Ceramic substrate with LED structure

Abstract

The utility model discloses a ceramic substrate with an LED structure. The ceramic substrate comprises a body, a circuit layer, a heat conduction layer, an LED chip layer and a sealing glue layer. The heat conduction layer covers the upper surface of the circuit layer, the mounting groove is integrally formed in the upper surface of the heat conduction layer in an inward concave mode, and the LED chip layer is fixed in the mounting groove in a matched mode and attached to the bottom and the side wall face of the mounting groove, so that heat generated when an LED chip works is rapidly transmitted to the whole plane of the ceramic substrate through the heat conduction layer, the heat dissipation area is increased, and the heat dissipation efficiency is improved. The heat dissipation effect is improved; and the temperature of each part of the ceramic substrate tends to be balanced, so that the ceramic substrate is prevented from being deformed or even damaged due to over-high local temperature, and meanwhile, the use scene of the high-power LED chip can be met.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrates, and in particular to a ceramic substrate with an LED structure. Background Technology

[0002] Ceramic substrates are special boards made by directly bonding copper foil to the surface (single-sided or double-sided) of an alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperatures. The resulting ultra-thin composite substrates possess excellent electrical insulation properties, high thermal conductivity, excellent solderability, and high adhesion strength. Like PCB boards, they can be etched with various patterns and have a large current-carrying capacity. Therefore, ceramic substrates have become a fundamental material for high-power power electronic circuit structure and interconnection technologies. In some applications, LED lights are also used in conjunction with ceramic substrates.

[0003] When existing LED lights are mounted on ceramic substrates, they come into partial contact with the substrate. During LED light operation, a large amount of heat is dissipated, resulting in a significantly higher temperature at the point of contact between the ceramic substrate and the LED chip compared to other parts. This uneven heating can easily cause the ceramic substrate to deform or even break during LED chip operation, especially for high-power LED chips, which generate even more heat and are more prone to damaging the ceramic substrate. Therefore, it is necessary to further improve the existing ceramic substrate structure. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide a ceramic substrate with an LED structure, which can effectively solve the problems of existing ceramic substrates with LEDs being prone to localized overheating, uneven heating causing deformation of the ceramic substrate, and being unable to be used in high-power LED lamps.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A ceramic substrate with an LED structure includes a body, a circuit layer, a thermally conductive layer, an LED chip layer, and an encapsulating layer. The circuit layer covers the upper surface of the body. The thermally conductive layer covers the upper surface of the circuit layer, and an integrally recessed mounting groove is formed on the upper surface of the thermally conductive layer. The bottom of the mounting groove extends inward to the upper surface of the circuit layer and forms a through hole. The LED chip layer is fixed in the mounting groove and is attached to the bottom and sidewalls of the mounting groove. The LED chip layer is electrically connected to the circuit layer through the through hole. The encapsulating layer covers the upper surface of the LED chip layer, and the upper surface of the encapsulating layer is located in the mounting groove.

[0007] As a preferred embodiment, the thermally conductive layer is made of thermally conductive plastic.

[0008] As a preferred embodiment, the through hole is filled with conductive slurry.

[0009] As a preferred embodiment, the mounting slots are arranged in two spaced-apart configurations, with each mounting slot containing a corresponding LED chip layer. Each LED chip layer is connected to the circuit layer via a corresponding through-hole.

[0010] As a preferred embodiment, the sealing layer is a fluorescent powder mixed adhesive layer.

[0011] As a preferred embodiment, a heat sink is attached to the lower end face of the body. A mounting hole penetrating the body and the circuit layer is connected between the upper surface of the heat sink and the lower surface of the heat-conducting layer. A heat-conducting column is provided in the mounting hole. The heat-conducting column is a plurality of columns arranged at intervals. The upper and lower ends of each heat-conducting column are in contact with the lower surface of the heat-conducting layer and the upper surface of the heat sink, respectively.

[0012] As a preferred embodiment, both the heat sink and the heat-conducting pillar are made of graphene.

[0013] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0014] A thermally conductive layer is applied to the upper surface of the circuit layer. The upper surface of the thermally conductive layer is integrally recessed with a mounting groove, which is used to fix the LED chip layer in the mounting groove and fits against the bottom and side walls of the mounting groove. This allows the heat generated by the LED chip during operation to be quickly transferred to the entire plane of the ceramic substrate through the thermally conductive layer. This not only increases the heat dissipation area and improves the heat dissipation effect, but also makes the temperature of various parts of the ceramic substrate tend to be balanced, avoiding local overheating that could cause deformation or even damage to the ceramic substrate. At the same time, it can also meet the application scenarios of high-power LED chips.

[0015] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0016] Figure 1 This is a cross-sectional schematic diagram of a preferred embodiment of the present invention;

[0017] Figure 2 yes Figure 1 Enlarged diagram of point A in the middle.

[0018] Explanation of reference numerals in the attached diagram:

[0019] 10. Body 101, Mounting Holes

[0020] 11. Heat sink 12. Heat conduction column

[0021] 20. Circuit layer; 30. Thermal conductive layer

[0022] 301, Mounting slot; 302, Through hole

[0023] 40. LED chip layer; 50. Encapsulation layer. Detailed Implementation

[0024] Please refer to Figures 1 to 2 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, which includes a body 10, a circuit layer 20, a heat-conducting layer 30, an LED chip layer 40, and an encapsulating layer 50.

[0025] The circuit layer 20 covers the upper surface of the body 10.

[0026] The thermally conductive layer 30 covers the upper surface of the circuit layer 20. An integrally recessed mounting groove 301 is formed on the upper surface of the thermally conductive layer 30. The bottom of the mounting groove 301 extends inward to the upper surface of the circuit layer 20 and forms a through hole 302. In this embodiment, the thermally conductive layer 30 is made of thermally conductive plastic. Further, the thermally conductive layer 30 can also be made of other insulating and thermally conductive materials. Conductive paste is injected into the through hole 302. Two mounting grooves 301 are spaced apart, and each mounting groove 301 corresponds to an LED chip layer 40. Each LED chip layer 40 is electrically connected to the circuit layer 20 through a corresponding through hole 302. The spaced arrangement of the mounting grooves 301 and the chip layers 40 facilitates the thermally conductive layer 30 in conducting the heat generated by each LED chip layer 40 during operation to various parts of the ceramic substrate surface.

[0027] The LED chip layer 40 is fixed in the mounting groove 301 and fits against the bottom and side wall of the mounting groove 301, ensuring the contact area between the LED chip layer 40 and the heat-conducting layer 30 and ensuring the heat conduction effect. The LED chip layer 40 is electrically connected to the circuit layer 20 through the through hole 302.

[0028] The encapsulating layer 50 covers the upper surface of the LED chip layer 40, and the upper surface of the encapsulating layer 50 is located in the mounting groove 301, so that the upper surface of the encapsulating layer 50 abuts against the upper surface of the heat-conducting layer 30. During use, when subjected to external force, the force acts on the heat-conducting layer 30 first, thereby preventing the force from acting on the encapsulating layer 50 and the LED chip layer 40, thus improving the protection of the LED chip layer 40. In this embodiment, the encapsulating layer 50 is a phosphor-mixed adhesive layer, which changes the point emission of the LED chips on the LED chip layer 40 into surface emission, resulting in better lighting performance.

[0029] Furthermore, a heat sink 11 is attached to the lower end face of the body 10. A mounting hole 101, penetrating the body 10 and the circuit layer 20, connects the upper surface of the heat sink 11 and the lower surface of the thermally conductive layer 30. A plurality of thermally conductive pillars 12 are arranged at intervals within the mounting hole 101. The upper and lower ends of each thermally conductive pillar 12 are in contact with the lower surface of the thermally conductive layer 30 and the upper surface of the heat sink 11, respectively. Heat from the thermally conductive layer 30 is transferred to the heat sink 11 through the thermally conductive pillars 12, and then dissipated outwards through the heat sink 11, effectively improving the heat dissipation performance of the ceramic substrate. Both the heat sink 11 and the thermally conductive pillars 12 are made of graphene.

[0030] The key design feature of this invention is that a heat-conducting layer is applied to the upper surface of the circuit layer. The upper surface of the heat-conducting layer is integrally recessed with a mounting groove, which is used to fix the LED chip layer in the mounting groove and fits against the bottom and side walls of the mounting groove. This allows the heat generated by the LED chip during operation to be quickly transferred to the entire plane of the ceramic substrate through the heat-conducting layer. This not only increases the heat dissipation area and improves the heat dissipation effect, but also makes the temperature of various parts of the ceramic substrate tend to be balanced, avoiding local overheating that could cause deformation or even damage to the ceramic substrate. At the same time, it can also meet the application scenarios of high-power LED chips.

[0031] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A ceramic substrate with an LED structure, characterized in that: The device includes a body, a circuit layer, a thermally conductive layer, an LED chip layer, and an encapsulating layer. The circuit layer covers the upper surface of the body. The thermally conductive layer covers the upper surface of the circuit layer, and an integrally recessed mounting groove is formed on the upper surface of the thermally conductive layer. The bottom of the mounting groove extends inward to the upper surface of the circuit layer and forms a through hole. The LED chip layer is fixed in the mounting groove and is attached to the bottom and sidewalls of the mounting groove. The LED chip layer is electrically connected to the circuit layer through the through hole. The encapsulating layer covers the upper surface of the LED chip layer, and the upper surface of the encapsulating layer is located in the mounting groove.

2. The ceramic substrate with an LED structure according to claim 1, characterized in that: The thermally conductive layer is made of thermally conductive plastic.

3. The ceramic substrate with an LED structure according to claim 2, characterized in that: Conductive slurry is injected into the through hole.

4. The ceramic substrate with an LED structure according to claim 1, characterized in that: The mounting slots are arranged in two spaced-out positions. Each mounting slot contains a corresponding LED chip layer, and each LED chip layer is connected to the circuit layer through a corresponding through hole.

5. The ceramic substrate with an LED structure according to claim 1, characterized in that: The sealing layer is a fluorescent powder mixed adhesive layer.

6. The ceramic substrate with an LED structure according to claim 1, characterized in that: A heat sink is attached to the lower end face of the main body. A mounting hole is provided between the upper surface of the heat sink and the lower surface of the heat conduction layer, penetrating the main body and the circuit layer. A heat conduction column is provided in the mounting hole. There are multiple heat conduction columns arranged at intervals. The upper and lower ends of each heat conduction column are in contact with the lower surface of the heat conduction layer and the upper surface of the heat sink, respectively.

7. The ceramic substrate with an LED structure according to claim 6, characterized in that: Both the heat sink and the heat-conducting pillars are made of graphene.

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