An assembly structure for a semiconductor laser chip and optical path

Abstract

This application relates to an assembly structure for a semiconductor laser chip and optical path, belonging to the field of semiconductor laser technology. It includes a base plate, an output optical fiber, multiple chips, and multiple optical elements. Multiple bases are welded to the base plate, and three chips are mounted on each base. The chip mounting surfaces on the bases are arranged in a gradient, with spacing between adjacent bases. Multiple ceramic or glass stepped plates are fixed to the base plate, and the optical elements are fixed to these stepped plates. Compared to a one-piece machining design, the base in this application, with multiple bases spaced apart, significantly reduces the use of copper material, lightens the weight, and eliminates the need for machining steps on the base plate, reducing CNC machining time. The use of ceramic or glass stepped plates increases the bonding stability of the optical elements, reduces optical path misalignment caused by the high thermal expansion coefficient of copper, and significantly improves product reliability.

Description

Technical Field

[0001] This application relates to the field of semiconductor laser technology, and in particular to an assembly structure for a semiconductor laser chip and optical path. Background Technology

[0002] Semiconductor lasers are a common type of laser, characterized by their small size and long lifespan. They can be activated by simple current injection, and their operating voltage and current are compatible with integrated circuits, allowing for monolithic integration. Due to these advantages, semiconductor lasers are widely used in laser communication, optical storage, optical gyroscopes, laser printing, ranging, and radar.

[0003] The utility model patent with announcement number CN214899323U discloses a semiconductor laser packaging structure, including a pump source composite base, comprising a first base with a first step and a second base with a second step connected together; a laser chip module disposed on the second step for generating a pump beam, with laser chip modules located on adjacent second steps connected in series; and a lens and a reflector disposed on the first step for collimating and combining the pump beam.

[0004] Regarding the aforementioned technologies, the base used to fix the chip is an integrated design with a large number of steps. This results in greater weight and consumption of more copper material, and the CNC machining process is also time-consuming. Utility Model Content

[0005] This application provides an assembly structure for a semiconductor laser chip and optical path, which adopts a multi-three-chip independent step assembly design, reducing weight and copper consumption, and reducing CNC machining time.

[0006] This application provides an assembly structure for a semiconductor laser chip and optical path, employing the following technical solution:

[0007] An assembly structure for a semiconductor laser chip and optical path includes a base plate, an output optical fiber, multiple chips, and multiple optical elements. Multiple bases are fixed to the base plate by welding, and three chips are mounted on each base. The chip mounting surfaces on the bases are arranged in a gradient, and there is a gap between adjacent bases.

[0008] By adopting the above technical solution, compared with the design of integrated processing, the use of multiple bases spaced apart significantly reduces the use of copper material and lightens the weight. Since the shape structure of each base is relatively simple and the number of faces is small, the CNC machining time is reduced when using blocks of different heights as raw materials.

[0009] Optionally, the top surface of the base is provided with a groove, the bottom of the groove is arc-shaped, the two ends of the groove are connected to the two side walls of the base, and the groove is located between adjacent chips.

[0010] By adopting the above technical solution, the weight of the base is further reduced by the groove, and the stress concentration at the top step of the base can be reduced to avoid cracking, which also facilitates the installation of the chip.

[0011] Optionally, a plurality of ceramic or glass step plates are fixed on the base plate, and the optical element is fixed on the step plates.

[0012] By adopting the above technical solutions, using ceramic or glass step plates can increase the bonding stability of optical components, reduce optical path deviation caused by the excessive thermal expansion coefficient of copper, and significantly improve product reliability.

[0013] Optionally, the stepped plates are also arranged in a gradient according to the arrangement direction of the base; as the thickness of the base increases, the thickness of the corresponding stepped plates also increases.

[0014] By adopting the above technical solution, the same set of optical components can be used for chips at different height positions, reducing the types of parts and lowering costs.

[0015] Optionally, a heat-conducting plate is provided between the base and the bottom plate.

[0016] By adopting the above technical solution, the heat from the base can be efficiently transferred to the base plate by filling the gap between the base and the bottom plate with a heat-conducting plate.

[0017] Optionally, the optical element includes a lens group corresponding to the chip position, a polarizing beam combiner prism, and several mirrors. Two sets of the lens group and the chip are symmetrically arranged, and the two sets of optical paths are combined by the polarizing beam combiner prism.

[0018] By adopting the above technical solution, and by setting up two sets of chips, the output power is increased by merging their light beams.

[0019] Optionally, an optical fiber mounting base is fixed on the base plate, and the end of the output optical fiber is located in the central hole of the optical fiber mounting base.

[0020] By adopting the above technical solution, the end of the output optical fiber is positioned and installed using an optical fiber fixing bracket.

[0021] Optionally, two identical convex lenses are fixed on the base plate. The two convex lenses are located between the polarization combining prism and the optical path of the output optical fiber. The convex lenses are cylindrical, with one convex lens set vertically and the other convex lens set horizontally.

[0022] By adopting the above technical solution, since the two convex lenses have the same structure but different installation angles, the number of parts can be reduced, the manufacturing cost can be lowered, and the production cost of the convex lens as a column is also lower.

[0023] In summary, this application includes at least one of the following beneficial technical effects:

[0024] 1. Compared to the one-piece machining design, the use of multiple spaced bases significantly reduces the amount of copper material used, lightens the weight, and eliminates the need to machine steps on the base plate, thus reducing CNC machining time;

[0025] 2. Using ceramic or glass step plates can increase the bonding stability of optical components, reduce optical path deviation caused by the excessive thermal expansion coefficient of copper, and significantly improve product reliability. Attached Figure Description

[0026] Figure 1 This is a perspective view of the assembly structure of a semiconductor laser chip and optical path according to an embodiment;

[0027] Figure 2 This is a partial view of an embodiment;

[0028] Figure 3 This is a schematic diagram of the optical path in an embodiment.

[0029] Explanation of reference numerals in the attached diagram: 1. Base plate; 11. Output optical fiber; 3. Chip; 4. Optical element; 12. Baffle; 2. Base; 21. Groove; 22. Heat-conducting plate; 5. Step plate; 41. Lens group; 42. Polarizing beam combiner prism; 43. Reflector; 13. Fiber optic fixing base; 44. Convex lens. Detailed Implementation

[0030] The present application will be further described in detail below with reference to the accompanying drawings.

[0031] Reference Figure 1 and Figure 2 This embodiment discloses an assembly structure of a semiconductor laser chip and optical path, including a base plate 1, an output optical fiber 11, multiple chips 3, and multiple optical elements 4. An annular baffle 12 is fixed at the edge of the base plate 1, and multiple bases 2 are fixed on the base plate 1 by welding. Both the bases 2 and the base plate 1 are made of copper and have good thermal conductivity.

[0032] Each base 2 has three chips 3 mounted on it. The mounting surfaces of the chips 3 on the base 2 are arranged in a gradient, and there is a gap between adjacent bases 2. In this embodiment, three bases 2 are arranged on the same side in a straight line, and the thickness of each base 2 increases, so that the height of all chips 3 on the same side increases in a gradient. Compared with the one-piece machining design, the use of multiple bases 2 spaced apart significantly reduces the use of copper material and lightens the weight. Since the shape structure of each base 2 is relatively simple and has fewer faces, the CNC machining time is reduced when using blocks of different heights as raw materials, and there is no need to machine steps on the base plate 1.

[0033] The top surface of the base 2 has a groove 21 with an arc-shaped bottom. The two ends of the groove 21 are connected to the two side walls of the base 2. The groove 21 is located between adjacent chips 3. The groove 21 further reduces the weight of the base 2, reduces stress concentration at the stepped position on the top surface of the base 2, avoids cracking, and facilitates the installation of the chip 3.

[0034] A heat-conducting plate 22 is provided between the base 2 and the base plate 1. The heat-conducting plate 22 fills the gap between the base 2 and the base plate 1, so that the heat of the base 2 can be efficiently transferred to the base plate 1. The heat-conducting plate 22 is preferably made of graphite. The thickness of the heat-conducting plate 22 is very small, so it does not affect the welding between the base 2 and the base plate 1. The metal produced by welding directly covers the outside of the side wall of the heat-conducting plate 22.

[0035] Multiple ceramic or glass stepped plates 5 are fixed on the base plate 1, and optical elements 4 are fixed on the stepped plates 5. The stepped plates 5 are also arranged in a gradient according to the arrangement direction of the base 2; as the thickness of the base 2 increases, the thickness of the corresponding stepped plates 5 also increases. Compared to the structural design where the optical elements 4 are directly bonded to the copper base plate 1, using ceramic or glass stepped plates 5 can increase the bonding stability of the optical elements 4, reduce optical path deviation caused by the excessive thermal expansion coefficient of copper, and significantly improve the reliability of the product.

[0036] By using stepped plates 5 of different thicknesses to elevate the optical element 4, the height of the optical element 4 is matched with the corresponding chip 3. The same set of optical elements 4 can be used for chips 3 at different heights, reducing the types of parts and lowering costs.

[0037] The optical structure of this application is described below:

[0038] Reference Figure 2 and Figure 3 The optical element 4 includes a lens group 41 corresponding to the position of the chip 3, a polarizing beam combiner 42, and several reflectors 43. Two sets of lens groups 41 and chip 3 are symmetrically arranged. The two sets of optical paths are merged by the polarizing beam combiner 42, and the reflectors 43 are used to adjust the orientation of the optical path.

[0039] An optical fiber mounting base 13 is fixed on the base plate 1, and the end of the output optical fiber 11 is located in the central hole of the optical fiber mounting base 13. Two identical convex lenses 44 are fixed on the base plate 1. The two convex lenses 44 are located between the polarization combining prism 42 and the optical path of the output optical fiber 11. The convex lenses 44 are cylindrical, one of which is vertically set and the other is horizontally set.

[0040] Two convex lenses 44 focus the light rays in the horizontal and vertical directions, respectively, so that the light rays are concentrated at the end of the output optical fiber 11. Since the two convex lenses 44 have the same structure but different installation angles, the number of parts can be reduced, the manufacturing cost can be lowered, and the production cost of the convex lens 44 as a column is also lower.

[0041] The implementation principle of the assembly structure of a semiconductor laser chip and optical path according to an embodiment of this application is as follows: Compared with the integrated processing design, the use of multiple bases 2 spaced apart significantly reduces the use of copper material, reduces weight, and eliminates the need to process steps on the base plate 1, reducing CNC machining time. The use of ceramic or glass step plates 5 can increase the bonding stability of optical components 4, reduce optical path deviation caused by the excessive thermal expansion coefficient of copper, and significantly improve product reliability.

[0042] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An assembly structure of a semiconductor laser chip and an optical path, comprising a base plate (1), an output optical fiber (11), and a plurality of chips (3), a plurality of optical elements (4), characterized in that: Multiple bases (2) are fixed on the base plate (1) by welding. Each base (2) has three chips (3) installed on it. The mounting surfaces of the chips (3) on the base (2) are arranged in a gradient, and there is a gap between adjacent bases (2).

2. The assembly of a semiconductor laser chip and an optical path according to claim 1, characterized in that: The top surface of the base (2) is provided with a groove (21), the bottom of the groove (21) is arc-shaped, the two ends of the groove (21) are connected to the two side walls of the base (2), and the groove (21) is located between adjacent chips (3).

3. The assembly structure of a semiconductor laser chip and an optical path according to claim 1, characterized in that: Multiple ceramic or glass step plates (5) are fixed on the base plate (1), and the optical element (4) is fixed on the step plate (5).

4. The assembly of a semiconductor laser chip and an optical path according to claim 3, characterized in that: According to the arrangement direction of the base (2), the step plate (5) is also arranged in a gradient; as the thickness of the base (2) increases, the thickness of the corresponding step plate (5) also increases.

5. The assembly of a semiconductor laser chip and an optical path according to claim 1, characterized in that: A heat-conducting plate (22) is provided between the base (2) and the bottom plate (1).

6. The assembly structure of a semiconductor laser chip and optical path according to claim 1, characterized in that: The optical element (4) includes a lens group (41) corresponding to the position of the chip (3), a polarizing beam combiner (42), and several mirrors (43). Two sets of the lens group (41) and the chip (3) are symmetrically arranged, and the two sets of optical paths are merged through the polarizing beam combiner (42).

7. The assembly structure of a semiconductor laser chip and optical path according to claim 6, characterized in that: An optical fiber mounting base (13) is fixed on the base plate (1), and the end of the output optical fiber (11) is located in the central hole of the optical fiber mounting base (13).

8. The assembly structure of a semiconductor laser chip and optical path according to claim 7, characterized in that: Two identical convex lenses (44) are fixed on the base plate (1). The two convex lenses (44) are located between the polarization beam combiner prism (42) and the output optical fiber (11). The convex lenses (44) are cylindrical, one of which is vertically set and the other is horizontally set.

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