Semiconductor optical chip packaging testboard
By using a motor-driven clamping and pushing plate structure and a ball bearing block design, the problems of unstable chip fixation and inconvenient replacement of the detection head in the existing technology are solved, thereby improving the stability and safety of the semiconductor optical chip packaging test station.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- RAISER ELECTRONIC TECHNOIOGY(SHENZHEN) LTD
- Filing Date
- 2025-07-17
- Publication Date
- 2026-05-26
AI Technical Summary
Existing semiconductor optical chip packaging test benches suffer from stress damage caused by loosening or excessive tightness during chip fixing and handling. Furthermore, tweezers or vacuum suction can easily scratch the chips, affecting test safety and yield.
The device employs a motor-driven clamping and pusher structure to achieve adaptive clamping and release of the chip. Combined with a ball and spring clip design for quick assembly and disassembly of the detection head, it avoids direct contact damage. The position of the detection head is adjusted by the motor to ensure accurate alignment.
It improves the stability and operational safety of chip testing, enhances the efficiency of test head replacement and the adaptability and flexibility of the test station, and reduces the risk of chip damage.
Smart Images
Figure CN224290604U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor optical chip packaging technology, and in particular to a semiconductor optical chip packaging test bench. Background Technology
[0002] In the packaging and testing of semiconductor optical chips, a semiconductor optical chip packaging test bench is a key piece of equipment for realizing chip performance testing (such as optical signal transmission efficiency and wavelength stability). Its core function lies in achieving stable chip fixation, precise alignment of the test head, and efficient execution of the testing process through a precise mechanical structure. With the rapid development of fields such as optical communication and lidar, semiconductor optical chips are evolving towards miniaturization and high integration, which places higher demands on the automation level, operational safety, and adaptability of the test bench. In particular, the reliability of the chip fixation and placement process directly affects the testing accuracy and mass production efficiency.
[0003] In existing technologies, semiconductor optical chip packaging test benches typically employ a mechanical structure of "rigid slots + manual-assisted positioning" to fix chips: the chip is placed in a slot of a preset size, and passive fixation is achieved through the dimensional tolerance between the slot and the chip; some devices supplement this with spring sheets to enhance the fit. Chip removal relies on manual tweezers to pick up the chip from the slot, or on the vacuum suction cups of a robotic arm for transfer. The underlying technology combines mechanical limiting with manual operation, restricting chip displacement through the physical boundaries of the slot to ensure a stable relative position between the test head and the chip.
[0004] However, in existing technologies, chip fixing relies on the dimensional tolerance of the slot. When there are slight dimensional deviations in the chip, the fixing may become loose or too tight, causing stress that can lead to chip cracking. At the same time, when using tweezers or vacuum adsorption to pick up and put in the chip, direct contact with the chip surface or edge is required, which can easily scratch the optical coating. Improper force control can also cause the chip to break, seriously affecting test safety and pass rate. To address these issues, a semiconductor optical chip packaging test bench is proposed. Utility Model Content
[0005] To overcome the above shortcomings, this utility model provides a semiconductor optical chip packaging test stage, which aims to improve the problem that tweezers can easily cause chip breakage or positioning deviation in the prior art.
[0006] To achieve the above objectives, the present invention adopts the following technical solution:
[0007] A semiconductor optical chip packaging test bench includes a workbench, a side plate fixedly connected to the side wall of the workbench, a sliding stage slidably connected inside the side plate, a detection head provided at the bottom of the sliding stage, a placement box fixedly connected to the upper surface of the workbench, a fixing component provided on the side wall of the placement box, a disassembly component provided below the sliding stage, and an adjustment component provided on the side wall of the side plate.
[0008] The fixing component includes a clamping plate, the side wall of which is slidably connected to the side wall of the placement box. A bracket is fixedly connected to the side wall of the placement box, a motor is fixedly connected to the side wall of the bracket, a rotating plate is fixedly connected to the output end of the motor, a connecting strip is rotatably connected to the side wall of the rotating plate, a sliding plate is rotatably connected to one end of the connecting strip, the side wall of the sliding plate is slidably connected to the inside of the placement box, and the side wall of the clamping plate is fixedly connected to the side wall of the sliding plate.
[0009] As a further description of the above technical solution:
[0010] The adjustment assembly includes a motor and a screw. One sidewall of the motor is fixedly connected to the sidewall of the side plate. The output end of the motor is fixedly connected to one end of the screw. One sidewall of the screw is rotatably connected to the inside of the side plate. The sidewall of the sliding table is threadedly connected to one sidewall of the screw. A second motor is fixedly connected to the sidewall of the sliding table. The output end of the second motor is fixedly connected to a second screw. The sidewall of the second screw is rotatably connected to the inside of the sliding table. A slider is threadedly connected to the sidewall of the second screw.
[0011] As a further description of the above technical solution:
[0012] The assembly / disassembly assembly includes an mounting sleeve, the sidewall of which is fixedly connected to the bottom of the slider, and the sidewall of the detection head is slidably connected inside the mounting sleeve.
[0013] As a further description of the above technical solution:
[0014] A push plate is slidably connected inside the placement box, and an electric push rod is fixedly connected to the bottom of the workbench. The output end of the electric push rod is fixedly connected to the bottom of the push plate.
[0015] As a further description of the above technical solution:
[0016] The mounting sleeve is rotatably connected to a rotating block, and ball bearings are provided inside the mounting sleeve.
[0017] As a further description of the above technical solution:
[0018] The ball's sidewall is slidably connected inside the detection head, and the rotating block has a slot inside that matches the ball. The ball's sidewall is slidably connected inside the rotating block.
[0019] As a further description of the above technical solution:
[0020] The mounting sleeve is fixedly connected to a mounting shell on its side wall. A fixing seat is fixedly connected inside the mounting shell. A spring is provided inside the mounting shell. One end of the spring is fixedly connected to the side wall of the fixing seat. The other end of the spring is fixedly connected to a locking block. The side wall of the locking block is slidably connected inside the rotating block.
[0021] As a further description of the above technical solution:
[0022] A limiting plate is fixedly connected to the side wall of the rotating block, and the side wall of the limiting plate is attached to the side wall of the mounting shell.
[0023] This utility model has the following beneficial effects:
[0024] 1. In this utility model, the self-adaptive clamping and release of the chip is achieved by the three-drive rotating plate of the motor, the connecting bar driving the sliding plate and the clamping plate. With the help of the electric push rod pushing the push plate to lift the chip, the chip is reliably fixed and easy to pick up and put down. This achieves the effect of avoiding the impact of chip instability on test accuracy and contact damage during picking up and putting down. It solves the problem that the existing tweezers are easy to cause chip breakage or positioning deviation. The above structure improves the stability and operational safety of the chip testing process.
[0025] 2. In this utility model, the detection head is quickly disassembled and securely fixed by the cooperation of the rotating block, ball bearing, spring, and locking block. The limiting plate prevents the rotating block from rotating excessively, making the replacement of the detection head convenient and the installation firm. This achieves the effect of improving the efficiency of detection head replacement and positioning stability, solving the problem that the existing detection head replacement requires disassembling multiple parts, is time-consuming, and is prone to positioning deviation. The above structure improves the flexibility of the test station to adapt to different types of chips. Attached Figure Description
[0026] Figure 1 This is a three-dimensional schematic diagram of a semiconductor optical chip packaging test station proposed in this utility model;
[0027] Figure 2 This is a schematic diagram of the placement box of a semiconductor optical chip packaging test stage proposed in this utility model;
[0028] Figure 3 This is a schematic diagram of the structure of the fixing component of a semiconductor optical chip packaging test station proposed in this utility model;
[0029] Figure 4 This is a schematic diagram of the disassembly and assembly components of a semiconductor optical chip packaging test station proposed in this utility model.
[0030] Figure 5This is a schematic diagram of the internal structure of the mounting sleeve of a semiconductor optical chip packaging test station proposed in this utility model;
[0031] Figure 6 This is a schematic diagram of the mounting sleeve of a semiconductor optical chip packaging test station proposed in this utility model;
[0032] Figure 7 for Figure 6 Enlarged view of point A in the middle.
[0033] Legend:
[0034] 1. Workbench; 2. Side plate; 3. Motor 1; 4. Screw 1; 5. Sliding table; 6. Motor 2; 7. Screw 2; 8. Slider; 9. Placement box; 10. Push plate; 11. Bracket; 12. Motor 3; 13. Rotating plate; 14. Connecting strip; 15. Sliding plate; 16. Clamping plate; 17. Detection head; 18. Mounting sleeve; 19. Rotating block; 20. Ball bearing; 21. Mounting shell; 22. Fixed base; 23. Spring; 24. Clamping block; 25. Limiting plate; 26. Electric push rod. Detailed Implementation
[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0036] Reference Figures 1-4 This utility model provides an embodiment of a semiconductor optical chip packaging test bench, including a workbench 1, a side plate 2 fixedly connected to the side wall of the workbench 1, a sliding stage 5 slidably connected inside the side plate 2, a detection head 17 provided at the bottom of the sliding stage 5, the detection head 17 being used to emit or receive light signals to detect the optical performance of the chip, a placement box 9 fixedly connected to the upper surface of the workbench 1, the placement box 9 being used to accommodate the chip to be tested, providing placement space for the chip and limiting its horizontal displacement range, a fixing component provided on the side wall of the placement box 9, the fixing component being used to clamp and fix the chip to prevent the chip from moving during the test and affecting the detection accuracy, a disassembly and assembly component provided below the sliding stage 5, the disassembly and assembly component being used to quickly replace different types of detection heads 17 to improve the versatility of the test bench, an adjustment component provided on the side wall of the side plate 2, the adjustment component being used to drive the sliding stage 5 and the detection head 17 to move, to achieve precise adjustment of the position of the detection head 17;
[0037] The fixing component includes a clamping plate 16, which is made of hard rubber and serves to directly contact and clamp the chip, avoiding damage to the chip from rigid contact. The side wall of the clamping plate 16 is slidably connected to the side wall of the placement box 9. A bracket 11 is fixedly connected to the side wall of the placement box 9, and a motor 12 is fixedly connected to the side wall of the bracket 11. The motor 12 provides power to the fixing component, and the rotation of its output end drives the movement of subsequent components. A rotating plate 13 is fixedly connected to the output end of the motor 12. A connecting strip 14 is rotatably connected to the side wall of the rotating plate 13, and a sliding plate 15 is rotatably connected to one end of the connecting strip 14. The sliding plate 15 is used to drive the clamping plate 16 to move, realizing the opening and closing of the clamping plate 16. The sliding plate 15 is slidably connected to the inside of the placement box 9, and the clamping plate 16 is fixedly connected to the side wall of the sliding plate 15. The motor 12, in conjunction with the rotating plate 13 and the connecting strip 14, drives the sliding plate 15 and the clamping plate 16 to perform reciprocating linear motion, achieving the effect of automatically clamping or releasing the chip. The adjustment component includes a motor 3 and a screw 4. The motor 3 provides power for the horizontal movement of the sliding table 5, and drives the screw 4 to rotate through the rotation of its output end. The side wall of the motor 3 is fixedly connected to the side wall of the side plate 2, and the output end of the motor 3 is fixedly connected to one end of the screw 4. The screw 4 is used to convert the rotational motion of the motor 3 into the linear motion of the sliding table 5. The side wall of the screw 4... The sliding table 5 is rotatably connected inside the side plate 2. The side wall of the sliding table 5 is threadedly connected to the side wall of the screw 4. A motor 6 is fixedly connected to the side wall of the sliding table 5. Motor 6 provides power for the lateral movement of the slider 8. The rotation of the output end drives the screw 7 to rotate. The output end of motor 6 is fixedly connected to the screw 7, which converts the rotational motion of motor 6 into the linear motion of the slider 8. The side wall of screw 7 is rotatably connected inside the sliding table 5. A slider 8 is threadedly connected to the side wall of screw 7. The slider 8 drives the detection head 17 to move laterally, achieving horizontal position adjustment of the detection head 17. Motor 3, in conjunction with screw 4, drives the sliding table 5 along the side plate 2. The motor 26, in conjunction with the screw 27, drives the slider 8 and the detection head 17 to move below the sliding table 5, thereby adjusting the position of the detection head 17 to accurately align the chip. Inside the placement box 9, a push plate 10 is slidably connected. The push plate 10 is used to lift the chip after the test, making it easy to pick up and put down the chip. The bottom of the worktable 1 is fixedly connected to an electric push rod 26, which provides power for the lifting and lowering of the push plate 10. The push plate 10 moves up and down through the extension and retraction of its output end. The output end of the electric push rod 26 is fixedly connected to the bottom of the push plate 10. The electric push rod 26, in conjunction with the push plate 10, lifts the chip from the placement box 9, thereby making it easy to pick up and put down the chip and reducing damage from manual contact.
[0038] Reference Figures 4-7The assembly includes a mounting sleeve 18, which accommodates the detection head 17 and provides initial positioning for it. The sidewall of the mounting sleeve 18 is fixedly connected to the bottom of the slider 8. The sidewall of the detection head 17 is slidably connected inside the mounting sleeve 18. A rotating block 19 is rotatably connected inside the mounting sleeve 18. A ball bearing 20 is installed inside the mounting sleeve 18. The ball bearing 20 is used for mechanical locking by embedding into the detection head 17. The sidewall of the ball bearing 20 is slidably connected inside the detection head 17. A groove adapted to the ball bearing 20 is provided inside the rotating block 19. The sidewall of the ball bearing 20 is slidably connected inside the rotating block 19. The rotating block 19, in conjunction with the ball bearing 20, performs a rotating and pressing motion to push the ball bearing 20 into the detection head 17 for locking or disengaging it for releasing. A mounting shell 21 is fixedly connected to the sidewall of the mounting sleeve 18. A fixing seat 22 is fixedly connected inside the mounting shell 21. A spring 23 is installed inside the mounting shell 21. One end of the spring 23 is fixedly connected to the side wall of the fixed base 22, and the other end of the spring 23 is fixedly connected to the locking block 24. The locking block 24 is used to lock the rotating block 19, restricting the reverse rotation of the rotating block 19 and ensuring a stable locking state. The side wall of the locking block 24 is slidably connected inside the rotating block 19. The spring 23 cooperates with the locking block 24 to perform telescopic movement, achieving the effect of locking or releasing the rotating block 19. The side wall of the rotating block 19 is fixedly connected to the limiting plate 25. The limiting plate 25 is used to limit the rotation angle of the rotating block 19 and prevent it from rotating excessively and causing damage to the components. The side wall of the limiting plate 25 is attached to the side wall of the mounting shell 21. The rotating block 19 cooperates with the limiting plate 25 to perform rotational movement, achieving the effect of limiting the maximum rotation angle of the rotating block 19. The combination of components such as the mounting sleeve 18, rotating block 19, ball 20, and locking block 24 enables the quick disassembly and assembly of the detection head 17, thereby improving the replacement efficiency of the detection head 17 and ensuring installation stability.
[0039] Working principle: When using this device, first place the chip inside the placement box 9, then start motor 3 12. Its output end drives the rotating plate 13 to rotate. The rotating plate 13 pushes the sliding plate 15 to slide inside the placement box 9 through the connecting bar 14. The sliding plate 15 drives the clamping plate 16 to move towards the center of the placement box 9. The clamping plates 16 on both sides work together to clamp the chip. At this time, the detection head 17 performs the test. After the test is completed, motor 3 12 reverses, and the rotating plate 13 pulls the sliding plate 15 back to its original position through the connecting bar 14. Separate the chip to both sides, then activate the electric push rod 26 at the bottom of the worktable 1. Its output end pushes the push plate 10 to slide upward along the inner wall of the placement box 9, lifting the chip onto the surface of the placement box 9 for easy manual or robotic arm handling, avoiding chip damage caused by direct contact. When it is necessary to adjust the position of the detection head 17, start the motor 3. Its output end drives the screw 4 to rotate. The sliding table 5, because it is threadedly connected to the screw 4, slides horizontally along the inner wall of the side plate 2, realizing the position adjustment of the detection head 17 in the X-axis direction. Start the sliding table 5. The output of motor 6 drives screw 7 to rotate. Slider 8, being threadedly connected to screw 7, slides laterally along the inside of sliding table 5, causing detection head 17 to move in the Y-axis direction. When installing detection head 17, it is first inserted into mounting sleeve 18. Rotating rotating block 19 causes its inner wall groove to press against ball bearings 20, partially embedding them into the corresponding grooves of detection head 17, achieving initial fixation. Simultaneously, spring 23 inside mounting shell 21 pushes locking block 24 into the positioning groove of rotating block 19, restricting the rotation of rotating block 19. Reverse the rotation to ensure the detection head 17 is secure. When disassembly is required, rotate the rotating block 19 in the opposite direction to compress the spring 23 by squeezing the locking block 24, causing it to disengage from the positioning groove of the rotating block 19. At this time, push the detection head 17 outward, and the ball 20 will be squeezed out of the groove of the detection head 17 and slide into the corresponding locking groove inside the rotating block 19, thereby releasing the fixing effect. The detection head 17 can then be removed from the mounting sleeve 18. The limiting plate 25 on the side wall of the rotating block 19 fits against the side wall of the mounting shell 21 to prevent structural damage caused by excessive rotation of the rotating block 19.
[0040] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A semiconductor optical chip packaging test stage, comprising a worktable (1), characterized in that: The workbench (1) has a side plate (2) fixedly connected to its side wall. A sliding table (5) is slidably connected inside the side plate (2). A detection head (17) is provided at the bottom of the sliding table (5). A placement box (9) is fixedly connected to the upper surface of the workbench (1). A fixing component is provided on the side wall of the placement box (9). A disassembly component is provided below the sliding table (5). An adjustment component is provided on the side wall of the side plate (2). The fixing assembly includes a clamping plate (16), the side wall of which is slidably connected to the side wall of the placement box (9), a bracket (11) is fixedly connected to the side wall of the placement box (9), a motor (12) is fixedly connected to the side wall of the bracket (11), a rotating plate (13) is fixedly connected to the output end of the motor (12), a connecting strip (14) is rotatably connected to the side wall of the rotating plate (13), a sliding plate (15) is rotatably connected to one end of the connecting strip (14), the side wall of the sliding plate (15) is slidably connected to the inside of the placement box (9), and the side wall of the clamping plate (16) is fixedly connected to the side wall of the sliding plate (15).
2. The semiconductor optical chip packaging test stand according to claim 1, characterized in that: The adjustment assembly includes a motor (3) and a screw (4). The side wall of the motor (3) is fixedly connected to the side wall of the side plate (2). The output end of the motor (3) is fixedly connected to one end of the screw (4). The side wall of the screw (4) is rotatably connected to the inside of the side plate (2). The side wall of the sliding table (5) is threadedly connected to the side wall of the screw (4). The side wall of the sliding table (5) is fixedly connected to a motor (6). The output end of the motor (6) is fixedly connected to a screw (7). The side wall of the screw (7) is rotatably connected to the inside of the sliding table (5). The side wall of the screw (7) is threadedly connected to a slider (8).
3. The semiconductor optical chip packaging test station according to claim 2, characterized in that: The assembly and disassembly assembly includes an mounting sleeve (18), the side wall of which is fixedly connected to the bottom of the slider (8), and the side wall of the detection head (17) is slidably connected inside the mounting sleeve (18).
4. The semiconductor optical chip packaging test stand according to claim 1, characterized in that: The placement box (9) is slidably connected to a push plate (10), and the bottom of the workbench (1) is fixedly connected to an electric push rod (26), the output end of which is fixedly connected to the bottom of the push plate (10).
5. A semiconductor optical chip packaging test stand according to claim 3, characterized in that: The mounting sleeve (18) is rotatably connected to a rotating block (19), and the mounting sleeve (18) is provided with a ball bearing (20).
6. The semiconductor optical chip packaging test stand according to claim 5, characterized in that: The sidewall of the ball (20) is slidably connected to the inside of the detection head (17), and the inside of the rotating block (19) is provided with a slot adapted to the ball (20). The sidewall of the ball (20) is slidably connected to the inside of the rotating block (19).
7. A semiconductor optical chip packaging test stand according to claim 6, characterized in that: The mounting sleeve (18) is fixedly connected to the side wall of the mounting shell (21), and a fixing seat (22) is fixedly connected inside the mounting shell (21). A spring (23) is provided inside the mounting shell (21). One end of the spring (23) is fixedly connected to the side wall of the fixing seat (22), and the other end of the spring (23) is fixedly connected to a locking block (24). The side wall of the locking block (24) is slidably connected inside the rotating block (19).
8. A semiconductor optical chip packaging test stand according to claim 7, characterized in that: The side wall of the rotating block (19) is fixedly connected to a limiting plate (25), and the side wall of the limiting plate (25) is attached to the side wall of the mounting shell (21).