A testing device for testing miniature connectors

By using the Leeno GN151AA micro probe and a microneedle module made of ceramic and PEEK composite material, combined with a floating module design and a state sensing system, the problems of accuracy and stability in micro connector detection were solved, achieving efficient detection results.

CN224286930UActive Publication Date: 2026-05-26ZHUHAI KEZHENG INTELLIGENT TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ZHUHAI KEZHENG INTELLIGENT TECH CO LTD
Filing Date
2025-04-11
Publication Date
2026-05-26

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Abstract

This utility model relates to a testing device for testing micro connectors. The module includes an electrical control box and a micro-needle module. The module also includes a substrate, a pressure plate module, a testing module, a USB-C module, and a SIM card module. This utility model only requires placing the corresponding product in the product placement area, pressing and fixing it to the testing module using the pressure plate module to ensure contact between the contacts, and then automatically aligning and inserting the USB-C module and SIM card module to begin functional testing. The micro-connector's shape positioning and floating mechanism on the micro-needle module ensures accurate alignment between the micro-probes and the test points on the micro-connector, meeting the testing requirements of micro connectors. It offers high testing accuracy, high efficiency, and is less likely to damage the product.
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Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to a testing device for testing micro connectors. Background Technology

[0002] As people's living standards continue to improve, they have higher requirements for the functionality and size of electronic products. They want more features while also demanding smaller, more portable sizes. One method is to reduce the size of connectors within electronic products to minimize their space. Smaller connectors mean smaller pins and smaller spacing. When the pin spacing is too small, conventional testing probes and methods become unsuitable, requiring the use of microprobes. Microprobes have higher requirements for pinhole size, and traditional testing equipment and manual testing methods can no longer meet current testing requirements. Utility Model Content

[0003] The purpose of this invention is to provide a testing device for testing micro connectors, which effectively solves the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution.

[0005] A testing device for testing micro connectors, the device comprising an electrical control box and a micro-needle module, the module further comprising a substrate, a pressure plate module, a testing module, a USB-C module and a SIM card module;

[0006] The substrate is mounted on the electrical control box;

[0007] The substrate is provided with a setting plate and a detection module. The detection module is provided with a USB-C module and a SIM card module on its side.

[0008] The pressure plate module includes a gantry frame, a downward drive cylinder, and a pressure plate.

[0009] The gantry frame is mounted on the base plate, and the gantry frame is equipped with a downward-pressing drive cylinder with the output axis, located above the carrier plate module;

[0010] A pressure plate is provided on the output shaft of the drive cylinder;

[0011] The carrier plate module includes a carrier plate and a needle plate; the carrier plate is disposed above the needle plate.

[0012] The needle plate is equipped with a microneedle module for detecting products;

[0013] Four sets of linear bearings and buffer springs are provided between the carrier plate and the needle plate;

[0014] The needle plate is equipped with a microneedle module;

[0015] The carrier plate is provided with a product placement area;

[0016] Preferably, the pressure plate module is further provided with a marker pen module;

[0017] The marker module includes a marker, a setting lever, and a marker drive cylinder;

[0018] The marking drive cylinder is mounted on the pressure plate via a setting rod, with its output shaft pointing downwards and connected to a marking pen;

[0019] The pressure plate has through holes;

[0020] The pen tip passes through a through hole and faces the product placement area on the carrier plate. When marking and inspection are required, the marking drive cylinder drives the pen downward, so that the ink at the pen tip marks the product. The marking reason can be set according to the requirements, including but not limited to inspecting finished products, NG error products, etc.

[0021] Preferably, the USB-C module and the SIM card module are slidably mounted on the setting plate.

[0022] Preferably, the USBC module includes a first drive cylinder, a USBC detection interface, a first slider, and a first guide rail;

[0023] The setting plate is provided with a first guide rail, and a first slider is slidably connected to the first guide rail. The first slider is provided with a USBC detection interface. The setting plate is also provided with a first drive cylinder to drive the first slider to slide relative to the first guide rail.

[0024] Preferably, the SIM card module includes a second drive cylinder, a SIM card simulation board, a second slider, and a second guide rail;

[0025] The setting plate is provided with a second guide rail, and a second slider is slidably connected to the second guide rail. A SIM card simulation board is provided on the second slider. The setting plate is also provided with a second driving cylinder to drive the second slider to slide relative to the second guide rail.

[0026] Preferably, the pressure plate is equipped with a speaker module and an electromagnet module, and also has a downward-facing probe. The speaker module and electromagnet module can sense the detection status and emit a prompt sound.

[0027] Preferably, the microneedle module includes an upper needle block and a lower needle block;

[0028] The upper needle block is positioned above the lower needle block by its shape positioning. The lower needle block is equipped with a micro probe, and a buffer spring is provided between the upper needle block and the lower needle block.

[0029] This invention only requires placing the corresponding product in the product placement area, pressing it into the detection module using the pressure plate module, and ensuring contact connection. The USB-C module and SIM card module then automatically align and insert, allowing functional testing to begin. During the pressing process, the pressure plate depresses, causing the carrier plate to press down. The carrier plate and pin plate ensure alignment accuracy, while four linear bearings ensure perpendicularity. The micro-needle module is a floating module; as the pressure plate continues to press down, the micro-connector of the product begins to contact the micro-needle module. The shape positioning and floating of the micro-connector on the micro-needle module ensure the alignment accuracy between the micro-probe and the test point on the micro-connector, meeting the testing requirements of the micro-connector. This method offers high testing accuracy, high efficiency, and minimal risk of product damage. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0031] Figure 2 This is a schematic diagram of the overall detection module of this utility model;

[0032] Figure 3 This is a schematic diagram of the USB-C module and SIM card module of this utility model;

[0033] Figure 4 This is a schematic diagram of the detection module structure of this utility model;

[0034] Figure 5 This is a schematic diagram of the structure of the lower needle block of this utility model. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0036] Please see Figures 1-5 The present invention provides a testing device for testing micro connectors. The device includes an electrical control box 1 and a set of micro probes 203. The module also includes a substrate 3, a pressure plate module 4, a testing module 5, a USB-C module 6, and a SIM card module 7.

[0037] The substrate 3 is mounted on the electrical control box 1;

[0038] The substrate 3 is provided with a mounting plate 9 and a detection module 5. The detection module 5 is provided with a USB-C module 6 and a SIM card module 7 on its side.

[0039] The pressure plate module 4 includes a gantry frame 401, a downward driving cylinder 402, and a pressure plate 403.

[0040] The gantry 401 is mounted on the base plate 3. The gantry 401 is equipped with a downward-pressing drive cylinder 402 with the output axis downward and is located above the carrier plate 501 module.

[0041] A pressure plate 403 is provided on the output shaft of the drive cylinder;

[0042] The carrier plate 501 module includes a carrier plate 501 and a needle plate 502; the carrier plate 501 is disposed above the needle plate 502.

[0043] The needle plate 502 is equipped with a microneedle module 2 for detecting products;

[0044] Four sets of linear bearings 503 and buffer springs 504 are provided between the carrier plate 501 and the needle plate 502.

[0045] The needle plate 502 is provided with a microneedle module 2;

[0046] The carrier plate 501 is provided with a product placement area;

[0047] Preferably, the pressure plate module 4 is further provided with a marker pen 801 module 8;

[0048] The marker pen 801 module 8 includes a marker pen 801, a setting lever 802, and a marker drive cylinder 803;

[0049] The marking drive cylinder 803 is mounted on the pressure plate 403 via a setting rod 802, with its output shaft pointing downwards and connected to a marker pen 801;

[0050] The pressure plate 403 has a through hole;

[0051] The tip of the marker 801 passes through a through hole and faces the product placement area on the carrier plate 501. When marking inspection is required, the marker driving cylinder 803 drives the marker 801 downward, so that the ink at the tip of the marker 801 marks the product. The marking reason can be set according to the requirements, including but not limited to inspecting finished products, NG error products, etc.

[0052] Preferably, the USBC module 6 and the SIM card module 7 are slidably mounted on the setting plate 9.

[0053] Preferably, the USBC module 6 includes a first drive cylinder 601, a USBC detection interface 602, a first slider 603, and a first guide rail 604;

[0054] The setting plate 9 is provided with a first guide rail 604, and a first slider 603 is slidably connected to the first guide rail 604. The first slider 603 is provided with a USBC detection interface 602. The setting plate 9 is also provided with a first driving cylinder 601 that drives the first slider 603 to slide relative to the first guide rail 604.

[0055] Preferably, the SIM card module 7 includes a second drive cylinder 701, a SIM card simulation board 702, a second slider 703, and a second guide rail 704;

[0056] The setting plate 9 is provided with a second guide rail 704, and a second slider 703 is slidably connected to the second guide rail 704. A SIM card simulation board 702 is provided on the second slider 703. The setting plate 9 is also provided with a second driving cylinder 701 that drives the second slider 703 to slide relative to the second guide rail 704.

[0057] Preferably, the pressure plate 403 is equipped with a speaker module and an electromagnet module, and also has a downward-facing probe. The speaker module and electromagnet module can sense the detection status and emit a prompt sound.

[0058] Preferably, the microneedle module 2 includes an upper needle block 201 and a lower needle block 202;

[0059] The upper needle block 201 is positioned above the lower needle block 202 by its shape positioning. The lower needle block 202 is provided with a micro probe 203. A buffer spring 504 is provided between the upper needle block 201 and the lower needle block 202.

[0060] For commonly available miniature connectors with a test point spacing of 0.35mm, using 0.28mm probes and Trinitron probe blocks, the existing solutions are no longer sufficient to meet the current testing requirements, particularly for 0.3mm test point spacing miniature connectors. Specifically: 1) standard probes cannot accommodate the pin insertion of miniature connectors with a 0.3mm test point spacing; 2) standard materials cannot meet the requirements for pin hole drilling with the 0.3mm test point spacing miniature probe 203; and 3) the accuracy and stability of miniature connector testing cannot be guaranteed. This device utilizes the Leeno GN151AA miniature probe 203, which can perform pin insertion testing with a 0.3mm test point spacing. The probe block is made of a ceramic-PEEK composite material, ensuring strong pin hole size stability, burr-free operation, good wear resistance and ductility, stable electrical characteristics, thermal stability, and cost-effectiveness. The micro-needle module 2, composed of the Leeno GN151AA miniature probe and the ceramic-PEEK probe block, ensures the accuracy and stability of the test.

[0061] Before testing, place the product in the corresponding position, scan the QR code on the product, and press the start buttons on both sides (set on the electrical control box 1, which serves as the base, according to requirements) to start the test. When the test starts, the pressure plate module 4 begins to press down. After it is pressed into place, the USB-C module 6 and SIM card module 7 on the right side begin to be inserted into the corresponding interfaces of the product, and the functional test can begin.

[0062] The pressure plate 403 presses down, causing the carrier plate 501 to press down. The pins between the carrier plate 501 and the needle plate 502 ensure alignment accuracy, while four linear bearings 503 ensure perpendicularity. The linear bearings include bearing sleeves set on the needle plate 502 and bearing pins set on the carrier plate 501.

[0063] The micro-needle module 2 is a floating module. When the pressure plate 403 continues to press down, the micro connector at the beginning of the product begins to contact the micro-needle module 2. The positioning and floating of the micro connector on the micro-needle module 2 ensure the alignment accuracy between the micro probe 203 and the test point on the micro connector.

[0064] In this embodiment, the Leeno GN151AA miniature probe 203 is used. The probe tip and tail size is only 0.1mm, the tube size is only 0.21mm, the recommended stroke is 0.65mm, the tip is pointed, the penetration is strong and the probe is resistant to contamination. This probe has good conductivity, good durability, high hardness, low impedance and wear resistance.

[0065] In this embodiment, the microneedle module 2 is mainly divided into an upper needle block 201 and a lower needle block 202. The two needle blocks are positioned by their shape, with a single-sided spacing of 0.01mm to ensure alignment accuracy. The spring in the middle makes them float. First, the micro connector is positioned with the upper needle block 201 to ensure accurate alignment before the probe is released.

[0066] The lower needle block 202 has a needle hole size of 0.13mm corresponding to the needle head and needle tail, and a minimum spacing of 0.17mm between the needle holes. The needle tube has a needle hole size of 0.22mm, and a minimum spacing of 0.08mm between the needle holes. For this purpose, a composite material of ceramic and PEEK is used, which can meet the processing requirements of this needle hole. Moreover, the needle hole has strong dimensional stability, no burrs, and good wear resistance and ductility, which can meet the testing requirements.

[0067] The above is a detailed description of the present invention in conjunction with specific embodiments, and it should not be construed that the specific embodiments of the present invention are limited to these descriptions. For those skilled in the art, any equivalent substitutions or obvious modifications made without departing from the concept of the present invention, and which have the same performance or use, should be considered as falling within the patent protection scope defined by the submitted claims.

Claims

1. A detection device applied to test micro connectors, the device comprising an electric control box and a micro needle module, characterized in that: The module also includes a base plate, a pressure plate module, a detection module, a USB-C module, and a SIM card module; The substrate is mounted on the electrical control box; The substrate is provided with a setting plate and a detection module. The detection module is provided with a USB-C module and a SIM card module on its side. The pressure plate module includes a gantry frame, a downward drive cylinder, and a pressure plate. The gantry frame is mounted on the base plate, and the gantry frame is equipped with a downward-pressing drive cylinder with the output axis, located above the carrier plate module; A pressure plate is provided on the output shaft of the drive cylinder; The carrier plate module includes a carrier plate and a needle plate; the carrier plate is disposed above the needle plate. The needle plate is equipped with a microneedle module for detecting products; Four sets of linear bearings and buffer springs are provided between the carrier plate and the needle plate; The needle plate is equipped with a microneedle module; The carrier plate has a product placement area.

2. The testing device for testing micro connectors according to claim 1, characterized in that: The pressure plate module is also equipped with a marker pen module; The marker module includes a marker, a setting lever, and a marker drive cylinder; The marking drive cylinder is mounted on the pressure plate via a setting rod, with its output shaft pointing downwards and connected to a marking pen; The pressure plate has through holes; The tip of the marker passes through a through hole toward the product placement area on the carrier plate.

3. The testing device for testing micro connectors according to claim 2, characterized in that: The USB-C module and SIM card module are slidably mounted on the settings panel.

4. The testing device for testing micro connectors according to claim 3, characterized in that: The USBC module includes a first drive cylinder, a USBC detection interface, a first slider, and a first guide rail; The setting plate is provided with a first guide rail, and a first slider is slidably connected to the first guide rail. The first slider is provided with a USBC detection interface. The setting plate is also provided with a first drive cylinder to drive the first slider to slide relative to the first guide rail.

5. The testing device for testing micro connectors according to claim 4, characterized in that: The SIM card module includes a second drive cylinder, a SIM card simulation board, a second slider, and a second guide rail. The setting plate is provided with a second guide rail, and a second slider is slidably connected to the second guide rail. A SIM card simulation board is provided on the second slider. The setting plate is also provided with a second drive cylinder to drive the second slider to slide relative to the second guide rail.

6. The testing device for testing micro connectors according to claim 5, characterized in that: The pressure plate is equipped with a horn module and an electromagnet module, and has a downward-facing Huarong probe.

7. A testing device for testing micro connectors according to claim 6, characterized in that: The microneedle module includes an upper needle block and a lower needle block; The upper needle block is positioned above the lower needle block by its shape positioning. The lower needle block is equipped with a micro probe, and a buffer spring is provided between the upper needle block and the lower needle block.