A crack-resistant, high thermal conductivity ceramic tile

Abstract

This utility model relates to a crack-resistant, high thermal conductivity ceramic tile. It solves the problems of poor thermal conductivity and easy cracking and hollowing in existing ceramic tiles. It includes a ceramic tile body, with a wear-resistant and crack-resistant structural layer on the upper surface, an adhesive bonding assembly at the lower end, and a pressure-resistant mechanism in the middle layer of the ceramic tile body for connecting the wear-resistant and crack-resistant structural layer and the adhesive bonding assembly. An adhesive supply structure is provided between the pressure-resistant mechanism and the adhesive bonding assembly. The advantages of this utility model are: good thermal conductivity, less prone to cracking and hollowing, and a stable structure.

Description

Technical Field

[0001] This utility model relates to the field of ceramic tile technology, specifically to a crack-resistant, high thermal conductivity ceramic tile. Background Technology

[0002] Underfloor heating is becoming increasingly popular in home renovations. After installation, backfilling and leveling are required before tiling. Currently, tiles are mainly made from quartz, kaolin, and talc as raw materials, pressed into a green body, and then coated with glaze. However, the resulting tiles are prone to cracking, affecting their usability. In addition, if the tile adhesive has poor thermal conductivity, it will affect the heat transfer of the underfloor heating system, resulting in slow heating. Furthermore, the thermal expansion and contraction of underfloor heating during use can easily lead to cracking of the tile adhesive and hollowing of the tiles.

[0003] To address the shortcomings of existing technologies, people have conducted long-term explorations and proposed various solutions. For example, Chinese patent literature discloses a crack-resistant ceramic tile and its production process [CN202210775743.0]. It includes a body and a glaze coated on the body. The body comprises the following raw materials in parts by weight: 20-35 parts dolomite, 10-20 parts quartz, 10-18 parts bentonite, 10-20 parts talc powder, 5-12 parts waste brick, and 6-18 parts modified basalt fiber. The preparation method is as follows: the raw materials of the body, except for the modified basalt fiber, are mixed evenly, ground, and then the modified basalt fiber is added and mixed evenly to obtain the body material; the raw materials of the glaze, except for water, are mixed evenly, ground, water is added, and mixed evenly to obtain the glaze; the body material is pressed into a green body and dried to obtain the body; the glaze is evenly coated on the body, dried, and after firing and cooling, the crack-resistant ceramic tile is obtained.

[0004] The above solution has solved the problem of easy cracking of tiles in the existing technology to a certain extent, but the solution still has many shortcomings, such as poor thermal conductivity and easy cracking and hollowing of tiles due to thermal expansion and contraction. Summary of the Invention

[0005] The purpose of this invention is to address the above-mentioned problems by providing a crack-resistant, high thermal conductivity ceramic tile.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a crack-resistant and high thermal conductivity ceramic tile, comprising a ceramic tile body, a wear-resistant and crack-resistant structural layer on the upper surface of the ceramic tile body, an adhesive bonding component on the lower end of the ceramic tile body, and a pressure-resistant mechanism for connecting the wear-resistant and crack-resistant structural layer and the adhesive bonding component in the middle layer of the ceramic tile body, and an adhesive supply structure between the pressure-resistant mechanism and the adhesive bonding component.

[0007] In the aforementioned crack-resistant and high thermal conductivity ceramic tile, the wear-resistant and crack-resistant structural layer includes a quartz wear-resistant layer disposed on the upper side, a wear-resistant and scratch-resistant zinc layer coated on the surface of the quartz wear-resistant layer, a polypropylene fiber layer disposed on the lower side of the quartz wear-resistant layer, and the polypropylene fiber layer being connected to the quartz wear-resistant layer through a thermally conductive ceramic adhesive layer.

[0008] In the aforementioned crack-resistant high thermal conductivity ceramic tile, the thermally conductive ceramic adhesive layer has several filling pores, which are filled with quartz sand.

[0009] In the aforementioned crack-resistant and high thermal conductivity ceramic tile, the adhesive bonding assembly includes an adhesive layer disposed at the bottom layer of the ceramic tile body, a graphite powder layer disposed at the upper end of the adhesive layer, and a sealing layer disposed around the graphite powder layer, and an anti-overflow adhesive bonding layer disposed at the lower end of the adhesive layer.

[0010] In the aforementioned crack-resistant and high thermal conductivity ceramic tile, the bottom layer of the anti-overflow adhesive layer is provided with a removable adhesive protective part, and the top layer of the anti-overflow adhesive layer is provided with an adhesive absorption part, with an adhesive layer between the adhesive absorption part and the adhesive protective part.

[0011] In the aforementioned crack-resistant high thermal conductivity ceramic tile, the upper end of the adhesive absorption part is provided with several thermally conductive plug-in parts, and an adhesive receiving slot is provided between two adjacent thermally conductive plug-in parts. The graphite powder layer is provided with several thermally conductive plug-in holes that correspond one-to-one with the thermally conductive plug-in parts, and a plug-in hole post corresponding to the adhesive receiving slot is provided between two connected thermally conductive plug-in holes. The adhesive receiving slot and the adhesive layer are interconnected.

[0012] In the aforementioned crack-resistant high thermal conductivity ceramic tile, the pressure-resistant mechanism includes a pressure-resistant middle layer, a thermally conductive support layer at the bottom of the pressure-resistant middle layer, a number of micro pressure-resistant springs in the thermally conductive support layer, a top pressure seat between two adjacent micro pressure-resistant springs, and a thermally conductive column passing through the inner side of the micro pressure-resistant spring in the circumferential direction.

[0013] In the aforementioned crack-resistant high thermal conductivity ceramic tile, a rigid support layer is provided at the upper end of the thermally conductive support layer, and a heat transfer connection layer connected to the polypropylene fiber layer is provided on the upper surface of the rigid support layer.

[0014] In the aforementioned crack-resistant high thermal conductivity ceramic tile, the adhesive supply structure includes a flexible adhesive storage layer disposed on the lower side of the thermally conductive support layer, and the flexible adhesive storage layer is provided with several open adhesive storage chambers that correspond one-to-one with the micro compression springs.

[0015] In the aforementioned crack-resistant and high thermal conductivity ceramic tile, the graphite powder layer is provided with several glue leakage channels that correspond one-to-one with the open glue storage bins. The glue leakage channels are provided with glue leakage buffer nets, and the lower end of the glue leakage channels is inserted into the insertion hole column.

[0016] Compared with existing technologies, the advantages of this utility model are: stable structure, good bonding effect, and rapid heat conduction, which is conducive to improving the heat conduction efficiency of underfloor heating and has a good performance. Secondly, by setting up an anti-compression mechanism, the compressive strength and wear resistance of the tile body can be effectively improved. Furthermore, the addition of the polypropylene fiber layer can improve the internal structure of the anti-cracking mortar and reduce its shrinkage rate. Due to the constraint effect of the fibers, the stress generated by the thermally conductive tile adhesive during thermal expansion and contraction will be effectively dispersed and relieved, thereby reducing cracking and the occurrence of hollow tiles. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a sectional view of the end structure of this utility model;

[0019] Figure 3 This is a cross-sectional view of the anti-compression mechanism in this utility model;

[0020] Figure 4 yes Figure 3 Schematic diagram of the structure at point A in the diagram;

[0021] Figure 5 This is a detailed structural diagram of the adhesive bonding component in this utility model;

[0022] In the diagram: 1. Main body of the ceramic tile; 2. Wear-resistant and crack-resistant structural layer; 21. Quartz wear-resistant layer; 22. Wear-resistant and scratch-resistant zinc layer; 23. Polypropylene fiber layer; 24. Thermally conductive ceramic adhesive layer; 241. Filling pores; 3. Adhesive assembly; 31. Adhesive layer; 32. Graphite powder layer; 321. Thermally conductive insertion hole; 322. Insertion hole post; 33. Sealing layer; 34. Anti-overflow adhesive bonding layer; 341. Adhesive absorption part; 342. Adhesive layer; 343. Thermally conductive insertion part; 344. Adhesive receiving slot; 345. Pressure-resistant mechanism; 41. Pressure-resistant middle layer; 42. Thermally conductive support layer; 43. Miniature pressure-resistant spring; 44. Top pressure seat; 45. Thermally conductive column; 46. Rigid support layer; 47. Heat transfer connection layer; 58. Adhesive supply structure; 51. Flexible adhesive storage layer; 52. Open adhesive storage tank; 53. Adhesive leakage channel; 54. Adhesive leakage buffer net. Detailed Implementation

[0023] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0024] like Figure 1-5 As shown, a crack-resistant and high thermal conductivity ceramic tile includes a ceramic tile body 1, a wear-resistant and crack-resistant structural layer 2 on the upper surface of the ceramic tile body 1, an adhesive bonding component 3 on the lower end of the ceramic tile body 1, and a pressure-resistant mechanism 4 for connecting the wear-resistant and crack-resistant structural layer 2 and the adhesive bonding component 3 in the middle layer of the ceramic tile body 1. An adhesive supply structure 5 is provided between the pressure-resistant mechanism 4 and the adhesive bonding component 3.

[0025] The wear-resistant and crack-resistant structural layer 2 includes a quartz wear-resistant layer 21 disposed on the upper side, a wear-resistant and scratch-resistant zinc layer 22 plated on the surface of the quartz wear-resistant layer 21, a polypropylene fiber layer 23 disposed on the lower side of the quartz wear-resistant layer 21, and the polypropylene fiber layer 23 is connected to the quartz wear-resistant layer 21 through a thermally conductive ceramic adhesive layer 24.

[0026] The quartz wear-resistant layer 21 and the wear-resistant and scratch-resistant zinc layer 22 are used to enhance the wear-resistant and scratch-resistant effect of the ceramic tile body 1. Secondly, the polypropylene fiber layer 23 is used to improve the internal structure of the crack-resistant mortar, reduce its shrinkage rate, and prevent cracking caused by thermal expansion and contraction during underfloor heating.

[0027] As can be seen, the thermally conductive ceramic adhesive layer 24 has a number of filling pores 241, and the filling pores 241 are filled with quartz sand.

[0028] The quartz sand used here is mixed and blended with different mesh sizes, making the tile adhesive more compact and filling the pores inside the tile adhesive more densely. This not only improves the thermal conductivity of the tile adhesive but also enhances the strength and resistance to shrinkage and cracking of the thermally conductive ceramic adhesive layer 24.

[0029] Obviously, the adhesive bonding assembly 3 includes an adhesive bonding layer 31 disposed at the bottom of the tile body 1, a graphite powder layer 32 disposed at the upper end of the adhesive bonding layer 31, and a sealing layer 33 disposed around the graphite powder layer 32 to seal it, and an anti-overflow adhesive bonding layer 34 disposed at the lower end of the adhesive bonding layer 31.

[0030] Graphite powder layer 32 has good thermal conductivity and a high thermal conductivity coefficient. When added to tile adhesive, it can significantly improve the thermal conductivity of the tile adhesive, help the heat transfer of underfloor heating, and increase the heating rate of underfloor heating. In addition, graphite has good lubricity, which can bring a better feel to the tile adhesive during construction.

[0031] Furthermore, the bottom layer of the anti-overflow adhesive layer 34 is provided with a detachable adhesive protective part 341, and the top layer of the anti-overflow adhesive layer 34 is provided with an adhesive absorption part 342, and an adhesive layer 343 is provided between the adhesive absorption part 342 and the adhesive protective part 341.

[0032] Furthermore, the upper end of the adhesive absorption part 342 is provided with several heat-conducting plug-in parts 344, and an adhesive receiving slot 345 is provided between two adjacent heat-conducting plug-in parts 344. The graphite powder layer 32 is provided with several heat-conducting plug-in holes 321 that correspond one-to-one with the heat-conducting plug-in parts 344, and an insertion hole post 322 corresponding to the adhesive receiving slot 345 is provided between two connected heat-conducting plug-in holes 321. The adhesive receiving slot 345 and the adhesive layer 343 are interconnected.

[0033] Specifically, the pressure-resistant mechanism 4 includes a pressure-resistant middle layer 41, a heat-conducting support layer 42 at the bottom of the pressure-resistant middle layer 41, a plurality of miniature pressure-resistant springs 43 in the heat-conducting support layer 42, a top pressure seat 44 between two adjacent miniature pressure-resistant springs 43, and a heat-conducting column 45 passing through the inner side of the miniature pressure-resistant springs 43.

[0034] More specifically, a rigid support layer 46 is provided on the upper end of the thermally conductive support layer 42, and a heat transfer connection layer 47 connected to the polypropylene fiber layer 23 is provided on the upper surface of the rigid support layer 46.

[0035] The compression-resistant mechanism 4 is mainly used to enhance the structural strength and compressive toughness, while the heat transfer connection layer 47 is used to improve the heat conduction effect.

[0036] In detail, the glue supply structure 5 includes a flexible glue storage layer 51 disposed on the lower side of the heat-conducting support layer 42, and the flexible glue storage layer 51 is provided with a number of open glue storage chambers 52 corresponding to the miniature anti-compression springs 43.

[0037] Preferably, the graphite powder layer 32 is provided with a plurality of glue leakage channels 53 corresponding one-to-one with the open glue storage bin 52, the glue leakage channel 53 is provided with a glue leakage buffer net 54, and the lower end of the glue leakage channel 53 is inserted into the insertion hole post 322.

[0038] The adhesive supply structure 5 can supply adhesive by pressing after installation, and form pores inside the tile body 1 after installation, thereby improving the heat insulation effect after heat conduction.

[0039] In summary, the principle of this embodiment is as follows: by setting an anti-compression mechanism 4 inside the tile body 1, the compressive strength can be effectively improved. Secondly, by adding a polypropylene fiber layer 23, the internal structure of the anti-cracking mortar is improved, its shrinkage rate is reduced, and cracking caused by thermal expansion and contraction during underfloor heating is prevented. Furthermore, the use of quartz sand filling makes the tile adhesive more compact, thereby improving the thermal conductivity of the tile adhesive and also improving the strength and anti-shrinkage and anti-cracking performance of the thermally conductive ceramic adhesive layer 24. At the same time, the graphite powder layer 32 at the bottom layer greatly improves the thermal conductivity, helps the heat transfer of underfloor heating, and improves the heating rate of underfloor heating. Finally, the adhesive supply structure is used to achieve pressing and bonding after installation, which facilitates construction operations.

[0040] The specific embodiments described herein are merely illustrative examples illustrating the spirit of this utility model. Those skilled in the art to which this utility model pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this utility model or exceeding the scope defined by the appended claims.

[0041] Although this article uses a lot of terms such as ceramic tile body 1, wear-resistant and crack-resistant structural layer 2, quartz wear-resistant layer 21, wear-resistant and scratch-resistant zinc layer 22, polypropylene fiber layer 23, thermally conductive ceramic adhesive layer 24, filling pores 241, adhesive bonding assembly 3, adhesive bonding layer 31, graphite powder layer 32, thermally conductive plug hole 321, plug hole post 322, sealing layer 33, anti-overflow adhesive bonding layer 34, adhesive-fit protective part 341, adhesive absorption part 342, adhesive layer 343, thermally conductive plug part 344, adhesive receiving slot 345, pressure-resistant mechanism 4, pressure-resistant middle layer 41, thermally conductive support layer 42, miniature pressure-resistant spring 43, top pressure seat 44, thermally conductive column 45, rigid support layer 46, heat transfer connection layer 47, adhesive supply structure 5, flexible adhesive storage layer 51, open adhesive storage hopper 52, adhesive leakage channel 53, adhesive leakage buffer net 54, the possibility of using other terms cannot be ruled out. The use of these terms is merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any kind of additional limitation would be contrary to the spirit of this utility model.

Claims

1. A crack-resistant, high thermal conductivity ceramic tile, comprising a tile body (1), characterized in that, The upper surface of the tile body (1) is provided with a wear-resistant and crack-resistant structural layer (2), the lower end of the tile body (1) is provided with an adhesive bonding component (3), and the middle layer of the tile body (1) is provided with a pressure-resistant mechanism (4) for connecting the wear-resistant and crack-resistant structural layer (2) and the adhesive bonding component (3). An adhesive supply structure (5) is provided between the pressure-resistant mechanism (4) and the adhesive bonding component (3).

2. The crack-resistant, high thermal conductivity ceramic tile according to claim 1, characterized in that, The wear-resistant and crack-resistant structural layer (2) includes a quartz wear-resistant layer (21) disposed on the upper side. The surface of the quartz wear-resistant layer (21) is coated with a wear-resistant and scratch-resistant zinc layer (22). A polypropylene fiber layer (23) is disposed on the lower side of the quartz wear-resistant layer (21), and the polypropylene fiber layer (23) is connected to the quartz wear-resistant layer (21) through a thermally conductive ceramic adhesive layer (24).

3. The crack-resistant, high thermal conductivity ceramic tile according to claim 2, characterized in that, The thermally conductive ceramic adhesive layer (24) has a plurality of filling pores (241), and the filling pores (241) are filled with quartz sand.

4. The crack-resistant, high thermal conductivity ceramic tile according to claim 1, characterized in that, The adhesive bonding assembly (3) includes an adhesive bonding layer (31) disposed at the bottom of the ceramic tile body (1), a graphite powder layer (32) is provided at the upper end of the adhesive bonding layer (31), and a sealing layer (33) is provided around the graphite powder layer (32) to seal it, and an anti-overflow adhesive bonding layer (34) is provided at the lower end of the adhesive bonding layer (31).

5. The crack-resistant, high thermal conductivity ceramic tile according to claim 4, characterized in that, The bottom layer of the anti-overflow adhesive bonding layer (34) is provided with a detachable adhesive protective part (341), and the top layer of the anti-overflow adhesive bonding layer (34) is provided with an adhesive absorption part (342). An adhesive layer (343) is provided between the adhesive absorption part (342) and the adhesive protective part (341).

6. The crack-resistant, high thermal conductivity ceramic tile according to claim 5, characterized in that, The upper end of the adhesive absorption part (342) is provided with a plurality of heat-conducting plug-in parts (344), and an adhesive receiving slot (345) is provided between two adjacent heat-conducting plug-in parts (344). The graphite powder layer (32) is provided with a plurality of heat-conducting plug-in holes (321) that correspond one-to-one with the heat-conducting plug-in parts (344), and an insertion hole post (322) that corresponds to the adhesive receiving slot (345) is provided between two connected heat-conducting plug-in holes (321). The adhesive receiving slot (345) is interconnected with the adhesive layer (343).

7. The crack-resistant, high thermal conductivity ceramic tile according to claim 6, characterized in that, The pressure-resistant mechanism (4) includes a pressure-resistant middle layer (41), and a heat-conducting support layer (42) is provided at the bottom of the pressure-resistant middle layer (41). A number of miniature pressure-resistant springs (43) are provided in the heat-conducting support layer (42), and a top pressure seat (44) is provided between two adjacent miniature pressure-resistant springs (43). A heat-conducting column (45) is provided on the inner side of the miniature pressure-resistant spring (43) in the circumferential direction.

8. The crack-resistant, high thermal conductivity ceramic tile according to claim 7, characterized in that, The upper end of the thermally conductive support layer (42) is provided with a rigid support layer (46), and the upper surface of the rigid support layer (46) is provided with a heat transfer connection layer (47) connected to the polypropylene fiber layer (23).

9. A crack-resistant, high thermal conductivity ceramic tile according to claim 7, characterized in that, The glue supply structure (5) includes a flexible glue storage layer (51) disposed on the lower side of the heat-conducting support layer (42), and the flexible glue storage layer (51) is provided with a number of open glue storage chambers (52) corresponding to the micro compression springs (43).

10. A crack-resistant, high thermal conductivity ceramic tile according to claim 9, characterized in that, The graphite powder layer (32) is provided with several glue leakage channels (53) that correspond one-to-one with the open glue storage bin (52). The glue leakage channel (53) is provided with a glue leakage buffer net (54), and the lower end of the glue leakage channel (53) is inserted into the insertion hole post (322).

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