Scale type diamond saw blade

Abstract

The utility model discloses a scale type diamond saw blade which comprises a saw blade base body, scales formed by diamond particles are arranged on the surfaces of the two sides of the saw blade base body, chip removal cooling grooves which are communicated with one another and are nonlinear in direction are formed between the scales, and the scales are sequentially increased from a center hole to the side edge direction of the saw blade base body. According to the diamond saw blade disclosed by the invention, the diamond grains form a plurality of scales higher than the surface of the saw blade base body, and chip removal cooling grooves which are communicated with one another and are nonlinear in direction are formed among the scales. According to the chip removal cooling groove formed by the scales of the irregular structure, heat and waste chips in the saw cutting process are rapidly discharged out of the scale area from the multiple outlets through the non-linear structure, rapid heat dissipation and chip removal are achieved, and heating of the saw blade base body is reduced. And through the circumferential surface sawing surface, the workpiece can be rapidly slotted in the sawing process, and the sawing of the workpiece is accelerated.

Description

Technical Field

[0001] This application relates to the field of machining and sawing technology, and in particular to a scale-type diamond saw blade. Background Technology

[0002] Sawing is a processing method that uses saw blades, saw teeth, and other sawing tools to divide materials. By cutting the material, it achieves grooving or separation, and is widely used in the processing of materials such as metals, wood, plastics, and stone. Saw blade sawing uses the saw teeth on the saw blade to cut the material, achieving separation. Saw blade sawing without saw teeth is typically used for metal cutting, and is characterized by high efficiency, high precision, and simple operation. Common saw blades include carbide saw blades, high-speed steel saw blades, and diamond saw blades. Due to its extremely high hardness and wear resistance, diamond is increasingly widely used in sawing.

[0003] Currently used diamond saw blades consist of diamond particles of a certain width bonded to the surface of the saw blade substrate to form a diamond cutting face. During sawing, the diamond cutting face contacts the workpiece to achieve cutting. Utilizing the hardness and wear resistance of diamond, this contact effectively protects the saw blade substrate, thus extending the saw blade's lifespan. Furthermore, because the diamond particles are evenly distributed and bonded to the surface of the saw blade substrate, they cover the surface of the substrate (e.g.,...). Figure 1 As shown in the diagram, during the sawing process, the diamond saw facet is in continuous contact with the workpiece's saw facet, causing the sawing temperature to continuously increase. This heat transfer to the saw blade substrate reduces the hardness of the substrate, leading to blade wobble during high-speed rotation, widening the kerf, and potentially causing the saw blade to become stuck and break. Simultaneously, the sawing chips cannot be discharged promptly, also causing the saw blade to become stuck and resulting in wear on the workpiece's saw facet. Summary of the Invention

[0004] To address the aforementioned problems, this application aims to provide a scale-type diamond saw blade that can quickly expel heat and chips generated during sawing, thereby solving the problem of continuous heat accumulation during sawing causing a decrease in the strength of the saw blade matrix, which in turn affects sawing quality and saw blade life.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: a scale-type diamond saw blade, comprising a saw blade substrate, on both sides of the saw blade substrate, diamond grains of a certain width are provided from their sides toward the central hole, the diamond grains constitute multiple scales higher than the surface of the saw blade substrate, and the scales form interconnected chip removal and cooling grooves in a non-linear direction, with the scales increasing in size sequentially from the central hole toward the side of the saw blade substrate.

[0006] Preferably, the centers of the scales are arranged in an arc shape along the radial direction.

[0007] Preferably, the scales on both sides of the saw blade base are connected to cover the side periphery and are spaced apart on the periphery to form a circumferential sawing surface.

[0008] Preferably, the peripheral sawing surfaces are all higher than the peripheral surface of the saw blade base, and grooves are formed between adjacent peripheral sawing surfaces.

[0009] The beneficial effects of this application are as follows: The diamond saw blade disclosed in this application consists of diamond grains arranged into multiple scales that are higher than the surface of the saw blade substrate. These scales form interconnected chip removal and cooling grooves with a non-linear orientation. The chip removal and cooling grooves formed by the irregularly structured scales utilize the non-linear structure to quickly discharge heat and waste chips during the sawing process from multiple outlets to the outside of the scale area, thereby achieving rapid heat dissipation and chip removal, and reducing the heat exposure of the saw blade substrate.

[0010] By creating a circumferential sawing surface through spacing on the circumferential surface of the saw blade, it can quickly groove the workpiece during the sawing process and intermittently separate from the workpiece. During the brief separation, it can effectively break the heat transfer from the workpiece to the saw blade, thereby achieving heat dissipation and chip removal on the circumferential sawing surface and extending the service life of the saw blade. Attached Figure Description

[0011] Figure 1 This is a diagram of the surface structure of a conventional diamond saw blade (the filling part is diamond particles).

[0012] Figure 2 This is a diagram showing the surface structure of the scale-type diamond saw blade of this application.

[0013] Figure 3 This is a magnified view of a portion of the surface of the scale-type diamond saw blade of this application.

[0014] Figure 4 This is a diagram showing the initial state of the workpiece being cut by the scale-type diamond saw blade of this application.

[0015] Figure 5 For this application Figure 4 A diagram illustrating the sawing process.

[0016] Figure 6 For this application Figure 4 Diagram showing the grooving process where the end face of the saw blade contacts the workpiece during sawing.

[0017] Figure 7 This is a diagram illustrating the circumferential saw cut surface formed after the inner and outer scales of this application are joined.

[0018] Figure 8 This is a side view of the scale-type diamond saw blade of this application.

[0019] Figure 9 This diagram illustrates the contact between the sawn surface of this application and the workpiece.

[0020] In the diagram: 4 - workpiece. Detailed Implementation

[0021] To enable those skilled in the art to better understand the technical solutions of this application, the technical solutions of this application will be further described below in conjunction with the accompanying drawings and embodiments.

[0022] See attached document Figures 1-9 The illustrated diamond saw blade includes a saw blade base 1. Diamond particles of a certain width are provided on both sides of the saw blade base 1 from the side towards the central hole 1a. During sawing, the saw blade is clamped onto the sawing equipment through the central hole 1a to make contact with the workpiece and perform sawing operation.

[0023] To address the current problems of poor heat dissipation in diamond saw blades and the inability to effectively remove sawdust, which affects sawing quality, such as... Figure 2-3 As shown, the diamond saw blade disclosed in this application comprises diamond grains arranged into multiple scales 2 that are higher than the surface of the saw blade substrate. These scales 2 form interconnected, non-linear chip removal and cooling grooves 1b. The scales have irregular shapes, such as… Figure 3 As shown, the chip removal and cooling groove 1b, composed of irregularly structured scales, also has a non-linear flow direction. This allows the chip removal and cooling groove 1b to achieve both chip removal and cooling functions, while utilizing its non-linear structure, such as... Figure 3 As shown by the dashed line, the heat and chips generated during the sawing process do not accumulate towards the rear of the rotating blade in a regular circumferential direction. Instead, they are rapidly discharged to the outside of the blade area from multiple outlets of the chip removal and cooling grooves 1b in different sections, towards the saw blade substrate inside the scales and towards the outside of the saw blade. This achieves rapid heat dissipation and chip removal. Furthermore, the non-linear chip removal and cooling grooves 1b can further reduce the heat on the saw blade substrate without accumulating chips and heat backward.

[0024] To further improve the irregularity of the chip removal and cooling tank 1b, such as Figure 2 As shown, the scales 2 increase in size sequentially from the central hole 1a toward the side of the saw blade substrate 1. The scales 2 of different sizes occupy different areas on the surface of the saw blade substrate, thereby further increasing the irregularity of the chip removal and cooling groove 1b, and further improving the heat dissipation and chip removal effect during sawing.

[0025] Because the saw blade performs rotary cutting during the sawing process, the number of radially linearly distributed scales is limited in the radial direction. Therefore, as... Figure 2 As shown, the centers of adjacent scales 2 form an arc structure along the radial direction. Figure 2(As shown by the dashed line). The scales distributed in this arc-shaped structure increase the number of scales simultaneously in contact with the workpiece's cutting seam, thereby increasing the sawing effect and improving sawing efficiency.

[0026] During the sawing operation, such as Figure 5-6 As shown, the saw kerf is typically formed by the contact between the end face (circumferential surface) of the saw blade and the workpiece. The scales on the surface of the saw blade primarily widen the kerf. Therefore, during sawing, the end face of the saw blade experiences excessive stress in contact with the workpiece, leading to premature wear. To enhance the grooving effect of the end face, such as... Figure 7-9 As shown, the scales 2 on both sides near the side of the saw blade base 1 are used to cover the side circumferential surface (to... Figure 7 The saw blade is wrapped around the saw blade (in the direction of the arrow) and connected to it, forming a circumferential sawing surface 3 at intervals on the circumferential surface. This circumferential sawing surface 3 is where diamond particles are bonded to the end face of the saw blade. During the sawing process, this circumferential sawing surface 3 enables rapid grooving of the workpiece, thereby improving sawing efficiency. At the same time, since the diamond particles are bonded to the surface of the saw blade substrate, this circumferential sawing surface 3 is in contact with the scales on the outer side of the saw blade surface. This also makes the diamond particles forming the circumferential sawing surface 3 and the diamond particles on the outer scales of the surface integrally bonded. During the grooving process when the circumferential sawing surface 3 contacts the workpiece, the integral structure of the outer scales 2 effectively improves the strength and firmness of the circumferential sawing surface 3, preventing it from falling off the saw blade substrate after continuous contact with the workpiece.

[0027] Since the peripheral sawing surface 3 is in continuous contact with the workpiece during cutting, in order to solve the heat dissipation problem of the peripheral sawing surface 3, such as... Figure 7 , 9 As shown, the peripheral sawing surfaces 3 are all higher than the peripheral surface of the saw blade base 1 (by bonding diamond particles to make the peripheral sawing surfaces 3 higher than the peripheral surface of the saw blade base), and grooves 1c are formed between adjacent peripheral sawing surfaces 3. During the saw blade's rotational cutting process, adjacent peripheral sawing surfaces 3 intermittently contact and separate from the workpiece through the grooves 1c. During the brief separation, the heat transfer from the workpiece to the saw blade can be effectively interrupted, thereby achieving heat dissipation and chip removal from the peripheral sawing surfaces 3, and extending the service life of the saw blade.

[0028] The principle of this application is as follows: When sawing a workpiece, the peripheral sawing surface 3 on the peripheral surface of the saw blade first contacts the workpiece to cut a groove. During the continuous grooving process, the peripheral sawing surface 3 intermittently contacts the workpiece, thereby achieving a heat dissipation effect. When the scales on the surface of the saw blade enter the cutting kerf, the waste chips generated by sawing are quickly discharged towards the inside and outside of the saw blade through the chip removal and cooling groove 1b, achieving a rapid heat dissipation effect and improving the service life of the diamond saw blade.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Various changes and modifications may be made to this utility model without departing from its spirit and scope of protection, and all such changes and modifications fall within the scope of protection claimed by this utility model.

Claims

1. A scale type diamond saw blade comprising a blade base (1) and diamond grains of a certain width provided on both side surfaces of the blade base (1) from the side edges thereof toward the center hole (1a) direction, characterized in that: The diamond grains form multiple scales (2) that are higher than the surface of the saw blade substrate. The scales (2) form interconnected chip removal and cooling grooves (1b) that are not linear in direction. The scales (2) increase in size sequentially from the central hole (1a) toward the side of the saw blade substrate (1).

2. The segmented diamond saw blade of claim 1, wherein: The centers of adjacent scales (2) in the radial direction form an arc structure.

3. The segmented diamond saw blade of claim 2, wherein: The scales (2) on both sides near the side of the saw blade base (1) are joined to cover the side periphery and form a circumferential sawing surface (3) at a distance on the circumferential surface.

4. The scale-type diamond saw blade according to claim 3, characterized in that: The peripheral sawing surfaces (3) are all higher than the peripheral surface of the saw blade base (1), and grooves (1c) are formed between adjacent peripheral sawing surfaces (3).

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