Split pin power-on module
By using a separate pin-type power supply module, the problem of high scrap rate of laser base due to poor welding or high temperature is solved, achieving the effects of reducing costs and improving heat dissipation efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 武汉宏钢电子科技有限公司
- Filing Date
- 2025-08-02
- Publication Date
- 2026-05-26
AI Technical Summary
Existing laser bases have a high scrap rate due to poor welding or high temperature. In traditional processes, poor welding requires replacing the entire base, which is costly.
A split-type pin-powered module is adopted, which forms an independent module by welding the pins and insulators to the connecting plate. The connecting plate can be detachably installed on the laser base, and gradient heat dissipation grooves and elastic compensation layers are set on the connecting plate to reduce the probability of thermal deformation and poor welding.
It reduces the scrap rate of laser bases due to poor welding or high temperature, improves heat dissipation efficiency and installation accuracy, and reduces costs.
Smart Images

Figure CN224288868U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of lasers, and in particular to a split-pin power-on module. Background Technology
[0002] With the continuous development of the laser application industry, semiconductor lasers are receiving increasing attention. The more advanced the laser's functionality, the more complex its internal integrated circuits, resulting in higher laser power and consequently larger laser mounts. Laser products generally consist of a mount, chip, collimator, insulator, and pins. As the laser industry continues to evolve, various lasers are constantly being developed and their power is increasing, leading to larger mounts and greater difficulty in sintering the pins.
[0003] The current main method for installing pins is as follows: place the insulator on the designated position on the base, then pass the pin through the insulator, and finally weld the insulator and pin, and the insulator and base together using silver-copper solder (Ag72Cu28). This makes the pin, insulator and base an integral structure, while the pin indirectly contacts the base through the insulator, preventing electrical conductivity between the pin and the base.
[0004] However, the welding temperature of silver-copper solder (Ag72Cu28) is as high as 810℃, which can easily cause thermal deformation of the base, resulting in poor flatness. At the same time, defects such as discontinuous welds and ceramic cracking are prone to occur when welding the pins to the shell, leading to the scrapping of the entire base. In traditional processes, if the welding is poor, the entire base needs to be replaced, which is very costly. Utility Model Content
[0005] To reduce the scrap rate of laser bases due to poor welding or high temperature, this application provides a split-type pin-powered module.
[0006] This application provides a split-type pin-powered module, which adopts the following technical solution:
[0007] A split-type pin-powered module includes pins, insulators, and a connecting plate. The pins and insulators are welded onto the connecting plate to form an independent module. The connecting plate is detachably mounted on a laser base by bolts.
[0008] By adopting the above technical solution, the pins and insulators are pre-welded onto the connecting plate to form independent modules. After confirming that the independent modules are well welded, the independent modules are fixedly installed on the laser base with bolts, thereby reducing the scrap rate of the laser base due to poor welding or high temperature.
[0009] Furthermore, the connecting plate has multiple sets of gradient heat dissipation grooves, and the depth of the gradient heat dissipation grooves on the side closer to the insulator is greater than the depth on the side farther away from the insulator.
[0010] By adopting the above technical solution, during welding, the gradient heat dissipation groove guides heat from the high-temperature zone to the low-temperature zone, improving heat dissipation efficiency and thus reducing the probability of thermal deformation of the connecting plate.
[0011] Furthermore, the laser base has a mounting groove for placing a connecting plate, and the thickness of the connecting plate is less than the depth of the mounting groove.
[0012] By adopting the above technical solution, the connecting plate is completely placed into the mounting slot, thereby reducing the impact of the connecting plate on the laser base shell.
[0013] Furthermore, the connecting plate has a positioning groove that engages with and positions the laser base.
[0014] By adopting the above technical solution, the positioning groove and the laser base are interlocked during installation, which facilitates the quick installation of the connecting plate and reduces the assembly error between the connecting plate and the laser base.
[0015] Furthermore, an elastic compensation layer is provided between the insulator and the connecting plate, and the elastic compensation layer is made of flexible graphite gasket.
[0016] By adopting the above technical solution, the thermal expansion difference stress between the insulator and the connecting plate is absorbed by the flexible graphite gasket during welding cooling, thereby reducing the probability of insulator breakage.
[0017] Furthermore, the connecting plate includes:
[0018] A base plate, which is detachably mounted on the laser base by bolts;
[0019] Mounting plate, which is detachably mounted on base plate by bolts, has a set of pins and a set of insulators welded on it to form a unit module, and multiple sets of mounting plates are spaced apart on the base plate.
[0020] By adopting the above technical solution, the mounting plate, pins and insulators are pre-welded into unit modules. After confirming that the unit modules are well welded, multiple sets of unit modules are fixedly installed on the base plate to form independent modules. Finally, the independent modules are installed on the laser base, which reduces the probability of mutual interference when welding adjacent pins and insulators, and further reduces the scrap rate caused by poor welding or high temperature.
[0021] Furthermore, the base plate is provided with positioning holes to facilitate the pins to pass through, and positioning pins are provided between the base plate and the mounting plate to facilitate precise alignment between the mounting plate and the base plate.
[0022] By adopting the above technical solution, the mounting accuracy of the mounting plate and the base plate is improved by the cooperation of the positioning holes and positioning pins, while reducing the force exerted on the pins by the sidewalls of the positioning holes.
[0023] Furthermore, an elastic pad is provided on the side of the mounting plate near the base plate.
[0024] By adopting the above technical solution, the elastic pad has a certain degree of elasticity, which makes it easy to install the mounting plate on the base plate.
[0025] In summary, this application includes at least one of the following beneficial technical effects:
[0026] 1. By pre-soldering the pins and insulators onto the connecting plate to form independent modules, and after confirming that the independent modules are well soldered, the independent modules are fixedly installed on the laser base with bolts, thereby reducing the scrap rate of the laser base due to poor soldering or high temperature.
[0027] 2. By pre-welding the mounting plate, pins, and insulators into unit modules, and after confirming that the unit modules are welded well, multiple sets of unit modules are fixedly installed on the base plate to form independent modules. Finally, the independent modules are installed on the laser base, which reduces the probability of mutual interference when welding adjacent pins and insulators, and further reduces the scrap rate caused by poor welding or high temperature. Attached Figure Description
[0028] Figure 1 This is a schematic diagram of the split-type pin-powered module structure of Embodiment 1 of this application, which only shows the part of the structure where the laser base is connected to the power-on module;
[0029] Figure 2 yes Figure 1 A cross-sectional schematic diagram of AA in the middle;
[0030] Figure 3 This is a schematic diagram of the independent module structure of Embodiment 1 of this application;
[0031] Figure 4 This is a schematic diagram of the split-type pin-powered module structure of Embodiment 2 of this application;
[0032] Figure 5 This is a schematic diagram of the independent module structure of Embodiment 2 of this application.
[0033] Reference numerals: 1. Laser base; 11. Mounting slot; 2. Connecting plate; 21. Gradient heat dissipation slot; 22. Positioning slot; 3. Pin; 4. Insulator; 41. Elastic compensation layer; 5. Base plate; 6. Mounting plate; 61. Guide slot; 7. Unit module; 8. Positioning pin; 9. Elastic pad. Detailed Implementation
[0034] The following is in conjunction with the appendix Figures 1-5 This application will be described in further detail.
[0035] This application discloses a split-type pin-powered module.
[0036] Example 1
[0037] Reference Figure 1 and Figure 2 A split-type pin-powered module includes pins 3, insulators 4 and connecting plates 2. Pins 3 and insulators 4 are welded onto the connecting plates 2 to form an independent module. The connecting plates 2 are detachably mounted on the laser base 1 by bolts.
[0038] Reference Figure 3 Multiple sets of gradient heat dissipation grooves 21 are provided on the connecting plate 2. The depth of the gradient heat dissipation grooves 21 on the side closer to the insulator 4 is greater than the depth on the side farther away from the insulator 4. The multiple sets of gradient heat dissipation grooves 21 are located around the pin 3. When the insulator 4 is soldered onto the connecting plate 2, the multiple sets of gradient heat dissipation grooves 21 can quickly dissipate heat, thereby reducing the temperature at the connection between the connecting plate 2 and the insulator 4 and reducing the probability of thermal deformation of the connecting plate 2.
[0039] Reference Figure 2 and Figure 3 The laser base 1 has a mounting groove 11 for placing the connecting plate 2. The thickness of the connecting plate 2 is less than the depth of the mounting groove 11, so that the connecting plate 2 can be completely placed in the mounting groove 11, reducing the impact of the connecting plate 2 on the external environment of the laser base 1. At the same time, the connecting plate 2 has a positioning groove 22 that engages with the laser base 1. The laser base 1 is fixedly installed with a positioning block that engages with the positioning groove 22. During installation, the positioning groove 22 engages with the positioning block, and the positioning block guides the connecting plate 2 to be placed in the mounting groove 11. Finally, it is fixed with bolts.
[0040] Reference Figure 2 An elastic compensation layer 41 is provided between the insulator 4 and the connecting plate 2. The elastic compensation layer 41 is made of flexible graphite gasket, which reduces the probability of cracking when the insulator 4 is welded.
[0041] Reference Figure 1 By pre-welding pins 3 and insulators 4 onto the connecting plate 2 to form an independent module, and then testing the independent module, once it is confirmed that the independent module is welded well, the independent module is placed on the laser base 1 and fixed in a detachable manner with bolts; when the formed independent module has poor welding, only a new independent module needs to be replaced, which greatly reduces the probability of the laser base 1 being scrapped.
[0042] The working principle of Embodiment 1 of this application is as follows:
[0043] By pre-welding pins 3 and insulators 4 onto the connecting plate 2 to form an independent module, and after confirming that the independent module is welded well, the independent module is fixedly installed on the laser base 1 with bolts, thereby reducing the scrap rate of the laser base 1 due to poor welding or high temperature.
[0044] Example 2
[0045] Reference Figure 4 The difference between this embodiment and embodiment 1 is that the connecting plate 2 consists of a base plate 5 and multiple mounting plates 6. The base plate 5 is continuously mounted on the laser base 1 by bolts. The mounting plates 6 are detachably mounted on the base plate 5 by bolts. Multiple mounting plates 6 are spaced apart on the base, and the spacing between the multiple mounting plates 6 is adjustable. A set of pins 3 and a set of insulators 4 are welded onto the mounting plates 6, so that the mounting plates 6, pins 3 and insulators 4 form a unit module 7. By mounting multiple unit modules 7 on the base plate 5, an independent module is finally formed. The spacing between the multiple unit modules 7 is adjustable. At the same time, by making the mounting plates 6, pins 3 and insulators 4 correspond one-to-one, the probability of mutual interference when adjacent pins 3 and insulators 4 are welded is reduced, further reducing the scrap rate caused by poor welding or high temperature.
[0046] Reference Figure 4 and Figure 5 The base plate 5 has positioning holes for the pins 3 to pass through, which facilitates the control of the positional relationship between multiple sets of pins 3. At the same time, the base plate 5 and the mounting plate 6 have guide grooves 61. After the mounting plate 6 is installed on the base plate 5, a positioning pin 8 is inserted into the mounting plate 6. The positioning pin 8 is inserted into the base plate 5 after being guided by the guide groove 61. The positioning of the positioning pin 8 makes the mounting plate 6 and the base accurately aligned, improving the positional accuracy of multiple sets of pins 3.
[0047] Reference Figure 5 An elastic pad 9 is fixedly installed on the side of the mounting plate 6 near the base plate 5. The mounting plate 6 and the base plate 5 are pressed together by the elastic pad 9, which improves the installation stability between the mounting plate 6 and the base plate 5.
[0048] The working principle of Embodiment 2 of this application is as follows:
[0049] By pre-welding the mounting plate 6, pins 3, and insulators 4 to form unit modules 7, and after confirming that the unit modules 7 are welded well, multiple sets of unit modules 7 are fixedly installed on the base plate 5 to form independent modules. Finally, the independent modules are installed on the laser base 1, which reduces the probability of mutual interference when welding adjacent pins 3 and insulators 4, and further reduces the scrap rate caused by poor welding or high temperature.
[0050] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A split-type pin-powered module, characterized in that: It includes pins (3), insulators (4) and connecting plates (2). The pins (3) and insulators (4) are welded to the connecting plates (2) to form an independent module. The connecting plates (2) are detachably mounted on the laser base (1) by bolts.
2. The split-type pin-powered module according to claim 1, characterized in that: The connecting plate (2) has multiple sets of gradient heat dissipation grooves (21), and the depth of the gradient heat dissipation grooves (21) on the side closer to the insulator (4) is greater than the depth on the side farther away from the insulator (4).
3. A split-type pin-powered module according to claim 1, characterized in that: The laser base (1) has an installation groove (11) for placing the connecting plate (2), and the thickness of the connecting plate (2) is less than the depth of the installation groove (11).
4. A split-type pin-powered module according to claim 3, characterized in that: The connecting plate (2) is provided with a positioning groove (22) that is engaged and positioned with the laser base (1).
5. A split-type pin-powered module according to claim 1, characterized in that: An elastic compensation layer (41) is provided between the insulator (4) and the connecting plate (2), and the elastic compensation layer (41) is made of flexible graphite gasket.
6. A split-type pin-powered module according to claim 1, characterized in that: The connecting plate (2) includes: The base plate (5) is detachably mounted on the laser base (1) by bolts; Mounting plate (6), which is detachably mounted on base plate (5) by bolts. A set of pins (3) and a set of insulators (4) are welded on the mounting plate (6) to form a unit module (7). Multiple sets of mounting plates (6) are spaced apart on the base plate (5).
7. A split-type pin-powered module according to claim 6, characterized in that: The base plate (5) is provided with a positioning hole to facilitate the pin (3) to pass through. A positioning pin (8) is provided between the base plate (5) and the mounting plate (6) to facilitate the precise alignment of the mounting plate (6) and the base plate (5).
8. A split-type pin-powered module according to claim 7, characterized in that: An elastic pad (9) is provided on the side of the mounting plate (6) near the base plate (5).