A drive mechanism for an etching equipment ejector pin

Abstract

This utility model relates to a drive mechanism for a ejector pin in an etching equipment, comprising an electrostatic chuck, a lifting assembly, a connecting assembly, a lifting ring, a linear guide rail, and a motor. The upper end of the electrostatic chuck is used to connect to the substrate, and the lower end of the electrostatic chuck is provided with the lifting assembly, which is mounted on the lifting ring. Multiple sets of lifting assemblies are provided, each set including an ejector pin. The ejector pin is movably inserted into the electrostatic chuck and the substrate. Connecting assemblies are symmetrically arranged on both sides of the lifting ring, one of which is connected to the output end of the motor, and the other is slidably mounted on the linear guide rail. By employing multiple sets of lifting assemblies, each including an ejector pin, and through the cooperation of the connecting assembly with the motor and linear guide rail, smooth lifting and lowering of the ejector pin is achieved, effectively preventing wafer tilting and improving the stability and reliability of wafer removal, especially suitable for lifting and lowering large-sized wafers.

Description

Technical Field

[0001] This utility model relates to the field of etching equipment technology, and specifically to a driving mechanism for an etching equipment ejector pin. Background Technology

[0002] In existing technologies, wafers are placed on a substrate. However, after the semiconductor process is completed, the wafer needs to be transferred from the substrate. At this time, a lifting pin is used to lift the wafer from the surface of the substrate, making it easier for a robotic arm to reach into the gap between the two and remove the wafer from the cavity. However, existing technologies only use a single piston or motor to drive the lifting pin for lifting and lowering, which is prone to uneven force and may cause the wafer or substrate to tilt, making it impossible to remove the wafer properly. Utility Model Content

[0003] This invention addresses the existing technical problems by providing a driving mechanism for the ejector pin of an etching device.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A driving mechanism for a pin of an etching device includes an electrostatic chuck, a lifting assembly, a connecting assembly, a lifting ring, a linear guide rail, and a motor. The upper end of the electrostatic chuck is used to connect with a substrate, and the lower end of the electrostatic chuck is provided with the lifting assembly. The lifting assembly is mounted on the lifting ring. The lifting assembly is provided in multiple sets, and each set of the lifting assembly includes a pin. The pin is movably inserted into the electrostatic chuck and the substrate. The connecting assemblies are symmetrically arranged on both sides of the lifting ring. One of the connecting assemblies is connected to the output end of the motor, and the other connecting assembly is slidably mounted on the linear guide rail.

[0005] Based on the above technical solution, the present invention can be further improved as follows:

[0006] Preferably, the lifting assembly further includes a bellows and a top column, the top pin is mounted on the top column, the bellows is sleeved on the outside of the top column, the upper end of the bellows is sealed to the electrostatic chuck, and the lower end is sealed to the lifting ring.

[0007] Preferably, the lifting assembly is provided in three sets, and the three sets of lifting assemblies are evenly arranged along the circumference of the lifting ring.

[0008] Preferably, each of the connecting components includes a lifting plate and a support block, with the support block mounted on the lifting plate and the lifting ring mounted on the support block.

[0009] Preferably, it further includes a limiting component, which includes a limiting ring and a support rod. The limiting ring is located above the substrate, and the support rods are symmetrically arranged on both sides of the limiting ring. The support rods are mounted on the connecting component.

[0010] The beneficial effects of this invention are as follows: By employing multiple sets of lifting components, each including a ejector pin, and through the cooperation of connecting components with a motor and linear guide rail, smooth lifting and lowering of the ejector pin is achieved, effectively preventing wafer tilting and improving the stability and reliability of wafer removal, especially suitable for lifting and lowering larger wafers. Simultaneously, the bellows design not only ensures the sealing of the lifting components, enabling the ejector pin to lift and lower without compromising the internal seal of the cavity, but also acts as a buffer and protector, further improving the stability and service life of the entire drive mechanism. Attached Figure Description

[0011] Figure 1 This is a three-dimensional schematic diagram of the drive mechanism of this utility model;

[0012] Figure 2 This is a front view of the drive mechanism of this utility model;

[0013] Figure 3 This is a cross-sectional view of the present invention;

[0014] Figure 4 This is a schematic diagram of the lifting assembly of this utility model;

[0015] Figure 5 This is a cross-sectional view of the lifting component of this utility model.

[0016] The attached diagram is labeled as follows: 1. Limiting ring; 2. Electrostatic chuck; 3. Bellows; 4. Lifting ring; 5. Linear guide rail; 6. Lifting plate; 7. Support block; 8. Support rod; 9. Motor; 10. Ejector pin; 11. Ejector column; 12. Base plate. Detailed Implementation

[0017] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0018] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. The terms "vertical," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this utility model.

[0019] like Figures 1 to 5 As shown, this utility model discloses a driving mechanism for a ejector pin in an etching device, including an electrostatic chuck 2, a lifting assembly, a connecting assembly, a lifting ring 4, a linear guide rail 5, and a motor 9. The upper end of the electrostatic chuck 2 is used to connect to a substrate 12. The electrostatic chuck 2 and the substrate 12 are connected by screws or bolts, and a sealing ring is provided at the joint between them. The substrate 12 is used to place a wafer. The electrostatic chuck 2 and the substrate 12 are fixed on the inner wall of a vacuum chamber (not shown in the figure). The lower end of the electrostatic chuck 2 is provided with a lifting assembly, which is mounted on the lifting ring 4. There are multiple sets of lifting assemblies, and each set of lifting assemblies includes an ejector pin 10. The ejector pin 10 is movably inserted into the electrostatic chuck 2 and the substrate 12. The ejector pin 10 moves upward through the electrostatic chuck 2 and the substrate 12, thereby pushing the wafer to rise and fall. Connecting assemblies are symmetrically arranged on both sides of the lifting ring 4. One connecting assembly is connected to the output end of the motor 9, and the other connecting assembly is slidably mounted on the linear guide rail 5.

[0020] When motor 9 starts, it drives the connected components to move, which in turn pushes the lifting ring 4 to move linearly along the linear guide rail 5. Since the lifting ring 4 is equipped with a lifting assembly, the lifting assembly moves along with the lifting ring 4. When the lifting assembly moves to a certain position, the ejector pin 10 extends upward through the electrostatic chuck 2 and the substrate 12, thereby lifting the wafer placed on the substrate 12. Because multiple sets of lifting assemblies are provided, and these lifting assemblies are evenly arranged along the circumference of the lifting ring 4, the stability of the wafer during the lifting process can be ensured, preventing the wafer from tilting.

[0021] In this embodiment, the lifting assembly also includes a bellows 3 and a top column 11. The ejector pin 10 is mounted on the top column 11, which provides a fixed length for mounting the ejector pin 10. The bellows 3 is sleeved on the outside of the top column 11. The upper end of the bellows 3 is sealed to the electrostatic chuck 2, and the lower end is sealed to the lifting ring 4. The bellows 3 is a metal bellows, and both ends of the bellows 3 can be welded to the electrostatic chuck 2 and the lifting ring 4 to achieve a sealed connection. The bellows 3 sleeved on the outside of the top column 11 not only ensures the sealing of the lifting assembly and enables the lifting action of the ejector pin 10 without compromising the internal sealing of the cavity, but also effectively prevents dust and impurities from entering the cavity, ensuring the cleanliness of the etching equipment and the working environment. In addition, the bellows 3 also plays a role in buffering and protection. When the ejector pin 10 is subjected to impact or vibration during lifting, the bellows 3 can absorb some energy, reducing the wear and damage of the ejector pin 10, thereby extending the service life of the entire drive mechanism.

[0022] Specifically, the lifting assembly consists of three sets, which are evenly arranged around the four circumferences of the lifting ring. This design, with three sets of lifting assemblies evenly arranged around the lifting ring, ensures more uniform force distribution on the wafer during lifting, further improving the stability and reliability of wafer lifting.

[0023] In this embodiment, each connecting assembly includes a lifting plate 6 and a support block 7. The support block 7 is mounted on the lifting plate 6, and the lifting ring 4 is mounted on the support block 7. One lifting plate 6 is slidably connected to the linear guide rail 5, and the other lifting plate 6 is connected to the output end of the motor 9. When the motor 9 is working, it can drive the lifting ring 4 to move smoothly along the linear guide rail 5, thereby driving the lifting assembly mounted on it to move. When the lifting assembly moves to the appropriate position, the ejector pin 10 will extend from the electrostatic chuck 2 and the substrate 12, thereby lifting the wafer on the substrate 12. This design not only achieves smooth lifting and lowering of the wafer, but also effectively avoids the tilting problem of the wafer during the lifting process, greatly improving the stability and reliability of wafer removal.

[0024] The drive mechanism for the etching equipment ejector pin also includes a limiting component, which includes a limiting ring 1 and support rods 8. The limiting ring 1 is located above the substrate 12 and is also located within the vacuum chamber. Support rods 8 are symmetrically arranged on both sides of the limiting ring 1 and are mounted on the connecting component. When the motor 9 drives the ejector pin 10 to descend below the electrostatic chuck 2, the limiting ring 1 moves downward synchronously, initially fixing the wafer on the substrate 12. The vacuum chuck (not shown in the figure) on the substrate 12 adsorbs the wafer, thus fixing it, and then the wafer is etched. After the wafer is etched, the motor 9 drives the ejector pin 10 and the limiting ring 1 to move upward. The ejector pin 10 overcomes the elasticity of the bellows 3, passes through the electrostatic chuck 2 and the substrate 12, and moves upward, thereby pushing the wafer up. Due to the height difference between the limiting ring 1 and the ejector pin 10, the robot arm extends into the vacuum chamber from the opening on the side of the vacuum chamber and removes the wafer from the substrate 12, thus achieving normal wafer removal.

[0025] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A drive mechanism for an etching device ejector pin, characterized in that, The system includes an electrostatic chuck (2), a lifting assembly, a connecting assembly, a lifting ring (4), a linear guide rail (5), and a motor (9). The upper end of the electrostatic chuck (2) is used to connect to the substrate (12). The lower end of the electrostatic chuck (2) is provided with the lifting assembly, which is mounted on the lifting ring (4). The lifting assembly is provided in multiple sets, and each set of the lifting assembly includes a pin (10). The pin (10) is movably inserted into the electrostatic chuck (2) and the substrate (12). The connecting assemblies are symmetrically arranged on both sides of the lifting ring (4). One of the connecting assemblies is connected to the output end of the motor (9), and the other connecting assembly is slidably mounted on the linear guide rail (5).

2. The driving mechanism for the etching equipment ejector pin according to claim 1, characterized in that, The lifting assembly also includes a bellows (3) and a top column (11). The top pin (10) is mounted on the top column (11). The bellows (3) is sleeved on the outside of the top column (11). The upper end of the bellows (3) is sealed to the electrostatic chuck (2), and the lower end is sealed to the lifting ring (4).

3. The driving mechanism for the etching equipment ejector pin according to claim 2, characterized in that, The lifting assembly is provided in three sets, and the three sets of lifting assemblies are evenly arranged along the circumference of the lifting ring (4).

4. The driving mechanism for the etching equipment ejector pin according to claim 1 or 2, characterized in that, Each of the connecting components includes a lifting plate (6) and a support block (7), the support block (7) being mounted on the lifting plate (6) and the lifting ring (4) being mounted on the support block (7).

5. The driving mechanism for the etching equipment ejector pin according to claim 1, characterized in that, It also includes a limiting component, which includes a limiting ring (1) and a support rod (8). The limiting ring (1) is located above the substrate (12), and the support rod (8) is symmetrically arranged on both sides of the limiting ring (1). The support rod (8) is mounted on the connecting component.

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