Electronic device

Abstract

The application discloses an electronic device, and belongs to the technical field of electronic devices. The electronic device comprises a frame body, a circuit board, a loudspeaker and a first support. The frame body comprises a main body and a frame, the frame is arranged along the outer peripheral edge of the main body, the frame is provided with a first sound outlet, the main body is provided with a sound outlet channel, the sound outlet channel is communicated with the first sound outlet. The circuit board is arranged on the main body, and a notch is arranged on the side of the circuit board close to the first sound outlet. The loudspeaker is arranged in the notch and connected with the main body, the loudspeaker and the main body surround a first sound cavity, the first sound cavity is communicated with the sound outlet channel. The first support is arranged on the side of the loudspeaker away from the main body and surrounds the loudspeaker, part of the first support is connected with the circuit board, and the other part of the first support is connected with the main body.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] In related technologies, electronic devices include a frame with a circuit board support. The circuit board of the electronic device is mounted on the circuit board support. The circuit board has through holes. The electronic device also includes a speaker, which is disposed within the through holes. The area on the circuit board surrounding the speaker is respectively fitted to the frame and the circuit board support to achieve a seal around the speaker. The frame has a sound outlet channel, and the top of the frame has a sound outlet hole. The sound outlet channel extends from the speaker to the sound outlet hole, allowing the sound emitted by the speaker to be transmitted to the outside of the electronic device through the sound outlet channel and the sound outlet hole. However, because the sound outlet channel extends from the speaker to the sound outlet hole, the distance between the speaker and the sound outlet hole increases, resulting in a longer sound outlet channel and making the injection molding of the one-piece injection molded frame more difficult. Utility Model Content

[0003] This application aims to provide an electronic device that at least solves one of the problems of the long length of the sound output channel and the difficulty of injection molding the one-piece injection molded middle frame.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] In a first aspect, embodiments of this application propose an electronic device, including a frame, a circuit board, a speaker, and a first bracket; the frame includes a body and a frame, the frame being arranged along the outer periphery of the body, the frame having a first sound outlet hole, the body having a sound outlet channel communicating with the first sound outlet hole; the circuit board being disposed on the body, the side of the circuit board near the first sound outlet hole having a notch; the speaker being disposed within the notch and connected to the body, the speaker and the body forming a first sound cavity, the first sound cavity communicating with the sound outlet channel; the first bracket being disposed on the side of the speaker away from the body, around the speaker, part of the first bracket being connected to the circuit board, and another part of the first bracket being connected to the body.

[0006] In the embodiments of this application, since a notch is provided on the side of the circuit board near the first sound outlet, and the speaker is disposed within the notch, the speaker is positioned closer to the first sound outlet, thereby shortening the length of the sound outlet channel. During the injection molding of the frame, the shorter length of the sound outlet channel reduces the injection molding difficulty, simplifying the frame's injection molding process, reducing its difficulty, and increasing the yield rate after injection molding. Furthermore, the notch on the side of the circuit board near the first sound outlet, with the speaker disposed within the notch, reduces the space occupied by the speaker on the circuit board layout, increases the size of the first sound cavity enclosed by the speaker and the body, improves the speaker's sound quality, and thus enhances the external playback quality of the electronic device.

[0007] Secondly, embodiments of this application propose an electronic device, including a frame, a circuit board, a second bracket, a speaker, and a first bracket; the frame includes a body and a frame, the frame being arranged along the outer periphery of the body, and the frame having a first sound outlet hole; the circuit board is disposed on the body, and the circuit board has a first through hole; the second bracket is disposed on the body, and the second bracket and the body enclose a sound outlet channel, the sound outlet channel communicating with the first sound outlet hole; the speaker is disposed in the first through hole and connected to the second bracket, the speaker, the second bracket, and the body enclose a first sound cavity, the first sound cavity communicating with the sound outlet channel; the first bracket is disposed on the side of the speaker away from the body and connected to the circuit board.

[0008] In the embodiments of this application, since the second bracket disposed on the main body and the main body enclose the sound outlet channel, at least a portion of the sound outlet channel is formed by the separable second bracket and the main body, thus shortening the length of the sound outlet channel disposed on the main body, or even eliminating the need for a separate sound outlet channel on the main body. During the injection molding of the frame, the shorter length of the sound outlet channel on the main body reduces the difficulty of injection molding, thereby simplifying the injection molding process, reducing the difficulty of injection molding, and increasing the yield rate of the molded frame. Furthermore, since the circuit board has a first through hole, and the speaker is disposed within the first through hole, the circuit board is disposed around the speaker, facilitating the sealing of the speaker and improving its quality and sound effect.

[0009] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0010] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0011] Figure 1 This is one of the exploded views of an electronic device according to an embodiment of this application;

[0012] Figure 2 This is one of the cross-sectional views of an electronic device according to an embodiment of this application;

[0013] Figure 3 This is a partial schematic diagram of the frame according to an embodiment of this application;

[0014] Figure 4 This is a partial schematic diagram of an electronic device according to an embodiment of this application;

[0015] Figure 5 This is a partial schematic diagram of the border according to an embodiment of this application;

[0016] Figure 6 This is a second exploded view of an electronic device according to an embodiment of this application;

[0017] Figure 7 This is a second cross-sectional view of an electronic device according to an embodiment of this application;

[0018] Figure 8 This is a third cross-sectional view of an electronic device according to an embodiment of this application;

[0019] Figure 9 This is a schematic diagram of the structure of the second bracket according to an embodiment of this application.

[0020] Figure label:

[0021] 100 Frame, 110 Body, 112 Sound outlet channel, 114 First sealing surface, 116 Second sealing surface, 118 Third sealing surface, 119 Fourth sealing surface, 120 Frame, 122 First sound outlet hole, 124 Groove, 130 Support part, 140 Glue, 200 Circuit board, 210 Notch, 220 First through hole, 300 Speaker, 310 First sound cavity, 320 Second sound cavity, 400 First bracket, 510 First seal, 512 First sealing part, 514 Second sealing part, 520 Second seal, 522 Third sealing part, 524 Fourth sealing part, 530 Third seal, 540 Fourth seal, 600 Screen module, 610 Foam, 620 Gap, 700 Second bracket, 710 Fifth sealing surface, 800 Battery cover. Detailed Implementation

[0022] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0023] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0024] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] The following is combined with Figures 1 to 9 This application describes an electronic device according to an embodiment of the present application.

[0027] like Figure 1 and Figure 2As shown, an electronic device according to some embodiments of this application includes a frame 100, a circuit board 200, a speaker 300, and a first bracket 400. The frame 100 includes a body 110 and a frame 120. The frame 120 is arranged along the outer peripheral edge of the body 110 and is provided with a first sound outlet 122. The body 110 is provided with a sound outlet channel 112, which communicates with the first sound outlet 122. The circuit board 200 is disposed on the body 110, and a notch 210 is provided on the side of the circuit board 200 near the first sound outlet 122. The speaker 300 is disposed in the notch 210 and connected to the body 110. The speaker 300 and the body 110 enclose a first sound cavity 310, which communicates with the sound outlet channel 112. The first bracket 400 covers the side of the speaker 300 away from the body 110. Around the speaker 300, part of the first bracket 400 is connected to the circuit board 200, and another part of the first bracket 400 is connected to the body 110.

[0028] In this embodiment, the electronic device includes a frame 100 and a circuit board 200. The frame 100 includes a body 110 and a frame 120. The frame 120 is arranged along the outer periphery of the body 110. The circuit board 200 is disposed on the body 110, thereby supporting the circuit board 200 through the body 110. A notch 210 is provided on the side of the circuit board 200 near the first sound outlet 122. The electronic device also includes a speaker 300, which is disposed in the notch 210 and connected to the body 110, thereby enabling the installation and fixation of the speaker 300. The frame 120 is provided with the first sound outlet 122, and the body 110 is provided with a sound outlet channel 112. The speaker 300 and the body 110 enclose a first sound cavity 310, which is connected to the first sound outlet 122 through the sound outlet channel 112. When the electronic device is working, the sound emitted by the speaker 300 can be transmitted to the outside of the electronic device through the first sound cavity 310, the sound outlet channel 112, and the first sound outlet 122 (the sound travels along the sound outlet). Figure 2 (The path indicated by the middle arrow) is used to transmit sound, thereby realizing the external sound playback function of the electronic device. The electronic device also includes a first bracket 400, which covers the side of the speaker 300 away from the body 110. Around the speaker 300, part of the first bracket 400 is connected to the circuit board 200, and another part of the first bracket 400 is connected to the body 110. While realizing the installation and fixation of the circuit board 200, the first bracket 400, the circuit board 200, and the body 110 work together to seal the speaker 300, thereby improving the sound quality of the speaker 300.

[0029] Because a notch 210 is provided on the side of the circuit board 200 near the first sound outlet 122, and the speaker 300 is disposed within the notch 210, the position of the speaker 300 is closer to the first sound outlet 122, thereby shortening the length of the sound outlet channel 112. During injection molding of the frame 100, the shorter length of the sound outlet channel 112 makes injection molding of the frame 100 easier, simplifying the injection molding process, reducing the injection difficulty of the frame 100, and increasing the yield rate after injection molding. Furthermore, because the notch 210 is provided on the side of the circuit board 200 near the first sound outlet 122, and the speaker 300 is disposed within the notch 210, the space occupied by the speaker 300 on the circuit board 200 is reduced, the first sound cavity 310 enclosed by the speaker 300 and the body 110 is enlarged, improving the sound quality of the speaker 300 and thus enhancing the external playback quality of the electronic device.

[0030] Furthermore, the speaker 300 is electrically connected to the circuit board 200, and the circuit board 200 can control the speaker 300 to emit sound.

[0031] Furthermore, the notch 210 extends from the edge of the circuit board 200 into the interior of the circuit board 200, and the edge of the notch 210 on the side of the circuit board 200 near the first sound outlet 122 is not closed.

[0032] Furthermore, the first acoustic cavity 310 is the front acoustic cavity of the loudspeaker 300.

[0033] The first bracket 400 and the speaker 300 enclose a second sound cavity 320, which is the rear sound cavity of the speaker 300.

[0034] Furthermore, there are multiple first sound outlet holes 122, which are arranged in parallel to meet the sound output requirements of the speaker 300 while reducing the noise carried by the speaker 300 when playing sound.

[0035] Furthermore, electronic devices include mobile phones, tablets, smart wearable devices, e-readers, or laptops.

[0036] According to some embodiments of this application, such as Figure 1 and Figure 2As shown, the electronic device also includes a first seal 510 and a second seal 520; the first seal 510 is arranged along the outer periphery of the speaker 300; the second seal 520 is arranged along the outer periphery of the speaker 300; wherein, in the area around the speaker 300 away from the first sound outlet 122, the first seal 510 is disposed between the body 110 and the circuit board 200, and the second seal 520 is disposed between the circuit board 200 and the first bracket 400; in the area around the speaker 300 near the first sound outlet 122, the second seal 520 is fitted with the first seal 510 and located between the body 110 and the first bracket 400.

[0037] In this embodiment, the electronic device further includes a first sealing member 510, which is arranged along the outer periphery of the speaker 300. In the area around the speaker 300 away from the first sound outlet 122, the first sealing member 510 is disposed between the body 110 and the circuit board 200, thereby achieving a seal between the body 110 and the circuit board 200. The electronic device also includes a second sealing member 520, which is arranged along the outer periphery of the speaker 300. In the area around the speaker 300 away from the first sound outlet 122, the second sealing member 520 is disposed between the circuit board 200 and the first bracket 400. While achieving a seal between the first bracket 400 and the circuit board 200, in the area around the speaker 300 near the first sound outlet 122, the first sealing member 510 and the second sealing member 520 fit together at the notch 210 of the circuit board 200, thereby achieving a seal between the first bracket 400 and the body 110 and improving the sealing effect around the speaker 300.

[0038] Specifically, both the first seal 510 and the second seal 520 are sealing foam.

[0039] Specifically, the speaker 300 is disposed within the notch 210 of the circuit board 200, and the body 110, the first seal 510, the circuit board 200, the second seal 520, and the first bracket 400 cooperate to save layout space, optimize the function of the speaker 300, and achieve an IP68 waterproof and dustproof rating. A first sound outlet 122 is provided on the frame 120, making the electronic device's appearance cleaner and more aesthetically pleasing.

[0040] According to some embodiments of this application, such as Figure 1 and Figure 2As shown, the first sealing member 510 includes a first sealing part 512 and a second sealing part 514; the first sealing part 512 is located in the area around the speaker 300 away from the first sound outlet 122, and is disposed between the circuit board 200 and the body 110; the second sealing part 514 is connected to the first sealing part 512, is located in the area around the speaker 300 near the first sound outlet 122, and fits against the second sealing member 520.

[0041] In this embodiment, the first sealing member 510 includes a first sealing portion 512, which is disposed between the circuit board 200 and the body 110, thereby achieving a seal between the body 110 and the circuit board 200. The first sealing member 510 also includes a second sealing portion 514, which is connected to the first sealing portion 512 and located in the area around the speaker 300 where the circuit board 200 is not located. It fits against the second sealing member 520, achieving a seal at the notch 210 of the circuit board 200, thus improving the sealing effect around the speaker 300. Furthermore, the connection between the first sealing portion 512 and the second sealing portion 514 allows the first sealing member 510 to form a continuous sealing structure around the speaker 300, preventing the formation of a continuous sealing structure due to the absence of the circuit board 200 in certain areas around the speaker 300, further improving the sealing effect around the speaker 300.

[0042] According to some embodiments of this application, such as Figure 1 and Figure 2 As shown, the second seal 520 includes a third seal portion 522 and a fourth seal portion 524; the third seal portion 522 is located in the area around the speaker 300 away from the first sound outlet 122 and is disposed between the circuit board 200 and the first bracket 400; the fourth seal portion 524 is connected to the third seal portion 522, one side of the fourth seal portion 524 is in contact with the second seal portion 514, and the other side of the fourth seal portion 524 is in contact with the first bracket 400.

[0043] In this embodiment, the second sealing member 520 includes a third sealing portion 522, which is disposed between the circuit board 200 and the first bracket 400, thereby achieving a seal between the circuit board 200 and the first bracket 400. The second sealing member 520 also includes a fourth sealing portion 524, one side of which is abutted against the second sealing portion 514, and the other side of which is abutted against the first bracket 400, thus sealing the notch 210 of the circuit board 200 and improving the sealing effect around the speaker 300. Furthermore, the third sealing portion 522 and the fourth sealing portion 524 are connected, forming a continuous sealing structure around the speaker 300, preventing the lack of a continuous sealing structure due to the absence of circuit board 200 in certain areas around the speaker 300, further improving the sealing effect around the speaker 300.

[0044] According to some embodiments of this application, such as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the body 110 includes a first sealing surface 114 and a second sealing surface 116. The first sealing surface 114 and the second sealing surface 116 are arranged around the speaker 300, and the second sealing surface 116 is closer to the first bracket 400 than the first sealing surface 114. The first sealing part 512 is attached to the first sealing surface 114, and the circuit board 200 is disposed at the first sealing surface 114. The second sealing part 514 is attached to the second sealing surface 116.

[0045] In this embodiment, the body 110 includes a first sealing surface 114 and a second sealing surface 116. The first sealing surface 114 and the second sealing surface 116 are arranged around the speaker 300, and the second sealing surface 116 is closer to the first bracket 400 than the first sealing surface 114. This makes the sealing surface supporting the first sealing member 510 around the speaker 300 form a stepped structure. The height difference between the first sealing surface 114 and the second sealing surface 116 offsets the thickness of the circuit board 200 itself, making the first sealing member 510 and the second sealing member 520 fit more tightly, thereby improving the sealing effect around the speaker 300.

[0046] According to some embodiments of this application, such as Figure 3 and Figure 4 As shown, the body 110 also includes a third sealing surface 118, which extends obliquely from the first sealing surface 114 to the second sealing surface 116 relative to the first sealing surface 114.

[0047] In this embodiment, the body 110 also includes a third sealing surface 118, which extends obliquely from the first sealing surface 114 to the second sealing surface 116 relative to the first sealing surface 114, making the transition between the first sealing surface 114 and the second sealing surface 116 smoother, avoiding the formation of a step between the first sealing surface 114 and the second sealing surface 116, improving the continuity between the first sealing portion 512 disposed on the first sealing surface 114 and the second sealing portion 514 disposed on the second sealing surface 116, and further improving the sealing effect around the speaker 300.

[0048] According to some embodiments of this application, both the first seal 510 and the second seal 520 are elastic elements.

[0049] In this embodiment, after the first bracket 400 and the circuit board 200 are assembled into the body 110, the first bracket 400, the circuit board 200 and the body 110 can compress the first seal 510 and the second seal 520 to produce a certain elastic deformation, thereby improving the tightness of the contact between the body 110, the first seal 510 and the circuit board 200, as well as improving the tightness of the contact between the circuit board 200, the second seal 520 and the first bracket 400, further improving the sealing effect around the speaker 300.

[0050] According to some embodiments of this application, such as Figure 1 and Figure 2 As shown, the electronic device also includes a screen module 600, which covers the frame 100 and is located on the side of the body 110 away from the circuit board 200. There is a gap 620 between the screen module 600 and the frame 120, and the gap 620 is connected to the sound output channel 112.

[0051] In this embodiment, the electronic device further includes a screen module 600, which covers the frame 100, thereby supporting the screen module 600. The screen module 600 is located on the side of the body 110 away from the circuit board 200. A gap 620 exists between the screen module 600 and the frame 120, and the gap 620 communicates with the sound outlet channel 112. When the user operates the electronic device, the sound generated by the speaker 300 can be transmitted to the outside of the electronic device through the sound outlet channel 112 and the gap 620 (the sound travels along the sound path). Figure 2 (Path transmission indicated by the middle arrow).

[0052] Specifically, when a user makes a call through an electronic device or when a user uses an electronic device to play music, the sound emitted by the speaker 300 can be transmitted to the user through the sound output channel 112 and the gap 620.

[0053] Specifically, the screen module 600 can be a rigid screen (such as a GOLED display panel, i.e., an OLED display panel set on an inflexible glass substrate).

[0054] The screen module 600 provides display and touch control for electronic devices.

[0055] Furthermore, the electronic device also includes a battery cover 800, which is disposed on the frame 100 and located on the side of the frame 100 away from the screen module 600.

[0056] According to some embodiments of this application, such as Figure 2 and Figure 5 As shown, a groove 124 is provided on the side of the frame 120 near the circuit board 200. The opening of the groove 124 faces the screen module 600, and the groove 124 is connected to the first sound hole 122.

[0057] In this embodiment, a groove 124 is provided on the side of the frame 120 near the circuit board 200. The opening of the groove 124 faces the screen module 600, and the groove 124 is connected to the first sound outlet 122. The frame 120 realizes the connection between the sound outlet channel 112 and the first sound outlet 122 through the groove 124, so as to avoid the frame 120 blocking the sound outlet channel 112 and improve the smoothness of sound transmission.

[0058] Furthermore, the sound outlet channel 112 is connected to the first sound outlet hole 122 via the groove 124.

[0059] Furthermore, a groove 124 is provided at the location of the gap between the frame 120 and the screen module 600 to reduce the width of the gap 620. The groove 124 can be machined by a T-shaped milling cutter, saving the time required to machine the groove 124 and improving the precision of the appearance.

[0060] The screen module 600 and the first bracket 400 of the frame 120 have a gap 620, and the sound channel 112 is connected to the gap 620 through the groove 124.

[0061] According to some embodiments of this application, such as Figure 2 As shown, the frame 100 also includes a support portion 130 and an adhesive 140; the support portion 130 is disposed on the side of the body 110 away from the speaker 300; the adhesive 140 is disposed on the support portion 130 and is bonded to the screen module 600.

[0062] In this embodiment, a support portion 130 for connecting the screen module 600 is provided on the frame 100, and the screen module 600 is bonded to the support portion 130 by the adhesive 140, which simplifies the assembly process of the screen module 600 and allows for a wider variety of screen modules 600 that can be adapted to electronic devices, thus broadening the scope of application.

[0063] Specifically, the support part 130 protrudes from the boss of the body 110, and the screen module 600 is provided with foam 610 on the side near the body 110. The foam 610 is bonded to the boss by adhesive 140.

[0064] According to some embodiments of this application, such as Figure 2 As shown, the electronic device also includes a third seal 530, which is disposed between the speaker 300 and the body 110 and extends around the first acoustic cavity 310.

[0065] In this embodiment, the third sealing member 530 is disposed between the speaker 300 and the body 110, extending around the first sound cavity 310, thereby sealing the first sound cavity 310 and improving the sound quality of the speaker 300.

[0066] Specifically, the third seal 530 is double-sided adhesive.

[0067] This application provides an electronic device, such as... Figure 6 and Figure 7 As shown, the device includes a frame 100, a circuit board 200, a second bracket 700, a speaker 300, and a first bracket 400. The frame 100 includes a body 110 and a frame 120. The frame 120 is arranged along the outer periphery of the body 110 and has a first sound outlet 122. The circuit board 200 is disposed on the body 110 and has a first through hole 220. The second bracket 700 is disposed on the body 110 and forms a sound outlet channel 112 with the body 110. The sound outlet channel 112 communicates with the first sound outlet 122. The speaker 300 is disposed in the first through hole 220 and connected to the second bracket 700. The speaker 300, the second bracket 700, and the body 110 form a first sound cavity 310, which communicates with the sound outlet channel 112. The first bracket 400 covers the side of the speaker 300 away from the body 110 and is connected to the circuit board 200.

[0068] In embodiments of this application, the electronic device includes a frame 100 and a circuit board 200. The frame 100 includes a body 110 and a frame 120, with the frame 120 arranged along the outer periphery of the body 110. The circuit board 200 is disposed on the body 110, thereby supporting the circuit board 200 through the body 110. The circuit board 200 is provided with a first through hole 220. The electronic device also includes a speaker 300, which is disposed within the first through hole 220, thereby enabling the installation and fixation of the speaker 300. The frame 120 is provided with a first sound outlet 122. The electronic device also includes a second bracket 700, which is disposed on the body 110. The second bracket 700 and the body 110 enclose a sound outlet channel 112. The speaker 300 is connected to the second bracket 700. The speaker 300, the second bracket 700, and the body 110 enclose a first sound cavity 310. The first sound cavity 310 is connected to the first sound outlet 122 through the sound outlet channel 112. When the electronic device is working, the sound emitted by the speaker 300 can be transmitted to the outside of the electronic device through the first sound cavity 310, the sound outlet channel 112, and the first sound outlet 122, thereby realizing the sound playback function of the electronic device. The electronic device also includes a first bracket 400, which covers the side of the speaker 300 away from the body 110. The first bracket 400 is connected to the circuit board 200, and the first bracket 400 realizes the installation and fixation of the circuit board 200.

[0069] Because the second bracket 700 disposed on the main body 110 and the main body 110 enclose the sound outlet channel 112, at least part of the sound outlet channel 112 is formed by the separable second bracket 700 and the main body 110, thus shortening the length of the sound outlet channel 112 disposed on the main body 110, or even eliminating the need for a separate sound outlet channel 112 on the main body 110. During injection molding of the frame 100, the shorter length of the sound outlet channel 112 on the main body 110 reduces the injection molding difficulty of the frame 100, thereby simplifying the injection molding process, reducing the injection molding difficulty of the frame 100, and increasing the yield rate of the molded frame 100. Furthermore, because the circuit board 200 has a first through hole 220, and the speaker 300 is disposed within the first through hole 220, the circuit board 200 is disposed around the speaker 300, facilitating the sealing of the speaker 300 and improving the quality and sound effect of the speaker 300.

[0070] Furthermore, a portion of the sound output channel 112 is disposed on the main body 110, and the portion of the sound output channel 112 is formed by the second bracket 700 surrounding the main body 110.

[0071] Furthermore, all sound output channels 112 are formed by the second bracket 700 surrounding the main body 110.

[0072] Furthermore, electronic devices include mobile phones, tablets, smart wearable devices, e-readers, or laptops.

[0073] According to some embodiments of this application, such as Figure 6 and Figure 7 As shown, the electronic device also includes a first seal 510 and a second seal 520; the first seal 510 is arranged along the outer periphery of the speaker 300 and is located between the circuit board 200 and the body 110; the second seal 520 is arranged along the outer periphery of the speaker 300 and is located between the circuit board 200 and the first bracket 400.

[0074] In this embodiment, the electronic device further includes a first seal 510, which is arranged along the outer periphery of the speaker 300 and located between the circuit board 200 and the body 110, thereby achieving a seal between the body 110 and the circuit board 200. The electronic device also includes a second seal 520, which is arranged along the outer periphery of the speaker 300 and located between the circuit board 200 and the first bracket 400, thereby achieving a seal between the first bracket 400 and the circuit board 200, improving the sealing effect around the speaker 300.

[0075] The body 110, the first seal 510, the circuit board 200, the second seal 520 and the first bracket 400 work together to effectively ensure the bonding and sealing requirements, while achieving an IP68 waterproof and dustproof rating.

[0076] Specifically, both the first seal 510 and the second seal 520 are sealing foam.

[0077] According to some embodiments of this application, such as Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, the main body 110 is provided with a fourth sealing surface 119, which extends obliquely relative to the circuit board 200 from one end away from the first sound outlet 122 to one end near the first sound outlet 122; the second bracket 700 is provided with a fifth sealing surface 710, which extends along the fourth sealing surface 119; the electronic device also includes a fourth sealing element 540, which is disposed between the fourth sealing surface 119 and the fifth sealing surface 710.

[0078] In this embodiment, the electronic device further includes a fourth seal 540, which is arranged along the outer periphery of the speaker 300 and located between the second bracket 700 and the body 110, thereby achieving a seal between the second bracket 700 and the body 110.

[0079] The main body 110 is provided with a fourth sealing surface 119, and one side of the fourth sealing element 540 is attached to the fourth sealing surface 119. The second bracket 700 is provided with a fifth sealing surface 710, and the other side of the fourth sealing element 540 is attached to the fifth sealing surface 710. The fourth sealing surface 119 and the fifth sealing surface 710 cooperate to press the fourth sealing element 540, so that the fourth sealing element 540 has a tighter contact with the main body 110 and the second bracket 700, thereby improving the sealing effect between the second bracket 700 and the main body 110.

[0080] The fourth sealing surface 119 extends at an angle relative to the circuit board 200 from the end away from the first sound outlet 122 to the end near the first sound outlet 122. The fifth sealing surface 710 extends along the fourth sealing surface 119, so that the fourth sealing surface 119 and the fifth sealing surface 710 extend smoothly while reserving space for the sound outlet channel 112, avoiding positional interference between the second bracket 700, the sound outlet channel 112 and the speaker 300, which is conducive to the thinning and lightening of electronic devices.

[0081] Furthermore, the second bracket 700 is provided with a second through hole, which penetrates the electronic device along the thickness direction of the electronic device. The speaker 300, the second bracket 700 and the body 110 surround the first sound cavity 310, which is the front sound cavity of the speaker 300.

[0082] The first bracket 400 and the speaker 300 enclose a second sound cavity 320, which is the rear sound cavity of the speaker 300.

[0083] Furthermore, the fourth seal 540 is an elastic element, for example, the fourth seal 540 is a sealing foam.

[0084] Furthermore, the fourth seal 540 is double-sided adhesive.

[0085] Furthermore, the electronic device also includes a third seal 530 disposed between the speaker 300 and the second bracket 700.

[0086] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0087] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, include: The frame includes a body and a frame, the frame is arranged along the outer periphery of the body, the frame is provided with a first sound outlet hole, the body is provided with a sound outlet channel, and the sound outlet channel is connected to the first sound outlet hole; A circuit board is disposed on the body, and a notch is provided on the side of the circuit board near the first sound outlet hole; A loudspeaker is disposed within the notch and connected to the body. The loudspeaker and the body enclose a first acoustic cavity, which is connected to the sound outlet channel. A first bracket is provided on the side of the speaker away from the body. Around the speaker, part of the first bracket is connected to the circuit board, and another part of the first bracket is connected to the body.

2. The electronic device according to claim 1, characterized in that, Also includes: A first seal is arranged along the outer periphery of the speaker; A second seal is arranged along the outer periphery of the speaker; Wherein, in the area around the speaker away from the first sound outlet, the first seal is disposed between the body and the circuit board, and the second seal is disposed between the circuit board and the first bracket; In the area around the speaker near the first sound outlet, the second seal is fitted to the first seal and located between the body and the first bracket.

3. The electronic device according to claim 2, characterized in that, The first seal includes: A first sealing portion is located in the area around the speaker away from the first sound outlet and is disposed between the circuit board and the body; The second sealing part is connected to the first sealing part and is located in the area around the speaker near the first sound outlet, and fits against the second sealing element.

4. The electronic device according to claim 3, characterized in that, The second seal includes: The third sealing part is located in the area around the speaker away from the first sound outlet, and is disposed between the circuit board and the first bracket; The fourth sealing part is connected to the third sealing part, one side of the fourth sealing part is in contact with the second sealing part, and the other side of the fourth sealing part is in contact with the first bracket.

5. The electronic device according to claim 3, characterized in that, The body includes a first sealing surface and a second sealing surface, the first sealing surface and the second sealing surface are arranged around the speaker, and the second sealing surface is closer to the first bracket than the first sealing surface; The first sealing part is attached to the first sealing surface, and the circuit board is disposed at the first sealing surface; The second sealing part is attached to the second sealing surface.

6. The electronic device according to claim 5, characterized in that, The body also includes a third sealing surface, which extends from the first sealing surface to the second sealing surface at an angle relative to the first sealing surface.

7. The electronic device according to any one of claims 1 to 6, characterized in that, Also includes: A screen module is disposed on the frame and located on the side of the body away from the circuit board. There is a gap between the screen module and the frame, and the gap is connected to the sound output channel.

8. An electronic device, characterized in that, include: A frame, the frame comprising a body and a frame, the frame being arranged along the outer peripheral edge of the body, and the frame being provided with a first sound outlet hole; A circuit board, which is disposed on the body, and has a first through hole; The second bracket is disposed on the body, and the second bracket and the body form a sound channel, which is connected to the first sound hole. A loudspeaker is disposed in the first through hole and connected to the second bracket. The loudspeaker, the second bracket, and the body together form a first sound cavity, which is connected to the sound outlet channel. A first bracket is placed on the side of the speaker away from the main body and is connected to the circuit board.

9. The electronic device according to claim 8, characterized in that, Also includes: A first seal is arranged along the outer periphery of the speaker and located between the circuit board and the body; A second seal is arranged along the outer periphery of the speaker and located between the circuit board and the first bracket.

10. The electronic device according to claim 8 or 9, characterized in that, The body is provided with a fourth sealing surface, which extends at an angle relative to the circuit board from one end away from the first sound outlet to one end close to the first sound outlet. The second bracket is provided with a fifth sealing surface, which extends along the fourth sealing surface; The electronic device further includes a fourth seal, which is disposed between the fourth sealing surface and the fifth sealing surface.

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