A new type of quartz wafer boat for low pressure chemical vapor deposition
By designing a cylindrical shell and an equidistantly arranged strip slot structure, the problem of uneven airflow in the LPCVD wafer carrier was solved, achieving uniform deposition of thin films on the wafer and meeting the requirements of high-precision processes.
CN224299350UActive Publication Date: 2026-05-29HANGZHOU HUAXIN OPTOELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU HUAXIN OPTOELECTRONICS CO LTD
- Filing Date
- 2025-05-09
- Publication Date
- 2026-05-29
AI Technical Summary
Technical Problem
The existing LPCVD carrier boat structure causes uneven airflow, resulting in inconsistent film thickness on the wafer, which makes it difficult to meet the requirements of high-precision processes.
Method used
Design a cylindrical shell structure with open ends, and set several sets of equally spaced strip slots on the shell, combined with a plate support, to ensure uniform airflow and avoid airflow obstruction.
Benefits of technology
It improves the deposition uniformity of the LPCVD process, avoids the problem of uneven film thickness distribution, and meets the requirements of high-precision processes.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224299350U_ABST
Abstract
The utility model discloses a novel quartz slide boat of low pressure chemical vapor deposition, including the casing, its characterized in that the casing is the cylindrical structure of two ends communicating, still be equipped with several groups equidistance arrangement's strip open slot and install in the slide support of casing in the casing, the utility model discloses a structure of casing is set up as the cylindrical structure of two ends communicating, and sets up several groups equidistance arrangement's strip open slot on the casing, makes the airflow even into the slide boat inside, effectively improves the deposition uniformity of LPCVD process, and the casing both ends are completely open, avoided the deposition thickness distribution uneven problem because of the airflow obstruction.
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