Board assembly and tester

By designing an inclined baffle and air duct structure in the testing machine, the heat dissipation problem caused by the increased power of the device under test was solved, achieving more efficient heat dissipation and dust prevention, and improving the testing accuracy and reliability of the equipment.

CN224286956UActive Publication Date: 2026-05-26CHANGMAI SEMICONDUCTOR (CHENGDU) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CHANGMAI SEMICONDUCTOR (CHENGDU) CO LTD
Filing Date
2025-05-28
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

The increased power of the devices under test in existing testing equipment leads to greater heat dissipation requirements, which traditional heat dissipation solutions cannot meet, resulting in excessively high operating temperatures and affecting testing accuracy and reliability.

Method used

Design a stress test board assembly, including a second baffle and a first baffle that are set at an angle to form an air duct to increase air volume, and prevent air volume from overflowing through the baffle structure. Combined with the structural optimization of the board body and heat sink, the heat dissipation effect and dust prevention capability are enhanced.

Benefits of technology

It improves the heat dissipation effect of the radiator on the heat-generating components and the board, reduces the temperature, extends the service life of the equipment, and has a simple structure, is easy to maintain, and has a low cost.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN224286956U_ABST
    Figure CN224286956U_ABST
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Abstract

This utility model relates to a stress test board assembly and a testing machine. The stress test board assembly includes: a board body; a heating element disposed on the board body; a heat sink disposed on one side of the board body; and a windproof structure including a first windproof plate and a second windproof plate connected to each other. The first windproof plate is disposed on the side of the heat sink away from the board body, and the second windproof plate extends obliquely from one end of the first windproof plate toward the side away from the board body. The end of the second windproof plate away from the first windproof plate forms an air inlet for the fan with the board body. The second windproof plate can guide as much air blown by the fan as possible through the air inlet into the air duct formed by the windproof structure and the board body, increasing the air volume passing through the heat sink. The first windproof plate can reduce the air volume leakage, thereby improving the heat dissipation effect and efficiency of the heat sink on the heating element and the board body. The windproof structure can also prevent dust contamination of the heat sink, heating element, and board body, extending the service life of the stress test board assembly.
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