A shared link for radio frequency transceiver channels and an AC front-end board

Abstract

This utility model discloses a shared link for radio frequency transceiver channels and an AC front-end board, including pads with a pair of matching traces connected to the pads, the other ends of which form differential connection terminals; two sets of connection leads, including a first connection lead and a second connection lead, which are respectively used to form candidate differential connection branches; and connection capacitors, including a first connection capacitor and a second connection capacitor. This shared link for radio frequency transceiver channels and AC front-end board enables selective access of the same differential signal link between different candidate differential connection branches by setting the shared link on the AC front-end board, thereby reducing the need for analog switch chips, redundant coupling capacitors, and related connection devices in traditional multi-interface gating structures. Simultaneously, since the shared link structure reduces the number of parallel interface paths, it helps to reduce the board-level wiring density of the AC front-end board.

Description

Technical Field

[0001] This utility model relates to the technical field of signal transmission, and in particular to a radio frequency transceiver channel shared link and AC front-end board. Background Technology

[0002] In the field of quantum measurement and control equipment, leading international manufacturers have launched a variety of high-performance integrated measurement and control equipment. These devices typically integrate modules such as multi-channel arbitrary waveform generators (AWG), analog-to-digital converters (ADC), and microwave signal sources. They feature high sampling rates, low phase noise, and high-precision fast readout, which can meet the stringent requirements of quantum bits for timing synchronization and signal fidelity.

[0003] In this type of equipment, the AC front-end board is typically used to connect and adapt external signal interfaces to internal signal links. To accommodate different input / output interface types, existing AC front-end boards usually have multiple different input / output interfaces and use analog switch chips to select and switch between each signal interface. Simultaneously, the input and output terminals of the analog switch chip must be connected one-to-one to each external signal port via coupling capacitors to meet the access requirements of different signal links.

[0004] However, in practical applications, the above structure still has the following shortcomings: First, among multiple input / output interfaces, often only one port participates in signal connection during long-term use, while the other ports and their corresponding connectors, coupling capacitors, and other devices remain idle for a long time, resulting in hardware resource redundancy and low device utilization; Second, the analog switch chip itself is expensive, and multiple sets of coupling capacitors and related passive devices are required to support multi-interface switching, further increasing the overall material cost; Third, there may be a slight leakage current inside the analog switch chip, which affects the fidelity of high-frequency signals.

[0005] Therefore, existing technologies urgently need a new AC front-end board connection structure to meet the selection requirements of different input / output interfaces while reducing the dependence on analog switch chips and multiple one-to-one connection structures, thereby reducing device redundancy and material costs, and simplifying board-level layout and routing. Utility Model Content

[0006] In view of the problems of device redundancy, high material cost and insufficient simplification of high-frequency signal paths in the existing AC front-end board multi-interface selection structure, this utility model is proposed.

[0007] Therefore, one of the objectives of this utility model is to provide a shared link for radio frequency transceiver channels, the purpose of which is to provide a shared link structure that allows the differential connection end to selectively connect to different candidate differential connection branches by setting different connection capacitors.

[0008] To solve the above technical problems, this utility model provides the following technical solution: a shared link for a radio frequency transceiver channel, including pads, with a pair of matching traces connected to the pads, the other end of which forms a differential connection terminal; two sets of connecting leads, including a first connecting lead and a second connecting lead, the first connecting lead and the second connecting lead respectively used to form candidate differential connection branches; connecting capacitors, including a first connecting capacitor and a second connecting capacitor; wherein, a first mounting gap is formed between the first connecting lead and the differential connection terminal for the first connecting capacitor to be connected; a second mounting gap is formed between the second connecting lead and the differential connection terminal for the second connecting capacitor to be connected; the length of the first connecting capacitor is adapted to the first mounting gap so that the differential connection terminal is selectively connected to the first connecting lead; the length of the second connecting capacitor is adapted to the second mounting gap so that the differential connection terminal is selectively connected to the second connecting lead; one of the first connecting capacitor and the second connecting capacitor is selectively provided.

[0009] In a preferred embodiment of the shared radio frequency transceiver channel link described in this utility model, the first installation spacing and the second installation spacing are equal.

[0010] In a preferred embodiment of the shared RF transceiver channel link described in this utility model, the first installation spacing is not equal to the second installation spacing.

[0011] As a preferred embodiment of the shared link for the radio frequency transceiver channel described in this utility model, the matching trace consists of several connection segments, which are alternately distributed along the direction from the pad to the connection lead, and the pair of matching traces maintains mirror symmetry throughout the entire path.

[0012] As a preferred embodiment of the shared link for the radio frequency transceiver channel described in this utility model, the connecting segment is a straight line segment, and the adjacent connecting segments are all broken line structures with an included angle of 135°, and the turning directions between two adjacent connecting segments are opposite, forming a serpentine structure to achieve differential pair equal length matching.

[0013] As a preferred embodiment of the shared link for the radio frequency transceiver channel described in this utility model, the connecting segment is an arc segment, adjacent connecting segments are connected by a rounded corner structure, and the turning directions between two adjacent connecting segments are opposite, forming a serpentine structure to achieve differential pair equal length matching.

[0014] In a preferred embodiment of the shared link for the radio frequency transceiver channel described in this utility model, the pin 8 of the pad is connected to the pin 1 of the RF port through a third connecting capacitor, and the pins 2, 4, 6, 7, 9, 10, 11, 12, and 13 of the pad are all connected to ground, and the pins 2, 3, 4, 5, and 6 of the RF port are all connected to ground.

[0015] The beneficial effects of this utility model are as follows: By setting pads, candidate differential connection branches, and a pair of matching traces connected to the pads, and by selectively setting connection capacitors adapted to different mounting spacings, the differential connection terminals can selectively connect to different candidate differential connection branches, thereby meeting the different differential signal access requirements while realizing branch switching under a shared link structure. Compared with the method of using analog switch chips and multiple sets of one-to-one interface connections, this utility model can reduce redundant device settings, reduce hardware resource occupation and material costs, and at the same time help simplify board-level connection relationships.

[0016] Another objective of this invention is to provide an AC front-end board, which aims to provide an AC front-end board that adopts the above-mentioned shared link for radio frequency transceiver channels, reduces device redundancy in the multi-interface gating structure, and reduces board-level wiring complexity.

[0017] To solve the above-mentioned technical problems, this utility model provides the following technical solution: an AC front-end board, including the aforementioned radio frequency transceiver channel shared link, and a processor disposed at one end of the radio frequency transceiver channel shared link; a circuit board interface assembly, including a first connector and a second connector; and mounting holes, including a first mounting hole and a second mounting hole, both of which are connected to ground.

[0018] As a preferred embodiment of the AC front-end board of this utility model, it further includes a plurality of grounding vias, which are disposed between a plurality of radio frequency transceiver channels sharing a common link.

[0019] In a preferred embodiment of the AC front-end board of this utility model, pins 7, 10, 13, 16, 19, 22, 25, and 28 of the first connector are connected to external ADC signals; pins 3, 6, 9, 12, 15, 18, 21, and 24 of the second connector are connected to external DAC signals.

[0020] The beneficial effects of this utility model are as follows: By setting the above-mentioned shared link for RF transceiver channels on the AC front-end board, the same differential signal link can selectively access different candidate differential connection branches, thereby reducing the setting of analog switch chips, redundant coupling capacitors and related connection devices in the traditional multi-interface gating structure; at the same time, since the shared link structure can reduce the number of parallel interface paths, it is beneficial to reduce the board-level wiring density of the AC front-end board, simplify the layout and wiring design, and reduce the design and debugging difficulty caused by the concentration of traces. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 The diagram shows an enlarged connection lead structure at point A in the circuit structure of the AC front-end board of Embodiment 1.

[0023] Figure 2 A schematic diagram of the circuit connection structure in DAC mode is shown.

[0024] Figure 3 A schematic diagram of the circuit connection structure in ADC mode is shown.

[0025] Figure 4 A schematic diagram of the circuit structure of Embodiment 2 is shown.

[0026] Figure 5 A schematic diagram of the circuit structure of Embodiment 3 is shown.

[0027] Figure 6 A schematic diagram of a circuit structure for connecting leads is shown.

[0028] Figure 7 A schematic diagram of another circuit structure for connecting leads is shown.

[0029] Figure 8 A schematic diagram of the circuit structure of a shared link for radio frequency transceiver channels is shown.

[0030] Figure 9 A schematic diagram of the circuit structure of the AC front-end board is shown.

[0031] Figure 10 A schematic diagram of the circuit structure of the first connector is shown.

[0032] Figure 11 A schematic diagram of the circuit structure of the second connector is shown.

[0033] Figure 12 A schematic diagram of the circuit structure for the first mounting hole is shown.

[0034] Figure 13 A schematic diagram of the circuit structure for the second mounting hole is shown.

[0035] In the diagram: 100, pad; 101, mating trace; T, differential connection terminal; 1011, connection segment; 102, third connection capacitor; 200, connection lead; 201, first connection lead; 202, second connection lead; 300, connection capacitor; 301, first connection capacitor; 302, second connection capacitor; D1, first mounting spacing; D2, second mounting spacing; 400, RF port; 500, circuit board interface assembly; 501, first connector; 502, second connector; 600, mounting hole; 601, first mounting hole; 602, second mounting hole; 700, grounding via; 800, processor. Detailed Implementation

[0036] To enable those skilled in the art to better understand this utility model, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0037] The terminology used in this invention refers to those general terms currently widely used in the art in consideration of the functionality of this invention; however, these terms may vary according to the intent, precedent, or new technology of those skilled in the art. Furthermore, specific terms may be chosen by the applicant, and in such cases, their detailed meanings will be described in the detailed description of this invention. Therefore, the terminology used in this specification should not be construed as simple names, but rather based on the meaning of the terms and the overall description of this invention.

[0038] Example 1, referring to Figures 1-3This is the first embodiment of the present invention, providing a shared link for a radio frequency transceiver channel. The device includes a pad 100 connected to a pair of matching traces 101, the other end of which forms a differential connection terminal T; two sets of connection leads 200, including a first connection lead 201 and a second connection lead 202, which are respectively used to form candidate differential connection branches; and a connection capacitor 300, including a first connection capacitor 301 and a second connection capacitor 302; wherein the first connection lead 201 is connected to the differential connection... A first mounting gap D1 is formed between terminals T for the first connecting capacitor 301 to be connected; a second mounting gap D2 is formed between the second connecting lead 202 and the differential connection terminal T for the second connecting capacitor 302 to be connected; the length of the first connecting capacitor 301 is adapted to the first mounting gap D1 so that the differential connection terminal T is selectively connected to the first connecting lead 201; the length of the second connecting capacitor 302 is adapted to the second mounting gap D2 so that the differential connection terminal T is selectively connected to the second connecting lead 202; one of the first connecting capacitor 301 and the second connecting capacitor 302 is selected.

[0039] In this embodiment, pins 1 to 12 on pad 100 are used to solder to the pins of the subsequent processor 800. Specifically, pins 1 and 3 are soldered to the SE and SE DOT ports on the processor 800, pin 8 is soldered to the PRI DOT port on the processor 800, and the remaining pins 2, 4 to 7, and 9 to 12 are soldered to the GND and NC1 to NC8 ports on the processor 800, respectively.

[0040] In this embodiment, reference Figure 1 ,for Figure 9 The enlarged view of point A in the circuit structure of the AC front-end board shows that the first connecting lead 201 and the second connecting lead 202 are respectively located at the candidate connection positions of the differential connection terminal T, used to form different differential connection branches under different assembly requirements. The first mounting spacing D1 and the second mounting spacing D2 can be set to the same value, or they can be set to different spacings according to the different package sizes of the first connecting capacitor 301 and the second connecting capacitor 302, so as to adapt to different models of connecting capacitors and realize the differentiation of different candidate differential connection branches.

[0041] Furthermore, the matching traces 101 are preferably a pair of differential traces, and the two matching traces 101 are arranged in a mirror-symmetric manner with respect to the central axis. By setting the matching traces 101, on the one hand, a common impedance-matched differential transmission segment can be provided between the pad 100 and the candidate differential connection branch; on the other hand, by adjusting the trace length and end position, a suitable connection position can be provided for the selective assembly of the first connection capacitor 301 or the second connection capacitor 302.

[0042] In one assembly state, refer to Figure 2 When it is necessary to establish a connection between the differential connection terminal T and the first connection lead 201, a first connection capacitor 301 is set at the position corresponding to the first mounting spacing D1. Since the length of the first connection capacitor 301 is adapted to the first mounting spacing D1, the differential connection terminal T and the first connection lead 201 can be connected through the first connection capacitor 301, thereby forming a differential connection branch that is output or input through the first connection lead 201.

[0043] In another assembly configuration, refer to Figure 3 When it is necessary to establish a connection between the differential connection terminal T and the second connection lead 202, a second connection capacitor 302 is installed at the position corresponding to the second mounting spacing D2. Since the length of the second connection capacitor 302 is adapted to the second mounting spacing D2, the differential connection terminal T and the second connection lead 202 can be connected through the second connection capacitor 302, thereby forming a differential connection branch that is output or input through the second connection lead 202.

[0044] In this context, DAC mode means the conversion from the internal digital domain to the external analog domain, while ADC mode means the conversion from the external analog domain to the internal digital domain.

[0045] In one application scenario, when the first connecting capacitor 301 is set at the position corresponding to the first mounting spacing D1, the shared link of the RF transceiver channel operates in DAC mode. The differential signal is transmitted from the first connecting lead 201 through the first connecting capacitor 301 and the matching trace 101 towards the pad 100. Since the first connecting lead 201 is a relatively long impedance matching segment, it can provide sufficient impedance transition length before the differential signal enters the pad 100. This is beneficial for pre-matching the differential signal on the DAC output side, reducing reflection and impedance abrupt changes when the signal enters the common differential transition section, and improving the stability of the differential signal output in this mode.

[0046] When the second connecting capacitor 302 is installed at the position corresponding to the second mounting spacing D2, the shared link of the RF transceiver channel operates in ADC mode. The differential signal is transmitted from the pad 100 through the matching trace 101 and the second connecting capacitor 302 to the second connecting lead 202. Since the second connecting lead 202 is a through-board cable, it can directly lead the differential signal collected by the pad 100 and the matching trace 101 to the outside of the board or the next level acquisition path. This helps to shorten the connection path of the signal transitioning from the common link inside the board to the through-board transmission path, reduces intermediate transfer structures, and improves the compactness and transmission convenience of the signal acquisition path in ADC mode.

[0047] Therefore, in this embodiment, by setting a common differential connection terminal T, two sets of candidate differential connection branches, and connection capacitors adapted to different installation spacings, the first connection capacitor 301 or the second connection capacitor 302 can be selectively set according to actual needs during assembly, thereby allowing the differential connection terminal T to selectively connect to the first connection lead 201 or the second connection lead 202. Under this structure, it is not necessary to set up complete independent links for different branches, which can meet the different differential signal access requirements while realizing branch switching under a shared link structure, and is beneficial for reducing redundant device settings, simplifying connection relationships, and reducing design complexity.

[0048] Example 2, refer to Figure 4 This is the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that the first installation spacing D1 is equal to the second installation spacing D2.

[0049] Compared to Embodiment 1, in this embodiment, the first mounting spacing D1 between the differential connection terminal T and the first connecting lead 201 and the second mounting spacing D2 between the differential connection terminal T and the second connecting lead 202 are set to the same value, i.e., the first mounting spacing D1 = the second mounting spacing D2. In this structure, the first connecting capacitor 301 and the second connecting capacitor 302 can be configured with the same or similar package size to meet the connectivity requirements between the differential connection terminal T and different candidate differential connection branches.

[0050] In one assembly state, when it is necessary to establish a connection between the differential connection terminal T and the first connection lead 201, a first connection capacitor 301 is set at the position corresponding to the first mounting spacing D1. Since the first connection capacitor 301 is compatible with the first mounting spacing D1, the differential connection terminal T and the first connection lead 201 can be connected through the first connection capacitor 301, thereby forming a differential connection branch transmitted through the first connection lead 201.

[0051] In another assembly configuration, when it is necessary to establish a connection between the differential connection terminal T and the second connection lead 202, a second connection capacitor 302 is installed at a position corresponding to the second mounting spacing D2. Since the second connection capacitor 302 is compatible with the second mounting spacing D2, the differential connection terminal T and the second connection lead 202 can be connected through the second connection capacitor 302, thereby forming a differential connection branch transmitted via the second connection lead 202.

[0052] Since the first mounting spacing D1 and the second mounting spacing D2 are equal, when switching between the two candidate differential connection branches, it is not necessary to change the overall mounting spacing layout of the area corresponding to the differential connection terminal T. The connection between different candidate differential connection branches can be achieved by selectively setting a connection capacitor 300. This solution has a relatively simple structure, facilitates a unified layout design of the pad area, and can reduce the impact of dimensional differences in the mounting area on the board layout design while meeting connectivity requirements.

[0053] In this embodiment, setting the first installation spacing D1 and the second installation spacing D2 to be equal can be used as a basic implementation scheme. In this scheme, the differential connection terminal T is connected to the first connection lead 201 and the second connection lead 202 through installation areas with the same spacing, which is suitable for application scenarios where the requirements for distinguishing assembly positions are low, but it is desirable to achieve switching of candidate differential connection branches.

[0054] The remaining structure is the same as that in Example 1.

[0055] Example 3, referring to Figure 5 This is the third embodiment of the present invention. The difference between this embodiment and the second embodiment is that the first installation spacing D1 is not equal to the second installation spacing D2.

[0056] Compared to Embodiment 2, as a further optimization of Embodiment 2, the first mounting spacing D1 and the second mounting spacing D2 between the differential connection terminal T and the two sets of connecting leads 200 are set to different values, that is, the first mounting spacing D1 ≠ the second mounting spacing D2. The connecting capacitor 300 includes a first connecting capacitor 301 and a second connecting capacitor 302, wherein the body length of the first connecting capacitor 301 is adapted to the first mounting spacing D1, and the body length of the second connecting capacitor 302 is adapted to the second mounting spacing D2. Thus, the first connecting capacitor 301 is used to bridge the differential connection terminal T and the first connecting lead 201, and the second connecting capacitor 302 is used to bridge the differential connection terminal T and the second connecting lead 202.

[0057] In one assembly state, when it is necessary to establish a connection between the differential connection terminal T and the first connection lead 201, a first connection capacitor 301 is set at the position corresponding to the first mounting spacing D1. Since the length of the first connection capacitor 301 is adapted to the first mounting spacing D1, the differential connection terminal T and the first connection lead 201 can be connected through the first connection capacitor 301, thereby forming a differential connection branch transmitted through the first connection lead 201.

[0058] In another assembly configuration, when it is necessary to establish a connection between the differential connection terminal T and the second connection lead 202, a second connection capacitor 302 is installed at a position corresponding to the second mounting spacing D2. Since the length of the second connection capacitor 302 is adapted to the second mounting spacing D2, the differential connection terminal T and the second connection lead 202 can be connected through the second connection capacitor 302, thereby forming a differential connection branch transmitted via the second connection lead 202.

[0059] Since the first mounting spacing D1 and the second mounting spacing D2 are different physical spacings, and the first connecting capacitor 301 and the second connecting capacitor 302 are respectively adapted to their corresponding mounting spacings, the first connecting capacitor 301 is only suitable for being placed at the position corresponding to the first mounting spacing D1, and the second connecting capacitor 302 is only suitable for being placed at the position corresponding to the second mounting spacing D2. When the connecting capacitors are placed in mismatched positions, it is easy for the pins to fail to be reliably connected simultaneously or for the soldering status to be abnormal, thus creating a constraint relationship in the structure that distinguishes the assembly positions.

[0060] Therefore, in this embodiment, by setting the first mounting spacing D1 and the second mounting spacing D2 to different values, and by adapting the first connecting capacitor 301 and the second connecting capacitor 302 to their respective mounting spacings, the differential connection terminal T can achieve differentiated assembly and selective connection between different candidate differential connection branches. This structure not only helps reduce the risk of missetting connection positions during assembly, but also enables on-demand switching between different connection branches without changing the structure of the common differential transition section.

[0061] The remaining structure is the same as that in Example 2.

[0062] Example 4, refer to Figures 6-8 This is the fourth embodiment of the present invention. The difference between this embodiment and the third embodiment is that the matching trace 101 is composed of a number of connecting segments 1011. The connecting segments 1011 are alternately distributed along the direction from the pad 100 to the connecting lead 200, and the pair of matching traces 101 maintains mirror symmetry throughout the entire path.

[0063] Connecting segment 1011 is a straight line segment. The adjacent connecting segments 1011 are all broken line structures with an included angle of 135°, and the turning directions between two adjacent connecting segments 1011 are opposite, forming a serpentine structure to achieve differential pair equal length matching.

[0064] The connecting segment 1011 is an arc segment. Adjacent connecting segments 1011 are connected by a rounded corner structure, and the turning directions between two adjacent connecting segments 1011 are opposite, forming a serpentine structure to achieve differential pair equal length matching.

[0065] Pin 8 of pad 100 is connected to pin 1 of RF port 400 via a third connecting capacitor 102, and pins 2, 4, 6, 7, 9, 10, 11, 12, and 13 of pad 100 are all connected to ground, and pins 2, 3, 4, 5, and 6 of RF port 400 are all connected to ground.

[0066] Compared to Embodiment 3, in this embodiment, the pair of matching traces 101 disposed between the pad 100 and the candidate differential connection branch are composed of several connection segments 1011. Each connection segment 1011 is alternately distributed along the direction from the pad 100 to the connection lead 200, ensuring that the two matching traces 101 maintain mirror symmetry along the overall path, thereby forming a common differential transition segment. This structural arrangement allows for adjustment of the total length of the matching traces 101 within a limited board space, and also ensures high consistency between the two differential traces along the transmission path.

[0067] In one specific embodiment, the connecting segment 1011 is a straight segment, and adjacent connecting segments 1011 are connected by a broken line structure with a 135° included angle, and the turning directions between two adjacent connecting segments 1011 are opposite, thereby forming a serpentine routing structure. This serpentine structure allows for extending the routing length without significantly increasing board space occupancy, which is beneficial for equal-length compensation of two matching routing lines 101 and improves length consistency in the differential transmission path.

[0068] In another specific embodiment, the connecting segment 1011 is an arc segment, and adjacent connecting segments 1011 are smoothly connected by a rounded corner structure. Furthermore, the turning directions between two adjacent connecting segments 1011 are opposite, thus forming a serpentine routing structure. Compared to a broken line structure, the rounded corner transition between arc segments makes the routing transitions smoother, which helps improve the impedance continuity in the routing transition area and reduces the impact of signal discontinuities at the transition points.

[0069] Furthermore, in this embodiment, pin 8 of pad 100 is connected to pin 1 of RF port 400 via a third connecting capacitor 102 to form a coupling connection path for radio frequency signals. Simultaneously, pins 2, 4, 6, 7, 9, 10, 11, 12, and 13 of pad 100 and pins 2, 3, 4, 5, and 6 of RF port 400 are all connected to ground. Through this grounding structure, a relatively stable reference ground environment can be formed near pad 100 and matching trace 101, thereby facilitating the provision of a stable return path for differential signal transmission and improving the transmission environment under high-frequency operating conditions.

[0070] In this embodiment, by setting a pair of matching traces 101 as a mirror-symmetric structure composed of multiple connecting segments 1011, and combining it with a serpentine extension method of broken lines or arcs, both length compensation and structural compactness can be taken into account in the common differential transition section; at the same time, through the connection relationship between the third connecting capacitor 102 and the RF port 400, the shared link can be made more suitable for high-frequency differential signal transmission scenarios.

[0071] Pin 1 of RF port 400 is the external connection pin, and pins 2 to 6 are the ground pins.

[0072] The remaining structure is the same as that in Example 3.

[0073] Example 5, refer to Figures 9-13 This is the fifth embodiment of the present invention, which differs from the fourth embodiment in that it provides an AC front-end board, including several shared links for radio frequency transceiver channels, and a processor 800 disposed at one end of the shared links; a circuit board interface assembly 500, including a first connector 501 and a second connector 502; mounting holes 600, including a first mounting hole 601 and a second mounting hole 602, both of which are connected to ground; and several grounding vias 700 disposed between the shared links; pins 7, 10, 13, 16, 19, 22, 25, and 28 of the first connector 501 are connected to an external ADC signal; pins 3, 6, 9, 12, 15, 18, 21, and 24 of the second connector 502 are connected to an external DAC signal.

[0074] Compared to Embodiment 4, this embodiment further provides an AC front-end board with an integrated RF transceiver channel shared link, which can be used in highly integrated signal acquisition or control platforms. By setting several RF transceiver channel shared links on the same front-end board, different differential signal links can be centrally deployed within the board, and selective access can be achieved among different candidate differential connection branches by selectively setting the connecting capacitor 300.

[0075] Among them, SE and SE DOT on the processor 800 are secondary differential signal ports, which together form a pair of balanced differential signal terminals. PRI DOT is the primary single-ended signal port, GND is the ground terminal, and NC1 to NC8 are all internal pins without connections.

[0076] The circuit board interface assembly 500 is located at the edge of the AC front-end board and is used to realize the signal connection between this AC front-end board and an external motherboard or other sub-modules. The first connector 501 is mainly used to connect an external ADC chip, and the second connector 502 is mainly used to connect an external DAC chip. By setting the first connector 501 and the second connector 502, the AC front-end board can be connected to different functional modules respectively, thereby meeting the access requirements under different signal input and output scenarios.

[0077] In this context, A01~A30 and B01~B30 on J1-1 are connection contacts of the first connector 501. Contacts B07, B10, B13, B16, B19, B22, B25, and B28 are paired to form differential signal pairs. When the RF transceiver channel operates in ADC mode, the analog signal output by the processor 800 is sent to the subsequent ADC chip for sampling. ADC_224_VIN_N0, ADC_224_VIN_N1, ADC_225_VIN_N0, ADC_225_VIN_N1, ADC_226_VIN_N0, ADC_226_VIN_N1, ADC_227_VIN_N0, and ADC_227_VIN_N1 all represent the signals received by the subsequent ADC chip.

[0078] On J2-1, A01~A30 and B01~B30 are connection contacts of the second connector 502. Contacts B03, B06, B09, B12, B15, B18, B21, and B24 are paired to form differential signal pairs. When the RF transceiver channel operates in DAC mode, these pairs receive analog signals from the subsequent DAC chip and input them to the processor 800 for integration. DAC_228_VIN_N0, DAC_228_VIN_N1, DAC_229_VIN_N0, DAC_229_VIN_N1, DAC_230_VIN_N0, DAC_230_VIN_N1, DAC_231_VIN_N0, and DAC_231_VIN_N1 all represent signals output by the subsequent DAC chip.

[0079] Furthermore, mounting holes 600 are provided in the fixing area of ​​the AC front-end board to realize the installation and fixing of the board body on the system housing or carrier plate, and at the same time form a grounding path. The first mounting hole 601 can be used as the main fixing hole, and the second mounting hole 602 can cooperate with the first mounting hole 601 to form an auxiliary positioning structure, thereby helping to improve the structural stability and assembly positioning accuracy of the AC front-end board after installation.

[0080] in, Figure 12 U1 to U4 are the codes for holes, and all four holes belong to the first mounting hole 601. Figure 13 U21~U30, U33~U42, and U45~U54 are all hole codes, and all 27 holes belong to the second mounting hole 602.

[0081] Preferably, refer to Figure 12 and Figure 13 The diameter of the first mounting hole 601 can be set to fit the size of a standard fastener, and the diameter of the second mounting hole 602 can be set to fit the size of an auxiliary positioning component or a grounding elastic component. By adapting the diameters of the two mounting holes, it is beneficial to balance installation strength, assembly versatility, and grounding connection requirements.

[0082] In addition, several grounding vias 700 are connected to the internal ground line of the PCB and share a common ground with the grounding terminals of key modules such as the processor 800 and RF port 400. By setting grounding vias 700 between several RF transceiver channels sharing a common link, a low-impedance common ground reference path can be formed within the board, which helps to improve the grounding environment during high-frequency signal transmission and reduce the risk of crosstalk between adjacent signal links.

[0083] In this embodiment, external signals can enter the AC front-end board via the first connector 501 or the second connector 502, and be transmitted and processed through the corresponding shared RF transceiver channel link. Since the AC front-end board employs the aforementioned shared RF transceiver channel link structure, it can meet the different differential signal access requirements while reducing the need for analog switch chips and redundant coupling capacitors in traditional multi-interface selection structures. This helps reduce device redundancy, simplify board-level connections, and improve the overall wiring organization of the AC front-end board.

[0084] The remaining structure is the same as that in Example 4.

[0085] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0086] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.

[0087] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A shared link for radio frequency transceiver channels, characterized in that: include, A pad (100) is connected to a pair of mating traces (101), the other end of which forms a differential connection terminal (T). Two sets of connecting leads (200) include a first connecting lead (201) and a second connecting lead (202), wherein the first connecting lead (201) and the second connecting lead (202) are respectively used to form candidate differential connection branches; The connecting capacitor (300) includes a first connecting capacitor (301) and a second connecting capacitor (302); Wherein, a first mounting gap (D1) is formed between the first connecting lead (201) and the differential connection terminal (T) for the first connecting capacitor (301) to be connected; A second mounting gap (D2) is formed between the second connecting lead (202) and the differential connection terminal (T) for the second connecting capacitor (302) to be connected. The length of the first connecting capacitor (301) is adapted to the first mounting spacing (D1) so that the differential connection terminal (T) is selectively connected to the first connecting lead (201); The length of the second connecting capacitor (302) is adapted to the second mounting spacing (D2) so that the differential connection terminal (T) can be selectively connected to the second connecting lead (202); The first connecting capacitor (301) and the second connecting capacitor (302) are selected to be provided.

2. The shared radio frequency transceiver channel link according to claim 1, characterized in that: The first installation spacing (D1) and the second installation spacing (D2) are equal.

3. The shared radio frequency transceiver channel link according to claim 1, characterized in that: The first installation spacing (D1) is not equal to the second installation spacing (D2).

4. The shared radio frequency transceiver channel link according to any one of claims 1 to 3, characterized in that: The matching trace (101) consists of a number of connection segments (1011), which are alternately distributed along the direction from the pad (100) to the connection lead (200), and the pair of matching traces (101) maintains mirror symmetry throughout the path.

5. The shared radio frequency transceiver channel link according to claim 4, characterized in that: The connecting segment (1011) is a straight line segment. The adjacent connecting segments (1011) are all broken line structures with an included angle of 135°. The turning directions between two adjacent connecting segments (1011) are opposite, forming a serpentine structure to achieve differential pair equal length matching.

6. The shared radio frequency transceiver channel link according to claim 4, characterized in that: The connecting segment (1011) is an arc segment. Adjacent connecting segments (1011) are connected by a rounded corner structure, and the turning directions between two adjacent connecting segments (1011) are opposite, forming a serpentine structure to achieve differential pair equal length matching.

7. The shared radio frequency transceiver channel link according to any one of claims 1, 2, 3, 5 or 6, characterized in that: The pin 8 of the pad (100) is connected to the pin 1 of the RF port (400) through the third connecting capacitor (102), and the pins 2, 4, 6, 7, 9, 10, 11, 12 and 13 of the pad (100) are all connected to ground, and the pins 2, 3, 4, 5 and 6 of the RF port (400) are all connected to ground.

8. An AC front-end board, characterized in that: The radio frequency transceiver channel shared link as described in any one of claims 1 to 7, and further includes a processor (800) disposed at one end of the radio frequency transceiver channel shared link; A circuit board interface assembly (500) includes a first connector (501) and a second connector (502); The mounting hole (600) includes a first mounting hole (601) and a second mounting hole (602), both of which are connected to ground.

9. The AC front-end board according to claim 8, characterized in that: It also includes several grounding vias (700), which are disposed between several radio frequency transceiver channels sharing a common link.

10. The AC front-end board according to claim 8 or 9, characterized in that: Pins 7, 10, 13, 16, 19, 22, 25, and 28 of the first connector (501) are connected to an external ADC signal; Pins 3, 6, 9, 12, 15, 18, 21, and 24 of the second connector (502) are connected to external DAC signals.

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