A type of through-hole LED lamp bead

Abstract

This utility model relates to a through-hole LED lamp bead, comprising a bracket with a light-transmitting colloid disposed on the bracket. The bracket is composed of a non-polar first pin and a second pin. A reflector is provided at the end of the first pin extending into the light-transmitting colloid, and a first light-emitting chip is connected inside the reflector. The ends of the first pin and the second pin are respectively provided with one or more sets of relatively distributed first connecting parts and second connecting parts. A second light-emitting chip is connected between each set of first connecting parts and second connecting parts. The inner sides of the first connecting parts and the second connecting parts are respectively formed by bending to form a first protective part and a second protective part. A black coating layer is formed at the end of the light-transmitting colloid. In this utility model, the first light-emitting chip and the second light-emitting chip are controlled by an IC to alternately flash at different times and frequencies in a scanning manner to simulate the jumping and flashing characteristics of a real candle flame. The black coating layer simulates a black lamp wick, improving the simulation effect and user experience.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp beads, specifically to a through-hole LED lamp bead. Background Technology

[0002] A light-emitting diode (LED) is a solid-state light source device based on the principle of electroluminescence of a semiconductor PN junction. The core of a through-hole LED is a chip composed of P-type and N-type semiconductors. There is a transition layer between the P-type and N-type semiconductors, called the PN junction. In the PN junction of certain semiconductor materials, when injected minority carriers recombine with majority carriers, they release excess energy in the form of light, thus directly converting electrical energy into light energy.

[0003] Through-hole LED chips, as one of the main forms of LED products, are directly inserted into a printed circuit board (PCB) via pins and soldered for fixation. They have a wide range of applications, and their basic structure includes: a bracket, LED chip, leads, encapsulating colloid, and pins. In certain special occasions, such as cafes, bars, stages, or temples, candles are needed to create ambiance. However, traditional candle wicks produce smoke when burning and pose a potential fire hazard. Therefore, LED candle lights that mimic candles have begun to appear on the market.

[0004] However, in decorative lighting scenarios requiring the simulation of dynamic flame effects, such as candle-like lamps, the LED beads used in existing candle-like lamps still have certain shortcomings. Specifically, the light-emitting structure of existing LED beads in candle-like lamps is relatively simple. Traditional candle-like LED beads mostly use a single-layer light-emitting structure, with a fixed light emission direction and a uniform light intensity distribution. This makes it difficult to reproduce the flickering, scattering, and dynamic jumping characteristics of a real candle flame, resulting in a stiff simulation effect, obvious light spots, and poor simulation of burning flames, thus reducing user experience and decorative aesthetics. Therefore, how to improve the dynamic simulation capability of through-hole LED beads in simulating candle flames through structural innovation has become an urgent technical problem to be solved in this field. Utility Model Content

[0005] The purpose of this utility model is to solve the above-mentioned defects and provide a through-hole LED lamp bead to solve the technical problem that the existing candle-simulation LED lamp beads have poor light emission simulation of burning flames, which affects user experience and decorative aesthetics.

[0006] The objective of this utility model is achieved through the following means:

[0007] A through-hole LED lamp bead includes a bracket with a light-transmitting colloid disposed on the bracket. The bracket is composed of a non-polar first pin and a second pin. A reflector bowl is disposed at the end of the first pin extending into the light-transmitting colloid. An emission cavity is formed inside the reflector bowl, and a first light-emitting chip is connected inside the reflector cavity. The first light-emitting chip is electrically connected to the second pin through a connecting wire. One or more sets of oppositely distributed first connecting parts and second connecting parts are respectively disposed at the ends of the first pin and the second pin extending into the light-transmitting colloid. A second light-emitting chip is connected between each set of first connecting parts and second connecting parts. The inner sides of the first connecting parts and the second connecting parts are bent to form a first protective part and a second protective part for positioning and contacting the second light-emitting chip. The first light-emitting chip and the second light-emitting chip are arranged vertically in the same direction and form an alternating light-emitting structure. A welding part is formed at the end of the first pin and the second pin passing through the light-transmitting colloid. A black coating layer is formed at the end of the light-transmitting colloid near the welding part by injection molding.

[0008] Furthermore, as described above, a first light-transmitting portion is formed at the end of the light-transmitting colloid near the first light-emitting chip, and a second light-transmitting portion is formed at the end of the light-transmitting colloid near the second light-emitting chip.

[0009] By setting a first light-transmitting part and a second light-transmitting part corresponding to the first light-emitting chip and the second light-emitting chip respectively on the light-transmitting colloid, a light transmission path can be provided for the double-layer light-emitting structure, so that the light from the first light-emitting chip and the second light-emitting chip can be emitted through different light-transmitting areas, thereby enhancing the sense of layering and dynamic change of light intensity distribution and improving the simulation effect of candle flame flickering and scattering characteristics.

[0010] Furthermore, as described above, the first connecting part and the second connecting part are respectively provided with a first connecting slot and a second connecting slot, and the second light-emitting chip is installed between the first connecting slot and the second connecting slot.

[0011] By setting dedicated connection slots in the first and second connection parts, precise installation positioning of the second light-emitting chip can be provided, ensuring the electrical connection stability between the second light-emitting chip and the first and second pins, thereby ensuring the reliable operation of the double-layer light-emitting structure and improving the stability of the overall light-emitting effect.

[0012] Furthermore, as described above, the inner surfaces of the first connecting portion and the second connecting portion are respectively formed with protruding first contact portion and second contact portion, and the first connecting groove and the second connecting groove are respectively opened on the inner sides of the first contact portion and the second contact portion.

[0013] By providing raised contact portions inside the first and second connecting portions and opening connecting slots on these portions, the contact area with the second light-emitting chip can be increased, improving the tightness and reliability of the electrical connection. At the same time, the raised structure can limit the second light-emitting chip, preventing it from being misaligned during installation, ensuring that the light-emitting direction of the second light-emitting chip coordinates with that of the first light-emitting chip, optimizing the light distribution of the double-layer light-emitting structure, and enhancing the dynamic simulation effect.

[0014] Furthermore, as described above, the first connecting portion and the second connecting portion are symmetrically disposed on the inner sides of the first pin and the second pin, so that the first protective portion and the second protective portion are symmetrically distributed. The first protective portion and the second protective portion extend protrudingly to the back side of the first connecting portion and the second connecting portion by bending, and positioning surfaces for supporting contact with the second light-emitting chip are formed on the first protective portion and the second protective portion.

[0015] The first and second protective parts formed by bending can position the second light-emitting chip during welding, reduce the phenomenon of positional displacement of the second light-emitting chip, and ensure the stability and reliability of the connection between the second light-emitting chip and the first and second pins. At the same time, the contact between the first and second protective parts and the second light-emitting chip through bending allows the positioning surface to conduct heat to the second light-emitting chip, which can dissipate heat from the second light-emitting chip.

[0016] Furthermore, as described above, the first protective part and the second protective part are formed into an "L" shape by bending.

[0017] Furthermore, as described above, a light-emitting portion is formed on the second light-emitting chip, which can extend toward the first light-emitting chip or toward the welding portion.

[0018] By designing light-emitting parts that can extend in different directions, the light emission direction of the second light-emitting chip can be diversified, complementing or superimposing the light from the first light-emitting chip. This simulates the dynamic jumping characteristics of candle flame light, avoiding the stiff simulation effect caused by the fixed light direction of traditional single-layer light-emitting structures, and improving the simulation capability of the flickering and jumping characteristics of real flames.

[0019] Furthermore, as described above, the light-transmitting colloid is formed by injection molding epoxy resin onto one end of the first pin and one end of the second pin.

[0020] The pin ends are wrapped with epoxy resin injection molding process, which effectively protects the internal first light-emitting chip, second light-emitting chip and connecting wires. At the same time, epoxy resin has good light transmittance, which can reduce the loss of light during light transmission, ensure the efficient emission of light from the first light-emitting chip and second light-emitting chip, and improve the overall luminous efficiency.

[0021] Furthermore, as described above, the end of the light-transmitting colloid away from the welded part has an arc-shaped light-transmitting surface, and the opening of the reflective bowl extends toward the arc-shaped light-transmitting surface.

[0022] By setting an arc-shaped light-transmitting surface, the light from the first and second light-emitting chips can be scattered.

[0023] Furthermore, as described above, the first light-emitting chip is electrically connected to the second pin and the first pin via positive and negative terminals respectively, and the second light-emitting chip is electrically connected to the first pin and the second pin via positive and negative terminals respectively.

[0024] The beneficial effects of this utility model are as follows: By vertically arranging the first and second light-emitting chips, a double-layer or multi-layer light-emitting structure is formed. When the pins are connected to an external IC controller, the first and second light-emitting chips are controlled by the IC to flash at different times and frequencies in a scanning manner, thereby simulating the jumping and flickering characteristics of a real candle flame. This avoids the problem of stiff simulation effect caused by the traditional fixed light-emitting mode and improves the simulation degree of dynamic simulation. The arrangement of the first and second light-emitting chips allows light to be emitted from different layers and directions, enhancing the sense of layering and dynamic change capability of the light. The first and second protective parts ensure the stability and reliability of the connection of the second light-emitting chip, reducing the phenomenon of misalignment or poor contact of the second light-emitting chip. At the same time, the first and second protective parts provide contact and heat conduction for the second light-emitting chip. Furthermore, a black coating layer is formed by injection molding at the end of the translucent colloid near the welding part to simulate the black appearance of a candle wick, further enhancing the decorative aesthetics and user experience. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of this embodiment;

[0026] Figure 2 This is a schematic diagram of the overall structure of this embodiment;

[0027] Figure 3 This is a partial structural diagram of this embodiment;

[0028] Figure 4 This is a partial structural diagram of the first and second pins in the first direction of this embodiment;

[0029] Figure 5 This is a partial structural diagram of the first and second pins in the second direction of this embodiment;

[0030] Figure 6 This is a schematic diagram of the structure of Embodiment 2;

[0031] Figure 7 This is a schematic diagram of the structure of Embodiment 3;

[0032] Figure 8 This is the control circuit diagram for the LED beads in this embodiment;

[0033] The reference numerals in the figure are as follows:

[0034] 100 - Bracket; 101 - First pin; 102 - Second pin; 103 - First connecting part; 104 - Second connecting part; 105 - First connecting slot; 106 - Second connecting slot; 107 - First contact part; 108 - Second contact part; 109 - First protective part; 110 - Second protective part.

[0035] 200 - Translucent colloid, 201 - First translucent part, 202 - Second translucent part;

[0036] 300 - Reflector bowl, 301 - Emission cavity;

[0037] 400 - First light-emitting chip, 500 - Connecting wire, 600 - Second light-emitting chip, 601 - Light-emitting part, 700 - Black coating layer. Detailed Implementation

[0038] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0039] To make the technical problem to be solved, the technical solution and the beneficial effects of this utility model clearer, the following describes the solution in further detail with reference to the accompanying drawings and embodiments.

[0040] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this scheme and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0041] Example 1

[0042] In this embodiment, refer to Figures 1-5 and Figure 8The present invention relates to a through-hole LED lamp bead, comprising a bracket 100, on which a light-transmitting colloid 200 is disposed. The bracket 100 is composed of a non-polar first pin 101 and a second pin 102. A reflector bowl 300 is disposed at the end of the first pin 101 extending into the light-transmitting colloid 200. An emission cavity 301 is formed inside the reflector bowl 300, and a first light-emitting chip 400 is connected inside the reflector cavity. The first light-emitting chip 400 is electrically connected to the second pin 102 via a connecting wire 500. A first connecting portion 103 and a second connecting portion 104 are respectively disposed at the ends of the first pin 101 and the second pin 102 extending into the light-transmitting colloid 200. 4. A second light-emitting chip 600 is electrically connected between the first connecting part 103 and the second connecting part 104. The inner sides of the first connecting part 103 and the second connecting part 104 are respectively formed by bending to form a first protective part 109 and a second protective part 110 for positioning and contacting the second light-emitting chip. The first light-emitting chip 400 and the second light-emitting chip 600 are arranged vertically in the same way, so that the first light-emitting chip 400 and the second light-emitting chip 600 form a double-layer alternating light-emitting structure. The ends of the first pin 101 and the second pin 102 are formed with welding parts through the light-transmitting colloid 200. The end of the light-transmitting colloid 200 near the welding part is formed with a black coating layer 700 by injection molding.

[0043] In some embodiments, one or more sets of first connection portions 103 and second connection portions 104 are provided on the first pin 101 and the second pin 102, so that a set of first connection portions 103 and second connection portions 104 are connected to a second light-emitting chip 600. A double-layer alternating light-emitting structure is formed by a set of second light-emitting chips 600 and a first light-emitting chip 400, so that the IC control terminal can be connected to alternately control the first light-emitting chip 400 and the second light-emitting chip 600 to flash alternately at intervals, simulating the jumping and flashing characteristics of a real candle flame.

[0044] In some other embodiments, multiple sets of first connection portions 103 and second connection portions 104 are provided on the first pin 101 and the second pin 102, such that each set of first connection portions 103 and second connection portions 104 is connected to a second light-emitting chip 600. The multiple sets of second light-emitting chips 600 and a first light-emitting chip 400 form an alternating light-emitting structure, and the alternating interval flashing of the light-emitting chips can be controlled by the IC control terminal.

[0045] The light-transmitting colloid 200 has a first light-transmitting portion 201 formed at the end near the first light-emitting chip 400, and a second light-transmitting portion 202 formed at the end near the second light-emitting chip 600.

[0046] By setting a first light-transmitting part 201 and a second light-transmitting part 202 corresponding to the first light-emitting chip 400 and the second light-emitting chip 600 respectively on the light-transmitting colloid 200, a light transmission path can be provided for the double-layer light-emitting structure, so that the light from the first light-emitting chip 400 and the second light-emitting chip 600 can be emitted through different light-transmitting areas, thereby enhancing the sense of layering and dynamic change of light intensity distribution and improving the simulation effect of the flickering and scattering characteristics of candle flame.

[0047] Specifically, when the first light-emitting chip 400 emits light, the first light-transmitting part 201 emits light through transmission, and when the second light-emitting chip 600 emits light, the second light-transmitting part 202 emits light through transmission. This enhances the sense of layering and dynamic change of the light intensity distribution of the simulated burning candle lamp through the transmission of light from different light-transmitting parts, thereby enhancing the simulated user experience.

[0048] The first connecting part 103 and the second connecting part 104 are respectively provided with a first connecting slot 105 and a second connecting slot 106, and the second light-emitting chip 600 is installed between the first connecting slot 105 and the second connecting slot 106.

[0049] By providing dedicated connection slots in the first connection portion 103 and the second connection portion 104, the second light-emitting chip 600 can be precisely positioned for installation, ensuring the electrical connection stability between the second light-emitting chip 600 and the first pin 101 and the second pin 102, thereby ensuring the reliable operation of the double-layer light-emitting structure and improving the stability of the overall light-emitting effect.

[0050] The inner surfaces of the first connecting portion 103 and the second connecting portion 104 are respectively formed with a protruding first contact portion 107 and a second contact portion 108, and the first connecting groove 105 and the second connecting groove 106 are respectively opened on the inner sides of the first contact portion 107 and the second contact portion 108.

[0051] By providing raised contact portions inside the first connecting portion 103 and the second connecting portion 104, and opening connecting slots on these portions, the contact area with the second light-emitting chip 600 can be increased, improving the tightness and reliability of the electrical connection. At the same time, the raised structure can limit the second light-emitting chip 600, preventing its installation from being offset, ensuring that the light-emitting direction of the second light-emitting chip 600 cooperates with the first light-emitting chip 400, optimizing the light distribution of the double-layer light-emitting structure, and enhancing the dynamic simulation effect.

[0052] The first connecting portion 103 and the second connecting portion 104 are symmetrically disposed on the inner surfaces of the first pin 101 and the second pin 102, so that the first protective portion 109 and the second protective portion 110 are symmetrically distributed. The first protective portion 109 and the second protective portion 110 extend protrudingly towards the back of the first connecting portion 103 and the second connecting portion 104 by bending, and positioning surfaces for supporting contact with the second light-emitting chip 600 are formed on the first protective portion 109 and the second protective portion 110. The first protective portion 109 and the second protective portion 110 are formed into an "L" shape by bending.

[0053] The first protective part 109 and the second protective part 110 formed by bending can play a positioning role in the welding of the second light-emitting chip 600, reduce the phenomenon of positional displacement of the second light-emitting chip 600, and ensure the stability and reliability of the connection between the second light-emitting chip 600 and the first pin 101 and the second pin 102. At the same time, the contact between the first protective part 109 and the second protective part 110 and the second light-emitting chip 600 makes the positioning surface conduct heat to the second light-emitting chip 600, which can dissipate heat from the second light-emitting chip 600.

[0054] Specifically, in this embodiment, a light-emitting part 601 is formed on the second light-emitting chip 600, and the light-emitting part 601 extends toward the first light-emitting chip 400, that is, the light-emitting part 601 extends upward.

[0055] By designing a light-emitting part 601 that can extend in different directions, the light emission direction of the second light-emitting chip 600 can be diversified, complementing or superimposing the light of the first light-emitting chip 400, thereby simulating the dynamic jumping characteristics of candle flame light, avoiding the problem of stiff simulation effect caused by the fixed light direction of traditional single-layer light-emitting structure, and improving the simulation ability of the flickering and jumping characteristics of real flame.

[0056] Specifically, in some embodiments, the light-emitting part 601 of the second light-emitting chip 600 can be arranged upward or downward, so that the heat dissipation angle of light emission is different, which is suitable for different usage requirements.

[0057] The light-transmitting colloid 200 is formed by injection molding epoxy resin onto one end of the first pin 101 and the second pin 102. Using epoxy resin injection molding to encapsulate the pin ends effectively protects the internal first light-emitting chip 400, second light-emitting chip 600, and connecting wire 500. Simultaneously, the excellent light transmittance of epoxy resin reduces light loss during transmission, ensuring efficient light emission from the first light-emitting chip 400 and the second light-emitting chip 600, and improving overall luminous efficiency.

[0058] The end of the light-transmitting colloid 200 away from the welding part has an arc-shaped light-transmitting surface, and the opening of the reflector bowl 300 extends towards the arc-shaped light-transmitting surface. By setting the arc-shaped light-transmitting surface, the light from the first light-emitting chip 400 and the second light-emitting chip 600 can be scattered.

[0059] The first light-emitting chip 400 is electrically connected to the second pin 102 and the first pin 101 through positive and negative terminals respectively, and the second light-emitting chip 600 is electrically connected to the first pin 101 and the second pin 102 through positive and negative terminals respectively.

[0060] Specifically, in this embodiment, the LED light bead uses a first light-emitting chip and a second light-emitting chip to form a double-layer alternating flashing light-emitting structure.

[0061] The specific working principle in this embodiment is as follows:

[0062] For example, the first pin 101 and the second pin 102 are electrically connected to an external IC control board through the first solder joint and the second solder joint. The IC controller provides positive power to the first pin 101 or the second pin 102 and negative power to the first pin 101 or the second pin 102.

[0063] Specifically, when the IC controller scans and controls the first pin 101 to be negative and the second pin 102 to be positive and energized, the first light-emitting chip 400 is energized and emits light. At this time, the second light-emitting chip 600 is in an off state, and only the first light-emitting chip 400 emits light.

[0064] When the IC controller scans and controls the first pin 101 to be positive and the second pin 102 to be negative, the second light-emitting chip 600 is powered on and emits light. At this time, the first light-emitting chip 400 is in the off state, and only the second light-emitting chip 600 emits light.

[0065] Therefore, by scanning and repeatedly executing the alternating flashing of the first light-emitting chip 400 or the second light-emitting chip 600 through the IC controller, the flickering, scattering, and dynamic jumping characteristics of a real candle flame can be simulated. By controlling the first light-emitting chip 400 and the second light-emitting chip 600 to flash at different times and frequencies through the IC, the simulation degree of candle flame burning and flickering is improved. In addition, a black coating layer 700 is formed by injection molding at the end of the translucent colloid 200 near the welding part to simulate the black appearance of the candle wick, visually enhancing the similarity to a real candle and further improving the decorative aesthetics and user experience.

[0066] Example 2

[0067] In this embodiment, refer to Figure 6The only difference between this second embodiment and the first embodiment is that the light-emitting part 601 extends towards the welding part, that is, the light-emitting part 601 extends downward.

[0068] Example 3

[0069] In this embodiment, refer to Figure 7 The difference between this embodiment three and embodiment one is only that the structure of the first light-emitting chip is removed, so that only multiple sets of second light-emitting chips are provided on the first and second pins. Specifically, this embodiment uses four sets of second light-emitting chips. The IC controller scans and controls the four sets of second light-emitting chips to flash alternately at intervals, so as to achieve the effect of flashing at different times and frequencies to improve the simulation of the flickering of the candle flame and simulate the flickering, scattering and dynamic jumping characteristics of the real candle flame.

[0070] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.

Claims

1. A through-hole LED lamp bead, comprising a bracket, wherein a light-transmitting colloid is disposed on the bracket, characterized in that: The bracket consists of a non-polar first pin and a second pin. A reflective bowl is provided at the end of the first pin extending into the light-transmitting colloid. A first light-emitting chip is connected inside the reflective bowl. The first light-emitting chip is electrically connected to the second pin through a connecting wire. One or more sets of oppositely distributed first connecting parts and second connecting parts are provided at the ends of the first pin and the second pin extending into the light-transmitting colloid. A second light-emitting chip is connected between each set of first connecting parts and second connecting parts. The inner sides of the first connecting parts and the second connecting parts are bent to form a first protective part and a second protective part for positioning and contacting the second light-emitting chip. The first light-emitting chip and the second light-emitting chip are arranged on the same vertical line. The ends of the first pin and the second pin have welded parts formed through the light-transmitting colloid. The ends of the light-transmitting colloid near the welded parts are coated with a black coating layer by injection molding.

2. The through-hole LED bead according to claim 1, characterized in that: The light-transmitting colloid has a first light-transmitting portion formed at the end near the first light-emitting chip, and a second light-transmitting portion formed at the end near the second light-emitting chip.

3. The through-hole LED bead according to claim 1, characterized in that: The first connecting part and the second connecting part are respectively provided with a first connecting slot and a second connecting slot, and the second light-emitting chip is installed between the first connecting slot and the second connecting slot.

4. The through-hole LED lamp bead according to claim 3, characterized in that: The inner surfaces of the first connecting portion and the second connecting portion are respectively formed with a protruding first contact portion and a second contact portion, and the first connecting groove and the second connecting groove are respectively opened on the inner sides of the first contact portion and the second contact portion.

5. The through-hole LED bead according to claim 1, characterized in that: The first connecting portion and the second connecting portion are symmetrically disposed on the inner sides of the first pin and the second pin, so that the first protective portion and the second protective portion are symmetrically distributed. The first protective portion and the second protective portion extend protrudingly to the back of the first connecting portion and the second connecting portion by bending, and positioning surfaces for supporting contact with the second light-emitting chip are formed on the first protective portion and the second protective portion.

6. The through-hole LED lamp bead according to claim 5, characterized in that: The first and second protective parts are formed into an "L" shape by bending.

7. A through-hole LED lamp bead according to any one of claims 1-6, characterized in that: The light-transmitting colloid is formed by injection molding epoxy resin onto one end of the first pin and one end of the second pin.

8. A through-hole LED lamp bead according to any one of claims 1-6, characterized in that: The end of the light-transmitting colloid away from the welded part has an arc-shaped light-transmitting surface, and the opening of the reflector bowl extends towards the arc-shaped light-transmitting surface.

9. A through-hole LED lamp bead according to claim 8, characterized in that: The first light-emitting chip is electrically connected to the second pin and the first pin through positive and negative terminals respectively, and the second light-emitting chip is electrically connected to the first pin and the second pin through positive and negative terminals respectively.

10. A through-hole LED lamp bead according to claim 8, characterized in that: The second light-emitting chip has a light-emitting part formed thereon, which can extend toward the first light-emitting chip or extend toward the welding part.

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