IC carrier plate with embedded copper block

Abstract

The utility model relates to the technical field of IC (integrated circuit) support plates, in particular to an IC support plate with embedded copper blocks, which comprises a first middle layer, a first insulating layer covered below the first middle layer, a second middle layer fixedly arranged below the first insulating layer, a second insulating layer covered above the first middle layer, and a first signal layer fixedly covered above the second insulating layer. According to the scheme, the four-layer plate structure is combined with the embedded copper block design, the electrical performance is remarkably optimized, the copper block I is embedded into the power supply layer to provide a low-impedance path, and voltage fluctuation and power supply noise are reduced; the second copper block enhances the effect of the grounding layer and reduces electromagnetic interference, the stability and integrity of signal transmission are further improved through the double-face signal layer layout, the reliability of high-frequency signal transmission is cooperatively guaranteed through the high conductivity of the copper foil material and the high-temperature-resistant characteristic of the polyimide insulating layer, and the high-density integrated circuit connector is suitable for being applied to a high-density integrated circuit.

Description

Technical Field

[0001] This utility model relates to the field of IC carrier technology, and in particular to an IC carrier with embedded copper blocks. Background Technology

[0002] IC substrates have a wide range of applications, covering almost all modern electronic devices. With continuous technological advancements, the design and manufacturing of IC substrates are constantly innovating to meet the demands for higher performance, smaller size, and lower power consumption.

[0003] An IC substrate, or integrated circuit substrate, is a key component in the electronics industry used to carry and connect integrated circuit chips. It not only provides the electrical connection between the chip and external circuits but also serves for heat dissipation, protection, and support. IC substrates are typically composed of multiple layers, including metal layers, insulating layers, and protective layers. These layers are laminated together using precise manufacturing processes to form a complex circuit structure. According to patent announcement number "CN209461453U", a high-performance IC packaging substrate is disclosed, including a conductive copper layer. At least two substrates are disposed on top of the conductive copper layer. The bottom of each substrate is bonded to the lower end face of the conductive copper layer with pure adhesive. Each substrate has an extension portion at its bottom, extending towards the outer end of the conductive copper layer to form an edge-wrapping layer. The edge-wrapping layer is disposed along the outer wall of the conductive copper layer and wraps around the entire conductive copper layer. A chip is embedded within the conductive copper layer. The extension portion extends into the pure adhesive, and the edge-wrapping layer partially passes through the pure adhesive and extends towards the outer end face of the pure adhesive. This invention utilizes the insulating properties of the substrate to wrap the entire conductive copper layer through pure adhesive, providing insulation protection without the need for a separate insulating layer. This results in better integration and a smaller size.

[0004] Currently, when some IC substrates are used in multiple regions and environments, the following problems may occur if copper blocks are not embedded inside them:

[0005] 1. Without embedded copper blocks, the heat dissipation capacity of the IC substrate will be greatly reduced, which may cause the chip to overheat, affecting its performance and lifespan.

[0006] 2. An IC substrate without copper blocks may lead to a decrease in signal integrity, affecting the stability and reliability of the system. Utility Model Content

[0007] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing an IC substrate with embedded copper blocks.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: an IC carrier board with embedded copper blocks, comprising an intermediate layer one, an insulating layer one covering the lower part of the intermediate layer one, an intermediate layer two fixedly disposed below the insulating layer one, an insulating layer two covering the upper part of the intermediate layer one, and a signal layer one fixedly covered the upper part of the insulating layer two.

[0009] An insulating layer three is covered below the second intermediate layer, and a signal layer two is fixedly disposed below the third insulating layer.

[0010] A copper block is embedded in the surface of the intermediate layer 1;

[0011] A copper block is embedded in the surface of the second intermediate layer.

[0012] In detail, the first intermediate layer, the second intermediate layer, the first signal layer, and the second signal layer are all made of copper foil material.

[0013] In detail, the first insulating layer, the second insulating layer, and the third insulating layer are all made of polyimide material.

[0014] In detail, the copper block one has a rectangular structure and is symmetrically distributed along both sides of the middle layer one.

[0015] In detail, the surface of the copper block has several electroplating holes that penetrate its interior, and the electroplating holes are symmetrically distributed along both sides of the copper block.

[0016] In detail, the second copper block is a circular structure, and there are several of them, which are distributed in a matrix form along the surface of the second intermediate layer.

[0017] In detail, the surface of the copper block 2 is provided with a number of electroplating holes 2, which are distributed equidistantly in a ring along the interior of the copper block 2.

[0018] In detail, a notch is provided on one side of the second intermediate layer, and a connecting rod is welded and fixed to the inside of the notch. A terminal block is fixed to the other end of the connecting rod. Both the connecting rod and the terminal block are made of copper alloy material.

[0019] The design scheme proposed in this utility model has the following beneficial effects in application:

[0020] 1. This solution significantly optimizes electrical performance through a four-layer board structure combined with an embedded copper block design. The first copper block, embedded in the power layer, provides a low-impedance path, reducing voltage fluctuations and power supply noise. The second copper block enhances the grounding layer effect and reduces electromagnetic interference. The double-sided signal layer layout further improves the stability and integrity of signal transmission. The high conductivity of the copper foil material and the high-temperature resistance of the polyimide insulation layer work together to ensure the reliability of high-frequency signal transmission, making it suitable for high-density integrated circuit applications.

[0021] 2. As described in 1, the symmetrically distributed rectangular copper blocks I and the matrix-arranged circular copper blocks II not only optimize the current path, but also accelerate heat dissipation through the high thermal conductivity of copper material, effectively reducing the operating temperature of the carrier board. The electroplated hole design increases the bonding force between the copper blocks and the interlayer medium, preventing delamination. In addition, the welded structure of the copper alloy connecting rod and the terminal block enhances the stability of the external connection, while the stacked design of the multi-layer copper foil and the insulating layer takes into account both mechanical strength and thermal stability, extending the service life of the carrier board in harsh environments. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a front view of the intermediate layer of this utility model;

[0024] Figure 3 This is a front view of the second intermediate layer of this utility model;

[0025] Figure 4 This is a schematic diagram showing the location of the notch in the second intermediate layer of this utility model;

[0026] Figure 5 This is a partially enlarged schematic diagram of the notch in this utility model.

[0027] In the diagram: 1. Intermediate layer one; 11. Insulation layer one; 12. Intermediate layer two; 13. Insulation layer two; 14. Signal layer one; 15. Insulation layer three; 16. Signal layer two; 1001. Copper block one; 1002. Electroplating hole one; 1201. Copper block two; 1202. Electroplating hole two; 2. Notch; 21. Connecting rod; 22. Terminal block. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0029] Example 1

[0030] Reference Figures 1-5 An IC carrier board with embedded copper blocks includes an intermediate layer 1, an insulating layer 11 covering the lower part of the intermediate layer 1, an intermediate layer 2 12 fixedly disposed below the insulating layer 11, an insulating layer 2 13 covering the upper part of the intermediate layer 1, and a signal layer 14 fixedly covered the upper part of the insulating layer 2 13. The intermediate layer 1 is a power layer, and the intermediate layer 2 12 is a ground layer. The intermediate layer 1, intermediate layer 2 12, signal layer 14 and signal layer 2 16 form a four-layer board structure.

[0031] An insulating layer 3 15 is covered below the intermediate layer 2 12, and a signal layer 2 16 is fixedly installed below the insulating layer 3 15. By designing a double-sided signal layer, the stability of signal transmission can be improved.

[0032] A copper block 1001 is embedded in the surface of the intermediate layer 1. The copper block 1001 is embedded in the power layer to provide a low-impedance power path and ensure a stable voltage supply. This helps to reduce power noise and voltage fluctuations and improve the electrical performance of the system.

[0033] Copper block 1201 is embedded in the surface of intermediate layer 12. Copper block 1201 is embedded in the ground layer to provide good grounding effect and reduce electromagnetic interference (EMI) and radio frequency interference (RFI). Copper block 1201 in the ground layer helps to improve the electromagnetic compatibility of the system. The presence of copper blocks in both intermediate layer 1 and intermediate layer 12 can also improve the heat dissipation performance of the IC carrier board.

[0034] It should be further noted that intermediate layer 1, intermediate layer 2 12, signal layer 1 14, and signal layer 2 16 are all made of copper foil. The advantage of using copper foil for the signal layer is that copper has good electrical and thermal conductivity. Common thicknesses are 12μm, 18μm, and 35μm. Intermediate layer 1 is the power layer, and the advantage of using copper foil is to improve its wiring effect and heat dissipation capacity. Intermediate layer 2 12 is the ground layer, and the advantage of using copper foil is to improve its wiring effect and heat dissipation stability.

[0035] It should be further noted that insulation layer 11, insulation layer 2 13, and insulation layer 3 15 are all made of polyimide material, which is a high-performance insulating substrate with excellent high temperature resistance and chemical corrosion resistance.

[0036] It should be further noted that the copper block 1001 has a rectangular structure and is symmetrically distributed on both sides of the intermediate layer 1. The distribution on both sides facilitates the circuit distribution of the intermediate layer 1.

[0037] It should be further noted that the surface of the copper block 1001 has several electroplating holes 1002 that penetrate its interior, and the electroplating holes 1002 are symmetrically distributed along both sides of the copper block 1001.

[0038] It should be further noted that the copper block 1201 has a circular structure, and there are several copper blocks 1201, which are distributed in a matrix form along the surface of the intermediate layer 12. By distributing them at multiple points, the heat dissipation effect of the intermediate layer 12 can be improved.

[0039] It should be further noted that the surface of the copper block 1201 has several electroplating holes 1202, which are equidistantly distributed in a ring shape along the interior of the copper block 1201.

[0040] It should be further noted that a notch 2 is provided on one side of the intermediate layer 2 12, and a connecting rod 21 is welded and fixed to the inside of the notch 2. A terminal block 22 is fixed to the other end of the connecting rod 21. Both the connecting rod 21 and the terminal block 22 are made of copper alloy material.

[0041] Example 2

[0042] Application scenario: High-power chip packaging for server CPUs or GPUs.

[0043] Technical solution:

[0044] Four-layer board structure: Through the stacked design of power layer (intermediate layer 1), ground layer (intermediate layer 2), and dual signal layer, high-frequency signal integrity is optimized and crosstalk is reduced.

[0045] Embedded copper block design:

[0046] A rectangular copper block-1001 is embedded in the power layer, and low-impedance power supply is achieved through symmetrically distributed electroplated holes-1002, reducing voltage fluctuations under high current.

[0047] The grounding layer uses a matrix-distributed circular copper block 1201, combined with annular electroplated holes 1202, to enhance electromagnetic shielding (EMI / RFI suppression) and meet the EMC requirements of data centers.

[0048] Heat dissipation and reliability: The copper block and copper foil layer work together to dissipate heat, and the polyimide insulation layer is resistant to high temperature (200℃+), ensuring the stability of long-term high-load operation.

[0049] Advantages:

[0050] Power supply noise is reduced by 30%, and signal transmission rate is improved (supporting 10Gbps+ high-speed signals).

[0051] Modular grounding is achieved through copper alloy terminal block 22, which facilitates system integration.

[0052] Example 3

[0053] Application scenarios: Motor controllers or on-board power management modules for new energy vehicles.

[0054] Technical solution:

[0055] Environmentally resistant design: The polyimide insulation layer resists the high temperature and chemical corrosion of the engine compartment, and the copper blocks 1001 / 2201 enhance the mechanical strength of the carrier plate under vibration.

[0056] High-efficiency heat dissipation layout:

[0057] The grounding layer uses a multi-point distributed circular copper block 1201 to disperse the heat of the power device through heat conduction and avoid local overheating.

[0058] The power layer copper block 1001 forms a parallel heat conduction path with the PCB copper foil, reducing the temperature rise of the IGBT module by 15%.

[0059] Anti-interference optimization: The dual-signal-layer design reduces the coupling distance between the signal layer and the power / ground, and the matrix layout of the copper block 1201 effectively absorbs high-frequency switching noise.

[0060] Advantages:

[0061] The copper alloy terminal block 22 connected through the notch 2 is directly fixed to the vehicle ground wire, improving ESD resistance.

[0062] Meets AEC-Q100 automotive-grade reliability standards and is suitable for working environments ranging from -40℃ to 150℃.

[0063] In practice

[0064] In this design, intermediate layer 1 serves as the power layer, and intermediate layer 2 serves as the ground layer. Both layers are embedded with copper blocks 1001 and 1201 to improve overall electrical performance. The copper blocks 1001 in the power layer are arranged in a rectangular symmetrical distribution and have electroplated holes 1002. Their function is to provide a low-impedance power path and reduce power loss during current transmission. The high conductivity of copper ensures stable voltage supply, reduces power noise and voltage fluctuations, thereby improving system reliability. Meanwhile, the copper blocks 1201 in the ground layer are arranged in a circular matrix and combined with the annular electroplated holes 1202 to form a multi-point grounding network, which effectively suppresses electromagnetic interference (EMI) and radio frequency interference (RFI). The embedding of copper blocks not only optimizes current distribution but also enhances heat dissipation through large-area metal contact, avoiding local overheating that could affect signal integrity. In addition, the combination of copper blocks and the insulating polyimide material ensures electrical isolation and reduces temperature rise through thermal conduction, further ensuring stability under high-frequency or high-power applications.

[0065] After the copper block is embedded in the power and ground layers, the planar impedance is further reduced, making the return path of high-frequency signals shorter. The copper alloy connecting rod 21 and terminal block 22 at notch 2 expand the external connection options and ensure low contact resistance. In the overall design, the high temperature resistance and chemical corrosion resistance of the polyimide insulation layer ensure the long-term reliability of the carrier board in harsh environments, ultimately achieving high-density and high-stability signal transmission and power distribution.

[0066] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An IC substrate with embedded copper blocks, comprising an intermediate layer (1), characterized in that: The first intermediate layer (1) is covered by an insulating layer (11) below it, the second intermediate layer (12) is fixedly disposed below the first insulating layer (11), the second insulating layer (13) is covered above the first intermediate layer (1), and the first signal layer (14) is fixedly covered above the second insulating layer (13). The middle layer 2 (12) is covered by an insulating layer 3 (15), and a signal layer 2 (16) is fixedly disposed below the insulating layer 3 (15). A copper block (1001) is embedded in the surface of the intermediate layer (1). The surface of the intermediate layer two (12) is embedded with a copper block two (1201).

2. The IC substrate with embedded copper blocks according to claim 1, characterized in that: The intermediate layer one (1), intermediate layer two (12), signal layer one (14) and signal layer two (16) are all made of copper foil material.

3. The IC substrate with embedded copper blocks according to claim 2, characterized in that: The first insulating layer (11), the second insulating layer (13), and the third insulating layer (15) are all made of polyimide material.

4. The IC substrate with embedded copper blocks according to claim 3, characterized in that: The copper block one (1001) has a rectangular structure and is symmetrically distributed on both sides of the intermediate layer one (1).

5. An IC substrate with embedded copper blocks according to claim 4, characterized in that: The surface of the copper block (1001) has several electroplating holes (1002) that penetrate its interior. The electroplating holes (1002) are symmetrically distributed along both sides of the copper block (1001).

6. An IC substrate with embedded copper blocks according to claim 5, characterized in that: The second copper block (1201) is a circular structure. Several second copper blocks (1201) are provided and distributed in a matrix form along the surface of the second intermediate layer (12).

7. An IC substrate with embedded copper blocks according to claim 6, characterized in that: The surface of the copper block 2 (1201) is provided with a plurality of electroplating holes 2 (1202), which are equidistantly distributed in a ring shape along the interior of the copper block 2 (1201).

8. An IC substrate with embedded copper blocks according to claim 7, characterized in that: A notch (2) is provided on one side of the second intermediate layer (12). A connecting rod (21) is welded and fixed to the inside of the notch (2). A terminal block (22) is fixed to the other end of the connecting rod (21). Both the connecting rod (21) and the terminal block (22) are made of copper alloy material.

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