A high-reliability chip-type light-emitting diode

Abstract

This utility model discloses a high-reliability chip-type light-emitting diode (LED), relating to the field of LED technology. It includes a copper-clad substrate, with an LED chip disposed on the upper center side of the copper-clad substrate. Thermally conductive die-bonding adhesive is disposed between the LED chip and the copper-clad substrate. This utility model utilizes a hemispherical silicone resin structure and a transparent epoxy resin planar structure. The hemispherical silicone resin is molded first to protect the LED chip, reducing internal stress in different high and low temperature environments. The planar epoxy resin is then molded secondarily to enhance the structural strength of the product, improve brightness, and reduce light spot.

Description

Technical Field

[0001] This utility model relates to the field of light-emitting diode technology, specifically a high-reliability chip-type light-emitting diode. Background Technology

[0002] LED light sources are widely used due to their advantages such as low-voltage power supply, low energy consumption, wide applicability, high stability, short response time, no environmental pollution, and multi-color emission. Existing LED light sources can include components such as LED brackets, LED chips, and lead frames. Chip-type LEDs are small in size, generally less than 2mm, and have a flat surface.

[0003] Existing chip-type LEDs are all molded in one piece using silicone / epoxy resin, resulting in large color spots, significant light decay in high and low temperature tests, and severe product homogenization. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the existing defects and provide a high-reliability chip-type light-emitting diode. By setting a hemispherical silicone resin structure and a transparent epoxy resin planar structure, the LED chip is protected by the hemispherical silicone resin in the first molding process, while the internal stress of the product is reduced in different high and low temperature environments. The planar epoxy resin in the second molding process enhances the structural strength of the product, improves the brightness of the product, and reduces the light spot of the product. This can effectively solve the problems in the background technology.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-reliability chip-type light-emitting diode, comprising a copper-clad substrate, an LED chip disposed on the upper side of the center of the copper-clad substrate, a thermally conductive die-bonding adhesive disposed between the LED chip and the copper-clad substrate, electroplating areas disposed on the upper sides of both ends of the copper-clad substrate, a wire connected to the upper side of the LED chip for connecting to the two electroplating areas on the copper-clad substrate, a transparent hemispherical silicone resin molded on the outside of the LED chip, the silicone resin encapsulating the LED chip and the wire, and a planar epoxy resin with planar and transparent outer surfaces molded on the outside of the silicone resin, the epoxy resin encapsulating the silicone resin.

[0006] Furthermore, the silicone resin contains yellow phosphor.

[0007] Furthermore, the conductor is connected to the two electroplated areas of the copper-clad substrate by soldering.

[0008] Furthermore, the ends of the two electroplated areas on the copper-clad substrate are respectively provided with semi-circular grooves.

[0009] Furthermore, the LED chip has a rectangular structure.

[0010] Furthermore, the copper-clad substrate is configured as a BT material copper-clad substrate.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. This utility model uses a hemispherical silicone resin structure and a transparent epoxy resin planar structure to protect the LED chip by first molding the hemispherical silicone resin and reduce the internal stress of the product in different high and low temperature environments. The second molding of the planar epoxy resin enhances the structural strength of the product, improves the brightness of the product, and reduces the light spot of the product. Attached Figure Description

[0013] Figure 1 This is a top view of the structure of this utility model;

[0014] Figure 2 This utility model Figure 1 Schematic diagram of the main sectional view structure.

[0015] In the diagram: 1. LED chip; 2. Conductor wire; 3. Epoxy resin; 4. Silicone resin; 5. Thermally conductive die bond adhesive; 6. Copper-clad substrate; 7. Electroplating area. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1-2 This embodiment provides a technical solution: a high-reliability chip-type light-emitting diode, including a copper-clad substrate 6, an LED chip 1 disposed on the upper side of the center of the copper-clad substrate 6, a thermally conductive die-bonding adhesive 5 disposed between the LED chip 1 and the copper-clad substrate 6, electroplating areas 7 disposed on the upper sides of both ends of the copper-clad substrate 6, a wire 2 connected to the upper side of the LED chip 1 for connecting to the two electroplating areas 7 on the copper-clad substrate 6, a transparent hemispherical silicone resin 4 molded on the outside of the LED chip 1, the silicone resin 4 encapsulating the LED chip 1 and the wire 2, a planar epoxy resin 3 with a planar and transparent outer surface molded on the outside of the silicone resin 4, the epoxy resin 3 encapsulating the silicone resin 4.

[0018] Silicone resin 4 can improve the lighting brightness of LED chip 1, protect LED chip 1, and reduce the stress of the product in different high and low temperature environments. Thermally conductive die bond adhesive 5 can fix LED chip 1 and transfer the heat of LED chip 1 to copper clad substrate 6, thereby improving the heat transfer effect.

[0019] Preferably, the silicone resin 4 also contains additional yellow phosphor.

[0020] In actual manufacturing, the two wires 2, which serve as positive and negative electrodes, can be connected to the two electroplated areas 7 of the copper-clad substrate 6 respectively by soldering. The two electroplated areas 7 are separated, and each of the two electroplated areas 7 can be electroplated with silver or gold.

[0021] Preferably, the ends of the two electroplated areas 7 on the copper-clad substrate 6 may also be provided with semi-circular grooves.

[0022] In this embodiment, the LED chip 1 has a rectangular structure.

[0023] Preferably, the copper-clad substrate 6 can be a BT material copper-clad substrate. Of course, other materials can also be used in other embodiments.

[0024] The working principle of this high-reliability chip-type light-emitting diode is as follows: Figures 1-2 As shown, the LED chip 1 is protected by a one-time molding of hemispherical silicone resin 4, which also reduces the internal stress of the product in different high and low temperature environments. The product's structural strength is enhanced by a two-time molding of planar transparent epoxy resin 3, which increases the product's brightness and reduces the product's light spot.

[0025] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A high-reliability chip-type light-emitting diode, comprising a copper-clad substrate (6), wherein an LED chip (1) is disposed on the upper side of the center of the copper-clad substrate (6), a thermally conductive die-bonding adhesive (5) is disposed between the LED chip (1) and the copper-clad substrate (6), and electroplated areas (7) are disposed on the upper sides of both ends of the copper-clad substrate (6), and a wire (2) for connecting to the two electroplated areas (7) on the copper-clad substrate (6) is connected to the upper side of the LED chip (1), characterized in that: The LED chip (1) is molded with a transparent hemispherical silicone resin (4) on the outside. The silicone resin (4) encapsulates the LED chip (1) and the wire (2). The silicone resin (4) is molded with a planar epoxy resin (3) with a planar and transparent outer surface on the outside. The epoxy resin (3) encapsulates the silicone resin (4).

2. A high-reliability chip-type light-emitting diode according to claim 1, characterized in that: The silicone resin (4) contains yellow phosphor.

3. A high-reliability chip-type light-emitting diode according to claim 1, characterized in that: The conductor (2) is connected to the two electroplated areas (7) of the copper-clad substrate (6) by soldering.

4. A high-reliability chip-type light-emitting diode according to claim 1, characterized in that: The ends of the two electroplated areas (7) on the copper-clad substrate (6) are respectively provided with semi-circular grooves.

5. A high-reliability chip-type light-emitting diode according to claim 1, characterized in that: The LED chip (1) has a rectangular structure.

6. A high-reliability chip-type light-emitting diode according to claim 1, characterized in that: The copper-clad substrate (6) is configured as a BT material copper-clad substrate.

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