A high thermal conductivity refractory ceramic plate for kilns

By setting a heat-conducting mechanism and a limiting structure on the ceramic plate, the problem of poor heat conduction performance of existing ceramic plates is solved, and the heat is evenly distributed between the ceramic plates, thus improving the kiln's performance.

CN224285447UActive Publication Date: 2026-05-26WUXI INNOVATION CERAMICS CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
WUXI INNOVATION CERAMICS CO LTD
Filing Date
2025-07-14
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

The existing refractory silicon carbide ceramic plates have poor thermal conductivity, which prevents heat from spreading quickly, resulting in uneven heating of sintered parts and affecting the molding quality.

Method used

The heat-conducting mechanism includes a fixed frame, silicon carbide blocks, metal heat-conducting sheets, and heat-conducting pads. Through a multi-level conduction structure, heat is evenly distributed between ceramic plates, and a limiting structure ensures tight splicing.

Benefits of technology

It improves heat conduction efficiency, ensures uniform heat distribution between ceramic plates, and enhances the performance in the kiln environment.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses a high thermal conductivity refractory ceramic plate for kilns, comprising a ceramic plate body, an installation mechanism on the outer surface of the ceramic plate body, and a heat-conducting mechanism fixedly connected to the inner wall of the ceramic plate body. The heat-conducting mechanism includes a fixed frame fixedly connected to the inner wall of the ceramic plate body, and multiple sets of silicon carbide crystal blocks fixedly connected to the outer surface of the fixed frame. This invention relates to the technical field of ceramic plates for kilns. The high thermal conductivity refractory ceramic plate for kilns expands the heat absorption area through the hexagonal silicon carbide crystal blocks outside the fixed frame, rapidly transferring heat. Copper-nickel alloy metal heat-conducting sheets conduct heat to the inner wall of the ceramic plate. Adjacent plates are connected to high-temperature resistant silicone heat-conducting pads via heat-conducting rods, reducing thermal resistance and achieving multi-plate collaborative heat conduction. Combined with a tightly spliced ​​limiting structure, heat is evenly distributed between the plates, improving overall heat conduction efficiency.
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Description

Technical Field

[0001] This utility model relates to the technical field of ceramic plates for kilns, specifically a high thermal conductivity refractory ceramic plate for kilns. Background Technology

[0002] In industrial production, ceramic firing plates are used for parts that require high-temperature sintering. The blanks are placed on the ceramic firing plates and sintered in the kiln. Most existing ceramic firing plates are silicon carbide ceramic plates. However, although existing refractory silicon carbide ceramic plates have high high-temperature resistance, their thermal conductivity is poor and they cannot conduct the heat received by the refractory silicon carbide ceramic plates, thus reducing their practicality.

[0003] Chinese utility model patent CN222849790U discloses a high thermal conductivity refractory ceramic plate for kilns, comprising a silicon carbide ceramic plate body, multiple connecting columns, a heat-conducting plate, and a fixing mechanism. The fixing mechanism includes multiple mounting protrusions, multiple supporting columns, and multiple return springs. Multiple connecting columns are sequentially inserted into corresponding fixing holes. During insertion, a second inclined surface applies force to a first inclined surface, causing the supporting column to slide within a sliding hole and applying force to the return spring, compressing it. When the connecting column is inserted to the bottom of the fixing hole, the supporting column, under the restoring force of the return spring, is inserted into the insertion hole, thus fixing the connecting column to the current silicon carbide ceramic plate body. Another silicon carbide ceramic plate body is fixed to the other end of the connecting column, making the fixing structure between adjacent silicon carbide ceramic plates more robust.

[0004] While existing silicon carbide ceramic plates are resistant to high temperatures, they lack a thermally conductive structure. Heat is transferred slowly only through the plate itself and cannot be diffused quickly. Furthermore, there is no connection structure for multiple plates to conduct heat together, which hinders heat exchange between adjacent plates and easily leads to localized high-temperature accumulation. This results in uneven heating of sintered parts, affecting molding quality and reducing practicality.

[0005] Therefore, this utility model provides a high thermal conductivity refractory ceramic plate for kilns to solve the above problems. Utility Model Content

[0006] To address the shortcomings of existing technologies, this utility model provides a high thermal conductivity refractory ceramic plate for kilns, which solves the aforementioned problems.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a high thermal conductivity refractory ceramic plate for kilns, comprising a ceramic plate body, an installation mechanism on the outer surface of the ceramic plate body, and a heat-conducting mechanism fixedly connected to the inner wall of the ceramic plate body. The heat-conducting mechanism includes a fixed frame fixedly connected to the inner wall of the ceramic plate body, multiple sets of silicon carbide blocks fixedly connected to the outer surface of the fixed frame, and limiting grooves on both the upper and lower surfaces of the ceramic plate body. Limiting blocks are slidably connected to the outer surface of the limiting grooves, and mounting grooves are provided on all side surfaces of the ceramic plate body. A heat-conducting rod is fixedly connected to one set of side surfaces of the ceramic plate body, and mounting grooves are provided on the other set of side surfaces of the ceramic plate body.

[0008] Furthermore, a heat-conducting pad is fixedly connected to the end of each heat-conducting rod away from the fixed frame, and the outer surface of the heat-conducting pad is in contact with the outer surface of the fixed frame.

[0009] By adopting the above technical solution, the outer surface of the heat-conducting rod and the fixed frame can be easily connected together through the heat-conducting pad, thereby increasing the efficiency of heat transfer.

[0010] Furthermore, multiple sets of fixing protrusions are fixedly connected to the upper surface of the ceramic plate body, and the central part of the fixing protrusions bulges upward.

[0011] By adopting the above technical solution, the fixed protrusions facilitate the increase of thermal radiation on the upper surface of the ceramic plate, thereby increasing the area for absorbing heat.

[0012] Furthermore, the silicon carbide block adopts a regular hexagonal prism structure, and the outer surface of the fixing frame is provided with multiple sets of through slots in conjunction with the outer surface of the silicon carbide block.

[0013] By adopting the above technical solution, the area of ​​heat transfer to the outer surface of the fixed frame can be increased by using silicon carbide blocks, thereby increasing the heat transfer effect.

[0014] Furthermore, metal heat-conducting sheets are fixedly connected to both the upper and lower surfaces of the fixed frame, and the outer surface of the metal heat-conducting sheets is fixedly connected to the inner wall of the ceramic plate body.

[0015] By adopting the above technical solution, multiple sets of metal heat-conducting sheets facilitate the rapid transfer of heat on the outer surface of the ceramic plate body, enabling heat exchange on the outer surfaces of multiple sets of ceramic plates body, and facilitating the uniform distribution of heat.

[0016] Furthermore, the outer surface of the limiting block is provided with a convex-shaped structure, and a pull ring is fixedly connected to the upper surface of the limiting block.

[0017] By adopting the above technical solution, the limiting block is set at the top corner of the four sets of ceramic plate bodies, which facilitates the limiting of the four adjacent sets of ceramic plate bodies. The limiting block and the ceramic plate body can be easily separated by pulling the pull ring.

[0018] Beneficial effects

[0019] This invention provides a high thermal conductivity refractory ceramic plate for kilns. Compared with the prior art, it has the following advantages:

[0020] 1. This high thermal conductivity refractory ceramic plate for kilns expands the heat absorption area through hexagonal silicon carbide crystal blocks outside the fixed frame, enabling rapid heat transfer. Copper-nickel alloy metal heat-conducting sheets conduct heat to the inner wall of the ceramic plate. Adjacent plates are connected to high-temperature resistant silicone heat-conducting pads through heat-conducting rods, reducing thermal resistance and achieving multi-plate collaborative heat conduction. Combined with a tightly spliced ​​limiting structure, heat is evenly distributed between the plates, improving the overall heat conduction efficiency.

[0021] 2. This high thermal conductivity refractory ceramic plate is easy to use in kilns. The upper surface of the ceramic plate is fixed with protrusions to increase the heat-receiving area and enhance heat radiation absorption. The limiting block and the limiting groove slide together to ensure that adjacent plates are tightly spliced ​​and reduce heat transfer gaps. The pull ring design makes it easy to disassemble and assemble. The overall structure takes into account both efficient heat absorption and stable connection, and is suitable for long-term use in high-temperature environments of kilns. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a perspective view of the external structure of this utility model;

[0024] Figure 2 This is a front sectional view of the structure of this utility model;

[0025] Figure 3 yes Figure 2 A magnified structural diagram of A in the middle;

[0026] Figure 4 This is a side sectional view of the structure of this utility model;

[0027] Figure 5 This is a top sectional view of the structure of this utility model.

[0028] In the diagram: 1. Ceramic plate body; 2. Mounting mechanism; 201. Limiting block; 202. Mounting groove; 203. Limiting groove; 204. Pull ring; 3. Heat conduction mechanism; 301. Heat conduction pad; 302. Heat conduction rod; 303. Fixing protrusion; 304. Fixing frame; 305. Silicon carbide crystal block; 306. Metal heat conduction sheet. Detailed Implementation

[0029] It should be noted that in the description of the embodiments of this application, the terms "front," "rear," "left," "right," "up," "down," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0030] The present application will be further described in detail below with reference to the accompanying drawings and embodiments.

[0031] Reference Figures 1 to 5 This application provides a high thermal conductivity refractory ceramic plate for kilns, including a ceramic plate body 1. An installation mechanism 2 is provided on the outer surface of the ceramic plate body 1, and a heat conduction mechanism 3 is fixedly connected to the inner wall of the ceramic plate body 1. The heat conduction mechanism 3 includes a fixed frame 304 fixedly connected to the inner wall of the ceramic plate body 1. Multiple sets of silicon carbide crystal blocks 305 are fixedly connected to the outer surface of the fixed frame 304. Limiting grooves 203 are provided on both the upper and lower surfaces of the ceramic plate body 1. Limiting blocks 201 are slidably connected to the outer surface of the limiting grooves 203. Installation grooves 202 are provided on the side surfaces of the ceramic plate body 1. A heat conduction rod 302 is fixedly connected to the side surface of one set of ceramic plate bodies 1, and an installation groove 202 is provided on the side surface of the other set of ceramic plate bodies 1.

[0032] Furthermore, a heat-conducting pad 301 is fixedly connected to the end of the heat-conducting rod 302 away from the fixed frame 304. The outer surface of the heat-conducting pad 301 is in contact with the outer surface of the fixed frame 304. Multiple sets of fixed protrusions 303 are fixedly connected to the upper surface of the ceramic plate body 1. The central part of the fixed protrusion 303 is raised upward. The silicon carbide crystal block 305 adopts a regular hexagonal prism structure, and multiple sets of through grooves are opened on the outer surface of the fixed frame 304 in conjunction with the outer surface of the silicon carbide crystal block 305.

[0033] In this embodiment, the heat absorption area is expanded by the hexagonal silicon carbide crystal block 305 outside the fixed frame 304, which quickly transfers heat. The copper-nickel alloy metal heat-conducting sheet 306 conducts heat to the inner wall of the ceramic plate. Adjacent plates are connected to the high-temperature resistant silicone heat-conducting pad 301 through the heat-conducting rod 302 to reduce thermal resistance and achieve multi-plate collaborative heat conduction. With the tight splicing limiting structure, the heat is evenly distributed between the plates, improving the overall heat conduction efficiency.

[0034] Reference Figures 1 to 4 In one aspect of this embodiment, a metal heat-conducting sheet 306 is fixedly connected to both the upper and lower surfaces of the fixed frame 304, and the outer surface of the metal heat-conducting sheet 306 is fixedly connected to the inner wall of the ceramic plate body 1.

[0035] Furthermore, the outer surface of the limiting block 201 is provided with a convex-shaped structure, and a pull ring 204 is fixedly connected to the upper surface of the limiting block 201.

[0036] In this embodiment, the fixed protrusion 303 on the upper surface of the ceramic plate increases the heating area and enhances heat radiation absorption; the limiting block 201 and the limiting groove 203 slide together to ensure that adjacent plates are tightly spliced ​​and reduce the heat transfer gap; the pull ring 204 is designed to facilitate disassembly and assembly; the overall structure takes into account both efficient heat absorption and stable connection, and is suitable for long-term use in the high-temperature environment of the kiln.

[0037] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0038] Working principle: When the kiln uses a high thermal conductivity refractory ceramic plate, heat is first transferred to the interior through the fixed protrusions 303 on the upper surface of the ceramic plate body 1, increasing the heating area and enhancing heat radiation absorption. The fixed frame 304 serves as the core heat-conducting carrier, containing multiple sets of regular hexagonal prism silicon carbide crystal blocks 305 made of high-purity silicon carbide. Its advantages include high thermal conductivity, high temperature resistance, and strong chemical stability, enabling rapid heat absorption and expansion of the heat transfer area. The metal heat-conducting plates 306 on the upper and lower surfaces of the fixed frame 304 are made of copper-nickel alloy, offering both high thermal conductivity and oxidation resistance. The metal heat-conducting plates 306 conduct heat to the ceramic plate body 1. The inner wall, and the adjacent ceramic plate bodies 1 are connected to the mounting groove 202 through the heat-conducting rod 302 on the side surface. The heat-conducting pad 301 at the end of the heat-conducting rod 302 is made of high-temperature resistant silicone. The advantage is that it enhances the fit and seal, reduces thermal resistance, and ensures that heat is efficiently transferred to the fixing frame 304 of another set of ceramic plates, realizing multi-plate collaborative heat conduction. The sliding cooperation between the limiting block 201 and the limiting groove 203 ensures that the adjacent ceramic plates are tightly spliced, reducing the heat transfer gap. Finally, through the multi-stage conduction of silicon carbide crystal block 305, metal heat-conducting sheet 306 and heat-conducting rod 302, heat is evenly distributed between the ceramic plate bodies 1, meeting the high-efficiency heat conduction requirements of the kiln in the high-temperature environment.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0040] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high thermal conductivity refractory ceramic plate for kilns, comprising a ceramic plate body (1), characterized in that: The ceramic plate body (1) has an installation mechanism (2) on its outer surface and a heat conduction mechanism (3) fixedly connected to the inner wall of the ceramic plate body (1). The heat conduction mechanism (3) includes a fixed frame (304) fixedly connected to the inner wall of the ceramic plate body (1). Multiple sets of silicon carbide blocks (305) are fixedly connected to the outer surface of the fixed frame (304). Limiting grooves (203) are opened on both the upper and lower surfaces of the ceramic plate body (1). Limiting blocks (201) are slidably connected to the outer surface of the limiting grooves (203). Installation grooves (202) are opened on the side surfaces of the ceramic plate body (1). A heat conduction rod (302) is fixedly connected to the side surface of one set of ceramic plate bodies (1). Installation grooves (202) are opened on the side surfaces of the other set of ceramic plate bodies (1).

2. The high thermal conductivity refractory ceramic plate for kilns according to claim 1, characterized in that: Each end of the heat-conducting rod (302) away from the fixed frame (304) is fixedly connected to a heat-conducting pad (301), and the outer surface of the heat-conducting pad (301) is in contact with the outer surface of the fixed frame (304).

3. The high thermal conductivity refractory ceramic plate for kilns according to claim 2, characterized in that: The upper surface of the ceramic plate body (1) is fixedly connected with multiple sets of fixing protrusions (303), and the central part of the fixing protrusions (303) is raised upward.

4. The high thermal conductivity refractory ceramic plate for kilns according to claim 3, characterized in that: The silicon carbide block (305) adopts a regular hexagonal prism structure, and the outer surface of the fixing frame (304) is provided with multiple sets of through slots in conjunction with the outer surface of the silicon carbide block (305).

5. The high thermal conductivity refractory ceramic plate for kilns according to claim 1, characterized in that: Metal heat-conducting sheets (306) are fixedly connected to both the upper and lower surfaces of the fixed frame (304), and the outer surface of the metal heat-conducting sheets (306) is fixedly connected to the inner wall of the ceramic plate body (1).

6. The high thermal conductivity refractory ceramic plate for kilns according to claim 5, characterized in that: The outer surface of the limiting block (201) is provided with a convex-shaped structure, and a pull ring (204) is fixedly connected to the upper surface of the limiting block (201).