Display module and display device

Abstract

The utility model provides a display module and a display device.The display module comprises a display panel, the display panel is provided with a display side and a non-display side which are arranged oppositely, the display panel comprises a display area and a binding area located on one side of the display area, and the binding area is connected with a flexible circuit board in a binding mode; the backboard is at least partially arranged on the non-display side of the display panel, the flexible circuit board extends and is attached to the surface of the side, away from the display panel, of the backboard, and the flexible circuit board comprises a first surface attached to the backboard and a second surface opposite to the first surface; at least one of the first surface and the second surface is provided with at least one copper exposing area; wherein at least part of the copper exposing area is in conduction connection with the back plate; and / or at least one of the first surface and the second surface is covered with an electromagnetic shielding layer, and the electromagnetic shielding layer covers and conducts at least part of the copper exposing area. According to the display module and the display device provided by the invention, the performance and the stability of the display module can be improved.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] For display modules, electrostatic discharge (ESD) risk and electromagnetic compatibility (EMC) are two important considerations, as they directly affect the performance and reliability of the device. Utility Model Content

[0003] In order to solve at least one of the technical problems in the above-mentioned related technologies, the present disclosure provides a display module and a display device.

[0004] The technical solutions provided in this disclosure are as follows:

[0005] In a first aspect, embodiments of this disclosure provide a display module, including:

[0006] A display panel has a display side and a non-display side arranged opposite to each other. The display panel includes a display area and a bonding area located on one side of the display area, wherein a flexible circuit board is bonded to the bonding area.

[0007] A backplate, at least partially disposed on the non-display side of the display panel, wherein the flexible circuit board extends and adheres to a surface of the backplate facing away from the display panel, the flexible circuit board including a first surface adhered to the backplate and a second surface disposed opposite to the first surface, at least one of the first surface and the second surface having at least one exposed copper area; wherein...

[0008] At least a portion of the exposed copper area is electrically connected to the backplate; and / or,

[0009] At least one of the first surface and the second surface is covered with an electromagnetic shielding layer, which covers and conducts at least a portion of the exposed copper area.

[0010] For example, the back panel has a perforation near the bonding area, and the flexible circuit board extends through the perforation and adheres to the side surface of the back panel facing away from the display panel.

[0011] For example, the backplane is grounded, and a first exposed copper area is provided on the first surface. The first surface and the backplane are bonded together by conductive adhesive, and the conductive adhesive covers at least part of the first exposed copper area to conduct electricity between the first exposed copper area and the backplane.

[0012] For example, at least one of the surface of the back plate facing away from the display panel and the first surface is provided with alignment marks, which are used to align the conductive adhesive with the first exposed copper area.

[0013] For example, the flexible circuit board has a first end connected to the bonding area and a second end disposed opposite to the first end, and the alignment mark includes a first positioning mark disposed on the surface of the back plate facing away from the display panel, wherein,

[0014] The first positioning mark is configured to position the conductive adhesive and the back plate in at least a first direction and a second direction, wherein the first direction is the direction from the first end to the second end, and the second direction is perpendicular to the first direction and parallel to the side surface of the back plate away from the display panel.

[0015] For example, the first positioning mark includes at least two sub-marks spaced apart along the second direction. Each sub-mark includes a first branch extending along the first direction and a second branch extending along the second direction. The first branch intersects with the second branch, and the two sub-marks together form a positioning cavity defining the position of the conductive adhesive.

[0016] For example, the first positioning mark has a first height in a third direction perpendicular to the side surface of the back plate away from the display panel, and the conductive adhesive has a first thickness in the third direction, wherein the first height is less than or equal to the first thickness.

[0017] For example, the alignment mark further includes:

[0018] A second positioning mark located on the side surface of the backplate away from the display panel; and

[0019] A third positioning mark is provided on the first surface, and the second positioning mark is aligned with the third positioning mark to align the flexible circuit board with the back plate.

[0020] For example, the flexible circuit board has a first end connected to the bonding area and a second end disposed opposite to the first end. The second positioning mark and the third positioning mark both include alignment marks extending along a second direction to align and position the flexible circuit board and the back plate at least in a first direction.

[0021] Wherein, the first direction is the direction from the first end to the second end; the second direction is perpendicular to the first direction and parallel to the side surface of the back plate away from the display panel.

[0022] For example, the second positioning mark and the third positioning mark have a predetermined length along the second direction, and the first surface has a predetermined width along the second direction at the position where the third positioning mark is set, wherein the predetermined length is greater than or equal to 2 / 3 of the predetermined width.

[0023] For example, the flexible circuit board has a first end connected to the bonding area and a second end disposed opposite to the first end, and at least a portion of the conductive adhesive is disposed on the first surface in a region close to the first end.

[0024] For example, the second end is a free end that is not fitted with a printed circuit board.

[0025] For example, at least one second exposed copper area is provided on the second surface, the second surface is covered by the electromagnetic shielding layer, and the electromagnetic shielding layer covers at least a portion of the second exposed copper area.

[0026] For example, the back plate is a metal casting.

[0027] Secondly, embodiments of this disclosure also provide a display device, which includes the display module described above.

[0028] The beneficial effects of the embodiments disclosed herein are as follows:

[0029] The display module and display device provided in this disclosure reduce electrostatic risks, improve electromagnetic compatibility, and enhance the electromagnetic compatibility performance and display stability of the display module by setting exposed copper areas on the surface of the flexible circuit board, and by making at least a portion of the exposed copper areas conductive with the backplane, and / or by covering the surface of the flexible circuit board with an electromagnetic shielding layer and covering and conducting at least a portion of the exposed copper areas with the electromagnetic shielding layer. Attached Figure Description

[0030] Figure 1 This diagram shows a partial cross-sectional structure of a display module in some embodiments of the present disclosure.

[0031] Figure 2 This is a structural schematic diagram showing the rear view of the back panel of the display module in some embodiments of this disclosure;

[0032] Figure 3 This diagram illustrates the back panel structure of the display module in some embodiments of the present disclosure.

[0033] Figure 4 express Figure 3 A magnified view of a portion of the dashed box E;

[0034] Figure 5 This diagram illustrates one of the first surface schematics of a flexible circuit board in some embodiments of the present disclosure.

[0035] Figure 6 This diagram illustrates the alignment relationship between the flexible circuit board and the backplate of the display module in some embodiments of this disclosure.

[0036] Figure 7 This diagram illustrates the second surface of a flexible circuit board in some embodiments of the present disclosure.

[0037] Figure 8 express Figure 7 Sectional view along the F-F' direction;

[0038] Figure 9 This disclosure includes a second schematic diagram of the first surface of a flexible circuit board in some embodiments. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0040] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0041] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of said value.

[0042] Furthermore, throughout this document, unless otherwise defined, the terms “substantially,” “essentially,” “approximately,” and “about” are used to describe and explain small variations. When used with an event or situation, these terms can cover situations where the event or situation occurs precisely or approximately. For example, when used with a numerical value, these terms can include a range of variation of the numerical value less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term “substantially coplanar” can refer to two surfaces arranged along the same plane within a micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.

[0043] It should be understood that, in the exemplary embodiments of this disclosure, when a layer or element is referred to as being on another layer or substrate, it may mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate. "A and B are set in the same layer" means that after A and B are formed using the same film deposition process to form a film layer for forming a specific pattern, the layer structure is formed in one patterning process using the same photomask.

[0044] In this article, the term "terminal" refers to the part of a chip or circuit board that is electrically connected to external leads, traces, electrodes, etc., including but not limited to the chip's pad.

[0045] For display modules, electrostatic discharge (ESD) risk and electromagnetic compatibility (EMC) are two crucial considerations, directly impacting device performance and reliability. Improving the ESD and EMC performance of the flexible circuit board on the display panel can enhance these aspects. Therefore, structural optimization of the flexible circuit board is necessary, taking into account the overall structure of the display module, to improve ESD and EMC performance.

[0046] like Figure 1As shown, the display module provided in this embodiment includes a display panel 100 and a back panel 200. The display panel 100 has a display side and a non-display side disposed opposite to each other. The display side refers to the side of the display panel 100 used to display an image. The non-display side refers to the side disposed opposite to the display side.

[0047] The back plate 200 is at least partially disposed on the non-display side of the display panel 100. For example, see [link to relevant documentation]. Figure 1 As shown, the back panel 200 may include a bottom plate 210 and a side plate 220. The bottom plate 210 is located on the non-display side of the display panel 100, and the side plate 220 may be located on the four sides of the display panel 100.

[0048] The display panel 100 includes a display area AA and a peripheral area surrounding the display area AA. The display area AA contains pixels for displaying images. The peripheral area contains driving circuits and conductive lines for driving the pixels.

[0049] The peripheral area includes a bonding area DP located on at least one side of the display area AA, and the bonding area DP can be bonded to a flexible circuit board 300. For example, the bonding area DP may be provided with bonding pins and signal lines, and the bonding pins can be bonded to the flexible circuit board 300. The bonding area DP can also be bonded to a driver chip, or the driver chip can also be integrated on the flexible circuit board 300; this application embodiment does not limit this.

[0050] The peripheral area or the flexible circuit board 300 may include a bending area B. Figure 1 As shown in the example, the flexible circuit board 300 has a bending area B. Conductive lines are arranged on the same side of the bending area B as the display side. When the bending area B is not bent, the side of the bending area B with the conductive lines is on the same side as the display side. When the bending area B is bent, the flexible circuit board 300 can be extended to the surface of the back plate 200 opposite to the display panel 100, and the flexible circuit board 300 is attached to the surface of the back plate 200 opposite to the display panel 100. For ease of description, the surface of the back plate 200 opposite to the display panel 100 will be referred to as the back surface 240 of the back plate 200 below.

[0051] The flexible circuit board 300 includes a first surface 310 and a second surface 320 disposed opposite to each other. When the bending area B is not bent, the second surface 320 (the front side of the flexible circuit board 300) is on the same side as the display side of the display panel 100. When the bending area B is bent, the first surface 310 (the back side of the flexible circuit board 300) is attached to the back side 240 of the back plate 200.

[0052] In some embodiments, see Figures 5 to 9 At least one exposed copper area T is provided on at least one of the first surface 310 and the second surface 320, and at least a portion of the exposed copper area T is electrically connected to the backplate 200. For example, the backplate 200 may be partially or entirely grounded. In this way, by making the exposed copper area T conductive to the backplate 200, the exposed copper area T can be grounded, so as to conduct away static electricity from the flexible circuit board 300 in a timely manner and reduce the risk of static electricity.

[0053] In other embodiments, such as Figure 7 and Figure 8 As shown, at least one of the first surface 310 and the second surface 320 is covered with an electromagnetic shielding layer 330, and the electromagnetic shielding layer 330 covers and conducts at least a portion of the exposed copper area T. For example, the electromagnetic shielding layer 330 can be a shielding coating or electromagnetic shielding tape. In this way, by covering the surface of the flexible circuit board 300 with the electromagnetic shielding layer 330, and making the electromagnetic shielding layer 330 cover and conduct at least a portion of the exposed copper area T, the electromagnetic compatibility of the display module can be improved.

[0054] In other embodiments, at least a portion of the exposed copper area T is electrically connected to the backplate 200, and at least one of the first surface 310 and the second surface 320 is covered with an electromagnetic shielding layer 330, which covers and conducts to at least a portion of the exposed copper area T. Thus, by connecting the exposed copper area T to the backplate 200, the exposed copper area T can be grounded, allowing for timely dissipation of static electricity from the flexible circuit board 300 and reducing the risk of static electricity buildup. Furthermore, by covering the surface of the flexible circuit board 300 with the electromagnetic shielding layer 330, which covers and conducts to at least a portion of the exposed copper area T, the electromagnetic compatibility of the display module can be improved.

[0055] In some embodiments, at least one exposed copper region T is provided on the first surface 310 and the second surface 320 respectively, and the exposed copper region T on one of the first surface 310 and the second surface 320 is electrically connected to the back plate 200, while the exposed copper region T on the other is covered and electrically connected by the electromagnetic shielding layer 330.

[0056] For example, since the first surface 310 is attached to the back surface 240 of the back plate 200, and the second surface 320 is away from the back surface 240 of the back plate 200, at least one exposed copper area T can be provided on the first surface 310 and is conductive to the back plate 200, while at least one second exposed copper area T2 can be provided on the second surface 320 and is covered by the electromagnetic shielding layer 330. However, this is not a limitation.

[0057] Taking automotive display modules as an example, there are various ways to ship display modules. For instance, in one shipping method, a printed circuit board is mounted on the flexible circuit board 300. In this case, both the flexible circuit board 300 and the printed circuit board can be covered with conductive tape on their front sides (i.e., the side facing away from the display panel 100) to improve static electricity issues.

[0058] In another shipping method, the printed circuit board (PCB) of the display module may need to be integrated with the PCBs of other systems in products such as vehicles, i.e., a board-to-board (Board-in-One) design. In this case, the flexible circuit board 300 can be shipped as a bare board. Bare board shipping means shipping the flexible circuit board 300 without the PCB assembled on it. With this bare board shipping method, the integrated PCB design has high integration density but weak anti-interference capabilities, failing to meet the stringent requirements of electrostatic discharge (ESD) or electromagnetic compatibility (EMC) testing. Furthermore, ESD / EMC testing is often strongly correlated with the overall PCB and structural design of the display module; failure to pass ESD / EMC testing can result in significant design change costs.

[0059] Therefore, for display modules shipped using a blank board method, the embodiments of this disclosure have carried out overall structural optimization design to improve the anti-static performance and electromagnetic compatibility of the display module.

[0060] by Figures 2 to 4 As shown in the example, in some embodiments, the back plate 200 has a perforation 230 near the bonding area DP, and the flexible circuit board 300 extends and adheres to the back side 240 of the back plate 200 (i.e., the side surface away from the display panel 100) after passing through the perforation 230.

[0061] This allows the flexible circuit board 300 to be exposed outside the back panel 200, facilitating subsequent assembly with the printed circuit board. For example, the flexible circuit board 300 can be a bare board without a printed circuit board. In other words, the display module can be shipped as a bare board, but it is not limited to this. In practical applications, in some scenarios, even when the flexible circuit board 300 is already assembled with the printed circuit board, it can also extend through the through-hole 230 and adhere to the back side 240 of the back panel 200.

[0062] In the above-described blank board shipping method, the flexible circuit board 300 needs to be subsequently assembled with a printed circuit board. The second surface 320 (front) of the flexible circuit board 300 is not easily covered with conductive tape or similar materials for grounding and anti-static purposes, which would cause interference in the structural design. Therefore, in some embodiments, for example, such as... Figure 5 As shown, at least one exposed copper area T is provided on the first surface 310. For ease of description, the exposed copper area T provided on the first surface 310 is referred to as the first exposed copper area T1. The back plate 200 is grounded, and the first surface 310 and the back plate 200 can be bonded together by conductive adhesive 400, and the conductive adhesive 400 covers at least part of the first exposed copper area T1 to conduct electricity between the first exposed copper area T1 and the back plate 200.

[0063] By adopting the above solution, a first exposed copper area T1 can be set on the back side of the flexible circuit board 300 (i.e., the first surface 310), and the conductive adhesive 400 bonded between the flexible circuit board 300 and the back plate 200 can be used to achieve the purpose of connecting the first exposed copper area T1 with the back plate 200. The structure is simple and easy to assemble. The anti-static effect is achieved by cleverly utilizing the structural connection relationship between the back plate 200, the conductive adhesive 400 and the flexible circuit board 300.

[0064] It should be noted that the back panel 200 is grounded, and there are various ways to ground the back panel 200. For example, the back panel 200 can be connected to the grounding system of the display module through wires or conductive points; or, grounding points can be set at multiple locations on the back panel 200. The grounding method of the back panel 200 is not limited here. The back panel 200 can be made of conductive materials such as metal. For example, the back panel 200 can be a die-cast metal part.

[0065] Furthermore, in order to ensure that the first exposed copper area T1 is correctly attached to the conductive adhesive 400 after the flexible circuit board 300 is bent in the bending area B, in some embodiments, as shown in the figure, at least one of the back surface 240 of the back plate 200 (the side surface facing away from the display panel 100) and the first surface 310 may be provided with an alignment mark 500, which can be used to align the conductive adhesive 400 with the first exposed copper area T1.

[0066] Specifically, in some embodiments, such as Figure 2 and Figure 5As shown, the flexible circuit board 300 has a first end 300a and a second end 300b disposed opposite to each other. The first end 300a is bonded to the bonding area DP, and the second end 300b can be used to assemble a printed circuit board. Specifically, the second end 300b can be electrically connected to the printed circuit board through a connector, such as a snap-fit ​​or gap-structure connector. This embodiment of the application does not specifically limit this connection.

[0067] like Figures 3 to 4 As shown, the alignment mark 500 includes a first positioning mark 510 disposed on the side surface of the back plate 200 facing away from the display panel 100. The first positioning mark 510 is configured to position the conductive adhesive 400 and the back plate 200 at least in a first direction Y and a second direction X. The first direction Y is the direction from the first end 300a to the second end 300b, and the second direction X is perpendicular to the first direction Y and parallel to the side surface of the back plate 200 facing away from the display panel 100.

[0068] In the above solution, by positioning the bonding position of the conductive adhesive 400 on the back plate 200, the position of the conductive adhesive 400 can be accurately guaranteed, so as to ensure that the position of the conductive adhesive 400 and the first exposed copper area T1 can overlap and conduct.

[0069] For example, such as Figure 4 As shown, the first positioning mark 510 includes at least two sub-markers 511 spaced apart along the second direction X. Each sub-marker 511 includes a first branch 5111 extending along the first direction Y and a second branch 5112 extending along the second direction X. The first branch 5111 and the second branch 5112 intersect, and the two sub-markers 511 together form a positioning cavity defining the position of the conductive adhesive 400. For example, as Figure 4 As shown, the sub-mark 511 can be a right-angled mark. However, it is not limited to this; the sub-mark 511 can also be a cross-shaped mark or other patterns.

[0070] Furthermore, it should be noted that the first exposed copper area T1 serves as a grounding structure on the flexible circuit board 300, and it can be connected to the grounding line on the flexible circuit board 300. The specific location of the first exposed copper area T1 can be determined according to the specific wiring of the flexible circuit board 300. For example... Figure 9 and Figure 5 The illustration shows two embodiments where the first exposed copper area T1 is distributed at different locations on two flexible circuit boards 300 with different structures.

[0071] Please see Figure 4 and Figure 5As shown, in some embodiments, at least two first exposed copper areas T1 may be distributed at intervals along the second direction X on the flexible circuit board 300. The conductive adhesive 400 may extend in a strip shape along the second direction X to coincide with the positions of at least two first exposed copper areas T1 to achieve conductivity while meeting the bonding area requirements. However, the position of the first exposed copper areas T1 and the shape of the conductive adhesive 400 are not limited thereto.

[0072] In some exemplary embodiments, the first positioning mark 510 has a first height in a third direction perpendicular to the side surface of the back plate 200 away from the display panel 100, and the conductive adhesive 400 has a first thickness in that third direction, wherein the first height is less than or equal to the first thickness. This ensures good and tight contact between the conductive adhesive 400 and the flexible circuit board 300.

[0073] Furthermore, in some exemplary embodiments, such as Figure 4 and Figure 5 As shown, the alignment mark 500 further includes: a second positioning mark 520 located on the side surface of the back plate 200 away from the display panel 100; and a third positioning mark 530 disposed on the first surface 310, wherein the second positioning mark 520 and the third positioning mark 530 are aligned and engaged to align the flexible circuit board 300 with the back plate 200.

[0074] Using the above solution, after the flexible circuit board 300 is bent in the bending area B, the second positioning mark 520 and the third positioning mark 530 can be used to position the flexible circuit board 300 relative to the back plate 200, so as to ensure accurate alignment between the conductive adhesive 400 and the first exposed copper area T1.

[0075] For example, such as Figures 4 to 6 As shown, the flexible circuit board 300 has a first end 300a connected to the bonding area DP and a second end 300b disposed opposite to the first end 300a. The second positioning mark 520 and the third positioning mark 530 both include alignment marks 500 extending along the second direction X, so as to align and position the flexible circuit board 300 and the back plate 200 at least in the first direction Y. Wherein, the first direction Y is the direction from the first end 300a to the second end 300b; the second direction X is perpendicular to the first direction Y and parallel to the side surface of the back plate 200 away from the display panel 100.

[0076] Since the first end 300a of the flexible circuit board 300 is bound to the binding area DP and extends through the through hole 230, the binding area DP and the through hole 230 can play a certain limiting role for the flexible circuit board 300 in the second direction X. Therefore, the flexible circuit board 300 can be limited only in the first direction Y to ensure that the first exposed copper area T1 coincides with the position of the conductive adhesive 400.

[0077] For example, such as Figures 4 to 6 As shown, the second positioning mark 520 and the third positioning mark 530 can be elongated strips extending along the second direction X, thus saving space. It is understood that the pattern design of the second positioning mark 520 and the third positioning mark 530 can also simultaneously limit the flexible circuit board 300 in both the first direction Y and the second direction X.

[0078] Furthermore, if the lengths of the second positioning mark 520 and the third positioning mark 530 along the second direction X are too short, it may cause errors when positioning in the first direction Y. Therefore, as shown in the figure, for example, the second positioning mark 520 and the third positioning mark 530 have a predetermined length along the second direction X, and the first surface 310 has a predetermined width along the second direction X at the position where the third positioning mark 530 is set, wherein the predetermined length is greater than or equal to 2 / 3 of the predetermined width. In this way, the lengths of the second positioning mark 520 and the third positioning mark 530 along the second direction X are long enough to ensure accurate positioning of the flexible circuit board 300 in the first direction Y.

[0079] It is understood that the above is only an exemplary description of the alignment mark 500, and the specific pattern of the alignment mark 500 is not limited thereto.

[0080] Furthermore, when the flexible circuit board 300 is shipped as a blank board, the second end 300b of the flexible circuit board 300 can be a free end without a printed circuit board, to facilitate the assembly of the printed circuit board. If the conductive adhesive 400 is located near the second end 30b, the conductive adhesive 400 is prone to separation from the flexible circuit board 300 during the assembly of the printed circuit board. Therefore, in some exemplary embodiments, such as... Figures 4 to 6 As shown, at least a portion of the conductive adhesive 400 is disposed on the first surface 310 in a region near the first end 300a. However, this is not a limitation.

[0081] Furthermore, in the above embodiments, by providing a first exposed copper area T1 on the back side (first surface 310) of the flexible circuit board 300, it is made conductive with the backplate 200, thereby achieving an anti-static effect. In some exemplary embodiments, such as... Figure 7 and Figure 8 As shown, at least one second exposed copper area T2 may be provided on the front side (second surface 320) of the flexible circuit board 300. The electromagnetic shielding layer 330 is covered on the second surface 320, and the electromagnetic shielding layer 330 at least covers a portion of the second exposed copper area T2. Thus, by covering the front side of the flexible circuit board 300 with the electromagnetic shielding layer 330, electromagnetic compatibility can be improved. The specific location of the second exposed copper area T2 is reasonably selected according to the circuit layout of the flexible circuit board, for example... Figure 7 The diagram illustrates one possible distribution of the second exposed copper region T2, but is not limited to this.

[0082] The electromagnetic shielding coating can adopt various structures and materials, such as conductive coatings, composite materials, or laminated shielding materials.

[0083] For example, the conductive coating can be a metal coating or a conductive polymer coating.

[0084] For example, the metal coating can be made of metal materials such as silver, copper, and aluminum, sprayed or electroplated on the second surface 320 of the flexible circuit board 300 to form a conductive coating and provide a good electromagnetic shielding effect.

[0085] For example, the conductive polymer can be a polymer material doped with conductive fillers (such as carbon black or conductive fibers), coated on the second surface 320 of the flexible circuit board 300 to achieve a certain shielding effect. For example, the composite material can include metal-polymer composite materials or multilayer structures, etc.

[0086] For example, metal-polymer composites can be made by combining metal particles or mesh structures with polymers, resulting in composites that are both lightweight and have shielding properties. For example, multilayer structures can be made by coating multiple layers of different materials onto a flexible circuit board 300, such as using a conductive polymer on the inside and a metal coating on the outside, to improve shielding effectiveness.

[0087] For example, the shielding material may include metal foil or shielding film. Metal foil can be a metal foil (such as aluminum foil or nickel foil) laminated onto the surface of the flexible circuit board 300 to provide effective shielding. Shielding film, for example, can be a specially designed electromagnetic shielding film material that effectively suppresses electromagnetic radiation.

[0088] In the case of shipping an empty board, the flexible circuit board 300 is not equipped with a printed circuit board. In order to avoid structural interference, the electromagnetic shielding layer 330 can be implemented by using a conductive coating.

[0089] In addition, such as Figures 7 to 8 As shown, the flexible circuit board 300 may include a substrate 301, at least one conductive layer 302 disposed on the substrate 301, and an insulating layer 303 covering the conductive layer 302. For example, such as Figure 8 As shown, the flexible circuit board 300 may include two conductive layers 302 respectively disposed on opposite sides of the substrate 301. The conductive layers 302 are used to form circuits on the flexible circuit board 300. Each conductive layer 302 is covered with an insulating layer 303. An opening is provided in the insulating layer 303 to expose the conductive layer 302, forming the exposed copper area T.

[0090] Furthermore, this disclosure also provides a display device, which includes the display module provided in this disclosure. The display device includes, but is not limited to, in-vehicle displays, smartphones, monitors, laptops, tablets, electronic photo frames, dashcams, smart wearable devices, and other devices with display functions. Other essential components of the display device (such as driver chips) are readily understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting this disclosure. Since the principle by which this display device solves the problem is similar to that of the display module described above, the embodiments of the display device provided in this disclosure can be referred to the embodiments of the display module provided in this disclosure, and will not be repeated here.

[0091] The following points need to be explained:

[0092] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0093] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0094] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0095] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. The scope of protection of this disclosure shall be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include: A display panel has a display side and a non-display side arranged opposite to each other. The display panel includes a display area and a bonding area located on one side of the display area, wherein a flexible circuit board is bonded to the bonding area. A backplate, at least partially disposed on the non-display side of the display panel, wherein the flexible circuit board extends and adheres to a surface of the backplate facing away from the display panel, the flexible circuit board including a first surface adhered to the backplate and a second surface disposed opposite to the first surface, at least one of the first surface and the second surface having at least one exposed copper area; wherein... At least a portion of the exposed copper area is electrically connected to the backplate; and / or, At least one of the first surface and the second surface is covered with an electromagnetic shielding layer, which covers and conducts at least a portion of the exposed copper area.

2. The display module according to claim 1, characterized in that, The back plate has a perforation near the bonding area. After passing through the perforation, the flexible circuit board extends and adheres to the side surface of the back plate that is opposite to the display panel.

3. The display module according to claim 1, characterized in that, The backplate is grounded, and a first exposed copper area is provided on the first surface. The first surface and the backplate are bonded together by conductive adhesive, and the conductive adhesive covers at least part of the first exposed copper area to conduct electricity between the first exposed copper area and the backplate.

4. The display module according to claim 3, characterized in that, Alignment marks are provided on at least one of the surfaces of the back plate facing away from the display panel and the first surface, and the alignment marks are used to align the conductive adhesive with the first exposed copper area.

5. The display module according to claim 4, characterized in that, The flexible circuit board has a first end connected to the bonding area and a second end disposed opposite to the first end. The alignment mark includes a first positioning mark disposed on the surface of the back plate facing away from the display panel. The first positioning mark is configured to position the conductive adhesive and the back plate in at least a first direction and a second direction, wherein the first direction is the direction from the first end to the second end, and the second direction is perpendicular to the first direction and parallel to the side surface of the back plate away from the display panel.

6. The display module according to claim 5, characterized in that, The first positioning mark includes at least two sub-marks spaced apart along the second direction. Each sub-mark includes a first branch extending along the first direction and a second branch extending along the second direction. The first branch intersects with the second branch, and the two sub-marks together form a positioning cavity that defines the position of the conductive adhesive.

7. The display module according to claim 5, characterized in that, The first positioning mark has a first height in a third direction perpendicular to the side surface of the back plate away from the display panel, and the conductive adhesive has a first thickness in the third direction, wherein the first height is less than or equal to the first thickness.

8. The display module according to claim 4, characterized in that, The alignment marker also includes: A second positioning mark located on the side surface of the backplate away from the display panel; and A third positioning mark is provided on the first surface, and the second positioning mark is aligned with the third positioning mark to align the flexible circuit board with the back plate.

9. The display module according to claim 8, characterized in that, The flexible circuit board has a first end connected to the bonding area and a second end disposed opposite to the first end. The second positioning mark and the third positioning mark both include alignment marks extending along a second direction to align and position the flexible circuit board and the back plate at least in a first direction. Wherein, the first direction is the direction from the first end to the second end; the second direction is perpendicular to the first direction and parallel to the side surface of the back plate away from the display panel.

10. The display module according to claim 9, characterized in that, The second positioning mark and the third positioning mark have a predetermined length along the second direction, and the first surface has a predetermined width along the second direction at the position where the third positioning mark is set, wherein the predetermined length is greater than or equal to 2 / 3 of the predetermined width.

11. The display module according to claim 3, characterized in that, The flexible circuit board has a first end connected to the bonding area and a second end disposed opposite to the first end, and at least a portion of the conductive adhesive is disposed on the first surface in a region close to the first end.

12. The display module according to claim 11, characterized in that, The second end is the free end without a printed circuit board attached.

13. The display module according to claim 1, characterized in that, The second surface has at least one second exposed copper area, and the second surface is covered by the electromagnetic shielding layer, wherein the electromagnetic shielding layer at least covers a portion of the second exposed copper area.

14. The display module according to claim 1, characterized in that, The back plate is a metal casting.

15. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 14.

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