motor controller

Abstract

This application provides a motor controller, including a housing, a double-layer circuit board, and a heat dissipation frame. The housing includes a notch. The double-layer circuit board is assembled inside the housing. The heat dissipation frame is assembled inside the housing. The heat dissipation frame includes a heat dissipation bracket and heat dissipation teeth disposed on the heat dissipation bracket. The double-layer circuit board is respectively disposed on both sides of the heat dissipation bracket, and the heat dissipation teeth are located at the notch and exposed outside the notch. The motor controller of this application, by setting a notch in the housing, placing the heat dissipation teeth at the notch and exposing them, and placing the double-layer circuit board on both sides of the heat dissipation bracket, achieves heat dissipation through the heat dissipation bracket and heat dissipation teeth. While meeting the functional module requirements of different power levels, it improves the heat dissipation effect, thereby meeting heat dissipation requirements and improving the user experience.

Description

Technical Field

[0001] This application relates to the field of servo control technology, and in particular to a motor controller. Background Technology

[0002] With the rapid development of industry, intelligent manufacturing, and the Internet of Things, the demand for motor controllers is continuously increasing. As a core component, the application scope of motor controllers is also expanding. In the future, motor controllers are expected to achieve new breakthroughs in performance, functionality, and applications. Motor controllers have a wide power range. For motor controllers with different power ratings (large, medium, and small), the functional module requirements and heat dissipation requirements vary. Current motor controllers cannot simultaneously meet the functional module requirements and heat dissipation requirements of different power ratings. Utility Model Content

[0003] This application provides a motor controller that can simultaneously meet the functional module requirements and heat dissipation requirements of different power levels.

[0004] This application provides a motor controller, including:

[0005] The casing, including the notch;

[0006] A double-layer circuit board is assembled inside the housing; and

[0007] A heat dissipation frame is assembled inside the housing; the heat dissipation frame includes a heat dissipation bracket and heat dissipation teeth disposed on the heat dissipation bracket, the double-layer circuit board is respectively disposed on both sides of the heat dissipation bracket, and the heat dissipation teeth are located at the notch and exposed outside the notch.

[0008] Preferably, the motor controller further includes a heat dissipation component assembled on the heat dissipation bracket; the heat dissipation component is exposed outside the notch and is located on the same side of the heat dissipation bracket as the heat dissipation teeth, and the heat dissipation channel of the heat dissipation component and the heat dissipation teeth are connected.

[0009] Preferably, the double-layer circuit board includes a motherboard and a driver board, the motherboard and the driver board being electrically connected; wherein the motherboard and the heat dissipation teeth are arranged side by side on one side of the heat dissipation bracket, the driver board is arranged on the other side of the heat dissipation bracket, and a portion of the driver board abuts against the heat dissipation teeth.

[0010] Preferably, the drive board includes a plurality of drive components, all protruding from the side of the drive board facing the heat dissipation bracket; some of the drive components abut against the heat dissipation bracket, and other drive components abut against the heat dissipation teeth; wherein, the power of the drive components abutting against the heat dissipation teeth is higher than the power of the other drive components abutting against the heat dissipation bracket.

[0011] Preferably, the drive board includes a drive capacitor protruding from the side of the drive board facing the heat dissipation bracket; the heat dissipation frame also includes a guide plate disposed on the heat dissipation bracket; the guide plate surrounds the periphery of the drive capacitor and forms a guide channel, and the guide channel is connected to the heat dissipation channel of the heat dissipation tooth.

[0012] Preferably, the motherboard has a clearance opening, and the driving capacitor is located in the clearance opening and is offset from the motherboard.

[0013] Preferably, the guide plate is located on the side of the heat dissipation bracket close to the heat dissipation teeth.

[0014] Preferably, the air guide plate is snapped together with the heat dissipation bracket.

[0015] Preferably, the motherboard includes multiple circuit components, all of which protrude from the side of the motherboard facing the heat sink bracket; the multiple circuit components abut against the heat sink bracket.

[0016] Preferably, the motherboard has multiple control ports; the driver board has multiple drive ports; the housing has multiple through holes corresponding to the multiple control ports and the multiple drive ports; when the motherboard and the driver board are assembled in the housing, the multiple control ports and the multiple drive ports are exposed through the multiple through holes.

[0017] Preferably, the motor controller further includes a display panel, which is assembled on one side of the double-layer circuit board and electrically connected to the double-layer circuit board; the display panel includes a digital display tube and buttons; the housing is provided with a display window corresponding to the digital display tube and the buttons; when the display panel is assembled inside the housing, the digital display tube and the buttons are exposed through the display window.

[0018] Preferably, the housing is further provided with a display cover plate, which is movably disposed at the display window to cover the display digital tube and the buttons.

[0019] Preferably, the housing further includes a display cover and a groove located below the display cover, the groove being located on both sides of the display window.

[0020] Preferably, the motor controller further includes a braking resistor, which is disposed on one side of the heat dissipation tooth and exposed outside the notch.

[0021] Preferably, the heat dissipation bracket and the heat dissipation teeth are an integral structure.

[0022] Preferably, the housing is provided with multiple heat dissipation holes.

[0023] Preferably, the heat dissipation frame includes an aluminum alloy heat dissipation frame.

[0024] The motor controller of this application embodiment includes a housing, a double-layer circuit board, and a heat dissipation frame. By setting a notch on the housing, heat dissipation teeth are set at the notch and exposed outside the notch, and the double-layer circuit board is respectively set on both sides of the heat dissipation bracket. The double-layer circuit board achieves heat dissipation through the heat dissipation bracket and heat dissipation teeth. While meeting the functional module requirements of different power, it improves the heat dissipation effect, thereby meeting the heat dissipation requirements and improving the user experience.

[0025] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0026] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0027] Figure 1 The diagram shown is a structural schematic of one embodiment of the motor controller of this application.

[0028] Figure 2 The diagram shown is a structural schematic of another embodiment of the motor controller of this application.

[0029] Figure 3 As shown Figure 2 The diagram shows the specific structure of the motor controller.

[0030] Figure 4 As shown Figure 2 The diagram shows a structural schematic of the motor controller from one perspective.

[0031] Figure 5 As shown Figure 2 The diagram shows another view of the motor controller.

[0032] Figure label:

[0033] Motor controller 1, housing 11, notch 111, through hole 112, display window 113, display cover 114, groove 115, heat dissipation hole 116, double-layer circuit board 12, main board 121, clearance port 1211, control port 1212, Type-C port 1212a, RJ45 communication port 1212b, control circuit terminal 1212c, first encoder interface 1212d, second encoder interface 1212e, driver board 122, drive capacitor 1221, drive port 1222, main circuit control port 1222a, drive capacitor charging port 1222b, indicator light 1222c, heat dissipation frame 13, heat dissipation bracket 131, heat dissipation teeth 132, flow guide plate 133, flow guide channel 134, heat dissipation component 14, display board 15, display digital tube 151, button 152, braking resistor 16. Detailed Implementation

[0034] The motor controller provided in the embodiments of this application will now be described in detail with reference to the accompanying drawings. Unless otherwise specified, the features of the various embodiments and implementation methods described below can be combined arbitrarily with each other.

[0035] The motor controller can be a servo motor controller. A servo motor controller can quickly track changes in commands and precisely control the position, speed, and torque of the servo motor, enabling it to accurately execute various actions. Working together, the two achieve high-precision motion control, exhibiting strong stability, good anti-interference capabilities, adaptability to various working conditions, and overload protection to ensure the safe operation of the servo motor.

[0036] Currently, motor controllers cover a wide power range. In terms of functional modules, low-power motor controllers typically use a single-layer circuit board, while medium- and high-power motor controllers generally use a double-layer circuit board. The modularity of circuitry between low, medium, and high-power motor controllers is weak, requiring separate circuit board development. Regarding heat dissipation, low-power motor controllers generally rely on natural cooling, while medium- and high-power motor controllers typically use air cooling. Because of the differences in power levels among motor controllers, the functional module requirements and heat dissipation requirements also differ, making it impossible to simultaneously meet the functional module requirements and heat dissipation needs of all power levels, thus reducing the user experience.

[0037] Therefore, this application provides a motor controller that can simultaneously meet the functional module requirements and heat dissipation requirements for large, medium and small power applications.

[0038] Figure 1 The diagram shown is a structural schematic of an embodiment of the motor controller 1 of this application. Figure 2 The diagram shown is a structural schematic of another embodiment of the motor controller 1 of this application. (In conjunction with...) Figure 1 and Figure 2 As shown, Figure 1 The image shows a low-power motor controller 1. Figure 2 The image shows a high- and medium-power motor controller. Figure 1 and Figure 2 In comparison, motor controller 1 differs in size, but its structure and principle are the same. The following explanation uses a high- or medium-power motor controller 1 as an example.

[0039] Figure 3 As shown Figure 2 The diagram shows the specific structure of the motor controller 1. Figure 4 As shown Figure 2 The diagram shows a structural schematic of the motor controller 1 from one perspective. Figure 5 As shown Figure 2 This is a schematic diagram of the motor controller 1 from another perspective. (Combined with...) Figures 2 to 5 As shown, the motor controller 1 includes a housing 11, a double-layer circuit board 12, and a heat dissipation frame 13. Both the double-layer circuit board 12 and the heat dissipation frame 13 are assembled within the housing 11. The housing 11 is used to assemble and fix the double-layer circuit board 12 and the heat dissipation frame 13. The housing 11 includes a notch 111, which is located on one side of the housing 11. The heat dissipation frame 13 includes a heat dissipation bracket 131 and heat dissipation teeth 132 disposed on the heat dissipation bracket 131. The double-layer circuit board 12 is disposed on both sides of the heat dissipation bracket 131, and the heat dissipation teeth 132 are located at and exposed above the notch 111. The main heat of the motor controller 1 comes from the double-layer circuit board 12, which is stacked above and below the heat dissipation bracket 131. The double-layer circuit board 12 can dissipate heat not only through the heat dissipation bracket 131 but also through the heat dissipation teeth 132. That is, the double-layer circuit board 12 achieves heat dissipation through both the heat dissipation bracket 131 and the heat dissipation teeth 132. The heat dissipation fins 132 are exposed at the notch 111, allowing for full contact with the external environment for heat exchange, which can improve the heat dissipation effect.

[0040] Compared with related technologies, the motor controller 1 of this application features a double-layer circuit board 12 and exposed heat dissipation fins 132 at the notch 111. For low-power motor controllers, the double-layer circuit board 12 facilitates weight reduction, allowing for a very small size. For medium- and high-power motor controllers, heat dissipation is achieved not only through the heat dissipation bracket 131 but also through the exposed heat dissipation fins 132, improving heat dissipation efficiency. This design reduces the power differences between different power motor controllers, simultaneously meeting the functional module requirements and heat dissipation needs of varying power levels. This achieves standardized integration of different power levels, contributing to the development of a platform-based, modular product series and enhancing user experience.

[0041] exist Figures 2 to 5In the illustrated embodiment, the heat sink bracket 131 and the heat sink fins 132 are an integral structure. The integrated heat sink frame 13 enhances structural stability and strength, reduces connecting parts, and facilitates assembly. Simultaneously, it effectively improves heat dissipation efficiency, quickly dissipating heat from the circuit board, ensuring stable controller performance, and extending its service life. Figures 2 to 5 In the illustrated embodiment, the heat dissipation frame 13 includes an aluminum alloy heat dissipation frame. The aluminum alloy heat dissipation frame has excellent thermal conductivity, which can efficiently dissipate the heat of the circuit board; it is also lightweight, without adding excessive weight, has strong corrosion resistance, and can adapt to complex working conditions; it is also easy to process and form, and can be customized to create a heat dissipation structure, ensuring the stable operation of the motor controller 1 in all aspects.

[0042] exist Figures 2 to 5 In the illustrated embodiment, the motor controller 1 further includes a heat dissipation component 14, assembled on a heat dissipation bracket 131. The heat dissipation component 14 is exposed at the notch 111 and is located on the same side of the heat dissipation bracket 131 as the heat dissipation teeth 132, with the heat dissipation channel of the heat dissipation component 14 communicating with that of the heat dissipation teeth 132. In this embodiment, the heat dissipation component 14 can be a cooling fan. The cooling fan is assembled on the heat dissipation bracket 131 and arranged side by side with the heat dissipation teeth 132. The cooling fan and the heat dissipation teeth 132 are located on one side of the heat dissipation bracket 131 and exposed at the notch 111. The heat dissipation teeth 132 are exposed to the external environment and communicate with the cooling fan. The cooling fan can act as a conduit, improving the heat dissipation effect. For low-power motor controllers 1, natural heat dissipation can be achieved through the heat dissipation bracket 131 and the heat dissipation teeth 132, in which case the cooling fan does not need to work. For high- and medium-power motor controllers 1, not only can natural heat dissipation be achieved through the heat dissipation bracket 131 and the heat dissipation teeth 132, but air cooling can also be achieved through the cooling fan. Through the combined action of the heat sink bracket 131, heat sink 132, and heat sink component 14, both natural heat dissipation and air cooling are compatible, meeting the heat dissipation requirements of different power levels.

[0043] exist Figures 2 to 5 In the illustrated embodiment, the double-layer circuit board 12 includes a main board 121 and a driver board 122, which are electrically connected. The main board 121 primarily receives and processes commands from the host computer, performs logical control and coordination of the motor controller 1's control system, and monitors the system status. The driver board 122 primarily amplifies and converts the signals from the main board 121 to provide sufficient power to drive the motor and control its speed, position, and torque. Figures 2 to 5In the illustrated embodiment, the motherboard 121 and the heat sink 132 are arranged side-by-side on one side of the heat sink bracket 131. The drive board 122 is located on the other side of the heat sink bracket 131. This effectively utilizes the space on both sides of the heat sink bracket 131, effectively isolating the motherboard 121 and the drive board 122, and effectively utilizing both sides of the heat sink bracket 131 for heat dissipation. In this embodiment, the drive board 122 generates more heat than the motherboard 121. The motherboard 121 is mainly cooled by the heat sink bracket 131. Part of the drive board 122 abuts against the heat sink 132. Part of the drive board 122 is cooled by the heat sink bracket 131, and the other part is cooled by the heat sink 132. For the high- and medium-power motor controller 1, the drive board 122 dissipates a lot of heat, which is not only naturally cooled by the heat sink bracket 131 and the heat sink 132, but also cooled by air cooling through the heat sink assembly 14, improving the heat dissipation effect.

[0044] exist Figures 2 to 5 In the illustrated embodiment, the drive board 122 includes multiple drive devices, all protruding from the side of the drive board 122 facing the heat sink 131. The drive devices primarily amplify and convert the weak electrical signals transmitted from the motherboard 121, providing sufficient drive current and suitable drive signals to the motor, thereby controlling the motor's start, stop, speed, and direction of operation. Figures 2 to 5 In the illustrated embodiment, some of the multiple driving devices abut against the heat sink bracket 131, while other driving devices abut against the heat sink fins 132. The power of the driving devices abutting against the heat sink fins 132 is higher than the power of the other driving devices abutting against the heat sink bracket 131. In this embodiment, the multiple driving devices include multiple low-power driving devices and multiple high-power driving devices. The multiple low-power driving devices generate less heat and are mainly cooled naturally through the heat sink bracket 131. The multiple high-power driving devices generate more heat and are mainly cooled naturally through the heat sink fins 132. If necessary, air cooling can also be used through the heat sink assembly 14 to quickly reduce the heat of the drive board 122. The heat dissipation effect is improved through the combined action of the heat sink assembly 14, the heat sink bracket 131, and the heat sink fins 132. In this embodiment, a heat dissipation pad is provided in the area where the driving device abuts against the heat dissipation bracket 131 and the heat dissipation teeth 132. The heat dissipation pad not only has a heat dissipation effect, but also has a supporting function, so that there is an assembly gap between the driving device and the heat dissipation bracket 131 and the heat dissipation teeth 132, preventing the driving device from colliding and improving safety.

[0045] exist Figures 2 to 5In the illustrated embodiment, the drive board 122 includes a drive capacitor 1221, protruding from the side of the drive board 122 facing the heat sink 131. The drive capacitor 1221 stabilizes the voltage, stores energy to prevent voltage drops when the current changes, and filters out high-frequency noise, ensuring stable power supply to the drive circuit and smooth motor operation. The heat generated by the drive capacitor 1221 can be dissipated through the heat sink 131. Figures 2 to 5 In the illustrated embodiment, the heat dissipation frame 13 further includes a guide plate 133 disposed on the heat dissipation bracket 131. The guide plate 133 surrounds the periphery of the driving capacitor 1221 and forms a guide channel 134, which communicates with the heat dissipation channel of the heat dissipation fins 132. In this embodiment, the guide plate 133 can be a plastic guide plate. The guide plate 133 is disposed on the periphery of the driving capacitor 1221 and forms a guide channel 134. This guide channel 134 serves to isolate the driving capacitor 1221, facilitating the dissipation of heat from the driving capacitor 1221. Figures 2 to 5 In the illustrated embodiment, the guide plate 133 is located on the side of the heat dissipation bracket 131 near the heat dissipation teeth 132. This arrangement ensures that the guide channel 134 communicates not only with the heat dissipation channel of the heat dissipation teeth 132 but also with the heat dissipation assembly 14. When the heat dissipation assembly 14 is not in operation, the heat generated by the driving capacitor 1221 is discharged through the guide channel 134 to the heat dissipation channel of the heat dissipation teeth 132 for natural heat dissipation. When the heat dissipation assembly 14 is in operation, it acts as a guide, allowing the heat in the guide channel 134 to dissipate quickly, thus improving the heat dissipation effect.

[0046] exist Figures 2 to 5 In the illustrated embodiment, the motherboard 121 has a clearance opening 1211, and the driving capacitor 1221 is located in the clearance opening 1211, offset from the motherboard 121. This clearance opening 1211 not only avoids the driving capacitor 1221 but also avoids the current-carrying channel 134, thereby preventing the heat generated by the driving capacitor 1221 from affecting the motherboard 121. Figures 2 to 5 In the illustrated embodiment, the airflow guide plate 133 is snap-fitted to the heat dissipation bracket 131. The snap-fit ​​connection method is simple and easy to assemble or disassemble.

[0047] exist Figures 2 to 5In the illustrated embodiment, the motherboard 121 includes multiple circuit components, all protruding from the side of the motherboard 121 facing the heat sink 131. These circuit components can implement various functions of the motor controller 1, enabling coordinated operation of these functions to precisely control the motor's operation. The multiple circuit components are primarily cooled by the heat sink 131. The multiple circuit components abut against the heat sink 131. This abutment arrangement improves heat dissipation. In this embodiment, a heat dissipation pad is provided in the area where the multiple circuit components abut against the heat sink 131. The heat dissipation pad not only provides heat dissipation but also serves a supporting function, creating an assembly gap between the circuit components and the heat sink 131 to prevent collisions and improve safety.

[0048] exist Figures 2 to 5 In the illustrated embodiment, the motherboard 121 has multiple control ports 1212. The driver board 122 has multiple driver ports 1222. In this embodiment, the multiple control ports 1212 may include a Type-C port 1212a, an RJ45 communication port 1212b, a control loop terminal 1212c, a first encoder interface 1212d, and a second encoder interface 1212e, etc., which are not limited in this application. The driver ports 1222 include a main circuit control port 1222a and a drive capacitor charging port 1222b. In addition, the driver board 122 also includes an indicator light 1222c, etc. In this embodiment, the Type-C port 1212a, the RJ45 communication port 1212b, the control loop terminal 1212c, the first encoder interface 1212d, and the second encoder interface 1212e are arranged in a row. The main circuit control port 1222a, the drive capacitor charging port 1222b, and the indicator light 1222c are arranged in a row. This allows for a dual-row interface configuration for motor controller 1, increasing the range of applications. Figures 2 to 5 In the illustrated embodiment, the housing 11 is provided with multiple through holes 112 corresponding to multiple control ports 1212 and multiple drive ports 1222. When the main board 121 and the drive board 122 are assembled inside the housing 11, the multiple control ports 1212 and multiple drive ports 1222 are exposed through the multiple through holes 112. In this embodiment, the multiple through holes 112 are located on the side of the housing 11 away from the notch 111, making the dual-row interface of the motor controller 1 easy for users to operate and making the overall structure compact.

[0049] exist Figures 2 to 5 In the illustrated embodiment, the motor controller 1 further includes a display panel 15, assembled on one side of the double-layer circuit board 12 and electrically connected to the double-layer circuit board 12. In this embodiment, the display panel 15 is vertically soldered to one side of the main board 121 and the driver board 122, and is located on top of multiple control ports 1212 and multiple drive ports 1222, effectively utilizing the side space of the double-layer circuit board 12. Figures 2 to 5In the illustrated embodiment, the display panel 15 includes a digital display tube 151 and buttons 152. The digital display tube 151 displays the status of the motor controller 1. The buttons 152 can be start or reset buttons, for user operation. The housing 11 has a display window 113 corresponding to the digital display tube 151 and buttons 152. When the display panel 15 is assembled inside the housing 11, the digital display tube 151 and buttons 152 are exposed in the display window 113. Exposing the digital display tube 151 and buttons 152 in the display window 113 facilitates user operation. Figures 2 to 5 In the illustrated embodiment, the housing 11 also includes a display cover 114, movably positioned at the display window 113 to cover the digital display tube 151 and the buttons 152. In this embodiment, the display cover 114 can be a semi-transparent or transparent cover, facilitating user observation. The display cover 114 serves to protect the digital display tube 151 and the buttons 152. Figures 2 to 5 In the illustrated embodiment, the housing 11 further includes a groove 115 located below the display cover 114, with the groove 115 situated on both sides of the display window 113. The semi-transparent cover of the display panel 15 is designed without a handle or pull tab, and is recessed below the display cover 114, located at the edges on both sides of the housing 11. This design allows the user to easily rotate and open the display cover 114 with their fingers. Furthermore, concealing the groove 115 below the display cover 114 results in a clean and aesthetically pleasing exterior with high external visibility. In this embodiment, screen-printed or laser-engraved prompt characters can be applied to the concave surface of the groove 115 to enhance its appearance and improve its recognizability.

[0050] exist Figures 2 to 5 In the illustrated embodiment, the motor controller 1 further includes a braking resistor 16, disposed on one side of the heat dissipation tooth 132 and exposed through the notch 111. The braking resistor 16 is used to convert the electrical energy fed back by the motor into heat energy during motor braking, preventing excessive DC bus voltage, protecting the motor controller and other equipment, and simultaneously achieving rapid braking, thus improving system stability and safety. The heat generated by the braking resistor 16 is mainly dissipated through the heat dissipation bracket 131. Since the braking resistor 16 generates a relatively high amount of heat, exposing it through the notch 111 improves heat dissipation. Simultaneously, the side space of the heat dissipation bracket 131 can be utilized to achieve a compact structure while still meeting heat dissipation requirements.

[0051] exist Figures 2 to 5 In the illustrated embodiment, the housing 11 can be made of a lightweight plastic shell. The heat dissipation frame 13 is slidably mounted to the housing 11 and is connected by a snap-fit ​​mechanism. This arrangement facilitates assembly and disassembly. Figures 2 to 5 In the illustrated embodiment, the housing 11 is provided with a plurality of heat dissipation holes 116. The provision of a plurality of heat dissipation holes 116 is beneficial for dissipating heat within the housing 11.

[0052] In actual installation, the braking resistor 16, heat dissipation component 14, drive board 122, main board 121, and guide plate 133 are first installed on the heat dissipation bracket 131. There is an electrical connection between the main board 121 and the drive board 122. Finally, the plastic housing 11 is installed, and the plastic housing 11 and the heat dissipation frame 13 are snapped together. The installation process involves sliding through a guide groove. The motor controller 1 of this application adopts a double-layer circuit board architecture with dual-row interfaces. The main board 121 can be standardized for both low-power and medium-to-high-power applications. The drive capacitor 1221, transformer, and other components on the drive board 122 can be replaced with different specifications depending on the power rating, achieving differentiation. The dual-row interfaces allow for higher interface density and a smaller size for low-power motor controllers 1. For medium-to-high-power motor controllers 1, the cooling fan is mounted on the heat dissipation bracket 131 and arranged side-by-side with the heat dissipation fins 132. The heat dissipation fins 132 and the heat dissipation bracket 131 are integrated. The plastic housing 11 avoids the heat dissipation fins 132, exposing them. When the power is high, the cooling fan operates for air cooling; when the power is low, the cooling fan does not operate, and the heat dissipation fins 132 provide natural cooling. This combines both natural and air cooling methods. Furthermore, the semi-transparent cover of the display panel 15 features a handle-less or handle-less design. The edges of the outer casing below the display cover 114 are recessed, facilitating easy rotation and opening of the transparent cover. The recessed surfaces can be screen-printed or laser-engraved with informational characters, enhancing the appearance and making it easily identifiable. All these aspects ensure that this motor controller 1 possesses strong product competitiveness.

[0053] It should be noted that this application lists two motor controllers 1 with different power ratings. Other power ratings can be further extended based on the different heights and power ratings of the drive capacitor 1221, but this application does not limit them.

[0054] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A motor controller, characterized in that, include: The casing, including the notch; A double-layer circuit board is assembled inside the housing; and A heat dissipation frame is assembled inside the housing; the heat dissipation frame includes a heat dissipation bracket and heat dissipation teeth disposed on the heat dissipation bracket, the double-layer circuit board is respectively disposed on both sides of the heat dissipation bracket, and the heat dissipation teeth are located at the notch and exposed outside the notch.

2. The motor controller according to claim 1, characterized in that, The motor controller further includes a heat dissipation component assembled on the heat dissipation bracket; the heat dissipation component is exposed in the notch and is located on the same side of the heat dissipation bracket as the heat dissipation teeth, and the heat dissipation channel of the heat dissipation component and the heat dissipation teeth are connected.

3. The motor controller according to claim 1, characterized in that, The double-layer circuit board includes a motherboard and a driver board, the motherboard and the driver board being electrically connected; wherein the motherboard and the heat dissipation teeth are arranged side by side on one side of the heat dissipation bracket, the driver board is arranged on the other side of the heat dissipation bracket, and the driver board partially abuts against the heat dissipation teeth.

4. The motor controller according to claim 3, characterized in that, The drive board includes multiple drive components, all of which protrude from the side of the drive board facing the heat dissipation bracket; some of the drive components abut against the heat dissipation bracket, while other drive components abut against the heat dissipation teeth; wherein, the power of the drive components abutting against the heat dissipation teeth is higher than the power of the other drive components abutting against the heat dissipation bracket.

5. The motor controller according to claim 3, characterized in that, The drive board includes a drive capacitor, which protrudes from the side of the drive board facing the heat dissipation bracket; the heat dissipation frame also includes a guide plate, which is disposed on the heat dissipation bracket; the guide plate surrounds the periphery of the drive capacitor and forms a guide channel, and the guide channel is connected to the heat dissipation channel of the heat dissipation tooth.

6. The motor controller according to claim 5, characterized in that, The motherboard has a clearance opening, and the driving capacitor is located in the clearance opening, offset from the motherboard; and / or The guide plate is located on the side of the heat dissipation bracket near the heat dissipation teeth; and / or The air guide plate is snapped together with the heat dissipation bracket.

7. The motor controller according to claim 3, characterized in that, The motherboard includes multiple circuit components, all of which protrude from the side of the motherboard facing the heat sink bracket; the multiple circuit components abut against the heat sink bracket.

8. The motor controller according to claim 3, characterized in that, The motherboard has multiple control ports; the driver board has multiple drive ports; the housing has multiple through holes corresponding to the multiple control ports and the multiple drive ports; when the motherboard and the driver board are assembled in the housing, the multiple control ports and the multiple drive ports are exposed through the multiple through holes.

9. The motor controller according to claim 1, characterized in that, The motor controller further includes a display panel, which is assembled on one side of the double-layer circuit board and electrically connected to the double-layer circuit board; the display panel includes a digital display tube and buttons; the housing is provided with a display window corresponding to the digital display tube and the buttons; when the display panel is assembled inside the housing, the digital display tube and the buttons are exposed through the display window. The housing also includes a display cover, movably positioned at the display window to cover the digital display tube and the buttons; and / or The housing also includes a display cover and a groove located below the display cover, with the groove situated on both sides of the display window.

10. The motor controller according to claim 1, characterized in that, The motor controller further includes a braking resistor, located on one side of the heat dissipation fins and exposed outside the notch; and / or The heat dissipation bracket and the heat dissipation teeth are an integral structure; and / or The housing is provided with multiple heat dissipation holes; and / or The heat dissipation frame includes an aluminum alloy heat dissipation frame.

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