively, thereby improving the reliability of the circuit board.

[0079] For example, the circuit board may be provided with corresponding pads for soldering to the first and second pins of the codec CO.

[0080] In one embodiment, the third conductive line 14 and the fourth conductive line 15 are electrically connected to the codec CO through the first filter circuit 30.

[0081] In this embodiment, the first filtering circuit filters out noise and interference signals in the audio signal output by the codec, preventing the audio power amplifier chip from amplifying the noise and interference signals, thereby improving the quality of audio signal processing.

[0082] For example, the first filter circuit 30 includes a first capacitor, a second capacitor, a third capacitor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, and an eighth resistor. The first terminal of the first capacitor is electrically connected to the first terminal of the fourth resistor and the inverting input pin of the audio power amplifier chip. The second terminal of the first capacitor is electrically connected to the first terminal of the fifth resistor and the non-inverting input pin of the audio power amplifier chip. The second terminal of the fourth resistor is electrically connected to the first terminal of the second capacitor. The second terminal of the second capacitor is electrically connected to the first terminals of the sixth and seventh resistors and the first pin of the codec CO. The second terminal of the fifth resistor is electrically connected to the first terminal of the third capacitor. The second terminal of the third capacitor is electrically connected to the second terminal of the sixth resistor, the first terminal of the eighth resistor, and the second pin of the codec CO. The second terminals of the seventh and eighth resistors are both used for electrical connection to ground. Corresponding pads may be provided on the circuit board for soldering to the first, second, third, fourth, fifth, sixth, seventh, and eighth resistors.

[0083] In one embodiment, the circuit board further includes a fifth pad P5 and a sixth pad P6. The fifth pad P5 is located in the soldering area 11 and is used to solder to the inverting output pin of the first audio power amplifier chip or the second audio power amplifier chip. The sixth pad P6 is located in the soldering area 11 and is used to solder to the non-inverting output pin of the first audio power amplifier chip or the second audio power amplifier chip.

[0084] In this embodiment, since the audio signal is transmitted in a differential form, it has strong anti-interference ability. By soldering the fifth and sixth pads to the inverting output pin and the non-inverting output pin of the audio power amplifier chip, respectively, the audio power amplifier chip can transmit differential audio signals to improve the reliability of the circuit board.

[0085] In one embodiment, the circuit board further includes a fifth conductive line 16 and a sixth conductive line 17. The fifth conductive line 16 is disposed on the circuit board body 10, with its first end electrically connected to a fifth pad P5 and its second end electrically connected to a first pin of the speaker SPK. The sixth conductive line 17 is disposed on the circuit board body 10, with its first end electrically connected to a sixth pad P6 and its second end electrically connected to a second pin of the speaker SPK.

[0086] In this embodiment, the fifth pad and the first pin of the speaker are electrically connected via the fifth conductive line, enabling the audio power amplifier to transmit an inverted audio signal to the first pin of the speaker via the fifth pad and the fifth conductive line. The sixth pad and the second pin of the speaker are electrically connected via the sixth conductive line, enabling the audio power amplifier chip to transmit a non-inverting differential audio signal to the second pin of the speaker via the sixth pad and the sixth conductive line. Because the audio power amplifier chip can transmit differential audio signals to the speaker via the fifth and sixth conductive lines, the audio signal can be transmitted effectively, thereby improving the reliability of the circuit board.

[0087] For example, the circuit board may be provided with corresponding pads for soldering to the first and second pins of the speaker SPK.

[0088] In one embodiment, the fifth conductive line 16 and the sixth conductive line 17 are electrically connected to the speaker SPK through the second filter circuit 40.

[0089] In this embodiment, the second filtering circuit filters out noise and interference signals in the audio signal transmitted by the audio power amplifier chip, preventing the speaker from playing noise and interference signals, thereby improving the quality of audio signal processing.

[0090] For example, the second filter circuit 40 includes a first ferrite bead, a second ferrite bead, a ninth resistor, a tenth resistor, a fourth capacitor, a fifth capacitor, a sixth capacitor, a seventh capacitor, and an eighth capacitor. The first end of the first ferrite bead is electrically connected to the first end of the ninth resistor and the inverting output pin of the audio power amplifier chip. The second end of the first ferrite bead is electrically connected to the second end of the ninth resistor, the first end of the fourth capacitor, the first end of the fifth capacitor, the first end of the sixth capacitor, and the first pin of the speaker SPK. The first end of the second ferrite bead is electrically connected to the first end of the tenth resistor and the non-inverting output pin of the audio power amplifier chip. The second end of the second ferrite bead is electrically connected to the second end of the tenth resistor, the second end of the fifth capacitor, the first end of the seventh capacitor, the first end of the eighth capacitor, and the second pin of the speaker. The second ends of the fourth, sixth, seventh, and eighth capacitors are all used for electrical connection to ground.

[0091] For example, the circuit board may be provided with corresponding pads for soldering to the first ferrite bead, the second ferrite bead, the ninth resistor, the tenth resistor, the fourth capacitor, the fifth capacitor, the sixth capacitor, the seventh capacitor, and the eighth capacitor.

[0092] In one embodiment, the circuit board further includes a seventh pad P7, an eighth pad P8, and a ninth pad P9. The seventh pad P7 is located in soldering area 11 and is used to solder to the power supply pin of the first or second audio power amplifier chip. The eighth pad P8 is located in soldering area 11 and is used to solder to the power supply pin of the first or second audio power amplifier chip. The ninth pad P9 is located in soldering area 11 and is used to solder to the ground pin of the first or second audio power amplifier chip.

[0093] In this embodiment, the power supply provides power to the audio power amplifier chip through the seventh pad, and the ground terminal is electrically connected to the ground pin of the audio power amplifier chip through the ninth pad, enabling the audio power amplifier chip to operate normally. The eighth pad is soldered to the power supply pin of the audio power amplifier chip, allowing the chip to amplify the audio signal. Using multiple pads ensures the audio power amplifier chip operates normally, preventing it from failing to amplify the audio signal and thus improving the reliability of the circuit board.

[0094] For example, the power supply pins include a first power supply pin and a second power supply pin. The seventh pad P7 includes a third sub-pad P71 and a fourth sub-pad P72. The third sub-pad P71 is used to solder to the first power supply pin. The fourth sub-pad P72 is used to solder to the second power supply pin. A ninth capacitor and a tenth capacitor are also provided on the circuit board. The first terminal of the ninth capacitor is electrically connected to the third sub-pad P71, the fourth sub-pad P72, the first terminal of the tenth capacitor, and the output pin of the power supply VSYS. The second terminal of the ninth capacitor is electrically connected to the second terminal of the tenth capacitor and the ground terminal GND. Corresponding pads may be provided on the circuit board for soldering to the ninth and tenth capacitors.

[0095] For example, the ground pin may include a first ground pin and a second ground pin. The ninth pad P9 includes a fifth sub-pad P91 and a sixth sub-pad P92. The fifth sub-pad P91 is used to solder to the first ground pin. The sixth sub-pad P92 is used to solder to the second ground pin. Both the fifth sub-pad P91 and the sixth sub-pad P92 are used for electrical connection to the ground terminal GND.

[0096] In one embodiment, the circuit board further includes a seventh conductive line 18 and an eighth conductive line 19. The seventh conductive line 18 is disposed on the circuit board body 10, with its first end electrically connected to a seventh pad P7 and its second end electrically connected to the output pin of the power supply VSYS. The eighth conductive line 19 is disposed on the circuit board body 10, with its first end electrically connected to a ninth pad P9 and its second end electrically connected to the ground terminal GND.

[0097] In this embodiment, the seventh conductive line electrically connects the seventh pad to the output pin of the power supply, and the eighth conductive line electrically connects the ninth pad to the ground terminal, so that the power supply can supply power to the audio power amplifier chip through the seventh conductive line, thereby improving the reliability of the circuit board.

[0098] For example, when the ninth pad P9 includes the fifth sub-pad P91 and the sixth sub-pad P92, the eighth conductive line is electrically connected between the fifth sub-pad P91, the sixth sub-pad P92 and the ground terminal GND.

[0099] For example, an eleventh capacitor and a twelfth capacitor are also provided on the circuit board. The first terminal of the eleventh capacitor is electrically connected to the first terminal of the twelfth capacitor and the eighth pad P8, and the second terminal of the eleventh capacitor and the second terminal of the twelfth capacitor are both used to be electrically connected to the ground terminal GND.

[0100] In one embodiment, the circuit board further includes a tenth pad, an eleventh pad P11, and a twelfth pad P12. The tenth pad is located in soldering area 11 and is used to solder to the boost pin of the first audio power amplifier chip or the second audio power amplifier chip. The eleventh pad P11 is located in soldering area 11 and is used to solder to the first capacitor pin of the first audio power amplifier chip or the second audio power amplifier chip. The twelfth pad P12 is located in soldering area 11 and is used to solder to the second capacitor pin of the first audio power amplifier chip or the second audio power amplifier chip.

[0101] In this embodiment, since the tenth pad is soldered to the boost pin of the audio power amplifier chip, when the audio power amplifier chip has a built-in boost circuit, the voltage of the boost circuit can be increased through external devices electrically connected to the boost pin to amplify the audio signal power, thereby improving the reliability of the circuit board. Since the eleventh and twelfth pads are soldered to the first and second capacitor pins respectively, when the audio power amplifier chip has a built-in boost charge pump, the voltage of the boost charge pump can be increased through external devices electrically connected to the first and second capacitor pins to amplify the audio signal power, thereby improving the reliability of the circuit board. Simultaneously, because the circuit board is equipped with the tenth, eleventh, and twelfth pads, it can be adapted to different audio power amplifier chips, thereby improving the compatibility of the circuit board.

[0102] For example, the first audio power amplifier chip may have a built-in boost circuit or boost charge pump. The second audio power amplifier chip may also have a boost circuit or boost charge pump.

[0103] In one embodiment, the circuit board further includes a ninth conductive line, a tenth conductive line 1a, and an eleventh conductive line 1b. The first end of the ninth conductive line is electrically connected to the tenth pad, and the second end of the ninth conductive line is used for electrical connection to an inductor. The first end of the tenth conductive line 1a is electrically connected to the eleventh pad P11, and the second end of the tenth conductive line 1a is used for electrical connection to the first end of the flying capacitor CF. The first end of the eleventh conductive line 1b is electrically connected to the twelfth pad P12, and the second end of the eleventh conductive line 1b is used for electrical connection to the second end of the flying capacitor CF.

[0104] In this embodiment, by electrically connecting the ninth conductive line to the inductor and the tenth pad, the inductor and part of the circuitry in the audio power amplifier chip can form a boost circuit to amplify the audio signal by increasing the voltage input from the inductor, thereby improving the reliability of the circuit board. Similarly, by electrically connecting the tenth and eleventh conductive lines to the flying capacitor, the eleventh pad, and the twelfth pad, the flying capacitor and part of the circuitry in the power amplifier chip can form a boost charge pump to amplify the audio signal by increasing the voltage of the power supply, further improving the reliability of the circuit board.

[0105] For example, the circuit board may have corresponding pads for soldering inductors and flying capacitors (CF).

[0106] For example, the circuit board may further include a thirteenth pad P13 and a fourteenth pad P14. Both the thirteenth pad P13 and the fourteenth pad P14 are located in soldering area 11. The thirteenth pad P13 is used to solder to the third capacitor pin of the first audio power amplifier chip or the second audio power amplifier chip, and the fourteenth pad P14 is used to solder to the fourth capacitor pin of the first audio power amplifier chip or the second audio power amplifier chip. That is, the first audio power amplifier chip and the second audio power amplifier chip may be provided with two boost charge pumps.

[0107] An exemplary embodiment of this disclosure provides an audio power amplifier circuit, such as Figure 4As shown, the audio power amplifier circuit includes an audio power amplifier chip 50, a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, an eighth capacitor C8, a ninth capacitor C9, a tenth capacitor C10, an eleventh capacitor C11, a twelfth capacitor C12, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, a ninth resistor R9, a tenth resistor R10, a first ferrite bead FB1, a second ferrite bead FB2, and peripheral devices 60. The audio power amplifier chip 50 can be either a first audio power amplifier chip or a second audio power amplifier chip. The first terminal of the first resistor R1 is electrically connected to the general purpose input / output pins (GPIO) of the audio power amplifier chip 50 and the general purpose input / output pins of the control chip 20. The second terminal of the first resistor R1 is electrically connected to the ground terminal GND. The first end of the second resistor R2 is electrically connected to the clock signal pin SCL of the audio power amplifier chip 50 and the clock signal pin of the control chip 20. The second end of the second resistor R2 is electrically connected to the second end of the third resistor R3 and the control pin of the control chip 20. The first end of the third resistor R3 is electrically connected to the data signal pin SDA of the audio power amplifier chip 50 and the data signal pin of the control chip 20. The first end of the fourth resistor R4 is electrically connected to the first end of the first capacitor C1 and the inverting input pin INN of the audio power amplifier chip. The second end of the fourth resistor R4 is electrically connected to the first end of the second capacitor C2. The second end of the second capacitor C2 is electrically connected to the first ends of the sixth resistor R6, the seventh resistor R7, and the first pin of the codec CO. The first end of the fifth resistor R5 is electrically connected to the second end of the first capacitor C1 and the non-inverting input pin INP of the audio power amplifier chip. The second end of the fifth resistor R5 is electrically connected to the first end of the third capacitor C3. The second end of the third capacitor C3 is electrically connected to the second ends of the sixth resistor R6, the first end of the eighth resistor R8, and the second pin of the codec CO. The second terminals of the seventh resistor R7 and the eighth resistor R8 are both electrically connected to the ground terminal GND. The first terminal of the first ferrite bead FB1 is electrically connected to the first terminal of the ninth resistor R9 and the non-inverting output pin VOP of the audio power amplifier chip 50. The second terminal of the first ferrite bead FB1 is electrically connected to the second terminal of the ninth resistor R9, the first terminal of the fourth capacitor C4, the first terminal of the fifth capacitor C5, the first terminal of the sixth capacitor C6, and the first pin of the speaker SPK. The first terminal of the second ferrite bead FB2 is electrically connected to the first terminal of the tenth resistor R10 and the inverting output pin VON of the audio power amplifier chip 50. The second terminal of the second ferrite bead FB2 is electrically connected to the second terminal of the tenth resistor R10, the second terminal of the fifth capacitor C5, the first terminal of the seventh capacitor C7, the first terminal of the eighth capacitor C8, and the second pin of the speaker SPK.The second terminals of the fourth capacitor C4, the sixth capacitor C6, the seventh capacitor C7, and the eighth capacitor C8 are all electrically connected to the ground terminal GND. The first terminal of the ninth capacitor C9 is electrically connected to the first terminal of the tenth capacitor C10, the first power supply pin VDD1, the second power supply pin VDD2, and the output pin of the power supply VSYS. The second terminal of the ninth capacitor C9 is electrically connected to the second terminal of the tenth capacitor C10 and the ground terminal GND. The first terminal of the eleventh capacitor C11 is electrically connected to the first terminal of the twelfth capacitor C12 and the power supply pin PVDD of the audio power amplifier chip 50. The second terminal of the eleventh capacitor C11 is electrically connected to the second terminal of the twelfth capacitor C12 and the ground terminal GND. The first ground pin GND1 and the second ground pin GND2 of the audio power amplifier chip 50 are both electrically connected to the ground terminal GND. The peripheral device 60 is electrically connected to the audio power amplifier chip 50. Depending on the internal circuitry, the peripheral device 60 can be a flying capacitor or an inductor. When the peripheral device 60 is an inductor, the inductor is electrically connected to the boost pin of the audio power amplifier chip 50. When the peripheral device is a flying capacitor CF, the first end of the flying capacitor CF is electrically connected to the first capacitor pin C1P of the audio power amplifier chip, and the second end of the flying capacitor CF is electrically connected to the second capacitor pin C1N of the audio power amplifier chip. The audio power amplifier circuit can be mounted on the circuit board as described above. When the audio power amplifier chip 50 is the first audio power amplifier chip, the control chip 20 can control the first audio power amplifier chip through the first pad P1. When the audio power amplifier chip 50 is the second audio power amplifier chip, the control chip 20 can control the second audio power amplifier chip through the first sub-pad P21 and the second sub-pad P22. In addition, the audio power amplifier chip 50 also reserves a third capacitor pin C2P and a fourth capacitor pin C2N for electrically connecting another flying capacitor.

[0108] In one exemplary embodiment, an electronic device is provided, which includes the circuit board as described above. Examples of electronic devices include mobile phones, speakers, electric vehicles, laptops, tablets, and wearable devices.

[0109] refer to Figure 5 As shown, the electronic device 400 may include one or more of the following components: a processing component 402, a memory 404, a power supply component 406, a multimedia component 408, an audio component 410, an input / output (I / O) interface 412, a sensor component 414, and a communication component 416.

[0110] Processing component 402 typically controls the overall operation of electronic device 400, such as operations associated with display, telephone calls, data communication, camera operation, and recording. Processing component 402 may include one or more processors 420 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 402 may include one or more modules to facilitate interaction between processing component 402 and other components. For example, processing component 402 may include a multimedia module to facilitate interaction between multimedia component 408 and processing component 402.

[0111] Memory 404 is configured to store various types of data to support the operation of electronic device 400. Examples of this data include instructions for any application or method operating on electronic device 400, contact data, phonebook data, messages, pictures, videos, etc. Memory 404 can be implemented by any type of volatile or non-volatile storage terminal or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0112] Power supply component 406 provides power to various components of electronic device 400. Power supply component 406 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic device 400.

[0113] Multimedia component 408 includes a screen that provides an output interface between electronic device 400 and user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of touch or swipe actions but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 408 includes a front-facing camera module and / or a rear-facing camera module. When electronic device 400 is in an operating mode, such as shooting mode or video mode, the front-facing camera module and / or rear-facing camera module may receive external multimedia data. Each front-facing camera module and rear-facing camera module may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0114] Audio component 410 is configured to output and / or input audio signals. For example, audio component 410 includes a microphone (MIC) configured to receive external audio signals when electronic device 400 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 404 or transmitted via communication component 416. In some embodiments, audio component 410 also includes a speaker for outputting audio signals.

[0115] I / O interface 412 provides an interface between processing component 402 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0116] Sensor assembly 414 includes one or more sensors for providing state assessments of various aspects of electronic device 400. For example, sensor assembly 414 may detect the on / off state of electronic device 400, the relative positioning of components such as the display and keypad of electronic device 400, changes in position of electronic device 400 or a component of electronic device 400, the presence or absence of user contact with electronic device 400, orientation or acceleration / deceleration of electronic device 400, and temperature changes of electronic device 400. Sensor assembly 414 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 414 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 414 may also include an accelerometer, gyroscope, magnetometer, pressure sensor, or temperature sensor.

[0117] Communication component 416 is configured to facilitate wired or wireless communication between electronic device 400 and other terminals. Electronic device 400 can access wireless networks based on communication standards, such as WiFi, 2G, 3G, 4G, 5G, or combinations thereof. In one exemplary embodiment, communication component 416 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 416 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0118] In an exemplary embodiment, the electronic device 400 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing terminals (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0119] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0120] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0121] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the utility models disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0122] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A circuit board, characterized by, The circuit board includes: The circuit board body has a soldering area for soldering a first audio power amplifier chip or a second audio power amplifier chip. The first pad is located in the soldering area and is used to solder to the input / output pins of the first audio power amplifier chip. The second pad, located in the soldering area, is used to solder to the communication pin of the second audio power amplifier chip.

2. The circuit board of claim 1, wherein The communication pins of the second audio power amplifier chip include a first communication pin and a second communication pin; the second pad includes: The first sub-pad is used to solder to the first communication pin of the second audio power amplifier chip; The second sub-pad is used to solder to the second communication pin of the second audio power amplifier chip.

3. The circuit board of claim 2, wherein, The input / output pins of the first audio power amplifier chip are general purpose input / output pins; and / or, the first communication pin of the second audio power amplifier chip is a clock signal pin, and the second communication pin of the second audio power amplifier chip is a data signal pin.

4. The circuit board of claim 1, wherein The circuit board also includes: A first conductive line is disposed on the circuit board body. The first end of the first conductive line is electrically connected to the first pad, and the second end of the first conductive line is used to be electrically connected to the input / output pin of the control chip. The second conductive line is disposed on the circuit board body. The first end of the second conductive line is electrically connected to the second pad, and the second end of the second conductive line is used to electrically connect to the communication pin of the control chip.

5. The circuit board of claim 1, wherein The circuit board also includes: The third pad is located in the welding area and is used to weld to the inverting input pin of the first audio power amplifier chip or the second audio power amplifier chip. A fourth pad, located in the soldering area, is used to solder to the in-phase input pin of the first audio power amplifier chip or the second audio power amplifier chip; and / or, The fifth pad, located in the soldering area, is used to solder to the inverting output pin of the first audio power amplifier chip or the second audio power amplifier chip. The sixth pad is located in the soldering area and is used to solder to the in-phase output pin of the first audio power amplifier chip or the second audio power amplifier chip.

6. The circuit board of claim 5, wherein, The circuit board also includes: A third conductive line is disposed on the circuit board body. The first end of the third conductive line is electrically connected to the third pad, and the second end of the third conductive line is used to be electrically connected to the first pin of the codec. A fourth conductive line is disposed on the circuit board body. The first end of the fourth conductive line is electrically connected to the fourth pad, and the second end of the fourth conductive line is used to electrically connect to the second pin of the codec; and / or, A fifth conductive line is disposed on the circuit board body. The first end of the fifth conductive line is electrically connected to the fifth pad, and the second end of the fifth conductive line is used to electrically connect to the first pin of the speaker. A sixth conductive line is disposed on the circuit board body. The first end of the sixth conductive line is electrically connected to the sixth pad, and the second end of the sixth conductive line is used to electrically connect to the second pin of the speaker.

7. The circuit board of claim 6, wherein The third and fourth conductive lines are electrically connected to the codec via a first filter circuit; and / or, the fifth and sixth conductive lines are electrically connected to the speaker via a second filter circuit.

8. The circuit board of claim 1, wherein, The circuit board also includes: The seventh pad is located in the soldering area and is used to solder to the power supply pin of the first audio power amplifier chip or the second audio power amplifier chip. The eighth pad is located in the soldering area and is used to solder to the power supply pin of the first audio power amplifier chip or the second audio power amplifier chip. The ninth pad is located in the soldering area and is used to solder to the ground pin of the first audio power amplifier chip or the second audio power amplifier chip.

9. The circuit board of claim 8, wherein, The circuit board also includes: A seventh conductive line is disposed on the circuit board body. The first end of the seventh conductive line is electrically connected to the seventh pad, and the second end of the seventh conductive line is used to be electrically connected to the output pin of the power supply. The eighth conductive line is disposed on the circuit board body. The first end of the eighth conductive line is electrically connected to the ninth pad, and the second end of the eighth conductive line is used for grounding connection.

10. The circuit board according to any one of claims 1 to 9, characterized by The circuit board also includes: The tenth pad is located in the soldering area and is used to solder to the boost pin of the first audio power amplifier chip or the second audio power amplifier chip. The eleventh pad is located in the soldering area and is used to solder to the first capacitor pin of the first audio power amplifier chip or the second audio power amplifier chip. The twelfth pad is located in the soldering area and is used to solder to the second capacitor pin of the first audio power amplifier chip or the second audio power amplifier chip.

11. The circuit board of claim 10, wherein, The circuit board includes: The ninth conductive line has a first end that is electrically connected to the tenth pad and a second end that is used to be electrically connected to an inductor. The tenth conductive line has a first end that is electrically connected to the eleventh pad and a second end that is electrically connected to the first end of the flying capacitor. The eleventh conductive line has its first end electrically connected to the twelfth pad and its second end electrically connected to the second end of the flying capacitor.

12. An electronic device, comprising: The electronic device includes a circuit board as described in any one of claims 1 to 11.

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