Display assembly and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, in particular to a display assembly and electronic equipment. The display assembly comprises a substrate which comprises a transition area, a bending area and a plane area which are sequentially arranged in the length direction of the display assembly; the metal circuit structure is arranged on the substrate, a signal transmission layer and a detection circuit group are integrated in the metal circuit structure, and the detection circuit group is used for detecting the fracture condition of the signal transmission layer; the protection layer is arranged on the metal circuit structure; the detection unit is connected with the detection circuit group to form a detection loop of the signal transmission layer; the detection circuit group comprises a first detection circuit which extends along the edge of the substrate in the circumferential direction; and the second detection circuit extends from the plane area of the substrate to the transition area of the substrate and penetrates through the bending area of the substrate. According to the embodiment of the invention, the detection circuit can be arranged in the bending area, so that the breakage of the metal circuit at each position in the bending area can be accurately detected.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a display component and an electronic device. Background Technology

[0002] Today, mobile phones, tablets, and other electronic devices enrich people's lives, providing users with a variety of services. With the rapid development of electronic device technology, these devices are constantly being upgraded and iterated, and users' functional needs are becoming increasingly diversified. From communication to entertainment, electronic devices have become indispensable tools in people's lives. Against this backdrop, users are placing higher demands on the performance and stability of electronic device screens.

[0003] However, the metal trace bending area (pad bending, PB) at the bottom bezel of the screen is easily affected by external forces, which can cause the circuits (such as power lines) in the PB area to break, resulting in defects such as bright lines and screen flickering, thus affecting the display effect of the screen. Utility Model Content

[0004] This application provides a display component and an electronic device for accurately detecting line breaks at various locations in the PB area.

[0005] In a first aspect, this application provides a display component, comprising: a substrate, including a transition area, a bending area, and a planar area sequentially disposed along the length direction of the display component; a metal circuit structure disposed on the substrate, the metal circuit structure integrating a signal transmission layer and a detection circuit group, the detection circuit group being used to detect the breakage of the signal transmission layer; a protective layer disposed on the metal circuit structure; and a detection unit connected to the detection circuit group to form a detection loop for the signal transmission layer; wherein the detection circuit group includes: a first detection line extending circumferentially along the edge of the substrate; and a second detection line extending from the planar area of ​​the substrate to the transition area of ​​the substrate and penetrating the bending area of ​​the substrate.

[0006] In this embodiment, not only is a first detection line extending circumferentially provided, but a second detection line is also provided covering each position in the bending area (such as the center position, the edge position, etc.) to accurately detect the breakage of the metal line at each position in the bending area.

[0007] In one possible implementation of the first aspect described above, the first detection line covers the first and second regions of the bend area, and the second detection line covers the third region of the bend area, with the third region located between the first and second regions.

[0008] In this embodiment of the application, the first region and the second region are the left edge region and the right edge region, respectively, and the third region is the middle region.

[0009] In one possible implementation of the first aspect above, the extension direction of the second detection line on the bending region of the substrate is the first direction, and the extension direction of the second detection line on the transition region of the substrate includes at least one of the following: the first direction, the second direction, and the third direction, wherein the second direction is perpendicular to the first direction, and the third direction is inclined to the first direction and the second direction.

[0010] In one possible implementation of the first aspect described above, the signal transmission layer includes a data line, and a second detection line is disposed on the data line in the transition region for detecting the breakage of the data line in the transition region.

[0011] In one possible implementation of the first aspect described above, the second detection circuit is disposed in the metal wiring layer within the bending region of the substrate.

[0012] In one possible implementation of the first aspect described above, the second detection circuit is disposed in the transition region of the substrate in one of the following layers: a touch layer, a gate layer, a metal wiring layer, or a shielding metal layer.

[0013] In one possible implementation of the first aspect described above, the second detection circuit is disposed in a planar region of the substrate in one of the following layers: a touch layer, a gate layer, a metal wiring layer, or a shielding metal layer.

[0014] In one possible implementation of the first aspect described above, the detection unit is a flexible printed circuit board with test points, and the detection circuit group is used to connect with the flexible printed circuit board to form a detection loop.

[0015] In one possible implementation of the first aspect above, the display component further includes: an integrated circuit module electrically connected to the metal circuit structure; wherein the detection unit is a logic detection unit disposed within the integrated circuit module, and the detection circuit group is used to connect with the logic detection unit to form a detection loop.

[0016] Secondly, this application provides an electronic device, which includes a housing and a display component provided in the first aspect, the display component being disposed within the housing. Attached Figure Description

[0017] Figure 1 A first structural schematic diagram of a display component 10 is shown according to an embodiment of this application;

[0018] Figure 2 A schematic cross-sectional view of a display component 10 along the YZ plane is shown according to an embodiment of this application;

[0019] Figure 3 A schematic diagram of a first detection line extending circumferentially is shown according to an embodiment of this application;

[0020] Figure 4An embodiment of this application illustrates a distribution diagram of a first detection line in the PB area;

[0021] Figure 5 According to an embodiment of this application, a distribution diagram of a first detection line and a second detection line in the PB area is shown;

[0022] Figure 6 A schematic diagram of a second structure of a display component 10 is shown according to an embodiment of this application;

[0023] Figure 7 A first plan view of a metal circuit structure 10-3 of a display component 10 is shown according to an embodiment of this application;

[0024] Figure 8 A first partial cross-sectional view of a display component 10 along the YZ plane is shown according to an embodiment of this application;

[0025] Figure 9 A second plan view of a metal circuit structure 10-3 of a display component 10 is shown according to an embodiment of this application;

[0026] Figure 10A A second partial cross-sectional view of a display component 10 along the YZ plane is shown according to an embodiment of this application;

[0027] Figure 10B A third partial cross-sectional view of a display component 10 along the YZ plane is shown according to an embodiment of this application;

[0028] Figure 10C A fourth partial cross-sectional view of a display component 10 along the YZ plane is shown according to an embodiment of this application;

[0029] Figure 11 A third plan view of a metal circuit structure 10-3 of a display component 10 is shown according to an embodiment of this application;

[0030] Figure 12 A fourth plan view of a metal circuit structure 10-3 of a display component 10 is shown according to an embodiment of this application;

[0031] Figure 13 A fifth partial cross-sectional view of a display component 10 along the YZ plane is shown according to an embodiment of this application. Detailed Implementation

[0032] The illustrative embodiments of this application include, but are not limited to, a display component and an electronic device.

[0033] It is understood that the electronic device provided in this application includes a housing and a display component as described in any embodiment of this application, with the display component disposed within the housing. The electronic device provided in this application may include, but is not limited to, any of the following electronic devices with microphones: mobile phones, tablets, laptops, cameras, ultra-mobile personal computers (UMPCs), handheld computers, touch-screen TVs, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), wearable devices, virtual reality devices, intelligent vehicles, intelligent robots, industrial equipment, etc. This application does not impose any limitations on this. For ease of description, a mobile phone will be used as an example for the following illustration.

[0034] Before introducing the display components, the directions indicated in the figures of this application will be explained. In the figures of this application, the X-axis direction represents the width direction of the display component, the Y-axis direction represents the length direction of the display component, and the Z-axis direction represents the thickness direction of the display component. The X-axis, Y-axis, and Z-axis directions are perpendicular to each other.

[0035] As mentioned earlier, the PB area at the edge of the display component of electronic devices is easily affected by external forces, which can cause the circuitry in the PB area to break, thereby affecting the display effect of the screen.

[0036] Figure 1 A schematic diagram of a display component 10 is shown according to an embodiment of this application.

[0037] refer to Figure 1 The display component 10 includes a top surface and a bottom surface 11 disposed opposite to each other along the Y-axis direction, wherein the PB area is disposed close to the bottom surface 11 of the display component 10.

[0038] Figure 2 A schematic cross-sectional view of the display component 10 along the YZ plane is shown.

[0039] refer to Figure 2 The display component 10 includes a cover plate 101, a front film 102, a display film 103, a signal transmission layer 1, a substrate 104, a first back film 105, a second back film 106, a third back film 107, a flexible printed circuit (FPC) 108, and a display driver integrated circuit (DDIC) 109, which are stacked sequentially along the Z-axis.

[0040] The cover plate 101 can be a composite of one or more film layers, such as cover glass, foldable ultra-thin glass (UTG), and polyethylene terephthalate (PET). The front film material 102 can be a composite of one or more film layers, such as optically clear adhesive (OCA) and polarizer (POL). The display screen film material 103 can be a composite of one or more structures, such as touch panel (TP), cover on encapsulation (COE), and microlens array (MLA). The signal transmission layer 1 can be a composite of one or more of the following: metal traces, inorganic insulating layer, organic insulating layer, oxide semiconductor, and silicon-based semiconductor. The substrate 104 can be a composite of one or more of the following: inorganic substrate and organic substrate. For example, the inorganic substrate can include silicon nitride (SiNx) and silicon oxide (SiOx) inorganic films, and the organic substrate can include polyimide (PI) films. The first backing film 105 can be a composite of one or more of PET, PI, and metal film. The second backing film 106 can be a composite of one or more of adhesive, copper foil, and other film layers. The third backing film 107 can be a composite of one or more of PET, PI, and metal film.

[0041] Optionally, in the application scenario of the overall architecture of this display component, it may also include an injection molding compound 110 disposed on one side of the display component 10 along the Y-axis direction, wherein the injection molding compound is used to seal and fix at least part of the structure in the display component 10; the glue of 110 may cover the periphery (space outside the semicircle) and center (space inside the center of the semicircle) of the entire PB area as shown in the schematic diagram, or it may only cover the center of the PB area, or only cover the periphery of the PB area.

[0042] like Figure 2As shown, the signal transmission layer 1 passes through the active area (AA), transition area (AA-PB) (not labeled in the figure), pad bending (PB) area, and pad area. The bending of the traces in the PB area of ​​the signal transmission layer can easily lead to breakage of the signal transmission layer 1 (i.e., metal lines, such as power lines, ground lines, signal lines, data lines, etc.) in the PB area during the fabrication or use of the display component 10. For example, in some embodiments, to thin the lower bezel of the display component 10, a low injection pressure over-molding (LIPO) process is used to inject the injection molding compound 10. However, during the injection process, external forces may be applied to the signal transmission layer 1 in the PB area or other areas, causing the metal lines to break and ultimately damaging the screen, such as vertical lines or screen distortion.

[0043] According to some embodiments, by providing detection lines at the edge of the display component 10, the breakage of metal lines in the edge region (including the edge region of the PB area) of the display component 10 can be detected. By detecting the impedance change of the detection lines, it can be determined whether the detection lines are broken, and further, whether the metal lines near the detection lines are broken. For example, during the manufacturing process of the display component 10, the impedance change of the detection lines can be detected. If the impedance increases, it can be determined that the detection lines are broken, and further, it can be inferred that the metal lines near the detection lines are broken.

[0044] Current wiring architectures also include traces with breakage monitoring, but these traces are typically located near the display's cutout, and all traces for the entire display component (such as the screen) are connected in series. For example, see reference... Figure 3 In the current wiring architecture, the first detection line 2 extends circumferentially along the outer periphery of the substrate (not shown in the figure) of the display component 10. The first detection line 2 passes through the PB area 111 and the fan-out packaging (FOP) 112, and is connected to the DDIC 109, thereby forming lines such as... in the left and right edge areas of the PB area 111. Figure 4 The four detection lines shown can only detect broken traces at the edges of the PB area, and cannot detect broken traces at the center of the PB area. Figure 3 The illustration shows an exemplary embodiment, in which the PB area is flattened for ease of illustration.

[0045] Based on this, embodiments of this application provide a display component, in which the detection lines may include multiple sets, and the multiple sets of detection lines are respectively arranged at different positions in the PB area, thereby being able to cover areas other than the edge areas. (Reference) Figure 5 In this embodiment of the application, compared to Figure 3 , Figure 4 The illustrated embodiment can add multiple sets of second detection lines 3, wherein the second detection lines 3 can cover the central area (non-edge area) of the PB region. By detecting the impedance change of the second detection lines 3, the breakage of the lines in the central area of ​​the PB region can be detected, thereby improving the comprehensiveness of the line quality detection.

[0046] It should be noted that, Figure 5 The number of detection lines shown is for illustrative purposes only, and this application does not limit the number or distribution of detection lines.

[0047] According to some embodiments, the display component 10 can be an active matrix organic light emitting diode (AMOLED) screen. This application does not limit the type of display component 10.

[0048] The following is combined Figure 6 An embodiment of a display component 10 is described.

[0049] refer to Figure 6 The display component 10 provided in this application embodiment includes a protective layer 10-1, a substrate 10-2, a metal circuit structure 10-3, and a detection unit 10-4.

[0050] Protective layer 10-1 may include, for example Figure 1 The cover plate 101, front film 102, and display film 103 are shown. The substrate 10-2 can be as follows: Figure 1 The substrate 104 is shown. The metal circuit structure 10-3 may include, for example, Figure 1 The diagram shows signal transmission layer 1 (i.e., the line to be tested) and a detection line group, the latter used to detect breaks in the signal transmission layer. Detection unit 10-4 can be as follows: Figure 1 The FPC 108 or DDIC 109 shown can be connected to the detection line group to form the detection loop of signal transmission layer 1.

[0051] The substrate 10-2 and the metal circuit structure 10-3 include an AA region 113, an AA-PB region 114, a PB region 111, and a Pad region 115 arranged sequentially. The detection circuit group may include a first detection line 2 extending circumferentially along the edge of the substrate 10-2; and a second detection line 3 extending from the Pad region 115 of the substrate 10-2 to the AA-PB region 114 of the substrate 10-2 and penetrating the PB region 111 of the substrate 10-2.

[0052] In this embodiment, the first detection line 2 and the second detection line 3 can cover different areas and can be detected and monitored separately, thereby increasing the detection coverage area of ​​the signal transmission layer 1 while ensuring independent detection of the lines in each area, so as to improve the comprehensiveness and efficiency of the detection of the signal transmission layer 1.

[0053] The following is combined Figure 7 and Figure 8 An embodiment of a display component 10 is described.

[0054] Figure 7 This is a first plan view of a metal circuit structure 10-3 of a display component 10 provided in an embodiment of this application, showing a signal transmission layer 1 and a second detection circuit 3. It can be understood that... Figure 7 The area shown in the plan view corresponds to a local area of ​​the display component 10 near the bottom surface 11. Figure 7 The signal transmission layer 1 shown is merely an example, and this application does not limit the type, layout, or number of each signal transmission layer 1. The metal circuit structure 10-3 may also include... Figure 7 The first detection line 2 is not shown in the diagram.

[0055] refer to Figure 7 The metal circuit structure 10-3 includes a signal transmission layer 1 and a second detection line 3. The signal transmission layer 1 includes a gate high / low voltage input (VGL / VGH) line 116, a gate in panel (GIP) line 117, a first power supply (VSS) line 118, a second power supply (VDD) line 119, a cell test (CT) line 120, a touch panel (TP) line 121, and a data line 122.

[0056] The second detection line 3 includes four sets of detection lines arranged sequentially along the X-axis. The first and fourth sets of detection lines along the X-axis cover the VSS line 118 and form a U-shaped line in the PB area 111 and the AA-PB area 114, respectively. Each set of detection lines extends from FOP 112 to PB area 111, passes through PB area 111 along the Y-axis, bends back to PB area 111 after AA-PB area 114, passes through PB area 111 again along the Y-axis, and finally returns to FOP 112, forming a detection loop.

[0057] The second and third groups of detection lines along the X-axis can cover VDD line 119 and form two U-shaped lines in PB area 111 and AA-PB area 114 respectively. Each group of detection lines extends from FOP 112 to PB area 111, passes through PB area 111 along the Y-axis, bends back to PB area 111 at AA-PB area 114, and passes through PB area 111 along the Y-axis, forming the first U-shaped loop. Then, each group of detection lines extends again to PB area 111, passes through PB area 111 along the Y-axis, bends back to PB area 111 at AA-PB area 114, and passes through PB area 111 along the Y-axis, forming the second U-shaped loop. Finally, the detection lines return to FOP 112, thus forming a detection loop for each group of detection lines.

[0058] In some embodiments, VGL / VGH lines 116 and GIP lines 117 are connected to the gate on array (GOA) 123, respectively.

[0059] It is understood that FOP 112 can be embedded in the bonding area of ​​FPC, and FOP 112 can be provided with test points 124 corresponding to each group of test lines in the second detection line 3. Specifically, the four groups of test lines are respectively connected to the four test points corresponding to the four groups of test lines provided on FOP 112, and the four test points are used to detect the impedance of the four groups of test lines.

[0060] According to some embodiments, the FPC can be used as a detection unit 10-4, and the FPC can be connected to the test point 124 set on the FOP 112 to detect the impedance of the second detection line 3.

[0061] According to some embodiments, the logic detection unit in the DDIC can be used as detection unit 10-4. After each group of detection lines in the second detection line 3 is connected to the FPC via the test points set on the FOP 112, it can extend back to the FOP 112 area and be connected to the logic detection unit through the line between the FOP 112 area and the DDIC, so that the logic detection unit can detect the impedance of the second detection line 3.

[0062] According to some embodiments, the two ends of each group of detection lines in the second detection line 3 may not be connected to FOP 112, but may be directly connected to DDIC, so that DDIC can detect the impedance of the second detection line 3.

[0063] Figure 8 This is a first partial cross-sectional view of a display component 10 provided in an embodiment of this application.

[0064] like Figure 8As shown, the display component 10 includes a touch panel over coating (TOC) 201, a touch panel interlayer dielectric layer (TLD) 202, a TP metal layer (touch panel metel A / TMA or touch panel metel B / TMB) 203, a touch panel buffer layer (TBL) 204, an organic planar insulating layer (PLN) 3 205, a PLN2 206, a source drain layer (SD) 2 207, a PLN1 208, a gate insulator + interlayer dielectric (GI+ILD) 209, a barrier + buffer layer 210, a polyimide layer (PI) 211, and a buffer layer (BF) 212, stacked between SD2 207 and the TP metal layer 203. 213, and a pixel definition layer + photo spacer (PDL + PS) 214 stacked on PLN3 205. It can be understood that in some embodiments, if there is no SD3 213 metal in the stacked architecture, the TP metal layer 203 can be directly connected to SD2 207.

[0065] According to some embodiments, each group of detection lines in the second detection line 3 can use TP metal layer 203 metal traces in Pad area 115, SD2 207 metal traces in PB area, and TP metal layer 203 metal traces in AA-PB area 114. It can be understood that for each U-shaped loop in each group of detection lines, the TP metal layer 203 metal trace from Pad area 115 to PB area 111 can be replaced with SD2 207 metal traces, the SD2 207 metal trace from PB area 111 to AA-PB area 114 can be replaced with TP metal layer 203 metal traces, and after bending in AA-PB area 114, the TP metal layer 203 metal trace from AA-PB area 114 to PB area 111 can be replaced with SD2 207 metal traces, and the SD2 207 metal trace from PB area 111 to Pad area 115 can be replaced with TP metal layer 203 metal traces.

[0066] It should be noted that the SD2 metal film layer (such as SD2 207) mentioned in the embodiments of this application refers to the film layer used for signal transmission. In some other optional embodiments, the SD2 metal film layer can also be replaced with the SD1 metal film layer while ensuring effective formation of electrical signal connection between the film layers. This application does not limit this.

[0067] According to other embodiments, each group of detection lines in the second detection line 3 can use SD2207 metal traces in both PB area 111 and AA-PB area 114. It is understood that for each U-shaped loop in each group of detection lines, the trace from Pad area 115 to PB area 111 can be replaced with SD2207 metal traces, and the trace from PB area 111 to Pad area 115 can be replaced with SD2207 metal traces.

[0068] The following is combined Figure 9 and Figures 10A-10C An embodiment of a display component 10 is described.

[0069] Figure 9 This is a second plan view of a metal circuit structure 10-3 of a display component 10 provided in an embodiment of this application, showing the signal transmission layer 1 and the second detection circuit 3. It can be understood that... Figure 9 The area shown in the plan view corresponds to a local area of ​​the display component 10 near the bottom surface 11. Figure 9 The signal transmission layer 1 shown is merely an example, and this application does not limit the type, layout, or number of each signal transmission layer 1. The metal circuit structure 10-3 may also include... Figure 9 The first detection line 2 is not shown in the diagram.

[0070] refer to Figure 9 The metal circuit structure 10-3 includes a signal transmission layer 1 and a second detection line 3. The signal transmission layer 1 includes a VGL / VGH line 116, a GIP line 117, a VSS line 118, a VDD line 119, a CT line 120, a TP line 121, and a data line 122.

[0071] The second detection line 3 includes six sets of detection lines arranged sequentially along the X-axis. The first and sixth sets of detection lines along the X-axis cover the VSS line 118 and employ a paperclip-style routing in the PB area 111 and AA-PB area 114, forming multiple U-shaped lines, i.e., multiple loops. Some U-shaped lines can extend from AA-PB area 114 through PB area 111, while others can be routed only within the AA-PB area. Each set of detection lines forms a detection loop.

[0072] The second, third, fourth, and fifth groups of detection lines along the X-axis can cover VDD line 119, and use a paperclip-style routing in PB area 111 and AA-PB area 114 to form multiple U-shaped lines, i.e., multiple loops. Some U-shaped lines can run from AA-PB area 114 through PB area 111, while some U-shaped lines can be only routed within the AA-PB area. Each group of detection lines forms a detection loop.

[0073] In some embodiments, VGL / VGH line 116 and GIP line 117 are connected to GOA 123, respectively.

[0074] It is understood that FOP 112 can be embedded in the soldering area of ​​FPC, and FOP 112 can be provided with test points 124 corresponding to each group of test lines in the second detection line 3. Specifically, the 6 groups of test lines are respectively connected to the 6 groups of test points provided on FOP 112, and the 6 groups of test points are used to detect the impedance of the 6 groups of test lines.

[0075] According to some embodiments, the FPC can be used as a detection unit 10-4, and the FPC can be connected to the test point 124 set on the FOP 112 to detect the impedance of the second detection line 3.

[0076] According to some embodiments, the logic detection unit in the DDIC can be used as detection unit 10-4. After each group of detection lines in the second detection line 3 is connected to the FPC via the test points set on the FOP 112, it can extend back to the FOP 112 area and be connected to the logic detection unit through the line between the FOP 112 area and the DDIC, so that the logic detection unit can detect the impedance of the second detection line 3.

[0077] According to some embodiments, the two ends of each group of detection lines in the second detection line 3 may not be connected to FOP 112, but may be directly connected to DDIC, so that DDIC can detect the impedance of the second detection line 3.

[0078] Figure 10A This is a second partial cross-sectional view of a display component 10 provided in an embodiment of this application.

[0079] like Figure 10AAs shown, the display component 10 includes TOC 201, TLD 202, TP metal layer 203, TBL 204, PLN3 205, PLN2 206, SD2 207, PLN1 208, GI+ILD 209, Barrier+Buffer 210, polyimide layer (PI) 211, and buffer layer (BF) 212 stacked sequentially along the Z-axis direction; SD3 213 stacked between SD2 207 and TP metal layer 203; PDL+PS 214 stacked on PLN3 205; and SD12 15 stacked on GI+ILD 209. It can be understood that in some embodiments, if SD3 213 is not present in the stacked architecture, TP metal layer 203 can be directly connected to SD2 207.

[0080] refer to Figure 10A VSS line 118 and VDD line 119 can use SD1 215 metal traces.

[0081] According to some embodiments, each group of detection lines in the second detection line 3 can use TP metal layer 203 metal traces in Pad area 115, SD2 207 metal traces in PB area, and TP metal layer 203 metal traces in AA-PB area 114. It can be understood that for each U-shaped loop in each group of detection lines, the TP metal layer 203 metal trace from Pad area 115 to PB area 111 can be replaced with SD2 207 metal traces, the SD2 207 metal trace from PB area 111 to AA-PB area 114 can be replaced with TP metal layer 203 metal traces, and after bending in AA-PB area 114, the TP metal layer 203 metal trace from AA-PB area 114 to PB area 111 can be replaced with SD2 207 metal traces, and the SD2 207 metal trace from PB area 111 to Pad area 115 can be replaced with TP metal layer 203 metal traces.

[0082] It should be noted that the SD2 metal film layer (such as SD2 207) mentioned in the embodiments of this application refers to the film layer used for signal transmission. In some other optional embodiments, the SD2 metal film layer can also be replaced with the SD1 metal film layer while ensuring effective formation of electrical signal connection between the film layers. This application does not limit this.

[0083] According to other embodiments, each group of detection lines in the second detection line 3 can use SD2207 metal traces in both PB area 111 and AA-PB area 114. It is understood that for each U-shaped loop in each group of detection lines, the trace from Pad area 115 to PB area 111 can be replaced with SD2207 metal traces, and the trace from PB area 111 to Pad area 115 can be replaced with SD2207 metal traces.

[0084] Figure 10B This is a third partial cross-sectional view of a display component 10 provided in an embodiment of this application.

[0085] like Figure 10B As shown, the display component 10 includes TOC 201, TLD 202, TP metal layer 203, TBL 204, PLN3 205, PLN2 206, SD2 207, PLN1 208, GI+ILD 209, Barrier+Buffer 210, polyimide (PI) layer 211 and buffer (BF) layer 212 stacked along the Z-axis, SD3 213 stacked between SD2 207 and TP metal layer 203 (if there is no SD3 metal in the stacked architecture, the TP metal layer can be directly connected to SD2), PDL+PS 214 stacked on PLN3 205, and SD1 215 stacked on GI+ILD 209.

[0086] It should be noted that the SD2 metal film layer (such as SD2 207) mentioned in the embodiments of this application refers to the film layer used for signal transmission. In some other optional embodiments, the SD2 metal film layer can also be replaced with the SD1 metal film layer while ensuring effective formation of electrical signal connection between the film layers. This application does not limit this.

[0087] Compared to Figure 10A The illustrated embodiment, in Figure 10B In the embodiment shown, VSS line 118 and VDD line 119 can be made of SD2 207 metal traces and SD1 215 metal traces stacked sequentially along the Z-axis.

[0088] Figure 10C This is a fourth partial cross-sectional view of a display component 10 provided in an embodiment of this application.

[0089] like Figure 10CAs shown, the display component 10 includes TOC 201, TLD 202, TP metal layer 203, TBL 204, PLN3 205, PLN2 206, SD2 207, PLN1 208, GI+ILD 209, Barrier+Buffer 210, PI 211 and BF 212 stacked sequentially along the Z-axis direction, SD3 213 stacked between SD2 207 and TP metal layer 203 (if there is no SD3 metal in the stacked architecture, the TP metal layer can be directly connected to SD2), PDL+PS 214 stacked on PLN3 205, and SD1 215 stacked on GI+ILD 209.

[0090] It should be noted that the SD2 metal film layer (such as SD2 207) mentioned in the embodiments of this application refers to the film layer used for signal transmission. In some other optional embodiments, the SD2 metal film layer can also be replaced with the SD1 metal film layer while ensuring effective formation of electrical signal connection between the film layers. This application does not limit this.

[0091] Compared to Figure 10A and Figure 10B The illustrated embodiment, in Figure 10C In the embodiment shown, VSS line 118 and VDD line 119 can be made of SD3 213 metal traces, SD2 207 metal traces and SD1215 metal traces stacked sequentially along the Z-axis.

[0092] The following is combined Figure 11 and Figure 8 An embodiment of a display component 10 is described.

[0093] Figure 11 This is a third plan view of a metal circuit structure 10-3 of a display component 10 provided in an embodiment of this application, showing the signal transmission layer 1 and the second detection circuit 3. It can be understood that... Figure 11 The area shown in the plan view corresponds to a local area of ​​the display component 10 near the bottom surface 11. Figure 11 The signal transmission layer 1 shown is merely an example, and this application does not limit the type, layout, or number of each signal transmission layer 1. The metal circuit structure 10-3 may also include... Figure 11 The first detection line 2 is not shown in the diagram.

[0094] refer to Figure 11 The metal circuit structure 10-3 includes a signal transmission layer 1 and a second detection line 3. The signal transmission layer 1 includes a VGL / VGH line 116, a GIP line 117, a VSS line 118, a VDD line 119, a CT line 120, a TP line 121, and a data line 122.

[0095] The second detection line 3 includes six groups of detection lines arranged sequentially along the X-axis. The first and sixth groups of detection lines along the X-axis cover VGL / VGH line 116, GIP line 117, and VSS line 118, and within the AA-PB area 114, they employ vertical (along the Y-axis), horizontal (along the X-axis), and diagonal (inclined to the X and Y axes) routing, forming multiple broken lines above VGL / VGH line 116, GIP line 117, and VSS line 118. Each group of detection lines forms a detection loop, enabling the detection of VGL / VGH line 116, GIP line 117, and VSS line 118 in the AA-PB area 114, as well as the detection of VSS line 118 in the PB area 111.

[0096] The second, third, fourth, and fifth groups of detection lines along the X-axis can cover VDD line 119 and data line 122. In the AA-PB area 114, they employ vertical (along the Y-axis), horizontal (along the X-axis), and diagonal (inclined to the X and Y axes) routing, forming multiple broken lines above VDD line 119 and data line 122. Each group of detection lines forms a detection loop, enabling detection of VDD line 119 and data line 122 in the AA-PB area 114, as well as detection of VDD line 119 in the PB area 111.

[0097] In some embodiments, VGL / VGH line 116 and GIP line 117 are connected to GOA 123, respectively.

[0098] It is understood that FOP 112 can be embedded in the soldering area of ​​FPC, and FOP 112 can be provided with test points 124 corresponding to each group of test lines in the second detection line 3. Specifically, the 6 groups of test lines are respectively connected to the 6 groups of test points provided on FOP 112, and the 6 groups of test points are used to detect the impedance of the 6 groups of test lines.

[0099] According to some embodiments, the FPC can be used as a detection unit 10-4, and the FPC can be connected to the test point 124 set on the FOP 112 to detect the impedance of the second detection line 3.

[0100] According to some embodiments, the logic detection unit in the DDIC can be used as detection unit 10-4. After each group of detection lines in the second detection line 3 is connected to the FPC via the test points set on the FOP 112, it can extend back to the FOP 112 area and be connected to the logic detection unit through the line between the FOP 112 area and the DDIC, so that the logic detection unit can detect the impedance of the second detection line 3.

[0101] According to some embodiments, the two ends of each group of detection lines in the second detection line 3 may not be connected to FOP 112, but may be directly connected to DDIC, so that DDIC can detect the impedance of the second detection line 3.

[0102] refer to Figure 8 According to some embodiments, each group of detection lines in the second detection line 3 can use TP metal layer 203 metal traces in Pad area 115, SD2 207 metal traces in PB area, and TP metal layer 203 metal traces in AA-PB area 114. It can be understood that for each U-shaped loop in each group of detection lines, the TP metal layer 203 metal trace from Pad area 115 to PB area 111 can be replaced with SD2 207 metal traces, the SD2 207 metal trace from PB area 111 to AA-PB area 114 can be replaced with TP metal layer 203 metal traces, and after bending in AA-PB area 114, the TP metal layer 203 metal trace from AA-PB area 114 to PB area 111 can be replaced with SD2 207 metal traces, and the SD2 207 metal trace from PB area 111 to Pad area 115 can be replaced with TP metal layer 203 metal traces.

[0103] According to other embodiments, each group of detection lines in the second detection line 3 can use SD2207 metal traces in both PB area 111 and AA-PB area 114. It is understood that for each U-shaped loop in each group of detection lines, the trace from Pad area 115 to PB area 111 can be replaced with SD2207 metal traces, and the trace from PB area 111 to Pad area 115 can be replaced with SD2207 metal traces.

[0104] The following is combined Figure 12 and Figure 13 An embodiment of a display component 10 is described.

[0105] Figure 12 A fourth plan view of a metal circuit structure 10-3 of a display component 10 provided in an embodiment of this application shows a signal transmission layer 1 and a second detection circuit 3.

[0106] Understandable. Figure 12 The area shown in the plan view corresponds to a local area of ​​the display component 10 near the bottom surface 11. Figure 12 The signal transmission layer 1 shown is merely an example, and this application does not limit the type, layout, or number of each signal transmission layer 1. The metal circuit structure 10-3 may also include... Figure 12 The first detection line 2 is not shown in the diagram.

[0107] refer to Figure 12 The metal circuit structure 10-3 includes a signal transmission layer 1 and a second detection line 3. The signal transmission layer 1 includes a VGL / VGH line 116, a GIP line 117, a VSS line 118, a VDD line 119, a CT line 120, a TP line 121, and a data line 122.

[0108] The second detection line 3 includes five sets of detection lines arranged sequentially along the X-axis. The first and fifth sets of detection lines along the X-axis cover VGL / VGH line 116, GIP line 117, VSS line 118, and data line 122. Within the AA-PB area 114, these lines are routed vertically (along the Y-axis), horizontally (along the X-axis), and diagonally (inclined to the X and Y axes), forming broken lines above VGL / VGH line 116, GIP line 117, VSS line 118, and data line 122. Each set of detection lines forms a detection loop, enabling detection of VGL / VGH line 116, GIP line 117, VSS line 118, and data line 122 in the AA-PB area 114, as well as detection of VSS line 118 in the PB area 111.

[0109] The second and fourth groups of detection lines along the X-axis can cover VDD line 119 and data line 122. In the AA-PB area 114, they employ vertical (along the Y-axis), horizontal (along the X-axis), and diagonal (inclined to the X and Y axes) routing to form a broken line on data line 122. Each group of detection lines forms a detection loop, enabling detection of data line 122 in the AA-PB area 114 and VDD line 119 in the PB area 111.

[0110] The third set of detection lines along the X-axis can cover VDD line 119 and data line 122, forming two symmetrical loop lines that run through PB area 111. Each loop line in AA-PB area 114 uses vertical (along the Y-axis), horizontal (along the X-axis), and diagonal (inclined to the X and Y axes) routing, thus forming a broken line above data line 122. Each set of detection lines can form a detection loop, enabling detection of data line 122 in AA-PB area 114 and VDD line 119 in PB area 111.

[0111] In some embodiments, VGL / VGH line 116 and GIP line 117 are connected to GOA 123, respectively.

[0112] It is understood that FOP 112 can be embedded in the soldering area of ​​FPC, and FOP 112 can be provided with test points 124 corresponding to each group of test lines in the second detection circuit 3. Specifically, the 5 groups of test lines are respectively connected to the 5 groups of test points provided on FOP 112, and the 5 groups of test points are used to detect the impedance of the 5 groups of test lines.

[0113] According to some embodiments, the FPC can be used as a detection unit 10-4, and the FPC can be connected to the test point 124 set on the FOP 112 to detect the impedance of the second detection line 3.

[0114] According to some embodiments, the logic detection unit in the DDIC can be used as detection unit 10-4. After each group of detection lines in the second detection line 3 is connected to the FPC via the test points set on the FOP 112, it can extend back to the FOP 112 area and be connected to the logic detection unit through the line between the FOP 112 area and the DDIC, so that the logic detection unit can detect the impedance of the second detection line 3.

[0115] According to some embodiments, the two ends of each group of detection lines in the second detection line 3 may not be connected to FOP 112, but may be directly connected to DDIC, so that DDIC can detect the impedance of the second detection line 3.

[0116] Figure 13 This is a partial cross-sectional view of a display component 10 provided in an embodiment of this application.

[0117] like Figure 13 As shown, the display component 10 includes TOC 201, TLD 202, TP metal layer 203, TBL 204, PLN3 205, PLN2 206, SD2 207, PLN1 208, GI+ILD 209, Barrier+Buffer 210, PI 211, and BF 212 stacked sequentially along the Z-axis, with PDL+PS 214 stacked on top of PLN3 205. The Barrier+Buffer 210 includes a back shield mask (BSM) 216, with SD2 207 stacked on top of BSM 216.

[0118] According to some embodiments, each group of detection lines in the second detection line 3 can use TP metal layer 203 metal traces in Pad area 115, SD2 207 metal traces in PB area, and BSM 216 metal traces in AA-PB area 114. It can be understood that for each U-shaped loop in each group of detection lines, the TP metal layer 203 metal trace from Pad area 115 to PB area 111 can be replaced with SD2 207 metal traces, the SD2 207 metal trace from PB area 111 to AA-PB area 114 can be replaced with BSM 216 metal traces, and after bending in AA-PB area 114, the BSM 216 metal trace from AA-PB area 114 to PB area 111 can be replaced with SD2 207 metal traces, and the SD2 207 metal trace from PB area 111 to Pad area 115 can be replaced with TP metal layer 203 metal traces.

[0119] It is understood that the wiring method of the second detection line 3 described above is merely exemplary, and the embodiments of this application do not limit the wiring method of the second detection line 3. For example, the second detection line 3 in the AA-PB region 114 can use any one of the following metal lines: touch layer (such as TP metal layer 203), gate layer (such as GI+ILD 209), metal wiring layer (such as SD2 207), and screen metal layer (such as BSM 216). As another example, the second detection line 3 in the Pad region 115 can use any one of the following metal lines: touch layer (such as TP metal layer 203), gate layer (such as GI+ILD 209), metal wiring layer (such as SD2 207), and screen metal layer (such as BSM 216).

[0120] It should be noted that in the examples and description of this application, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, including an element by a statement does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0121] Although this application has been illustrated and described with reference to certain preferred embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made thereto without departing from the scope of this application.

Claims

1. A display component, characterized in that, include: The substrate includes a transition area, a bending area, and a planar area arranged sequentially along the length of the display component; A metal circuit structure is disposed on the substrate, and the metal circuit structure integrates a signal transmission layer and a detection circuit group, wherein the detection circuit group is used to detect the breakage of the signal transmission layer. A protective layer is disposed on the metal circuit structure; A detection unit is connected to the detection circuit group to form a detection loop of the signal transmission layer. The detection circuit group includes: The first detection line extends circumferentially along the edge of the substrate; The second detection line extends from the planar area of ​​the substrate to the transition area of ​​the substrate and passes through the bending area of ​​the substrate.

2. The display component according to claim 1, characterized in that, The first detection line covers the first and second regions of the bending area, and the second detection line covers the third region of the bending area, the third region being located between the first and second regions.

3. The display component according to claim 1, characterized in that, The second detection line extends in the bending area of ​​the substrate in the first direction. The extension direction of the second detection line on the transition area of ​​the substrate includes at least one of the following: the first direction, the second direction, and the third direction, wherein the second direction is perpendicular to the first direction, and the third direction is inclined to the first direction and the second direction.

4. The display component according to claim 1, characterized in that, The signal transmission layer includes a data line, and the second detection line is disposed on the data line in the transition region for detecting the breakage of the data line in the transition region.

5. The display component according to claim 1, characterized in that, The second detection line is located in the metal wiring layer within the bending area of ​​the substrate.

6. The display component according to claim 1, characterized in that, The second detection circuit is disposed in one of the following layers within the transition region of the substrate: a touch layer, a gate layer, a metal wiring layer, or a shielding metal layer.

7. The display component according to claim 1, characterized in that, The second detection circuit is disposed in one of the following layers within the planar region of the substrate: a touch layer, a gate layer, a metal wiring layer, or a shielding metal layer.

8. The display component according to any one of claims 1-7, characterized in that, The detection unit is a flexible printed circuit board with test points, and the detection circuit group is used to connect with the flexible printed circuit board to form a detection loop.

9. The display component according to any one of claims 1-7, characterized in that, The display component further includes: An integrated circuit module electrically connected to the metal circuit structure; The detection unit is a logic detection unit located within the integrated circuit module, and the detection circuit group is used to connect with the logic detection unit to form a detection loop.

10. An electronic device, characterized in that, The electronic device includes a housing and a display component as described in any one of claims 1-9, the display component being disposed within the housing.

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