A wafer bonding equipment adhesive spraying abnormality detection mechanism

Abstract

This utility model relates to the field of wafer bonding processing technology and discloses a wafer bonding equipment adhesive spraying anomaly detection mechanism. It includes a main connecting plate, with a side support plate fixedly connected to the top rear side of the main connecting plate. An imaging mechanism is disposed on the top of the main connecting plate to detect whether there is a deviation in the adhesive spraying process of the wafer bonding equipment. A module mechanism is disposed inside the side support plate for convenient pushing and pulling, quick replacement, and maintenance of the wafer bonding module. The imaging mechanism includes a sliding frame, with its front side fixedly connected to the rear side of the main connecting plate. A sliding connector is slidably connected to the front side of the sliding frame, and a rotating component is disposed on the front side of the sliding connector. A rear box is fixedly connected to the rear side of the main connecting plate. In this utility model, an adjustable-height dual-track camera detection imaging device is disposed on the rear side of the device, enabling right-angle scanning detection of the adhesive spraying process by the dual cameras.

Description

Technical Field

[0001] This utility model relates to the field of wafer bonding processing technology, and in particular to a wafer bonding equipment adhesive spraying abnormality detection mechanism. Background Technology

[0002] As a component of the wafer bonding process, the adhesive spraying anomaly detection mechanism of the wafer bonding equipment mainly monitors and analyzes the operating status and effect of the adhesive spraying process in real time. In the entire wafer bonding process, the adhesive spraying process is the prerequisite for ensuring reliable connection between wafers, and this detection mechanism is responsible for closely monitoring various situations in the adhesive spraying process, especially adhesive spraying tilt and errors that occur during the adhesive spraying process.

[0003] By utilizing the adhesive spraying anomaly detection mechanism in wafer bonding equipment, abnormalities that occur during the adhesive spraying process, such as adhesive dot position deviations and spraying interruptions, can be detected in a timely manner. This can effectively prevent wafer bonding defects caused by adhesive spraying anomalies, help improve the yield of wafer bonding, reduce wafer waste caused by bonding failures, lower production costs, and ensure the smooth progress of subsequent chip manufacturing processes, thereby improving the quality and stability of the entire semiconductor product.

[0004] Currently, existing wafer bonding equipment adhesive spraying anomaly detection mechanisms only use a single camera as the detection and imaging device. A single camera can only detect adhesive spraying from a single fixed angle. Since the actual adhesive spraying scenario is relatively complex, the adhesive spraying state varies from different angles. The image information obtained by relying on a single camera is limited and cannot comprehensively and accurately reflect the adhesive spraying status. In actual inspection, when there are slight tilts or local changes in adhesive amount, the image taken from a single angle is prone to visual blind spots, making it impossible to accurately capture these anomalies, thus causing detection errors. This seriously affects the accuracy of judging adhesive spraying anomalies and makes it difficult to meet the stringent requirements of wafer bonding processes for high-precision inspection. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a wafer bonding equipment adhesive spraying abnormality detection mechanism, which aims to improve the problem that the existing technology only uses a single camera for detection, which is prone to errors.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a wafer bonding equipment adhesive spraying abnormality detection mechanism, including a main connecting plate, a side support plate fixedly connected to the top rear side of the main connecting plate, an imaging mechanism provided on the top of the main connecting plate, the imaging mechanism being used to detect whether there is a deviation in the adhesive spraying of the wafer bonding equipment, and a module mechanism being provided inside the side support plate, the module mechanism being used for convenient pushing and pulling, quick replacement and repair of the wafer bonding module;

[0007] The imaging mechanism includes a sliding frame, the front side of which is fixedly connected to the rear side of the main connecting plate. A sliding connector is slidably connected to the front side of the sliding frame, and a rotating component is provided on the front side of the sliding connector. A rear box is fixedly connected to the rear side of the main connecting plate, and a door is rotatably connected to the rear side of the rear box. A computing component is provided on the top inner side of the rear box, and a cooling fan is fixedly connected to the bottom inner side of the rear box. An algorithm component and a power supply component are provided on the right inner side of the rear box.

[0008] As a further description of the above technical solution:

[0009] The module mechanism includes a rear connecting rod, the rear side of which is fixedly connected to the front side of the side support plate. A front connecting rod is fixedly connected to the front side of the rear connecting rod. A telescopic rod is slidably connected to the front side of the front connecting rod. A front connecting piece is fixedly connected to the front side of the telescopic rod. An upper sliding connecting frame is fixedly connected to the top of the main connecting plate. A glue spraying assembly is provided on the rear side of the top of the upper sliding connecting frame. A wafer placement assembly is provided on the front side of the top of the upper sliding connecting frame.

[0010] As a further description of the above technical solution:

[0011] The rotating assembly includes a rotating block, the rear side of which is fixedly connected to the front side of the sliding connector, and a rotating camera is rotatably connected to the front side of the rotating block.

[0012] As a further description of the above technical solution:

[0013] The computing component includes a rear connecting frame, the rear side of which is fixedly connected to the top inner side of the rear box, and the front side of which is fixedly connected to an imaging computing device.

[0014] As a further description of the above technical solution:

[0015] The algorithm component includes an algorithm chip, the rear side of which is fixedly connected to the inside right side of the rear box, and a chip heat sink is fixedly connected to the rear side of the algorithm chip.

[0016] As a further description of the above technical solution:

[0017] The power assembly includes a bottom support frame, the bottom of which is fixedly connected to the inside right side of the rear compartment, and a battery is fixedly connected to the top of the bottom support frame.

[0018] As a further description of the above technical solution:

[0019] The adhesive spraying assembly includes a sliding connecting piece, the bottom of which is fixedly connected to the top rear side of the upper sliding connecting frame, a sliding connecting block is slidably connected to the front side of the sliding connecting piece, and an adhesive spray nozzle is fixedly connected to the bottom of the sliding connecting block.

[0020] As a further description of the above technical solution:

[0021] The wafer placement assembly includes a placement base block, the bottom of which is slidably connected to the top front side of the upper sliding connecting frame, and a replaceable module is fixedly connected to the top of the placement base block.

[0022] This utility model has the following beneficial effects:

[0023] 1. In this utility model, an adjustable-height dual-track camera detection and imaging device is installed on the rear side of the device. It can realize the detection of the glue spraying process by scanning the camera at a right angle. The dual tracks can flexibly adjust the camera height to ensure that the best detection position can be found in different glue spraying scenarios. The right-angle view setting forms complementary detection coverage in the spatial dimension, avoiding the visual blind spots when a single camera is detected. This multi-angle collaborative detection method can capture the details of the glue spraying process more comprehensively and accurately. Whether it is the change of glue amount, position deviation or slight tilting anomaly, it can be identified in a timely and accurate manner, providing a more solid guarantee for the quality of wafer bonding.

[0024] 2. In this utility model, a convenient push-pull placement block is provided on the bottom inner side of the device, which facilitates the maintenance and replacement of the wafer placement module. Operators can quickly complete the disassembly and assembly of the wafer placement module through simple push-pull actions without cumbersome operation steps, shortening the time for module maintenance and replacement, effectively reducing the downtime of equipment maintenance, enabling more efficient response to module failures during production, improving the continuous operation capability and production efficiency of the entire wafer bonding equipment, and reducing production delays caused by equipment maintenance. Attached Figure Description

[0025] Figure 1 This is a perspective view of a wafer bonding equipment adhesive spraying abnormality detection mechanism proposed in this utility model.

[0026] Figure 2 This is a front view of a wafer bonding equipment adhesive spraying abnormality detection mechanism proposed in this utility model.

[0027] Figure 3 This is a schematic diagram of the imaging mechanism in a wafer bonding equipment adhesive spraying anomaly detection mechanism proposed in this utility model.

[0028] Figure 4This is a schematic diagram of the computing component in a wafer bonding equipment adhesive spraying anomaly detection mechanism proposed in this utility model.

[0029] Figure 5 This is a schematic diagram of the module mechanism in a wafer bonding equipment adhesive spraying abnormality detection mechanism proposed in this utility model.

[0030] Legend:

[0031] 1. Main connecting plate; 2. Side support plate; 3. Imaging mechanism; 31. Sliding frame; 32. Sliding connector; 33. Rotating assembly; 331. Rotating block; 332. Rotating camera; 34. Rear box; 35. Box door; 36. Computing assembly; 361. Rear connecting frame; 362. Imaging computing device; 37. Cooling fan; 38. Algorithm assembly; 381. Algorithm chip; 382. Chip heat dissipation; 39. Power supply assembly; 391. Bottom support frame; 392. Battery; 4. Module mechanism; 41. Rear connecting rod; 42. Front connecting rod; 43. Telescopic rod; 44. Front connector; 45. Upper sliding connecting frame; 46. Glue spraying assembly; 461. Sliding connecting piece; 462. Sliding connecting block; 463. Glue spraying nozzle; 47. Wafer placement assembly; 471. Placement base block; 472. Replaceable module. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Reference Figure 1 , Figure 3 and Figure 4 The present invention provides an embodiment of a wafer bonding equipment adhesive spraying abnormality detection mechanism, including a main connecting plate 1, a side support plate 2 fixedly connected to the top rear side of the main connecting plate 1, an imaging mechanism 3 provided on the top of the main connecting plate 1, the imaging mechanism 3 being used to detect whether there is a deviation in the adhesive spraying of the wafer bonding equipment, and a module mechanism 4 being provided inside the side support plate 2, the module mechanism 4 being used for convenient pushing and pulling, quick replacement and repair of the wafer bonding module;

[0034] The imaging mechanism 3 includes a sliding frame 31, the front side of which is fixedly connected to the rear side of the main connecting plate 1. A sliding connector 32 is slidably connected to the front side of the sliding frame 31. A rotating component 33 is provided on the front side of the sliding connector 32. A rear box 34 is fixedly connected to the rear side of the main connecting plate 1. A door 35 is rotatably connected to the rear side of the rear box 34. A computing component 36 is provided on the top inner side of the rear box 34. A cooling fan 37 is fixedly connected to the bottom inner side of the rear box 34. An algorithm component 38 is provided on the right inner side of the rear box 34. A power supply component 39 is provided on the right inner side of the rear box 34.

[0035] Specifically, the main connecting plate 1 is a horizontally arranged plate structure. Its top plane is used to support the imaging mechanism 3 and the module mechanism 4. The top rear edge of the main connecting plate 1 is fixedly connected to the bottom of the side support plate 2. The side support plate 2 extends vertically upward, and its plate surface forms a right angle with the top surface of the main connecting plate 1. The inner side of the side support plate 2 has reserved installation space to accommodate the module mechanism 4. The imaging mechanism 3 is arranged at the top of the main connecting plate 1 near the front side. The detection area of ​​the imaging mechanism 3 covers the glue spraying area of ​​the wafer bonding equipment. The internal cavity of the side support plate 2 is adapted to the external contour of the module mechanism 4. The module mechanism 4 can move along the internal guide structure of the side support plate 2.

[0036] The sliding frame 31 in the imaging mechanism 3 is a rectangular frame structure. Its front edge is fixedly connected to the rear surface of the main connecting plate 1 by bolts. The front side of the sliding frame 31 is machined with a slide rail extending in the vertical direction. The rear side of the sliding connector 32 is provided with a slider that matches the slide rail. The slider is embedded in the slide rail to achieve sliding connection. The middle of the front surface of the sliding connector 32 is rotatably connected to the bottom of the rotating component 33. The rotating component 33 can rotate around the connecting shaft on the horizontal plane. The middle position of the rear surface of the main connecting plate 1 is fixedly connected to the front of the rear box 34. The rear box 34 is a cuboid shell structure, which forms a closed space inside.

[0037] The rear edge of the rear box 34 is connected to the door 35 via a hinge. The size of the door 35 matches the rear opening of the rear box 34. A computing component 36 is fixed to the inner top surface of the rear box 34 via a bracket. The input end of the computing component 36 is connected to the detection element of the imaging mechanism 3 via a wire. A cooling fan 37 is fixed to the inner bottom surface of the rear box 34 near the front. The exhaust direction of the cooling fan 37 is towards the computing component 36 and the algorithm component 38. The algorithm component 38 is fixed to the inner right side wall of the rear box 34 via bolts. The output end of the algorithm component 38 is connected to the input end of the computing component 36 via a wire. A power supply component 39 is fixed to the inner right side wall of the rear box 34 below the algorithm component 38. The output end of the power supply component 39 is connected to the computing component 36, the algorithm component 38, the cooling fan 37, and the electrical components in the imaging mechanism 3 via wires.

[0038] Reference Figure 1 , Figure 2 and Figure 5 The module mechanism 4 includes a rear connecting rod 41, the rear side of which is fixedly connected to the front side of the side support plate 2. A front connecting rod 42 is fixedly connected to the front side of the rear connecting rod 41. A telescopic rod 43 is slidably connected to the front side of the front connecting rod 42. A front connecting piece 44 is fixedly connected to the front side of the telescopic rod 43. An upper sliding connecting frame 45 is fixedly connected to the top of the main connecting plate 1. A glue spraying assembly 46 is provided on the rear side of the top of the upper sliding connecting frame 45. A wafer placement assembly 47 is provided on the front side of the top of the upper sliding connecting frame 45.

[0039] Specifically, in module mechanism 4, the rear connecting rod 41 is a long strip structure with its length direction set horizontally. The rear end face of the rear connecting rod 41 is fixedly connected to the front side face of the side support plate 2, and the connection position is close to the middle height of the side support plate 2. The front end face of the rear connecting rod 41 is fixedly connected to the rear end face of the front connecting rod 42. The axes of the two are on the same straight line, and together they constitute the fixed support part of module mechanism 4.

[0040] The front side of the front connecting rod 42 is provided with a sliding groove extending along its length direction. The rear side of the telescopic rod 43 is embedded in the sliding groove to form a sliding connection. The telescopic rod 43 can reciprocate along the length direction of the front connecting rod 42. Its front end face is fixedly connected to the rear end face of the front connecting member 44. The front connecting member 44 is a plate-shaped structure, and its plate surface is parallel to the top surface of the main connecting plate 1.

[0041] The top surface of the main connecting plate 1 is fixedly connected to the bottom of the upper sliding connecting frame 45 near the middle position. The upper sliding connecting frame 45 is a frame structure, and its top plane is parallel to the top surface of the main connecting plate 1. A glue spraying assembly 46 is provided in the top rear area of ​​the upper sliding connecting frame 45. The bottom of the glue spraying assembly 46 is fixed to the top surface of the upper sliding connecting frame 45. The glue outlet of the glue spraying assembly 46 faces downward, corresponding to the area above the wafer placement assembly 47.

[0042] A wafer placement assembly 47 is provided on the top front side of the upper sliding connecting frame 45. The bottom of the wafer placement assembly 47 is slidably connected to the top surface of the upper sliding connecting frame 45 and can move along the length of the upper sliding connecting frame 45. The rear edge of the wafer placement assembly 47 is connected to the front edge of the front connector 44. When the telescopic rod 43 slides along the front connector 42, the wafer placement assembly 47 can be moved synchronously through the front connector 44 to realize the position adjustment of the wafer placement assembly 47 relative to the upper sliding connecting frame 45.

[0043] The rear connecting rod 41 and the front connecting rod 42 provide a stable guiding foundation for the sliding of the telescopic rod 43, ensuring that the telescopic rod 43 will not deviate during movement. The upper sliding connecting frame 45 provides an installation platform for the glue spraying assembly 46 and the wafer placement assembly 47, ensuring that the two are in a relatively stable position during operation, which facilitates the glue spraying assembly 46 to accurately spray glue onto the wafers on the wafer placement assembly 47. The front connecting piece 44 connects the telescopic rod 43 and the wafer placement assembly 47, so that the movement of the telescopic rod 43 can be effectively transmitted to the wafer placement assembly 47, thereby completing the position adjustment of the wafer placement assembly 47 and facilitating the replacement and maintenance of the wafer placement assembly 47.

[0044] Reference Figure 1 and Figure 2 The rotating assembly 33 includes a rotating block 331, the rear side of which is fixedly connected to the front side of the sliding connector 32. A rotating camera 332 is rotatably connected to the front side of the rotating block 331. The computing assembly 36 includes a rear connecting frame 361, the rear side of which is fixedly connected to the top inner side of the rear box 34. An imaging computing device 362 is fixedly connected to the front side of the rear connecting frame 361. The algorithm assembly 38 includes an algorithm chip 381, the rear side of which is fixedly connected to the right inner side of the rear box 34. A chip heat sink 382 is fixedly connected to the rear side of the algorithm chip 381. The power supply assembly 39 includes a bottom support frame 391. The bottom of the support frame 391 is fixedly connected to the inside right side of the rear box 34, and the top of the bottom support frame 391 is fixedly connected to the battery 392. The glue spraying assembly 46 includes a sliding connecting piece 461. The bottom of the sliding connecting piece 461 is fixedly connected to the top rear side of the upper sliding connecting frame 45. The front side of the sliding connecting piece 461 is slidably connected to a sliding connecting block 462. The bottom of the sliding connecting block 462 is fixedly connected to a glue spraying nozzle 463. The wafer placement assembly 47 includes a placement base block 471. The bottom of the placement base block 471 is slidably connected to the top front side of the upper sliding connecting frame 45. The top of the placement base block 471 is fixedly connected to a replaceable module 472.

[0045] Specifically, in the rotating assembly 33, the rear side of the rotating block 331 is fixedly connected to the front side of the sliding connector 32, and the connecting surfaces of the two are in contact. The front side of the rotating block 331 is provided with a circular groove, and the rear side of the rotating camera 332 is provided with a protrusion that matches the groove. The protrusion is embedded in the groove to achieve a rotating connection. The rotating camera 332 can rotate around the front side of the rotating block 331 to adjust the shooting angle and ensure that the glue spraying area is fully covered. The computing assembly 36 includes a rear connecting frame 361, which is an L-shaped structure. The rear side of its vertical part is fixedly connected to the inner top of the rear box 34, and the horizontal part extends forward. Its position is in the middle area of ​​the inner top of the rear box 34. The front side of the rear connecting frame 361 is fixedly connected to the imaging computing device 362. The outer shell of the imaging computing device 362 is fastened to the horizontal part of the rear connecting frame 361 by bolts. The input end of the imaging computing device 362 is connected to the rotating camera 332 through a line to receive the image information transmitted by the rotating camera 332.

[0046] Algorithm component 38 includes algorithm chip 381. The rear side of algorithm chip 381 is fixedly connected to the inner right side wall of rear box 34 by welding. Its installation height is lower than that of computing component 36, leaving a certain space between them. The rear side of algorithm chip 381 is fixedly connected to chip heat sink 382. Chip heat sink 382 has a plate-like structure, and its area is larger than the rear surface area of ​​algorithm chip 381. The rear side of chip heat sink 382 is completely attached to the inner right side wall of rear box 34, dissipating the heat generated by algorithm chip 381 during operation through the wall. Power supply component 39 includes a bottom support frame 391, which is a rectangular frame structure. Its four bottom corners are fixedly connected to the inner right side wall of the rear box 34 by bolts, located directly below the algorithm chip 381, with a certain distance between them. The top of the bottom support frame 391 is fixedly connected to the battery 392, and the bottom of the battery 392 is in complete contact with the top surface of the bottom support frame 391. The battery 392 is connected to the rotating camera 332, the imaging computing device 362, and the algorithm chip 381 through wires to provide power support to each component.

[0047] The adhesive spraying assembly 46 includes a sliding connecting piece 461, which is elongated and its bottom is fixedly connected to the rear edge of the top of the upper sliding connecting frame 45 by bolts. Its length direction is consistent with the length direction of the upper sliding connecting frame 45. A T-shaped groove is machined on the front side of the sliding connecting piece 461. The sliding connecting block 462 can move horizontally along the front side of the sliding connecting piece 461. The bottom of the sliding connecting block 462 is fixedly connected to the adhesive spraying nozzle 463. The axis of the adhesive spraying nozzle 463 is perpendicular to the top surface of the upper sliding connecting frame 45. The outlet of the adhesive spraying nozzle 463 faces the area above the wafer placement assembly 47.

[0048] The wafer placement assembly 47 includes a placement base block 471. The bottom of the placement base block 471 is machined with a guide rail. The top front side of the upper sliding connecting bracket 45 is provided with a corresponding track. The guide rail and the track cooperate to achieve a sliding connection. The sliding direction is the same as the sliding direction of the sliding connecting block 462. The top of the placement base block 471 is fixedly connected to the replaceable module 472. The bottom edge of the replaceable module 472 is aligned with the top edge of the placement base block 471. The upper surface of the replaceable module 472 is a flat wafer bearing surface. This surface corresponds to the outlet of the glue spray nozzle 463 to ensure that the glue sprayed from the glue spray nozzle 463 can accurately land on the wafer.

[0049] Working principle: During the detection of glue spraying anomalies, the imaging mechanism 3 plays a core role. The sliding frame 31 is fixed to the rear side of the main connecting plate 1, providing a sliding base for the sliding connector 32. The sliding connector 32 can move along the front side of the sliding frame 31, driving the rotating component 33 to adjust its lateral position. In the rotating component 33, the rotating block 331 is fixed to the sliding connector 32, and the rotating camera 332 on its front side achieves full circumference rotation through the cooperation of protrusions and grooves. Combined with the sliding of the sliding connector 32, it can capture images of the glue spraying area from multiple angles.

[0050] The rotating camera 332 transmits the captured glue spraying image information to the computing component 36 via a line. The rear connecting bracket 361 is fixed to the top of the inner side of the rear box 34, supporting the imaging computing device 362. After receiving the image information, the imaging computing device 362 performs preliminary processing and then transmits the data to the algorithm component 38. The algorithm chip 381 is fixed to the right side inside the rear box 34. The chip heat sink 382 on its rear side dissipates heat by adhering to the inner wall of the rear box 34, ensuring the stable operation of the algorithm chip 381. The algorithm chip 381 analyzes the received data to determine whether there is any deviation in glue spraying.

[0051] In the power supply assembly 39, the bottom support frame 391 supports the battery 392, which powers the rotating camera 332, the imaging computing device 362, and the algorithm chip 381. The cooling fan 37 on the bottom inside the rear box 34 dissipates heat from the internal components. The door 35 can be rotated and opened for easy maintenance of the internal components of the rear box 34. Through the cooperation of the various components of the imaging mechanism 3, the rotating camera 332 takes pictures from multiple angles, and the imaging computing device 362 and the algorithm chip 381 work together to process the data, realizing comprehensive monitoring of the glue spraying process. It can accurately identify abnormal glue spraying deviations and avoid poor bonding caused by glue spraying problems.

[0052] The operation of module mechanism 4 ensures efficient equipment maintenance and smooth wafer replacement. The rear connecting rod 41 is fixed to the front side of the side support plate 2, and the front side is fixed to the front connecting rod 42, forming a support base. The front side of the front connecting rod 42 is slidably connected to the telescopic rod 43, which can extend and retract along the front connecting rod 42, driving the front connecting piece 44 to move. The upper sliding connecting frame 45 on the top of the main connecting plate 1 provides an installation and sliding track for the glue spraying assembly 46 and the wafer placement assembly 47. In the glue spraying assembly 46, the sliding connecting piece 461 is fixed to the top of the upper sliding connecting frame 45. On the rear side, the sliding connecting block 462 slides along the T-shaped groove on its front side, driving the bottom glue nozzle 463 to adjust its position to ensure glue spraying accuracy; in the wafer placement assembly 47, the guide rail at the bottom of the placement base block 471 slides in cooperation with the track on the front side of the top of the upper sliding connecting frame 45, and the replaceable module 472 on its top is used to place the wafer. The front connector 44 is connected to the placement base block 471. When the telescopic rod 43 extends or retracts, it can drive the placement base block 471 and the replaceable module 472 to move.

[0053] Through the cooperation of the various components of the module mechanism 4, the telescopic rod 43 drives the wafer placement component 47 to be pushed and pulled conveniently, the replaceable module 472 facilitates quick replacement and maintenance, and the glue spraying component 46 can adjust the glue spraying position, thereby realizing the convenience of equipment maintenance and the improvement of work efficiency.

[0054] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer bonding equipment adhesive spraying abnormality detection mechanism, comprising a main connecting board (1), characterized in that: The main connecting plate (1) is fixedly connected to the rear top of the side support plate (2). The main connecting plate (1) is provided with an imaging mechanism (3) at its top. The imaging mechanism (3) is used to detect whether there is a deviation in the adhesive spraying of the wafer bonding equipment. The side support plate (2) is provided with a module mechanism (4) inside. The module mechanism (4) is used for convenient pushing and pulling, quick replacement and maintenance of the wafer bonding module. The imaging mechanism (3) includes a sliding frame (31), the front side of which is fixedly connected to the rear side of the main connecting plate (1), a sliding connector (32) is slidably connected to the front side of the sliding frame (31), a rotating component (33) is provided on the front side of the sliding connector (32), a rear box (34) is fixedly connected to the rear side of the main connecting plate (1), a door (35) is rotatably connected to the rear side of the rear box (34), a computing component (36) is provided on the top inner side of the rear box (34), a cooling fan (37) is fixedly connected to the bottom inner side of the rear box (34), an algorithm component (38) is provided on the right inner side of the rear box (34), and a power supply component (39) is provided on the right inner side of the rear box (34).

2. The wafer bonding equipment adhesive spraying abnormality detection mechanism according to claim 1, characterized in that: The module mechanism (4) includes a rear connecting rod (41), the rear side of which is fixedly connected to the front side of the side support plate (2), the front side of which is fixedly connected to a front connecting rod (42), the front side of which is slidably connected to a telescopic rod (43), the front side of which is fixedly connected to a front connector (44), the top of the main connecting plate (1) is fixedly connected to an upper sliding connecting frame (45), the rear side of the top of the upper sliding connecting frame (45) is provided with a glue spraying assembly (46), and the front side of the top of the upper sliding connecting frame (45) is provided with a wafer placement assembly (47).

3. The wafer bonding equipment adhesive spraying abnormality detection mechanism according to claim 1, characterized in that: The rotating assembly (33) includes a rotating block (331), the rear side of which is fixedly connected to the front side of the sliding connector (32), and a rotating camera (332) is rotatably connected to the front side of the rotating block (331).

4. The wafer bonding equipment adhesive spraying abnormality detection mechanism according to claim 1, characterized in that: The computing component (36) includes a rear connecting frame (361), the rear side of which is fixedly connected to the top of the inner side of the rear box (34), and the front side of which is fixedly connected to an imaging computing device (362).

5. The wafer bonding equipment adhesive spraying abnormality detection mechanism according to claim 1, characterized in that: The algorithm component (38) includes an algorithm chip (381), the rear side of which is fixedly connected to the inside right side of the rear box (34), and a chip heat sink (382) is fixedly connected to the rear side of the algorithm chip (381).

6. The wafer bonding equipment adhesive spraying abnormality detection mechanism according to claim 1, characterized in that: The power supply assembly (39) includes a bottom support frame (391), the bottom of which is fixedly connected to the inside right side of the rear box (34), and a battery (392) is fixedly connected to the top of the bottom support frame (391).

7. The wafer bonding equipment adhesive spraying abnormality detection mechanism according to claim 2, characterized in that: The adhesive spraying assembly (46) includes a sliding connecting piece (461), the bottom of which is fixedly connected to the top rear side of the upper sliding connecting frame (45), and a sliding connecting block (462) is slidably connected to the front side of the sliding connecting piece (461), and an adhesive spray nozzle (463) is fixedly connected to the bottom of the sliding connecting block (462).

8. The wafer bonding equipment adhesive spraying abnormality detection mechanism according to claim 2, characterized in that: The wafer placement assembly (47) includes a placement base (471), the bottom of which is slidably connected to the top front side of the upper sliding connecting frame (45), and a replaceable module (472) is fixedly connected to the top of the placement base (471).

Images