Magnetic resonance equipment and radio frequency coil assembly and radio frequency coil thereof

Abstract

The utility model provides magnetic resonance equipment and a radio frequency coil assembly and a radio frequency coil thereof. The radio frequency coil assembly comprises a coil main body part and a preset jumper part, the preset jumper wire part is used for placing a plurality of preset jumper wires; the coil main body part comprises a PCB, the PCB is provided with a first coil unit and a second coil unit which are overlapped, and the first coil unit and the second coil unit form a first overlapping part at the overlapping part; at least one of the first coil unit and the second coil unit is provided with a first jumper welding part; the first jumper wire welding part is provided with a first adjusting part extending in the first direction, and the first jumper wire can adjust the position where the first jumper wire and the first jumper wire welding part are welded on the first adjusting part in the first direction so as to adjust the overlapping area of the first overlapping part. According to the radio frequency coil assembly, engineering and standardization in the coil decoupling process can be achieved, the manufacturing difficulty is lowered, and the reliability and consistency of the coil are improved.

Description

Technical Field

[0001] This application relates to the field of magnetic resonance technology, and in particular to a magnetic resonance device and its radio frequency coil assembly and radio frequency coil. Background Technology

[0002] Magnetic resonance imaging (MRI) is a non-invasive imaging technique widely used in clinical diagnosis. Radiofrequency coils, as a key component of MRI equipment, are responsible for transmitting radiofrequency pulses and receiving magnetic resonance signals. In multi-channel MRI coil systems, electromagnetic coupling between adjacent coil units can lead to signal quality degradation; therefore, coil decoupling techniques are crucial for improving image quality.

[0003] Currently, the commonly used decoupling methods for radio frequency coils in magnetic resonance imaging (MRI) devices mainly include geometric decoupling, capacitive decoupling, and inductive decoupling. Among them, geometric decoupling is a commonly used technique that eliminates or reduces the mutual inductance between coils by adjusting the overlap area of ​​adjacent coil units, thereby achieving the purpose of decoupling.

[0004] However, existing RF coil decoupling and debugging methods have several problems. Traditional decoupling debugging typically uses semi-steel cables or enameled copper wires as jumpers, requiring manual adjustment of the jumper shape and soldering position to change the overlap area of ​​adjacent coils. This method lacks clear adjustment indicators, forcing production personnel to repeatedly try based on changes in the network analyzer curves, resulting in an unfriendly and inefficient operation. Furthermore, because the debugging process is highly dependent on the operator's experience and skills, it is difficult to guarantee the performance consistency of coils produced in different batches, and there is a lack of engineered and standardized solutions. Utility Model Content

[0005] Based on this, some embodiments of this application provide a magnetic resonance device and its radio frequency coil assembly, radio frequency coil, and manufacturing method, which can realize the engineering and standardization of the coil decoupling process, reduce the difficulty of the adjustment process, and increase the reliability and consistency of the coil.

[0006] In some embodiments, a radio frequency coil assembly for a magnetic resonance imaging device is provided, the radio frequency coil assembly comprising: a coil body portion and a preset jumper portion;

[0007] The preset jumper section is used to place multiple preset jumpers, and the multiple preset jumpers include a first jumper;

[0008] The main body of the coil includes a PCB board, on which there are overlapping first coil units and second coil units, and the first coil units and second coil units form a first overlapping portion at the overlapping point;

[0009] At least one of the first coil unit and the second coil unit has a first jumper solder portion, which is located in the first overlapping portion;

[0010] The first jumper welding portion has a first adjustment portion extending along a first direction, and the first jumper can be adjusted in the first adjustment portion along the first direction to adjust the position of welding with the first jumper welding portion, so as to adjust the overlapping area of ​​the first overlapping portion.

[0011] In some embodiments, the PCB board has a third coil unit, which overlaps with both the first coil unit and the second coil unit, forming a second overlapping portion at the overlap.

[0012] The third coil unit has a detune plate welding portion, which is located in the second overlapping portion;

[0013] The detune plate welding part has a second adjustment part extending in a second direction, which is used to adjust the position of the detune plate and the detune plate welding part for welding in the second direction, so as to adjust the overlap area of ​​the second overlapping part.

[0014] In some embodiments, the plurality of preset jumpers includes a second jumper;

[0015] The PCB board has a fourth coil unit, which overlaps with the third coil unit to form a third overlapping portion at the overlap point;

[0016] At least one of the third and fourth coil units has a second jumper solder portion located in the third overlapping portion;

[0017] The second jumper welding portion has a second adjustment portion extending along a first direction. The second jumper can be adjusted in the first direction to adjust the position of welding with the second jumper welding portion, thereby adjusting the overlap area of ​​the third overlapping portion.

[0018] In some embodiments, the second jumper is the same length as the first jumper, or the second jumper is different in length from the first jumper.

[0019] In some embodiments, the first jumper soldering portion includes two first pads disposed opposite to each other, and the distance between the two first pads matches the length of the first jumper;

[0020] The second jumper soldering portion includes two second solder pads arranged opposite each other, the distance between the two second solder pads being matched with the length of the second jumper;

[0021] The detune board soldering section includes two detune board pads arranged opposite each other, and the distance between the two detune board pads matches the length of the detune board.

[0022] In some embodiments, the first direction is perpendicular to the second direction.

[0023] In some embodiments, the preset jumper portion is connected to the coil body portion.

[0024] In some embodiments, a radio frequency coil assembly for a magnetic resonance device is also provided, the radio frequency coil assembly comprising: a coil body portion;

[0025] The main body of the coil includes a PCB board, on which overlapping coil units are arranged, and at least one of the overlapping coil units has a jumper soldering part.

[0026] The jumper welding part has a first adjustment part extending in a first direction. The preset jumper can be adjusted in the first adjustment part to be welded to the first jumper welding part in the first direction, so as to adjust the overlap area between the overlapping coil units.

[0027] And / or,

[0028] At least one of the overlapping coil units has a detune plate welded portion;

[0029] The detune plate welding section has a second adjustment section extending in a second direction, used to adjust the position of the detune plate and the detune plate welding section for welding in the second direction.

[0030] In some embodiments, a radio frequency coil for a magnetic resonance imaging (MRI) device is also provided, the radio frequency coil including a PCB board.

[0031] The PCB board has at least two adjacent overlapping coil units;

[0032] The radio frequency coil further includes a jumper wire, and at least one of the overlapping coil units has a jumper wire soldering portion. The jumper wire soldering portion has a first adjustment portion extending along a first direction. The first adjustment portion includes two first pads arranged opposite each other along a second direction. The distance between the two first pads matches the length of the jumper wire. The jumper wire is soldered to the two first pads at a target position of the first adjustment portion. The target position allows the overlap area of ​​the two adjacent overlapping coil units to achieve decoupling.

[0033] And / or,

[0034] The RF coil also includes a detune board, and at least one of the overlapping coil units has a detune board solder portion; the detune board solder portion has a second adjustment portion extending along a second direction, the second adjustment portion including two second pads disposed opposite each other along a first direction, the distance between the two second pads matching the length of the detune board.

[0035] In some embodiments, a magnetic resonance device is also provided, the magnetic resonance device including the radio frequency coil assembly as described in the above embodiments.

[0036] In the embodiments of this application, by pre-setting several jumpers on the PCB flexible board and designing the jumper soldering part to have an adjustment part extending in a specific direction, the jumper can be moved left and right on the solder pad for adjustment, thus realizing the engineering and standardization of the coil decoupling process; at the same time, by designing the detune board soldering part to extend up and down, it is convenient to adjust the overlapping area of ​​the upper and lower coils, increasing the convenience of coupling debugging of the upper and lower coils.

[0037] Compared with existing technologies, this application eliminates the need for jumpers made from semi-steel cables or enameled copper wires, reducing the difficulty of the adjustment process, increasing the reliability and consistency of the coils, and facilitating the handover process from R&D to mass production. Through preset jumpers and adjustable soldering positions, operators can precisely adjust the coil overlap area according to specific needs, thereby achieving an ideal decoupling effect and improving the performance stability of the RF coil in magnetic resonance imaging equipment. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the radio frequency coil assembly of a magnetic resonance device in some embodiments of this application.

[0039] Figure 2 This is a schematic diagram of the radio frequency coil assembly of a magnetic resonance device in some embodiments of this application.

[0040] Figure 3 This is a schematic diagram of the radio frequency coil assembly of a magnetic resonance device in some embodiments of this application.

[0041] Figure 4 This is a schematic diagram of the radio frequency coil assembly of a magnetic resonance device in some embodiments of this application.

[0042] Figure 5 This is a schematic diagram of the radio frequency coil in some embodiments of this application. Detailed Implementation

[0043] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0044] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0045] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0046] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0047] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0048] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0049] Figure 1 A schematic diagram of the radio frequency coil assembly of a magnetic resonance device in some embodiments of this application is shown. See also... Figure 1 In some embodiments, a radio frequency coil assembly for a magnetic resonance device is provided, the radio frequency coil assembly including a coil body portion 1000.

[0050] The coil body 1000 includes a PCB board 200, on which overlapping coil units 300 are arranged. At least one of the overlapping coil units has a jumper soldering portion 400. The jumper soldering portion 400 has a jumper adjustment portion 500 extending in a first direction. A preset jumper can be adjusted in the first direction to be soldered to the jumper soldering portion, thereby adjusting the overlap area between the overlapping coil units.

[0051] In the embodiments of this application, when manufacturing the RF coil, a pre-set jumper can be directly placed in the jumper soldering part, and then soldered at a suitable position along the first direction in the jumper adjustment part. By changing the soldering position, the overlap area between coil units can be adjusted, thereby achieving the best decoupling effect.

[0052] In some embodiments, the overlapping coil units 300 are partially overlapping, and there are multiple coil units 300 arranged along a first direction. In some embodiments, the first direction may be... Figure 1 Along the direction of arrow X. Figure 1In the illustrated embodiment, the plurality of coil units 300 have eight. This includes those along the second direction ( Figure 1 The two rows of coil units are distributed in the Y direction shown in the diagram. Each row of coil units includes four coil units arranged along the first direction. In some embodiments, the second direction is perpendicular to the first direction. It is understood that in some embodiments, the PCB board 200 is a flexible board that can be bent, and the first and second directions are schematic diagrams of the orientation of the PCB board 200 in a flat state.

[0053] Figure 2 A schematic diagram of the radio frequency coil assembly of a magnetic resonance device in some embodiments of this application is shown. See also... Figure 2 In some embodiments, at least one of the overlapping coil units has a detune plate welding portion 600. The detune plate welding portion 600 has a detune plate adjustment portion 700 extending in a second direction for adjusting the position of the detune plate and the detune plate welding portion for welding in the second direction.

[0054] In the embodiments of this application, the position of the detune board can be adjusted by changing the welding position. Welding is performed at a suitable position along the second direction on the detune board adjustment section to achieve the best decoupling effect. It is understood that the detune board, also known as the RF coil detuning adjustment board, is an important circuit device for the RF coil in magnetic resonance imaging (MRI) equipment. It detunes the RF coil when it is not in operation, avoiding unnecessary coupling and interference with other coils or system components. The detune board has a detuning circuit that creates high impedance at the resonant frequency, thereby preventing coupling with other coils. Simultaneously, during the transmission phase, the RF coil emits high-power RF pulses. At this time, the receiving coil needs to be in a detuned state to prevent high-power signals from entering the receiving link, thus protecting sensitive components such as the preamplifier and low-noise amplifier. The detuning circuit can quickly switch the resonant state of the RF coil.

[0055] In some embodiments, the PCB board 200 may simultaneously have a detune board soldering portion 600 and a jumper soldering portion 400. Of course, in some embodiments, the detune board soldering portion 600 and the jumper soldering portion 400 may exist in the same coil unit. It is understood that not every coil unit necessarily has a detune board soldering portion 600 and / or a jumper soldering portion 400.

[0056] Figure 3 A schematic diagram of the radio frequency coil assembly of a magnetic resonance device in some embodiments of this application is shown. See also... Figure 3In some embodiments, a radio frequency coil assembly for a magnetic resonance device is provided, the radio frequency coil assembly including a coil body portion 1000 and a preset jumper portion 2000.

[0057] The preset jumper section 2000 is used to place a plurality of preset jumpers. In some embodiments, the preset jumpers include a first jumper 2001.

[0058] The coil body 1000 includes a PCB board 200, on which there are overlapping first coil units 301 and second coil units 302, and the first coil units and the second coil units form a first overlapping portion 3012 at the overlapping point.

[0059] At least one of the first coil unit and the second coil unit has a first jumper welding portion 401 located in the first overlapping portion. The first jumper welding portion has a first jumper adjustment portion 501 extending in a first direction, and the first jumper can be adjusted in the first jumper adjustment portion along the first direction to adjust the position of welding with the first jumper welding portion, thereby adjusting the overlapping area of ​​the first overlapping portion.

[0060] In embodiments of this application, the overlapping coil units include a first coil unit and a second coil unit, and at least one coil unit ( Figure 3 The first coil unit shown has a first jumper welding portion. The first jumper is adjusted in a first direction by the first jumper adjustment portion to weld to the first jumper welding portion, thereby adjusting the overlap area of ​​the first overlapping portion.

[0061] In some embodiments, the PCB board further includes a third coil unit 303, which overlaps with both the first and second coil units, forming a second overlapping portion 3123 at the overlap. The third coil unit has a detune board soldering portion 600 located in the second overlapping portion. The detune board soldering portion has a detune board adjustment portion 700 extending in a second direction for adjusting the position of the detune board and the detune board soldering portion in the second direction to adjust the overlapping area of ​​the second overlapping portion.

[0062] In some embodiments, the plurality of preset jumpers also include a second jumper 2002.

[0063] The PCB board also has a fourth coil unit 304, which overlaps with the third coil unit to form a third overlapping portion 3034. At least one of the third and fourth coil units has a second jumper soldering portion 402 located in the third overlapping portion. The second jumper soldering portion has a second jumper adjustment portion 502 extending in a first direction, allowing the second jumper to be adjusted in the first direction to solder to the second jumper soldering portion, thereby adjusting the overlapping area of ​​the third overlapping portion.

[0064] In embodiments of this application, at least one coil unit in the first coil unit and the second coil unit ( Figure 3 The first coil unit shown has a first jumper solder joint in the first overlapping portion. At least one coil unit in the third and fourth coil units ( Figure 3 The third coil unit shown has a second jumper solder joint in the third overlapping portion. The overlapping areas of the first overlapping portion and the third overlapping portion are adjusted by the first jumper solder joint and the second jumper solder joint, respectively.

[0065] It is understood that the first coil unit, second coil unit, third coil unit, and fourth coil unit mentioned above are merely examples. The number of coil units on the PCB is not limited to two or more of the first coil unit, second coil unit, third coil unit, and fourth coil unit. The coil units on the PCB may also include a fifth coil unit, a sixth coil unit, a seventh coil unit, an eighth coil unit, etc.

[0066] Figure 4 A schematic diagram of the radio frequency coil assembly of a magnetic resonance device in some embodiments of this application is shown. See also... Figure 4 In some embodiments, the coil units on the PCB board include a first coil unit 301, a second coil unit 302, a third coil unit 303, a fourth coil unit 304, a fifth coil unit 305, a sixth coil unit 306, a seventh coil unit 307, and an eighth coil unit 308.

[0067] First coil unit 301, second coil unit 302, fifth coil unit 305, and sixth coil unit 306 are arranged sequentially along a first direction, with adjacent coil units overlapping. First coil unit 301 overlaps with second coil unit 302, second coil unit 302 overlaps with fifth coil unit 305, and fifth coil unit 305 overlaps with sixth coil unit 306. Each overlapping portion has a jumper soldering part. Figure 4In the illustrated embodiment, the first coil unit 301, the fifth coil unit 305, and the sixth coil unit 306 each have a first jumper soldering portion in the first overlapping portion. Each first jumper soldering portion has a first jumper adjustment portion. The second coil unit 302 does not have a jumper soldering portion.

[0068] The third coil unit 303, the fourth coil unit 304, the seventh coil unit 307, and the eighth coil unit 308 are arranged sequentially along a first direction, with adjacent coil units overlapping. The third coil unit 303 overlaps with the fourth coil unit 304, the fourth coil unit 304 overlaps with the seventh coil unit 307, and the seventh coil unit 307 overlaps with the eighth coil unit 308. Each overlapping portion has a jumper wire soldering section. Figure 4 In the illustrated embodiment, the third coil unit 303, the fourth coil unit 304, and the seventh coil unit 307 each have a second jumper soldering portion in the second overlapping portion. Each second jumper soldering portion has a second jumper adjustment portion. The eighth coil unit 308 does not have a jumper soldering portion.

[0069] The first coil unit 301, the second coil unit 302, the fifth coil unit 305, and the sixth coil unit 306 form the first row of coil units, and the third coil unit 303, the fourth coil unit 304, the seventh coil unit 307, and the eighth coil unit 308 form the second row of coil units. The first row of coil units and the second row of coil units are arranged along the second direction and overlap.

[0070] In some embodiments, the overlapping portions of the third coil unit 303, the fourth coil unit 304, the seventh coil unit 307, the eighth coil unit 308, and the first row of coil units each have a detune plate welding portion. Each detune plate welding portion has a detune plate adjustment portion extending along the second direction.

[0071] In some embodiments, the second jumper wire may have the same or different lengths than the first jumper wire. In the illustrated embodiment, the second jumper wire has different lengths than the first jumper wire. In some embodiments, the first jumper wire is 9 mm long and the second jumper wire is 11 mm long.

[0072] In some embodiments, the number of preset jumpers is greater than or equal to the number of jumper solder joints.

[0073] In some embodiments, the number of preset first jumpers is not less than the number of first jumper solder joints. In some embodiments, the number of preset first jumpers is greater than the number of first jumper solder joints. The number of preset second jumpers is not less than the number of second jumper solder joints. In some embodiments, the number of preset second jumpers is greater than the number of second jumper solder joints.

[0074] In some embodiments, the first jumper soldering portion includes two opposing first pads 5011, the distance between the two first pads matching the length of the first jumper. The second jumper soldering portion includes two opposing second pads 5021, the distance between the two second pads matching the length of the second jumper. The detune board soldering portion includes two opposing detune board pads 701, the distance between the two detune board pads matching the length of the detune board.

[0075] It is understandable that the distance between the two first pads is the distance along the second direction. Matching the distance between the two first pads with the length of the first jumper means that the distance between the two first pads is the same as the length of the first jumper, so that the first jumper can be directly soldered between the first pads. The distance between the two second pads is also the distance along the second direction. Matching the distance between the two second pads with the length of the second jumper means that the distance between the two second pads is the same as the length of the second jumper, so that the second jumper can be directly soldered between the second pads.

[0076] The distance between the two detune board pads is the distance along the first direction. Matching the distance between the two detune board pads to the length of the detune board can be achieved by making the distance between the two detune board pads the same as the length of the detune board, so that the detune board can be directly soldered between the detune board pads.

[0077] In some embodiments, the first direction (X direction in the figure) is perpendicular to the second direction (Y direction in the figure). It is understood that in some embodiments, the PCB board 200 is a flexible board that can be bent, and the first and second directions are schematic representations of the orientation of the PCB board 200 in a flat state.

[0078] In some embodiments, the preset jumper portion is connected to the coil body portion, facilitating the removal and soldering of the preset jumper. In some embodiments, the preset jumper portion has multiple preset jumpers. In some embodiments, the preset jumper portion has multiple first jumpers, which are spaced apart along a first direction. In some embodiments, the preset jumper portion also has multiple second jumpers, which are spaced apart along the first direction. The first jumpers and second jumpers are arranged side by side along a second direction.

[0079] In some embodiments, this application also provides a method for manufacturing a radio frequency coil for a magnetic resonance device. This method employs the radio frequency coil assembly described in any of the preceding embodiments and includes the following steps:

[0080] Remove the preset jumper from the preset jumper section, and adjust the position of the preset jumper in the jumper adjustment section along the first direction to weld it to the jumper welding section, so as to adjust the overlap area of ​​two adjacent overlapping coil units; weld the preset jumper to the jumper welding section at the target position of the jumper adjustment section, the target position is such that the overlap area of ​​two adjacent overlapping coil units can achieve the purpose of decoupling.

[0081] In this embodiment, the specific steps of the manufacturing method are as follows:

[0082] First, prepare a PCB board and fabricate multiple coil units on it, ensuring that adjacent coil units overlap. The coil units can be made of copper wire or copper foil. Jumper soldering portions are provided in the overlapping areas of the coil units, and these jumper soldering portions include jumper adjustment mechanisms.

[0083] Specifically, a jumper soldering section is fabricated in the overlapping portion, and the jumper soldering section has a first adjustment section extending along a first direction. The first adjustment section includes two first pads arranged opposite each other along a second direction, and the distance between the two first pads matches the length of the preset jumper. The length of the first adjustment section can be designed according to the overall size of the coil unit, and should not be too long, just long enough to allow adjustment within a certain range, so that the preset jumper can be adjusted in soldering position within this range.

[0084] In some embodiments, a detune board soldering portion can be fabricated at the desired overlapping portion, the detune board soldering portion having a second adjustment portion extending along a second direction. The second adjustment portion includes two second pads disposed opposite each other along a first direction, the distance between the two second pads matching the length of the detune board. The length of the second adjustment portion can be designed according to the overall dimensions of the coil unit, and should not be too long, only requiring adjustment within a certain range, so that the detune board can adjust its soldering position within this range.

[0085] In some embodiments, a pre-installed jumper section is also included for placing multiple pre-installed jumpers. The pre-installed jumpers can be made of copper wire or copper foil, and their length can be set according to the distance reserved between the two pads of the jumper soldering section. Different specifications and lengths can be set according to different jumper soldering sections.

[0086] In some embodiments, the above steps of setting the first coil unit, the second coil unit, the third coil unit, and the fourth coil unit on the PCB board, and the pre-set jumpers, etc., can be directly and automatically manufactured to form a pre-set PCB board.

[0087] During the manufacturing of the RF coil, a preset jumper of matching length to the jumper soldering part is removed from the preset jumper section. A suitable position (i.e., the target position) is selected in the jumper adjustment section along the first direction, and the preset jumper is soldered to the jumper soldering part. The selection of the soldering position should ensure that the overlap area of ​​the coil unit achieves decoupling.

[0088] Select a suitable position along the second direction on the detune board adjustment section and solder the detune board to the detune board soldering section. The soldering position should be selected so that the coil unit can achieve the best decoupling effect.

[0089] The above manufacturing method allows for convenient adjustment of the overlap area of ​​the coil units during the manufacturing process. The RF coil assembly in this embodiment can adjust the overlap area between different coil units during the manufacturing process according to actual needs, thereby achieving optimal decoupling and improving the imaging quality of the magnetic resonance imaging equipment.

[0090] In some embodiments, coil units such as a first coil unit, a second coil unit, a third coil unit, and a fourth coil unit can be pre-installed on the PCB board to ensure that they have overlapping portions at the designed locations. Furthermore, a first jumper soldering portion, a detune board soldering portion, and a second jumper soldering portion are reserved in the necessary overlapping portions. These soldering portions each have adjustment portions extending in a specific direction.

[0091] In actual processing, according to design requirements, the first jumper, the detune board, and the second jumper are soldered to appropriate positions in the corresponding adjustment parts to complete the manufacturing of the RF coil.

[0092] If the requirements are not met during testing, the overlap area needs to be adjusted. This can be achieved by resoldering jumpers and detune boards, changing their positions, thereby altering the overlap area of ​​the coil units and decoupling the coils.

[0093] In this embodiment, the PCB board can be made of FR4 material with a thickness of 1.6mm, which has good mechanical strength and electrical insulation properties. The coil unit can be made of copper foil with a thickness of 35μm, which has good conductivity.

[0094] The jumper wire soldering section and the detune board soldering section can be gold-plated to improve soldering reliability. The length of the jumper wire adjustment section and the detune board adjustment section can be designed according to the size of each coil unit. In some embodiments, the length of each coil unit along the first direction and / or the width along the second direction are both 10-20 mm. The length of the jumper wire adjustment section and / or the detune board adjustment section is 2-5 mm, which is set to provide sufficient adjustment range without interference.

[0095] In practical applications, the initial design parameters of the coil unit, including its shape, size, and overlap area, can be determined first using electromagnetic simulation software. Then, the PCB board and coil unit are fabricated, with jumper soldering sections and detune board soldering sections created at the overlap. Finally, by adjusting the soldering positions of the jumpers and detune board, the overlap area of ​​the coil unit is fine-tuned to achieve optimal performance for the RF coil assembly.

[0096] Figure 5 Schematic diagrams of radio frequency coils in some embodiments of this application are shown. See also... Figure 5 In some embodiments of this application, a radio frequency coil for a magnetic resonance device is also provided, the radio frequency coil including a PCB board.

[0097] The PCB board has at least two adjacent overlapping coil units. The RF coil also includes a jumper. At least one of the overlapping coil units has a jumper soldering portion. The jumper soldering portion has a jumper adjustment portion extending along a first direction. The jumper adjustment portion includes two first pads disposed opposite each other along a second direction, the distance between the two first pads matching the length of the jumper. The jumper is soldered to the two first pads at a target position in the jumper adjustment portion, the target position enabling decoupling of the overlap area of ​​the two adjacent overlapping coil units.

[0098] The RF coil also includes a detune board, and at least one of the overlapping coil units has a detune board solder portion. The detune board solder portion has a detune board adjustment portion extending in a second direction, and the detune board adjustment portion includes two second pads disposed opposite each other in a first direction, the distance between the two second pads matching the length of the detune board.

[0099] In some embodiments, the PCB board has eight coil units CH1, CH2, CH3, CH4, CH5, CH6, CH7, and CH8, which correspond to the first coil unit 301, the second coil unit 302, the fifth coil unit 305, the sixth coil unit 306, the third coil unit 303, the fourth coil unit 304, the seventh coil unit 307, and the eighth coil unit 308, respectively.

[0100] First coil unit 301, second coil unit 302, fifth coil unit 305, and sixth coil unit 306 are arranged sequentially along a first direction, with adjacent coil units overlapping. First coil unit 301 overlaps with second coil unit 302, second coil unit 302 overlaps with fifth coil unit 305, and fifth coil unit 305 overlaps with sixth coil unit 306. Each overlapping portion has a jumper soldering part. Figure 5In the illustrated embodiment, the first coil unit 301, the fifth coil unit 305, and the sixth coil unit 306 each have a first jumper soldering portion in the first overlapping portion. Each first jumper soldering portion has a first jumper adjustment portion. The second coil unit 302 does not have a jumper soldering portion.

[0101] The third coil unit 303, the fourth coil unit 304, the seventh coil unit 307, and the eighth coil unit 308 are arranged sequentially along a first direction, with adjacent coil units overlapping. The third coil unit 303 overlaps with the fourth coil unit 304, the fourth coil unit 304 overlaps with the seventh coil unit 307, and the seventh coil unit 307 overlaps with the eighth coil unit 308. Each overlapping portion has a jumper wire soldering section. Figure 5 In the illustrated embodiment, the third coil unit 303, the fourth coil unit 304, and the seventh coil unit 307 each have a second jumper soldering portion in the second overlapping portion. Each second jumper soldering portion has a second jumper adjustment portion. The eighth coil unit 308 does not have a jumper soldering portion.

[0102] The first coil unit 301, the second coil unit 302, the fifth coil unit 305, and the sixth coil unit 306 form the first row of coil units, and the third coil unit 303, the fourth coil unit 304, the seventh coil unit 307, and the eighth coil unit 308 form the second row of coil units. The first row of coil units and the second row of coil units are arranged along the second direction and overlap.

[0103] In some embodiments, the overlapping portions of the third coil unit 303, the fourth coil unit 304, the seventh coil unit 307, the eighth coil unit 308, and the first row of coil units each have a detune plate welding portion. Each detune plate welding portion has a detune plate adjustment portion extending along the second direction.

[0104] The RF coil also includes a jumper wire, which is soldered to the jumper wire soldering point. For details, please refer to... Figure 5 The jumper has a first jumper A and a second jumper B. The first jumper A is soldered to the first jumper solder joint. The second jumper B is soldered to the second jumper solder joint.

[0105] The RF coil also includes a detune board 800, which is soldered to the detune board soldering section.

[0106] In some embodiments, the PCB board can be made of high-frequency substrate material, such as Rogers RO4350B, which has low dielectric loss and good high-frequency characteristics. The coil unit can be made using a thick copper process, with copper foil thickness up to 70μm, to reduce the coil's resistive loss.

[0107] Jumpers can be made of silver-plated copper wire with a diameter of 0.5-1.0mm, offering good conductivity and mechanical strength. The detune board can consist of ceramic capacitors and PIN diodes, used to detune the coil at specific times, preventing interference with the operation of other coils.

[0108] The design of the jumper adjustment section and the detune board adjustment section allows the jumper and detune board to be adjusted within a certain range during soldering, thereby precisely controlling the overlap area of ​​the coil units. This design is particularly suitable for multi-channel RF coil systems, effectively reducing coupling between channels and improving signal reception quality.

[0109] In practical applications, the S-parameters of the coil can be measured using a network analyzer. Based on the measurement results, the soldering positions of the jumpers and the detune board can be adjusted to achieve the best decoupling effect. This adjustment method is simple and effective, requiring no redesign or fabrication of the PCB board, nor the design of complex jumper and detune board shapes. It can achieve the goal of decoupling by adjusting the overlap area, greatly shortening the development cycle of the RF coil.

[0110] In some embodiments, each coil unit has a capacitor element. The first coil unit 301, the second coil unit 302, the fifth coil unit 305, the sixth coil unit 306, the third coil unit 303, the fourth coil unit 304, the seventh coil unit 307, and the eighth coil unit 308, i.e., eight coil units CH1, CH2, CH3, CH4, CH5, CH6, CH7, and CH8, respectively have capacitors C1, C2, C3, C4, C5, C6, C7, and C8.

[0111] In some embodiments, each coil unit has a detune plate. In some embodiments, some coil units do not have a detune plate adjustment section. A detune plate is directly soldered to a fixed position on the coil unit without a detune plate adjustment section.

[0112] It is understood that in some embodiments of this application, the radio frequency coil of the magnetic resonance device can be manufactured using the radio frequency coil assembly in any of the above embodiments or manufactured using the radio frequency coil manufacturing method in any of the above embodiments, thereby forming the corresponding radio frequency coil.

[0113] In some embodiments of this application, a magnetic resonance imaging (MRI) device is also provided, which includes a radio frequency (RF) coil as described in the above embodiments. In some embodiments, the RF coil is a receiving coil. In some embodiments, the MRI device further includes a main magnet, a gradient coil system, an RF transmitting system, and a control system. The main magnet is used to generate a stable main magnetic field, the gradient coil system is used to generate a gradient magnetic field, the RF transmitting system is used to transmit RF pulses, and the control system is used to control the operation of the entire MRI device.

[0114] The radio frequency (RF) coil is mounted on the examination table of the magnetic resonance imaging (MRI) device to receive MRI signals. The RF coil's PCB board has multiple overlapping coil units, which are decoupled through jumpers and a detune board to achieve optimal imaging results.

[0115] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0116] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A radio frequency coil assembly of a magnetic resonance apparatus, characterized by, The radio frequency coil assembly includes: a coil body and a preset jumper section; The preset jumper section is used to place multiple preset jumpers, and the multiple preset jumpers include a first jumper; The main body of the coil includes a PCB board, on which there are overlapping first coil units and second coil units, and the first coil units and second coil units form a first overlapping portion at the overlapping point; At least one of the first coil unit and the second coil unit has a first jumper solder portion, which is located in the first overlapping portion; The first jumper welding portion has a first jumper adjustment portion extending along a first direction. The first jumper can be adjusted in the first jumper adjustment portion along the first direction to weld with the first jumper welding portion, so as to adjust the overlapping area of ​​the first overlapping portion.

2. The RF coil assembly of the magnetic resonance apparatus of claim 1, characterized in that, The PCB board has a third coil unit, which overlaps with both the first and second coil units, forming a second overlapping portion at the overlap point. The third coil unit has a detune plate welding portion, which is located in the second overlapping portion; The detune plate welding part has a detune plate adjustment part extending along the second direction, which is used to adjust the position of the detune plate and the detune plate welding part for welding along the second direction, so as to adjust the overlap area of ​​the second overlapping part.

3. The radio frequency coil assembly of the magnetic resonance device according to claim 2, characterized in that, The plurality of preset jumpers includes a second jumper; The PCB board has a fourth coil unit, which overlaps with the third coil unit to form a third overlapping portion at the overlap point; At least one of the third and fourth coil units has a second jumper solder portion located in the third overlapping portion; The second jumper welding portion has a second jumper adjustment portion extending along a first direction. The second jumper can be adjusted in the first direction to weld with the second jumper welding portion to adjust the overlapping area of ​​the third overlapping portion.

4. The radio frequency coil assembly of the magnetic resonance device according to claim 3, characterized in that, The second jumper is the same length as the first jumper, or the second jumper is different in length from the first jumper.

5. The radio frequency coil assembly of the magnetic resonance device according to claim 4, characterized in that, The first jumper soldering portion includes two first solder pads arranged opposite each other, and the distance between the two first solder pads matches the length of the first jumper; The second jumper soldering portion includes two second solder pads arranged opposite each other, the distance between the two second solder pads being matched with the length of the second jumper; The detune board soldering section includes two detune board pads arranged opposite each other, and the distance between the two detune board pads matches the length of the detune board.

6. The radio frequency coil assembly of the magnetic resonance device according to claim 2, characterized in that, The first direction is perpendicular to the second direction.

7. The radio frequency coil assembly of the magnetic resonance device according to claim 1, characterized in that, The preset jumper section is connected to the main body of the coil.

8. A radio frequency coil assembly for a magnetic resonance imaging device, characterized in that, The radio frequency coil assembly includes: a coil body portion; The main body of the coil includes a PCB board, on which overlapping coil units are arranged, and at least one of the overlapping coil units has a jumper soldering part. The jumper welding part has a jumper adjustment part extending in a first direction. The preset jumper can be adjusted in the jumper adjustment part to be welded to the jumper welding part in the first direction, so as to adjust the overlap area between the overlapping coil units. And / or, At least one of the overlapping coil units has a detune plate welded portion; The detune plate welding section has a detune plate adjustment section extending in a second direction, used to adjust the position of the detune plate and the detune plate welding section for welding in the second direction.

9. A radio frequency coil for a magnetic resonance device, characterized in that, The radio frequency coil includes a PCB board. The PCB board has at least two adjacent overlapping coil units; The radio frequency coil further includes a jumper wire, and at least one of the overlapping coil units has a jumper wire soldering portion. The jumper wire soldering portion has a jumper wire adjustment portion extending along a first direction. The jumper wire adjustment portion includes two first pads arranged opposite each other along a second direction. The distance between the two first pads matches the length of the jumper wire. The jumper wire is soldered to the two first pads at a target position of the jumper wire adjustment portion. The target position allows the overlap area of ​​the two adjacent overlapping coil units to achieve decoupling. And / or, The RF coil also includes a detune board, and at least one of the overlapping coil units has a detune board soldering portion; the detune board soldering portion has a detune board adjustment portion extending along a second direction, and the detune board adjustment portion includes two second pads arranged opposite each other along a first direction, the distance between the two second pads matching the length of the detune board.

10. A magnetic resonance imaging device, characterized in that, The magnetic resonance device includes the radio frequency coil assembly as described in claim 9.

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