A DC copper busbar with single-phase conduction function

Abstract

This utility model relates to the field of high-voltage electrical system technology, and particularly to a DC copper busbar with single-phase conduction function, comprising: an input copper busbar, an output copper busbar, a power diode, and an insulating material; the input and output copper busbars are arranged in parallel, and the two copper busbars have an overlapping area in a direction perpendicular to the plane of the copper busbars, with a predetermined gap between the input and output copper busbars in the overlapping area; the power diode is disposed within the gap in the overlapping area of ​​the input and output copper busbars, and its two ends are electrically connected to the input and output copper busbars respectively; the insulating material fills the remaining gaps outside the power diode in the overlapping area of ​​the input and output copper busbars. This utility model solves the problems of high cost, reliance on manual operation, and complex structure of existing anti-reverse protection measures.

Description

Technical Field

[0001] This utility model relates to the field of high-voltage electrical system technology, and in particular to a DC copper busbar with single-phase conduction function. Background Technology

[0002] Copper busbars, as conductive components, are widely used in high-voltage systems such as electric vehicles and industrial equipment to connect circuit input and output terminals and carry current. Ensuring the correct current flow direction is crucial for system safety in high-voltage systems. Reversing the high-voltage busbar connection can damage the controller or even cause system failure; therefore, a reliable reverse connection protection measure is required.

[0003] In the existing technology, the anti-reverse protection measures mainly include the following schemes: (1) Through connector foolproof design: the physical structure of the connector is used to limit the incorrect connection of the high voltage bus, ensuring that the main positive and main negative poles are not reversed. (2) Through housing marking: the wiring direction is marked on the housing, and the wiring personnel are required to operate correctly according to the marking. (3) Through relay control: a relay is added to the high voltage main circuit, and the high voltage anti-reverse protection is realized through the control logic of the relay.

[0004] The existing technology has the following technical problems: (1) The connector error prevention measures are only applicable to high-voltage quick-connect schemes, which are costly and cannot cover all high-voltage connection scenarios. (2) The housing marking measures rely heavily on the operation level of the wiring personnel, which poses a risk of human error leading to failure of the error prevention measures. (3) The relay control scheme requires additional relays and control circuits, which are complex in structure and costly, and the relays themselves may have lifespan and reliability issues. Utility Model Content

[0005] To address the shortcomings of existing technologies, the purpose of this utility model embodiment is to provide a DC copper busbar with single-phase conduction function, so as to solve the problems of high cost, reliance on manual operation, and complex structure of existing anti-reverse protection measures.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A DC copper busbar with single-phase conduction function includes: an input copper busbar, an output copper busbar, a power diode, and an insulating material; the input copper busbar and the output copper busbar are arranged in parallel, and the two copper busbars have an overlapping area in a direction perpendicular to the plane of the copper busbars, with a set gap between the input copper busbar and the output copper busbar in the overlapping area; the power diode is disposed in the gap of the overlapping area of ​​the input copper busbar and the output copper busbar, and the two ends of the power diode are electrically connected to the input copper busbar and the output copper busbar respectively; the insulating material fills the other gaps outside the power diode in the overlapping area of ​​the input copper busbar and the output copper busbar.

[0008] Optionally, the anode of the power diode is connected to the input copper busbar, and the cathode of the power diode is connected to the output copper busbar, so that the current flows from the input copper busbar to the output copper busbar and cuts off the current from the output terminal to the input terminal.

[0009] Optionally, the insulating material is wrapped around the power diode.

[0010] Optionally, the filling area of ​​the insulating material is greater than the area of ​​the overlapping region of the input copper busbar and the output copper busbar.

[0011] Optionally, the end of the input copper busbar away from the overlapping area and the end of the output copper busbar away from the overlapping area are provided with mounting holes for connection.

[0012] Optionally, the input copper busbar on the side away from the power diode and / or the output copper busbar on the side away from the power diode are provided with heat dissipation fins.

[0013] Optionally, the input copper busbar facing the power diode and / or the output copper busbar facing the power diode are provided with grooves, and the power diode is embedded in the grooves.

[0014] Optionally, multiple power diodes are provided between the input copper busbar and the output copper busbar. The multiple power diodes are arranged in the same direction and are connected in parallel between the input copper busbar and the output copper busbar.

[0015] Optionally, the input copper busbar has multiple stepped bosses on the side facing the power diode. The multiple stepped bosses have different thicknesses. Each power diode is connected to one stepped boss. An elastic conductive pad is provided on the other side of the power diode. The other side of the elastic conductive pad is connected to the output copper busbar.

[0016] Optionally, an insulating isolation structure is provided between the stepped bosses, the isolation structure comprising a high-temperature resistant polymer material or an embedded ceramic sheet filling the gaps between the stepped bosses.

[0017] One or more technical solutions provided in the embodiments of this utility model have at least the following technical effects or advantages:

[0018] 1. This utility model's DC copper busbar achieves unidirectional conduction through the coordinated operation of the input copper busbar, output copper busbar, power diode, and insulating material. The input and output copper busbars are arranged in parallel, forming an overlapping area perpendicular to the plane of the copper busbars. The power diode is embedded in the gap within this overlapping area. The two ends of the power diode form electrical paths with the input and output copper busbars, respectively. The insulating material fills the gaps outside the power diode, ensuring that current flows between the input and output copper busbars solely through the power diode. The power diode controls the current direction, cutting off abnormal current when the high-voltage busbar is reversed, thus preventing current from flowing back from the output to the input when the high-voltage busbar is reversed, thereby protecting the controller and the high-voltage system.

[0019] 2. In this invention, the stepped boss adjusts the contact resistance through a mechanical structure, transforming the problem of discrete electrical parameters into a quantifiable and controllable structural parameter problem. The elastic gasket increases dynamic adaptability and solves secondary problems caused by vibration and thermal expansion.

[0020] Additional advantages of this invention will be set forth in the description which follows, and in part will be obvious from the description or may be learned by practice of the invention. Attached Figure Description

[0021] The accompanying drawings, which form part of this specification, are used to provide a further understanding of this utility model. The illustrative embodiments and descriptions of this utility model are used to explain this utility model and do not constitute an undue limitation thereof. Furthermore, the spacing or dimensions between components are exaggerated to show their positions; the schematic diagrams are for illustrative purposes only.

[0022] Figure 1 This is a schematic diagram of a DC copper busbar with single-phase conduction function provided in an embodiment of this utility model;

[0023] Figure 2 This is a schematic diagram of a DC copper busbar with single-phase conduction function provided by another embodiment of this utility model;

[0024] In the diagram: 1. Input copper busbar; 2. Output copper busbar; 3. Power diode; 4. Insulating material; 11. Stepped boss; 5. Elastic conductive pad; Detailed Implementation

[0025] It should be noted that the following detailed description is illustrative and intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0026] like Figure 1 As shown, this embodiment proposes a DC copper busbar with single-phase conduction function, including: an input copper busbar 1, an output copper busbar 2, a power diode 3, and an insulating material 4; the input copper busbar 1 and the output copper busbar 2 are arranged in parallel, and the two copper busbars have an overlapping area in the direction perpendicular to the plane of the copper busbars, and there is a set gap between the input copper busbar 1 and the output copper busbar 2 in the overlapping area; the power diode 3 is disposed in the gap of the overlapping area of ​​the input copper busbar 1 and the output copper busbar 2, and the two ends of the power diode 3 are electrically connected to the input copper busbar 1 and the output copper busbar 2 respectively; the insulating material 4 fills the other gaps outside the power diode 3 in the overlapping area of ​​the input copper busbar 1 and the output copper busbar 2.

[0027] The input copper busbar 1 and the output copper busbar 2 are arranged in parallel stacks, forming an overlapping structure in the vertical projection area. A predetermined spacing is maintained between the two copper busbars to form a cavity, within which the power diode 3 is fixed. The remaining space of the cavity is completely filled with insulating material 4, forming an electrical isolation barrier. This structure forces current to flow through the diode, achieving unidirectional conduction, and the insulating material 4 eliminates the risk of leakage current along non-diode paths between the copper busbars.

[0028] The input copper busbar 1 connects the circuit input terminal and carries the current, while also supporting and dissipating heat from the power diode 3. The power diode 3 controls the current flow, ensuring that under normal conditions the current flows from the input copper busbar 1 to the output copper busbar 2, and cutting off the current from the output terminal to the input terminal in case of an abnormal reverse connection at the external high-voltage interface. The insulating material 4 electrically isolates the input copper busbar 1 and the output copper busbar 2, ensuring that the current from the input copper busbar 1 to the output copper busbar 2 flows through the power diode 3. This copper busbar directly integrates the power diode 3, providing reverse protection, and eliminates the need for relays and large-package power diodes, resulting in a simple structure. Furthermore, the power diode 3 can be directly cooled through the input and output copper busbars 2, and its junction temperature is controllable, leading to a long lifespan.

[0029] The anode of the power diode 3 is connected to the input copper busbar 1, and the cathode of the power diode 3 is connected to the output copper busbar 2, allowing current to flow from the input copper busbar 1 to the output copper busbar 2 and cutting off the current from the output terminal to the input terminal. Specifically, the power diode 3 is connected to the input copper busbar 1 and the output copper busbar 2 by soldering or laser welding, or by using a bonding wire process, with leads from the power diode 3 connecting the input copper busbar 1 and the output copper busbar 2.

[0030] The anode of power diode 3 is connected to the input copper busbar 1, and the cathode is connected to the output copper busbar 2, ensuring that current can only flow from the input copper busbar 1 to the output copper busbar 2. This polarity connection utilizes the unidirectional conductivity of power diode 3, allowing current to flow during normal operation while cutting off current flow when the high-voltage busbar is reversed, thus achieving reverse polarity protection. This design, through the polarity limitation of the electrical connection, avoids system damage caused by human wiring errors.

[0031] The insulating material 4 surrounds the power diode 3, forming an electrical isolation layer. The insulating material 4 not only prevents a direct short circuit between the input copper busbar 1 and the output copper busbar 2, but also ensures that current can only flow through the power diode 3. This encapsulation design avoids exposing the power diode 3, improves structural reliability, and prevents external interference or short-circuit risks.

[0032] The filling area of ​​the insulating material 4 is larger than the area of ​​the overlapping region between the input copper busbar 1 and the output copper busbar 2. This larger filling area ensures complete isolation between the input copper busbar 1 and the output copper busbar 2 throughout the entire overlapping area. This design avoids the possibility of partial short circuits and enhances electrical safety, especially in high humidity or vibration environments; the larger the coverage area of ​​the insulating material 4, the more significant the protective effect.

[0033] The input copper busbar 1, at its end furthest from the overlapping area, and the output copper busbar 2, at its end furthest from the overlapping area, are provided with mounting holes for connection, used to fix the copper busbars to other components. The design of the mounting holes not only facilitates the mechanical fixing of the copper busbars and simplifies the installation process, but also ensures the stability and reliability of the copper busbars.

[0034] The input copper busbar 1 and / or the output copper busbar 2, located on the side opposite to the power diode 3, are equipped with heat dissipation fins. These fins increase the heat dissipation area of ​​the copper busbars, effectively reducing the junction temperature of the power diode 3 and extending its lifespan. In high-power applications, the heat dissipation fins can quickly dissipate heat to the surrounding environment, ensuring the stable operation of the power diode 3 under high-temperature conditions.

[0035] In another embodiment, the input copper busbar 1 is provided with a groove on the side facing the power diode 3 and / or the output copper busbar 2 is provided with a groove on the side facing the power diode 3, and the power diode 3 is embedded in the groove.

[0036] The groove design, through mechanical positioning and pressing, significantly improves the connection strength between power diode 3 and the copper busbar. In vibrating environments or under high temperature and humidity conditions, the groove reduces the risk of poor soldering or contact, ensuring a stable and reliable electrical connection between power diode 3 and the copper busbar.

[0037] Single or multiple diodes can be connected in parallel based on the rated parameters of the power diodes and the current-carrying design of the copper busbars. For example... Figure 2 As shown, multiple power diodes 3 are arranged between the input copper busbar 1 and the output copper busbar 2. These power diodes 3 are oriented in the same direction and connected in parallel between the input and output copper busbars. This parallel design allows the copper busbars to carry a larger current while dispersing heat, reducing the thermal load on individual power diodes 3. This parallel structure also improves system redundancy; even if one power diode 3 fails, the other diodes can continue to operate, ensuring system reliability.

[0038] Due to manufacturing tolerances, the on-resistance of power diode 3 varies, resulting in a ±5% dispersion in diode on-resistance (Vf value). Conventional parallel structures are prone to uneven dynamic current distribution. Testing revealed that when the current suddenly increases to 500A, the current difference between the individual power diodes 3 in a typical parallel structure can reach 15%, leading to localized overheating. Sudden current changes cause transient current shifts due to differences in inductance between branches, and differences in parallel branch lengths lead to inductance deviations. Branches with higher current experience higher temperature rises, resulting in lower resistance and attracting even more current. For example, in a high-voltage system, uneven current caused the junction temperature of a single diode to reach 160℃ (design limit 150℃), leading to failure after 1000 cycles.

[0039] Based on this, in one embodiment, such as Figure 2 As shown, the input copper busbar 1 has multiple stepped protrusions 11 on the side facing the power diode 3. The multiple stepped protrusions 11 have different thicknesses. Each power diode 3 is connected to a stepped protrusion 11. An elastic conductive pad 5 is provided on the other side of the power diode 3. The other side of the elastic conductive pad 5 is connected to the output copper busbar 2.

[0040] The height difference of the stepped bosses 11 is used to compensate for the on-resistance variation of the power diode 3, and to achieve uniform current distribution by adjusting the contact resistance. The elastic conductive pad 5 provides constant contact pressure under vibration environment, ensuring that the contact resistance fluctuation is less than 2%, thereby avoiding local overheating caused by uneven current distribution.

[0041] The height difference of the stepped boss 11 was determined by finite element analysis. The height difference range is 0.03-0.08mm. It is preferred to adopt a 0.05mm step gradient design. For example, the height of the first boss is 1.05mm, the height of the second boss is 1mm, and so on.

[0042] The elastic gasket uses a beryllium copper substrate with a silver plating layer (silver layer thickness 2-5μm). It is formed into a wave structure through multiple bending (wave crest angle 30°-45°, compression 0.2-0.5mm). The gasket pre-compression deformation is 0.3mm (elastic modulus 110GPa), and the contact pressure is 3N / mm2, ensuring that the contact resistance fluctuation is <2% under vibration environment.

[0043] During mass production, the Vf value of diodes is tested in batches and graded in ±1% increments. Diodes with lower Vf values ​​are installed at higher boss positions, and diodes with higher Vf values ​​are installed at lower boss positions. If the on-resistance (Vf) of a diode is low (prone to overcurrent), the corresponding boss height is increased, and the total resistance tends to be consistent. For example, diode A (Vf = 0.95V) is matched with a high boss (L = 1.05mm), and diode B (Vf = 1.05V) is matched with a low boss (L = 0.95mm).

[0044] By adjusting the contact resistance of the welding surfaces of each power diode 3 according to the height difference, the resistance dispersion of the power diode 3 body is compensated. Constant contact pressure ensures stable contact resistance under dynamic vibration. Under a step current of 200A→500A, the current difference of conventional parallel structure reaches 18%, while in this embodiment it can be controlled within 5%.

[0045] An insulating isolation structure is provided between the stepped protrusions 11, and the isolation structure includes a high-temperature resistant polymer material or an embedded ceramic sheet filling the gap between the stepped protrusions 11.

[0046] An insulating isolation structure is provided between the stepped bosses 11. The isolation structure includes a high-temperature resistant polymer material or embedded ceramic sheet filling the gaps between the stepped bosses 11. The high-temperature resistant polymer material (such as polyimide or silicone rubber) or embedded ceramic sheet can further isolate the electrical connection between the input copper busbar 1 and the output copper busbar 2, preventing current leakage through the gaps between the stepped bosses 11. This design improves electrical safety while also enhancing the mechanical strength and durability of the copper busbars.

[0047] Although the specific embodiments of the present utility model have been described above in conjunction with the accompanying drawings, this is not intended to limit the scope of protection of the present utility model. Those skilled in the art should understand that various modifications or variations that can be made by those skilled in the art without creative effort based on the technical solution of the present utility model are still within the scope of protection of the present utility model.

Claims

1. A DC copper busbar with single-phase conduction function, characterized in that, include: Input copper busbar, output copper busbar, power diodes, and insulating materials; The input copper busbar and the output copper busbar are arranged in parallel, and the two copper busbars have an overlapping area in the direction perpendicular to the plane of the copper busbars. There is a set gap between the input copper busbar and the output copper busbar in the overlapping area. The power diode is disposed in the gap between the overlapping areas of the input copper busbar and the output copper busbar, and the two ends of the power diode are electrically connected to the input copper busbar and the output copper busbar respectively. The insulating material fills the gaps outside the power diode in the overlapping area of ​​the input and output copper busbars.

2. The DC copper busbar with single-phase conduction function as described in claim 1, characterized in that, The anode of the power diode is connected to the input copper busbar, and the cathode of the power diode is connected to the output copper busbar, so that the current flows from the input copper busbar to the output copper busbar and cuts off the current from the output terminal to the input terminal.

3. The DC copper busbar with single-phase conduction function as described in claim 1, characterized in that, The insulating material covers the power diode.

4. The DC copper busbar with single-phase conduction function as described in claim 3, characterized in that, The area of ​​the insulating material is greater than the area of ​​the overlapping region of the input copper busbar and the output copper busbar.

5. The DC copper busbar with single-phase conduction function as described in claim 1, characterized in that, The input copper busbar at one end away from the overlapping area and the output copper busbar at one end away from the overlapping area are provided with mounting holes for connection.

6. The DC copper busbar with single-phase conduction function as described in claim 1, characterized in that, The input copper busbar on the side away from the power diode and / or the output copper busbar on the side away from the power diode are provided with heat dissipation fins.

7. The DC copper busbar with single-phase conduction function as described in claim 1, characterized in that, The input copper busbar facing the power diode and / or the output copper busbar facing the power diode are provided with grooves, and the power diode is embedded in the grooves.

8. The DC copper busbar with single-phase conduction function as described in claim 1, characterized in that, Multiple power diodes are arranged between the input copper busbar and the output copper busbar. The multiple power diodes are arranged in the same direction and connected in parallel between the input copper busbar and the output copper busbar.

9. The DC copper busbar with single-phase conduction function as described in claim 8, characterized in that, The input copper busbar has multiple stepped protrusions on the side facing the power diode. The stepped protrusions have different thicknesses. Each power diode is connected to one stepped protrusion. An elastic conductive pad is provided on the other side of the power diode. The other side of the elastic conductive pad is connected to the output copper busbar.

10. The DC copper busbar with single-phase conduction function as described in claim 9, characterized in that, An insulating isolation structure is provided between the stepped bosses, and the isolation structure includes a high-temperature resistant polymer material or an embedded ceramic sheet filling the gap between the stepped bosses.

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