A high-pressure microenvironment vapor deposition device

By introducing a positioning plate, adjustment frame, and infrared thermal imaging system into the high-pressure microenvironment vapor deposition apparatus, the problem of inaccurate nozzle control was solved, enabling precise control and defect repair in thin film processing, and improving film quality and processing efficiency.

CN224280434UActive Publication Date: 2026-05-26CHANGZHOU GUANGHUI NANO POWDER TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CHANGZHOU GUANGHUI NANO POWDER TECH CO LTD
Filing Date
2025-06-27
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

In existing high-pressure microenvironment vapor deposition equipment, the timing and duration of nozzle opening and closing are not precisely controlled during the thin film processing, resulting in uneven spraying of vapor phase materials, difficulty in controlling film thickness, and affecting quality consistency and process stability. At the same time, the lack of a real-time monitoring and precise positioning system leads to poor defect repair results.

Method used

A high-pressure microenvironment vapor deposition device was designed, comprising a positioning plate, an adjustment frame, a telescopic plate, and an infrared thermal imaging system. This device enables precise positioning and position control of the sample. Through the coordinated operation of a stepper motor and a high-pressure automatic valve, the opening and closing of the nozzle is precisely controlled. Combined with real-time monitoring by infrared thermal imaging, intelligent operation and defect repair of the thin film are achieved.

Benefits of technology

It achieves precise control of the film processing process, improves film quality consistency and processing efficiency, reduces the defect rate, ensures the quality and process stability of film coverage, and enhances the overall processing effect.

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Abstract

This utility model discloses a high-pressure microenvironment vapor deposition device, relating to the field of vapor deposition technology. It includes a fixed structure, with a sample structure mounted at the bottom of its inner cavity. The fixed structure includes a base, and a sealing cover is mounted at the bottom of the base. A sealing cover door is rotatably connected to one side of the outer wall of the sealing cover. Air inlets are provided on both sides of the outer wall of the sealing cover. Through the coordinated operation of a stepper motor, a transmission rod, and a rotating rod, the opening and closing of the sealing plug is precisely controlled, thereby controlling the opening and closing of the nozzle of the first spray tube and thus precisely controlling the thin film processing flow. Furthermore, a high-pressure automatic valve and specific structure in the second sealing tank can automatically open the nozzle to precisely coat the defective area upon detection of coating defects. Combined with real-time infrared thermal imaging monitoring, compared to traditional devices, this achieves intelligent and controllable operation of thin film processing, not only ensuring the quality of film coverage but also efficiently repairing defects and improving the overall processing effect.
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Description

Technical Field

[0001] This utility model relates to the field of vapor deposition technology, and in particular to a high-pressure microenvironment vapor deposition device. Background Technology

[0002] In current technologies, high-pressure microenvironment vapor deposition (HPCVD) is widely used in key industries such as semiconductors, optical devices, and coating preparation due to its unique advantages in modern materials processing. This technology deposits vapor-phase materials onto the sample surface to form a thin film under high pressure and a microenvironment, thereby enhancing material properties and imparting special functions. However, in terms of thin film processing control, existing devices exhibit deviations in the timing and duration of nozzle opening and closing. This directly leads to uneven vapor-phase material spraying and difficulty in accurately controlling film thickness. Consequently, the precision of the thin film processing is insufficient, making it difficult to ensure the consistency of film coverage and process stability, thus affecting product performance and yield.

[0003] However, existing technologies still have shortcomings, such as the following:

[0004] Existing technologies for thin film vapor deposition suffer from deviations in the timing and duration of nozzle opening and closing, leading to uneven spraying of vapor-phase materials, difficulty in controlling thickness, and insufficient precision in the thin film processing. This makes it challenging to guarantee the consistency of film coverage quality and the stability of the process. Furthermore, existing technologies have significant shortcomings in the defect repair stage. Due to the lack of a real-time monitoring and precise positioning system, the location of defects cannot be quickly pinpointed after detection. Moreover, the lack of targeted repair structure design makes it difficult to implement precise film repair at defective sites, resulting in poor repair effects and impacting overall processing yield and product performance. Utility Model Content

[0005] The purpose of this invention is to provide a high-pressure microenvironment vapor deposition device to solve the problem of significant shortcomings in the coating defect repair process mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A high-pressure microenvironment vapor deposition device includes a fixed structure, a sample structure installed at the bottom of the inner cavity of the fixed structure, a base, a sealing cover installed at the bottom of the base, a sealing cover door rotatably connected to one side of the outer wall of the sealing cover, air inlets on both sides of the outer wall of the sealing cover, a vacuum pump installed at one end of the air inlet, and an infrared thermal imaging device installed on one side of the inner cavity of the sealing cover.

[0008] A first sealing barrel is installed on the top of the base and inside the sealing cover. A first spray pipe is installed on the outer wall of the first sealing barrel. A second sealing barrel is installed on the top of the base and inside the sealing cover. A second spray pipe is installed on the outer wall of the second sealing barrel. A high-pressure automatic valve is installed at the bottom of the outer wall of the second spray pipe. A dynamic seal is installed on the top of the second sealing barrel.

[0009] Preferably, the sample structure includes a positioning plate, the top of which has a positioning groove, and a sample box is slidably connected to the inner side of the positioning groove, with a sample placed on the inner side of the top of the sample box.

[0010] Preferably, an adjustment frame is installed on the top of the positioning plate and on the upper surface of the positioning groove. An adjustment disc is rotatably connected to the inner side of the top of the adjustment frame, and a scale is fixedly connected to the inner side of the top of the adjustment frame.

[0011] Preferably, an adjustment groove is provided on the inner side of the top of the adjustment plate, a limiting protrusion is fixedly connected to the bottom of the inner side of the adjustment groove, and a limiting slider is slidably connected to the inner side of the adjustment groove.

[0012] Preferably, an external telescopic plate is slidably connected to the top of the limiting slider, an internal telescopic plate is slidably connected to the inner cavity of the external telescopic plate, and a stop block is provided at one end of the external telescopic plate and inside the adjustment groove.

[0013] Preferably, a fixing frame is installed on the top of the sealing cover, a stepper motor is installed on the top of the fixing frame, and a transmission rod is installed on the bottom drive end of the stepper motor.

[0014] Preferably, a rotating rod is installed at one end of the bottom of the transmission rod, and a sealing plug is installed at one end of the bottom of the rotating rod, which is located inside the second sealing barrel.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. This device achieves an innovative breakthrough in sample structure design. Through the precise cooperation between the positioning plate and the sample box, the sample can be accurately positioned, ensuring stable sample position during vapor deposition and preventing positional deviations from affecting film coverage quality. The flexible adjustment structure, composed of components such as the adjustment frame, adjustment disc, and telescopic plate, can precisely control the sample position and slot size based on infrared thermal imaging detection results. When encountering coating defects, it can quickly locate and implement targeted treatments, significantly improving the accuracy and efficiency of sample processing and effectively reducing the defect rate.

[0017] 2. Through the coordinated operation of a stepper motor, transmission rod, and rotating rod, the opening and closing of the sealing plug is precisely controlled, thereby controlling the opening and closing of the nozzle of the No. 1 spray pipe and thus precisely controlling the film processing flow. Furthermore, the high-pressure automatic valve and specific structure of the No. 2 sealing tank can automatically open the nozzle to precisely coat the defective area upon detection of coating defects. Combined with real-time infrared thermal imaging monitoring, compared to traditional devices, this achieves intelligent and controllable operation of film processing, not only ensuring the quality of film coverage but also efficiently repairing defects and improving the overall processing effect. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the inner cavity structure of the sealing cover of this utility model;

[0020] Figure 3 This is a schematic diagram of the adjustment frame structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the adjustment disc structure of this utility model;

[0022] Figure 5 This is a cross-sectional view of the No. 2 sealing bucket of this utility model.

[0023] In the diagram: 1. Fixed structure; 11. Base; 12. Sealing cover; 121. Sealing cover door; 13. Fixing frame; 14. Stepper motor; 141. Transmission rod; 142. Rotating rod; 143. Sealing plug; 15. Vacuum pump; 151. Air inlet; 16. No. 1 sealing barrel; 161. No. 1 spray pipe; 17. No. 2 sealing barrel; 171. No. 2 spray pipe; 172. High-pressure automatic valve; 173. Dynamic seal; 18. Infrared thermal imaging; 2. Sample structure; 21. Positioning plate; 22. Positioning groove; 23. Sample box; 231. Sample; 24. Adjustment frame; 241. Scale; 25. Adjustment plate; 251. Adjustment groove; 252. Limiting protrusion; 253. External telescopic plate; 254. Internal telescopic plate; 255. Limiting slider; 256. Stop. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] like Figures 1-5As shown, a high-pressure microenvironment vapor deposition device includes a fixed structure 1, and a sample structure 2 is installed at the bottom of the inner cavity of the fixed structure 1 for placing samples. The fixed structure 1 includes a base 11, and a sealing cover 12 is installed at the bottom of the base 11 to provide a sealed space. A sealing cover door 121 is rotatably connected to one side of the outer wall of the sealing cover 12 for easy adjustment or replacement of samples. Air inlets 151 are opened on the outer walls on both sides of the sealing cover 12 for gas extraction. A vacuum pump 15 is installed at one end of the air inlet 151 to extract the gas in the inner cavity of the sealing cover 12. An infrared thermal imager 18 is installed on one side of the inner cavity of the sealing cover 12 for detecting the film coverage on the surface of the sample 231.

[0026] A first sealing container 16 is installed on the top of the base 11 and inside the sealing cover 12 for storing vapor deposition. A first spray pipe 161 is installed on the outer wall of the first sealing container 16 to cover the surface of the sample with a thin film. A second sealing container 17 is installed on the top of the base 11 and inside the sealing cover 12. It has the same function as the first sealing container 16 for storing vapor deposition. A second spray pipe 171 is installed on the outer wall of the second sealing container 17, which has the same function as the first spray pipe 161. However, a high-pressure automatic valve 172 is installed at the bottom of the outer wall of the second spray pipe 171 to restrict several nozzles. A dynamic seal 173 is installed on the top of the second sealing container 17 to allow the rotating rod 142 to enter the sealed second sealing container 17.

[0027] It should be noted that in this embodiment, before coating, the sealing cover door 121 is opened first, and then the sample 231 is placed inside the sample box 23. Then the sample box 23 is inserted into the positioning groove 22 for positioning. The sealing cover door 121 is then closed to make the sealing cover 12 a sealed environment. Then the vacuum pump 15 is connected to the air inlet 151, and the inner cavity of the sealing cover 12 is adjusted when the vacuum pump 15 is started.

[0028] Sample structure 2 includes a positioning plate 21, with a positioning groove 22 on the top of the positioning plate 21 for limiting the sample box 23. The sample box 23 is slidably connected to the inner side of the positioning groove 22 for placing the sample 231. The sample 231 is located on the inner side of the top of the sample box 23 for vapor deposition to cover the film. An adjustment frame 24 is installed on the top of the positioning plate 21 and on the upper surface of the positioning groove 22 to limit the adjustment plate 25. The adjustment plate 25 is rotatably connected to the inner side of the top of the adjustment frame 24, allowing the adjustment plate 25 to adjust the angle of the adjustment groove 251. A scale 241 is fixedly connected to the inner side of the top of the adjustment frame 24 for reference. The adjustment groove 251 is located on the inner side of the top of the adjustment plate 25. To facilitate the telescopic sliding of the outer telescopic plate 253 and the inner telescopic plate 254, a limiting protrusion 252 is fixedly connected to the bottom of the inner side of the adjusting groove 251 to limit the movement of the outer telescopic plate 253 and the inner telescopic plate 254. A limiting slider 255 is slidably connected to the inner side of the adjusting groove 251 to facilitate sliding within the limiting protrusion 252. The top of the limiting slider 255 is slidably connected to the outer telescopic plate 253, and the inner cavity of the outer telescopic plate 253 is slidably connected to the inner telescopic plate 254, so as to adjust the size of the inner through groove of the adjusting groove 251. A stop block 256 is provided at one end of the outer telescopic plate 253 and inside the adjusting groove 251 to block the inner through groove of the adjusting groove 251.

[0029] It should be noted that in this embodiment, if the coating defect is large, during assembly, the sample box 23 is placed in the positioning groove 22 at the bottom of the second sealing barrel 17, and adjustments are made according to the defects detected by infrared thermal imaging 18. The adjustment plate 25 is rotated, and the position is adjusted according to the scale 241. The external telescopic plate 253 is pushed to make the external telescopic plate 253 and the internal telescopic plate 254 contract or extend, thereby adjusting the size of the through groove exposed by the adjustment groove 251. The bottom nozzle of the second spray pipe 171 is opened by the high-pressure automatic valve 172, thereby coating the defective area of ​​the sample 231.

[0030] A fixing frame 13 is installed on the top of the sealing cover 12, and a stepper motor 14 is installed on the top of the fixing frame 13. The stepper motor 14 can drive the transmission rod 141 to rotate. The transmission rod 141 is installed at the bottom end of the stepper motor 14. The bottom of the transmission rod 141 can push the rotating rod 142. The rotating rod 142 is installed at the bottom end of the transmission rod 141, which facilitates the connection between the top of the rotating rod 142 and the bottom of the transmission rod 141, and also facilitates the connection between the top of the sealing plug 143 and the rotating rod 142. The sealing plug 143 is installed at the bottom end of the rotating rod 142 and inside the second sealing barrel 17 to block the exhaust port.

[0031] It should be noted that in this embodiment, the stepper motor 14 is started to drive the transmission rod 141 to rotate, and the transmission rod 141 is started to pull the rotating rod 142, thereby driving the sealing plug 143 to disengage from the exhaust port of the first sealing barrel 16, so that the bottom nozzle of the outer wall of the first spray pipe 161 performs thin film processing on the sample 231. After processing, the film coating is checked by infrared thermal imaging 18. The film coating temperature is checked and recorded, and then the film coating operation process is completed.

[0032] The working principle of this utility model is as follows: Before coating, the sealing cover door 121 is opened first, and then the sample 231 is placed inside the sample box 23. Then the sample box 23 is inserted into the positioning groove 22 for positioning. The sealing cover door 121 is then closed to make the sealing cover 12 a sealed environment. Then the vacuum pump 15 is connected to the air inlet 151, and the inner cavity of the sealing cover 12 is adjusted when the vacuum pump 15 is started.

[0033] Then, the stepper motor 14 is started to drive the transmission rod 141 to rotate, and the transmission rod 141 is started to pull the rotating rod 142, thereby driving the sealing plug 143 to disengage from the exhaust port of the first sealing barrel 16, so that the bottom nozzle of the outer wall of the first spray tube 161 performs thin film processing on the sample 231. After processing, the film coating is checked by infrared thermal imaging 18. The film coating temperature is checked and recorded, and then the film coating operation process is completed.

[0034] If the coating defect is large, during assembly, the sample box 23 is placed in the positioning groove 22 at the bottom of the second sealing barrel 17, and adjustments are made according to the defects detected by infrared thermal imaging 18. The position is adjusted by rotating the adjustment plate 25 and referring to the scale 241, and the external telescopic plate 253 is pushed to make the external telescopic plate 253 and the internal telescopic plate 254 contract or extend, thereby adjusting the size of the through groove exposed in the adjustment groove 251. The bottom nozzle of the second spray pipe 171 is opened through the high-pressure automatic valve 172, so as to coat the defective area of ​​the sample 231.

[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high-pressure microenvironment vapor deposition apparatus, comprising a fixed structure (1), wherein a sample structure (2) is mounted at the bottom of the inner cavity of the fixed structure (1), characterized in that: The fixed structure (1) includes a base (11), a sealing cover (12) is installed at the bottom of the base (11), a sealing cover door (121) is rotatably connected to one side of the outer wall of the sealing cover (12), an air inlet (151) is opened on the outer walls on both sides of the sealing cover (12), a vacuum pump (15) is installed at one end of the air inlet (151), and an infrared thermal imaging (18) is installed on one side of the inner cavity of the sealing cover (12). A first sealing barrel (16) is installed on the top of the base (11) and inside the sealing cover (12). A first spray pipe (161) is installed on the outer wall of the first sealing barrel (16). A second sealing barrel (17) is installed on the top of the base (11) and inside the sealing cover (12). A second spray pipe (171) is installed on the outer wall of the second sealing barrel (17). A high-pressure automatic valve (172) is installed at the bottom of the outer wall of the second spray pipe (171). A dynamic seal (173) is installed on the top of the second sealing barrel (17).

2. The high-pressure microenvironment vapor deposition apparatus according to claim 1, characterized in that: The sample structure (2) includes a positioning plate (21), a positioning groove (22) is provided on the top of the positioning plate (21), a sample box (23) is slidably connected to the inner side of the positioning groove (22), and a sample (231) is provided on the inner side of the top of the sample box (23).

3. The high-pressure microenvironment vapor deposition apparatus according to claim 2, characterized in that: An adjustment frame (24) is installed on the top of the positioning plate (21) and on the upper surface of the positioning groove (22). An adjustment disc (25) is rotatably connected to the inner side of the top of the adjustment frame (24), and a scale (241) is fixedly connected to the inner side of the top of the adjustment frame (24).

4. The high-pressure microenvironment vapor deposition apparatus according to claim 3, characterized in that: An adjustment groove (251) is provided on the inner side of the top of the adjustment plate (25). A limiting protrusion (252) is fixedly connected to the bottom of the inner side of the adjustment groove (251). A limiting slider (255) is slidably connected to the inner side of the adjustment groove (251).

5. The high-pressure microenvironment vapor deposition apparatus according to claim 4, characterized in that: The top of the limiting slider (255) is slidably connected to an external telescopic plate (253), and the inner cavity of the external telescopic plate (253) is slidably connected to an internal telescopic plate (254). One end of the external telescopic plate (253) and located inside the adjustment groove (251) is provided with a stop block (256).

6. The high-pressure microenvironment vapor deposition apparatus according to claim 1, characterized in that: A fixing frame (13) is installed on the top of the sealing cover (12), and a stepper motor (14) is installed on the top of the fixing frame (13). A transmission rod (141) is installed at the bottom end of the stepper motor (14).

7. The high-pressure microenvironment vapor deposition apparatus according to claim 6, characterized in that: A rotating rod (142) is installed at one end of the bottom of the transmission rod (141), and a sealing plug (143) is installed at one end of the bottom of the rotating rod (142) and inside the second sealing barrel (17).