Chip testing equipment

Abstract

This utility model discloses a chip testing device, relating to the field of electronic chip testing technology. The chip testing device includes a first pressing mechanism and a second pressing mechanism. The second pressing mechanism includes a cover assembly, a pipe connector disposed on the cover assembly, and multiple first test pieces. The cover assembly is detachably disposed on a base to open or close the slot of the positioning groove. The first test pieces are used for electrical connection with the chip. The cover assembly has a flow cavity, and multiple first test pieces are spaced apart within the flow cavity to form multiple gas supply channels. One end of the pipe connector is used to connect to a nitrogen gas source, and the other end is connected to the multiple gas supply channels. The technical solution provided by this utility model achieves the effect of eliminating electric arc generation through the interaction of nitrogen input and the first test pieces as testing structures, thereby improving the overall safety of the testing device.

Description

Technical Field

[0001] This utility model relates to the field of electronic chip testing technology, and in particular to a chip testing device. Background Technology

[0002] With the rapid development of modern electronic products, electronic chips, as an important core component, require increasingly strict quality control during production and processing. In actual testing, through automated production lines, test fixtures place the electronic chip within a limiting frame and apply pressure. The electronic chip is then connected to the testing circuit via the test structure, thereby achieving performance testing of the electronic chip.

[0003] Currently, most electronic chip testing equipment uses the Kelvin test method for chip performance testing. It is also known as four-terminal detection (4T sensing), four-wire detection, or four-point probe method. It is a resistance measurement technology that uses separate electrodes for detecting current and voltage. Compared with the traditional two-terminal (2T) sensing, it can perform more accurate measurements. Kelvin four-wire detection is used in some ohmmeters and impedance analyzers, and in the wiring configuration of precision strain gauges and resistance thermometers. It can also be used to measure the resistance of thin films or chips.

[0004] In the existing technology, during the electrical characteristic testing of a chip, the terminal chip needs to be powered on, and the voltage gradually increases from low to high. During the testing process, the testing device is prone to generating electric arcs, which leads to poor overall safety of the testing device. Utility Model Content

[0005] The main purpose of this invention is to propose a chip testing device that aims to solve the problem of electric arcs easily generated during the testing process of existing testing devices.

[0006] To achieve the above objectives, this utility model proposes a chip testing device, comprising:

[0007] A first pressing mechanism includes a base, a positioning fixture, a temperature regulating component, and an adsorption component. The base has a mounting groove, and the positioning fixture, temperature regulating component, and adsorption component are all disposed within the mounting groove. The positioning fixture has a positioning slot for placing a chip. The temperature regulating component is used to regulate the temperature of the positioning fixture, and the adsorption component is used to adsorb and fix the chip on the positioning fixture.

[0008] The second pressing mechanism includes a cap assembly, a pipe connector disposed on the cap assembly, and a plurality of first test pieces. The cap assembly is detachably disposed on the base to open or close the slot of the positioning groove. The first test pieces are used for electrical connection with the chip. The cap assembly has a flow cavity, and the plurality of first test pieces are spaced apart in the flow cavity to form a plurality of gas supply channels. One end of the pipe connector is used to communicate with a nitrogen gas source, and the other end is used to communicate with the plurality of gas supply channels.

[0009] In one embodiment, the capping assembly includes a first cap and a second cap stacked together. The pipe connector is detachably disposed on the first cap. The second cap is detachably provided with a mounting bracket, a flow element, and a circuit board. A plurality of first test pieces are disposed on the mounting bracket. One end of the flow element is connected to the pipe connector, and the other end is connected to the mounting bracket to form the flow cavity.

[0010] In one embodiment, the first test piece includes a test body, a plurality of abutment portions disposed on the top of the test body, and two contact portions disposed on the bottom of the test body. The two contact portions are symmetrically arranged and are used for electrical connection with the chip.

[0011] In one embodiment, the contact portion includes a connecting segment, a first bending segment, a second bending segment and a contact segment connected in sequence. One end of the connecting segment is provided with a protrusion, which is connected to the test body. The connecting segment is spaced apart from the test body and forms a first deformation buffer groove with the test body.

[0012] And / or, the opening directions of the first bending segment and the second bending segment are different to form a second deformation buffer groove and a third deformation buffer groove.

[0013] In one embodiment, the base includes a first seat and a second seat. The first seat has the mounting groove, and the second seat is detachably disposed in the mounting groove. The second seat has a mounting hole, and a portion of the adsorption element passes through the mounting hole and is connected to the temperature regulating component. Both the temperature regulating component and the positioning fixture have adsorption air channels communicating with the adsorption element.

[0014] In one embodiment, the temperature regulating assembly includes a support frame, a heater, and a temperature sensor. The heater and the temperature sensor are both disposed on the support frame, with the heater and the temperature sensor spaced apart. The adsorption element is detachably disposed on the support frame.

[0015] In one embodiment, the positioning fixture includes a conductive copper block, a positioning frame, and a positioning plate. The positioning frame and the positioning plate are detachably mounted on the conductive copper block. The positioning plate is located inside the positioning frame. A support platform protrudes from the side of the conductive copper block away from the support frame. The positioning plate has a through hole corresponding to the support platform. The height of the support platform is H, and the depth of the through hole is D. H is less than D. The support platform and the through hole together form the positioning groove.

[0016] In one embodiment, the conductive copper block has a plurality of recessed receiving grooves and wiring grooves on the side opposite to the positioning frame. The plurality of receiving grooves are used for mounting the heater and the temperature sensor, and the wiring grooves are used for laying test wires.

[0017] In one embodiment, the support platform is provided with a test hole communicating with the wiring groove. The test hole is used for mounting an elastic conductive probe, which is electrically connected to the circuit board through the test wire.

[0018] The support platform is also provided with multiple adsorption holes, all of which are connected to the adsorption gas channel.

[0019] In one embodiment, the second pressing mechanism further includes a second test piece disposed within the cover assembly and spaced apart from a plurality of first test pieces, the second test piece being used for electrical connection with the chip.

[0020] In the technical solution of this utility model, nitrogen gas used for arc extinguishing is introduced to the chip surface through multiple gas supply channels formed by multiple first test pieces spaced apart. That is to say, the nitrogen gas needs to flow through the surface of each first test piece before flowing to the surface of the chip, thereby further preventing the generation of electric arc on the first test piece. This setting can further prevent the generation of electric arc, thereby improving the overall safety performance of the chip testing device. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0022] Figure 1 A schematic diagram of an embodiment of the chip testing device provided by this utility model;

[0023] Figure 2 A schematic diagram of the disassembled structure of the first pressing mechanism provided by this utility model;

[0024] Figure 3 A schematic diagram of the disassembled structure of the second pressing mechanism provided by this utility model;

[0025] Figure 4 A cross-sectional structural schematic diagram of the second pressing mechanism provided by this utility model;

[0026] Figure 5 for Figure 4 Enlarged structural diagram at point A in the middle;

[0027] Figure 6 for Figure 2 A schematic diagram of the structure of the conductive copper sheet from one perspective;

[0028] Figure 7 for Figure 2 Another perspective structural diagram of the conductive copper sheet;

[0029] Figure 8 for Figure 3 A schematic diagram of the structure of the first test piece.

[0030] Explanation of icon numbers:

[0031] 1. Chip testing device; 10. First pressing mechanism; 11. Base; 111. First seat body; 112. Second seat body; 12. Positioning fixture; 121. Conductive copper block; 1211. Support platform; 1211a. Test hole; 1211b. Adsorption hole; 1212. Receiving groove; 1213. Wiring groove; 122. Positioning frame; 123. Positioning plate; 1231. Through hole; 13. Temperature control assembly; 131. Support frame; 132. Heater; 133. Temperature sensor; 14. Adsorption element; 20. Second pressing mechanism; 21. Pressing... Cover assembly; 211, first cover body; 212, second cover body; 2121, mounting bracket; 2122, flow part; 2123, circuit board; 22, pipe connector; 23, first test piece; 231, test body; 232, contact part; 232a, first deformation buffer groove; 232b, second deformation buffer groove; 232c, third deformation buffer groove; 2321, connecting section; 2321a, protrusion; 2322, first bending section; 2323, second bending section; 2324, contact section; 233, supporting part; 24, second test piece.

[0032] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0034] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0035] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0036] In the existing technology, during the electrical characteristic testing of a chip, the terminal chip needs to be powered on, and the voltage gradually increases from low to high. During the testing process, the testing device is prone to generating electric arcs, which leads to poor overall safety of the testing device.

[0037] This application provides a chip testing device that tests chips using a first test piece. For example, the first test piece contacts each chip's pins to perform the test. It should be noted that, in addition to testing chips, the device can also be used to test electronic connectors or other electronic components; the type of electronic component is not limited here.

[0038] This invention proposes a chip testing device.

[0039] Please see Figures 1 to 3In one embodiment of this utility model, the chip testing device 1 includes a first pressing mechanism 10 and a second pressing mechanism 20. The first pressing mechanism 10 includes a base 11, a positioning fixture 12, a temperature regulating component 13, and an adsorption component 14. The base 11 has a mounting groove, and the positioning fixture 12, temperature regulating component 13, and adsorption component 14 are all disposed within the mounting groove. The positioning fixture 12 has a positioning groove for placing the chip. The temperature regulating component 13 is used to regulate the temperature of the positioning fixture 12, and the adsorption component 14 is used to press the positioning fixture... The chip on 12 is adsorbed and fixed; the second pressing mechanism 20 includes a pressing cap assembly 21 and a pipe connector 22 and a plurality of first test pieces 23 disposed on the pressing cap assembly 21. The pressing cap assembly 21 is detachably disposed on the base 11 to open or close the slot of the positioning groove. The first test pieces 23 are used to electrically connect with the chip. The pressing cap assembly 21 has a flow cavity. The plurality of first test pieces 23 are spaced apart in the flow cavity to form a plurality of gas supply channels. One end of the pipe connector 22 is used to communicate with a nitrogen gas source, and the other end is used to communicate with the plurality of gas supply channels.

[0040] The technical solution of this utility model involves positioning the chip to be tested on the positioning groove of the positioning fixture 12 in the first pressing mechanism 10, and then manually or electrically moving the first pressing mechanism 10 to below the second pressing mechanism 20, so that the pressure cover assembly 21 in the second pressing mechanism 20 closes the opening of the positioning groove, or moving the second pressing mechanism 20 above the first pressing mechanism 10 and closing the opening of the positioning groove. The specific driving methods of the first pressing mechanism 10 and the second pressing mechanism 20 are not limited. To keep the chip stable during testing, in this embodiment, an adsorption member 14 is provided on the base 11 of the first pressing mechanism 10, which can adsorb and position the chip placed on the positioning groove. To make the testing structure of the chip testing device 1 more comprehensive, in this embodiment, a temperature adjustment assembly 13 is also provided. This temperature adjustment assembly 13 can adjust the temperature of the positioning fixture 12 to indirectly achieve the purpose of temperature testing of the chip placed on the positioning fixture 12. To effectively prevent electric arcing during chip testing, the chip testing device 1 incorporates a gas flow chamber in the cap assembly 21 of the second pressing mechanism 20. Multiple first test pieces 23 are spaced apart at one end of the flow chamber near the outlet, forming multiple gas supply channels. A pipe connector 22 connects to an external nitrogen source. Since the first test pieces 23 are test terminals for electrical connection to the chip, nitrogen introduced from the outside enters the chip surface through the multiple gas supply channels formed by the first test pieces 23, ensuring uniform delivery of nitrogen to the chip surface and preventing electric arcing. Furthermore, because nitrogen is introduced to the chip surface through multiple gas supply channels—meaning it flows over the surface of each first test piece 23 before reaching the chip surface—electric arcing on the first test pieces 23 is further prevented. This design enhances the overall safety performance of the chip testing device 1.

[0041] In one embodiment, the capping assembly 21 includes a first cap 211 and a second cap 212 stacked together. The pipe connector 22 is detachably disposed on the first cap 211. The second cap 212 is detachably provided with a mounting bracket 2121, a flow element 2122, and a circuit board 2123. A plurality of first test pieces 23 are disposed on the mounting bracket 2121. One end of the flow element 2122 communicates with the pipe connector 22, and the other end communicates with the mounting bracket 2121 to form the flow cavity. Figure 3 , Figure 4 and Figure 5As shown, in this embodiment, the capping assembly 21 includes a first cap 211 and a second cap 212, wherein the second cap 212 is frame-shaped. The first cap 211 and the second cap 212 are connected in a detachable manner. To facilitate the installation of the flow cavity and the first test piece 23 in the above embodiment, this embodiment also includes a mounting bracket 2121, a flow member 2122, and a circuit board 2123. The circuit board 2123 is used to electrically connect multiple test modules of the chip testing device 1, such as the temperature regulation component 13 and / or multiple first test pieces 23, etc. The mounting bracket 2121... 1 is detachably mounted on the second cover 212, while the flow element 2122 and the circuit board 2123 are detachably mounted on the mounting frame 2121. It is worth mentioning that the flow element 2122 has a flow pipe, one end of the flow element 2122 is connected to the pipe connector 22, and the other end is connected to the mounting frame 2121. A plurality of first test pieces 23 are arranged in the mounting frame 2121 at intervals to form a plurality of air supply channels. In this embodiment, the pipe connector 22, the flow element 2122, the mounting frame 2121 and the plurality of first test pieces 23 together constitute the above-mentioned flow cavity.

[0042] In one embodiment, the first test piece 23 includes a test body 231, a plurality of abutment portions 233 disposed on the top of the test body 231, and two contact portions 232 disposed on the bottom of the test body 231. The two contact portions 232 are symmetrically arranged and are used for electrical connection with the chip. Figure 8 As shown, in this embodiment, the first test piece 23 mainly includes a test body 231, a plurality of abutment portions 233 formed on the top of the test body 231, and two contact portions 232 on the bottom. The abutment portions 233 can be formed by opening at least one oblique through-slot on the top of the test body 231. These abutment portions 233 are mainly used to abut against the first cover 211, and the first cover 211 serves as a support point to provide elastic support for the contact portions 232, thus making the first test piece 23 elastic. This prevents the contact portions 232 from being rigidly electrically connected to the chip, which could damage the contact portions 232 themselves or the contact surface of the chip. In this embodiment, two contact portions 232 are provided, symmetrically arranged, and both are used for electrical connection with the chip to meet the requirements of Kelvin testing for chip performance testing.

[0043] Further, the contact portion 232 includes a connecting segment 2321, a first bending segment 2322, a second bending segment 2323, and a contact segment 2324 connected in sequence. One end of the connecting segment 2321 is provided with a protrusion 2321a, which is connected to the test body 231. The connecting segment 2321 is spaced apart from the test body 231 and forms a first deformation buffer groove 232a with the test body 231; and / or, the opening directions of the first bending segment 2322 and the second bending segment 2323 are different to form a second deformation buffer groove 232b and a third deformation buffer groove 232c. Figure 8 As shown, in this embodiment, the contact portion 232 includes a connecting segment 2321, a first bending segment 2322, a second bending segment 2323, and a contact segment 2324 connected sequentially from the top to the bottom of the first test piece 23. One end of the connecting segment 2321 has a protrusion 2321a, through which the connecting segment 2321 is connected to the test body 231. The connecting segment 2321 extends horizontally and is spaced apart from the test body 231 to form a first deformation buffer groove 232a, thereby improving the elastic performance of the first test piece 23. Because the first bending segment 2322... The first bending segment 2322 and the second bending segment 2323 are formed with bending grooves. These bending grooves can form a second deformation buffer groove 232b and a third deformation buffer groove 232c. When the contact segment 2324 of the contact portion 232 contacts the surface of the chip, the contact segment 2324 can achieve an elastic connection with the chip by relying on the abutment portion 233 as described in the above embodiment. Furthermore, the contact segment 2324 can achieve better elasticity through the first deformation buffer groove 232a, the second deformation buffer groove 232b, and the third deformation buffer groove 232c, so that the contact segment 2324 can avoid hard connection with the chip and damage to the chip. In another embodiment, the opening directions of the first bending groove and the second bending groove formed by the first bending segment 2322 and the second bending segment 2323 are different. This allows the first deformation buffer groove 232a and the second deformation buffer groove 232b to cooperate better, so that the elastic performance of the first test piece 23 is better.

[0044] It is worth mentioning that when nitrogen gas enters through the pipe connector 22 in the above embodiment, most of the nitrogen gas passes through the gap between the two contact portions 232 to the surface of the chip. Since the multiple first test pieces 23 are spaced apart, a small portion of the nitrogen gas passes through the gap between two adjacent first test pieces 23 to the surface of the chip, thus achieving a better arc extinguishing effect. In this embodiment, the connecting section 2321, the first bending section 2322, the second bending section 2323, and the contact section 2324 can be integrally cast, and the test body 231, the supporting portion 233, and the contact portion 232 can also be integrally cast; no further limitations are imposed on this.

[0045] In one embodiment, the base 11 includes a first seat body 111 and a second seat body 112. The first seat body 111 has the mounting groove, and the second seat body 112 is detachably disposed within the mounting groove. The second seat body 112 has a mounting hole, and a portion of the adsorption element 14 passes through the mounting hole and connects to the temperature regulating assembly 13. Both the temperature regulating assembly 13 and the positioning fixture 12 have adsorption air channels communicating with the adsorption element 14. Figure 2 As shown, in this embodiment, the base 11 includes a first base body 111 and a second base body 112, wherein a mounting groove is formed on the first base body 111, and the first base body 111 can be detachably connected to an external device via a screw connector. The second base body 112 is detachably disposed in the mounting groove. In this embodiment, the second base body 112 is provided with a mounting hole, which is used for a portion of the adsorption element 14 to pass through and connect to the temperature regulating component 13 located above the second base body 112. In this embodiment, both the temperature regulating component 13 and the positioning fixture 12 are provided with adsorption air channels communicating with the adsorption element 14, so that after the adsorption element 14 is connected to the external adsorption device, it can adsorb and position the chip in the positioning fixture 12 through the adsorption air channels.

[0046] In one embodiment, the temperature regulating assembly 13 includes a support frame 131, a heater 132, and a temperature sensor 133. Both the heater 132 and the temperature sensor 133 are mounted on the support frame 131, with the heater 132 and the temperature sensor 133 spaced apart. The adsorption member 14 is detachably mounted on the support frame 131. Figure 2 As shown, in this embodiment, the temperature regulation component 13 includes a support frame 131 detachably mounted on the second base 112, and a heater 132 and a temperature sensor 133 detachably mounted on the support frame 131 away from the second base 112. Both the heater 132 and the temperature sensor 133 are electrically connected to the circuit board 2123 in the previous embodiment. In this embodiment, the heater 132 is mainly used to heat the positioning fixture 12 to change the temperature environment of the chip and thus perform temperature testing on the chip. The temperature sensor 133 is mainly used to measure the current temperature of the positioning fixture 12 to determine the current temperature at which the chip is being tested. It can also be used to precisely control the heater 132 to prevent overheating and chip burnout. In this embodiment, to prevent the temperature sensor 133 from mismeasuring the temperature of the positioning fixture 12, the temperature sensor 133 and the heater 132 are spaced apart. In this embodiment, the number of temperature sensors 133 and heaters 132 can be multiple, and there is no particular limitation on this.

[0047] In one embodiment, the positioning fixture 12 includes a conductive copper block 121, a positioning frame 122, and a positioning plate 123. Both the positioning frame 122 and the positioning plate 123 are detachably mounted on the conductive copper block 121. The positioning plate 123 is located within the positioning frame 122. A support platform 1211 protrudes from the side of the conductive copper block 121 opposite to the support frame 131. The positioning plate 123 has a through hole 1231 corresponding to the support platform 1211. The height of the support platform 1211 is H, and the depth of the through hole 1231 is D, where H is less than D. The support platform 1211 and the through hole 1231 together form the positioning groove. Figure 2 , Figure 6 as well as Figure 7 As shown, in this embodiment, the positioning fixture 12 includes a conductive copper block 121, a positioning frame 122, and a positioning plate 123. The conductive copper block 121, positioning frame 122, and positioning plate 123 are arranged in a stacked manner from bottom to top. The positioning frame 122 and positioning plate 123 are detachably mounted on the conductive copper block 121, while the positioning plate 123 is located within the positioning frame 122. The conductive copper block 121 is mainly used to connect to an external power supply to perform electrical testing on the chip. In this embodiment, the side of the conductive copper block 121 facing away from the support frame 131 protrudes... A support platform 1211 is provided, and a through hole 1231 is provided on the positioning plate 123 for the support platform 1211 to pass through. In this embodiment, the height of the support platform 1211 is H, and the depth of the through hole 1231 is D, where H is less than D. The support platform 1211 and the through hole 1231 together form a positioning groove for placing the chip. When the second pressing mechanism 20 and the first pressing mechanism 10 are closed, the positioning groove forms a sealed test cavity. With this arrangement, not only can a support platform 1211 electrically connected to the chip be formed, but it can also cooperate with the insulating positioning plate 123 to form a positioning groove.

[0048] In one embodiment, the conductive copper block 121 has a plurality of recessed receiving grooves 1212 and wiring grooves 1213 on the side opposite to the positioning frame 122. The plurality of receiving grooves 1212 are used for mounting the heater 132 and the temperature sensor 133, and the wiring grooves 1213 are used for laying test wires. Figure 7As shown, in order to better coordinate the heater 132 and temperature sensor 133 with the conductive copper block 121, in this embodiment, a plurality of receiving grooves 1212 are recessed on the side of the conductive copper block 121 away from the positioning frame 122. Among the plurality of receiving grooves 1212, there are receiving grooves 1212 adapted to the heater 132 and receiving grooves 1212 adapted to the temperature sensor 133. In this embodiment, a wiring groove 1213 is also provided on the conductive copper block 121. The wiring groove 1213 is used for the wires that have an electrical connection with the chip to pass through. The wires are electrically connected to the circuit board 2123 through the end away from the chip. This arrangement makes the composition structure of the first pressing mechanism 10 more compact, and the heater 132 can better conduct heat to the conductive copper block 121.

[0049] In one embodiment, the support platform 1211 is provided with a test hole 1211a communicating with the wiring groove 1213. The test hole 1211a is used for mounting an elastic conductive probe, which is electrically connected to the circuit board 2123 through the test wire. The support platform 1211 is also provided with a plurality of adsorption holes 1211b, all of which are connected to the adsorption air channel. Figure 6 and Figure 7 As shown, in this embodiment, the support platform 1211 is provided with a test hole 1211a communicating with the wiring groove 1213. The test hole 1211a is mainly used for mounting an elastic conductive probe, which is mainly used to abut against the surface of the chip to achieve electrical connection. The elastic conductive probe is also electrically connected to the wire described in the above embodiment, and is electrically connected to the circuit board 2123 through the wire. In this embodiment, the support platform 1211 is also provided with a plurality of adsorption holes 1211b, which are all connected to the adsorption air channel described in the above embodiment. That is to say, the adsorption member 14 achieves adsorption and positioning of the chip through the adsorption air channel and the plurality of adsorption holes 1211b.

[0050] In one embodiment, the second pressing mechanism 20 further includes a second test element 24, which is disposed within the cover assembly 21 and spaced apart from a plurality of first test elements 23. The second test element 24 is used for electrical connection with the chip. Figure 3 As shown, in this embodiment, a second test piece 24 is also provided. The second test piece 24 has the same function as the first test piece 23 in the above embodiment, both of which are used to make electrical connections to the chip in order to perform electrical tests on the chip.

[0051] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A chip testing device, characterized in that, include: The first pressing mechanism includes a base, a positioning fixture, a temperature regulating component, and an adsorption component. The base is provided with a mounting groove. The positioning fixture, the temperature regulating component, and the adsorption component are all disposed in the mounting groove. The positioning fixture is provided with a positioning groove for placing the chip. The temperature regulating component is used to regulate the temperature of the positioning fixture. The adsorption component is used to adsorb and fix the chip on the positioning fixture. as well as, The second pressing mechanism includes a cap assembly, a pipe connector disposed on the cap assembly, and a plurality of first test pieces. The cap assembly is detachably disposed on the base to open or close the slot of the positioning groove. The first test pieces are used for electrical connection with the chip. The cap assembly has a flow cavity, and the plurality of first test pieces are spaced apart in the flow cavity to form a plurality of gas supply channels. One end of the pipe connector is used to communicate with a nitrogen gas source, and the other end is used to communicate with the plurality of gas supply channels.

2. The chip testing apparatus as described in claim 1, characterized in that, The capping assembly includes a first cap and a second cap stacked together. The pipe connector is detachably disposed on the first cap. The second cap is detachably provided with a mounting bracket, a flow element, and a circuit board. A plurality of first test pieces are disposed on the mounting bracket. One end of the flow element is connected to the pipe connector, and the other end is connected to the mounting bracket to form the flow cavity.

3. The chip testing apparatus as described in claim 2, characterized in that, The first test piece includes a test body, a plurality of abutment portions disposed on the top of the test body, and two contact portions disposed on the bottom of the test body. The two contact portions are symmetrically arranged and are used for electrical connection with the chip.

4. The chip testing apparatus as described in claim 3, characterized in that, The contact portion includes a connecting segment, a first bending segment, a second bending segment and a contact segment connected in sequence. One end of the connecting segment is provided with a protrusion, which is connected to the test body. The connecting segment and the test body are spaced apart and together form a first deformation buffer groove with the test body. And / or, the opening directions of the first bending segment and the second bending segment are different to form a second deformation buffer groove and a third deformation buffer groove.

5. The chip testing apparatus as described in claim 1, characterized in that, The base includes a first base and a second base. The first base has the mounting groove, and the second base is detachably disposed in the mounting groove. The second base has a mounting hole, and part of the adsorption element passes through the mounting hole and is connected to the temperature regulating component. Both the temperature regulating component and the positioning fixture have adsorption air channels communicating with the adsorption element.

6. The chip testing apparatus as described in claim 5, characterized in that, The temperature regulating component includes a support frame, a heater, and a temperature sensor. The heater and the temperature sensor are both mounted on the support frame and are spaced apart from each other. The adsorption element is detachably mounted on the support frame.

7. The chip testing apparatus as described in claim 6, characterized in that, The positioning fixture includes a conductive copper block, a positioning frame, and a positioning plate. The positioning frame and the positioning plate are detachably mounted on the conductive copper block. The positioning plate is located inside the positioning frame. A support platform protrudes from the side of the conductive copper block away from the support frame. The positioning plate has a through hole corresponding to the support platform. The height of the support platform is H, and the depth of the through hole is D. H is less than D. The support platform and the through hole together form the positioning groove.

8. The chip testing apparatus as described in claim 7, characterized in that, The conductive copper block has a plurality of recessed slots and wiring slots on the side opposite to the positioning frame. The plurality of recessed slots are used for mounting the heater and the temperature sensor, and the wiring slots are used for laying test wires.

9. The chip testing apparatus as described in claim 8, characterized in that, The support platform is provided with a test hole that communicates with the wiring groove. The test hole is used for mounting an elastic conductive probe, which is electrically connected to the circuit board through the test wire. The support platform is also provided with multiple adsorption holes, all of which are connected to the adsorption gas channel.

10. The chip testing apparatus as described in claim 1, characterized in that, The second pressing mechanism further includes a second test piece, which is disposed within the cover assembly and spaced apart from a plurality of first test pieces. The second test piece is used to electrically connect to the chip.

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