A patch device for semiconductor chip processing

Abstract

The utility model discloses a kind of patching devices for semiconductor chip processing, including support base, the upper surface of the support base is fixedly installed with driving assembly, the upper surface of the support base is fixedly installed with support vertical board, the top of the support vertical board is fixedly installed with gluing element, one side of the support vertical board is fixedly installed with support recess, the inner side wall of the support recess is fixedly installed with electric cylinder, the telescopic end of the electric cylinder is fixedly installed with transmission plate, one side of the transmission plate is fixedly connected with feeding push plate, the upper of the support base is equipped with rotary disc. The utility model, by integrating gluing element and patching mechanism in one, gluing and patching operation can be completed on the same equipment, without transferring substrate between different equipment, shorten processing cycle, additionally, while patching, substrate gluing and feeding can be carried out synchronously, reduce the waiting time of process linkage, have the patching speed of promotion when chip processing.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip processing, and in particular to a chip mounting device for semiconductor chip processing. Background Technology

[0002] Semiconductor chips, also known as integrated circuit chips, are miniaturized devices that integrate a large number of electronic components such as transistors, resistors, and capacitors, along with their interconnections, onto an extremely small semiconductor single crystal wafer through semiconductor manufacturing processes. These devices achieve specific electronic functions and are core components of modern electronic devices. They are widely used in many fields such as computers, communications, consumer electronics, and automotive electronics, playing a crucial role in promoting the development of information technology and industrial upgrading.

[0003] In semiconductor chip manufacturing, chip mounting is a crucial step, where chips are attached to a substrate to enable electrical connection and physical fixation with external circuits. Existing chip mounting equipment typically separates adhesive application and chip mounting into independent processes. First, adhesive is applied to the substrate using a separate adhesive application device, and then the chip is placed onto the substrate using a separate mounting device. This transition between adhesive application and chip mounting wastes time, prevents continuous adhesive application and chip mounting, and reduces the chip mounting speed in semiconductor chip manufacturing. To address these issues, we propose a chip mounting device for semiconductor chip manufacturing. Utility Model Content

[0004] The purpose of this invention is to provide a chip mounting device for semiconductor chip processing to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A semiconductor chip mounting apparatus includes a support base, a drive assembly fixedly mounted on the upper surface of the support base, a support plate fixedly mounted on the upper surface of the support base, an adhesive applicator fixedly mounted on the top of the support plate, a support recess fixedly mounted on one side of the support plate, an electric cylinder fixedly mounted on the inner wall of the support recess, a transmission plate fixedly mounted on the telescopic end of the electric cylinder, a feeding pusher fixedly connected to one side of the transmission plate, a rotary disk above the support base, a mounting mechanism fixedly mounted on the upper surface of the support base, and a controller fixedly mounted on the outer surface of the support plate.

[0007] In a further embodiment, the adhesive applicator includes a carrier plate fixedly mounted on the upper surface of a support plate, a storage tank fixedly mounted on the upper surface of the carrier plate, an adhesive applicator pump fixedly mounted on the bottom surface of the carrier plate, an output end of the adhesive applicator pump fixedly connected to a drain pipe, and a bottom end of the drain pipe fixedly connected to an adhesive applicator tray.

[0008] In a further embodiment, the outer surface of the drain pipe is fixedly connected to a solenoid valve, the input end of the adhesive pump extends into the interior of the storage tank, and the upper surface of the storage tank is provided with an injection hole.

[0009] In a further embodiment, a servo motor is fixedly mounted on the upper surface of the support base, and a rotating shaft is fixedly mounted on the output end of the servo motor. The top end of the rotating shaft is fixedly connected to the bottom surface of the rotating disk.

[0010] In a further embodiment, a reinforcing plate is fixedly connected to the upper surface of the support base, and a bearing seat is fixedly connected to one side of the reinforcing plate. The inner ring of the bearing seat is rotatably connected to the outer surface of the rotating shaft.

[0011] In a further embodiment, a plurality of positioning seats are fixedly installed on the upper surface of the rotary disk, a feeding through hole is opened on one side of the support plate, the transmission plate is located inside the feeding through hole, and the feeding push plate is located on one side of one of the positioning seats.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This invention utilizes a coating component to apply adhesive to the substrate before chip mounting. Furthermore, an electric cylinder, transmission plate, and feeding pusher push the coated substrate to the top of the rotary table for subsequent chip mounting. A servo motor drives the rotary shaft, rotating the rotary table to deliver the next substrate to the mounting position of the chip mounting mechanism. Therefore, by integrating the coating component and the chip mounting mechanism, coating and mounting operations can be completed on the same equipment, eliminating the need to transfer substrates and chips between different devices, thus shortening the processing cycle. Additionally, substrate coating and feeding can be performed simultaneously during chip mounting, reducing waiting time between processes and increasing the chip mounting speed during chip processing. Attached Figure Description

[0014] Figure 1 A three-dimensional structural diagram of a chip mounting apparatus for semiconductor chip fabrication, viewed from the front.

[0015] Figure 2 A frontal cross-sectional view of a chip mounting apparatus for semiconductor chip fabrication;

[0016] Figure 3 A three-dimensional structural diagram of a chip mounting device for semiconductor chip processing, viewed from below;

[0017] Figure 4 A frontal cross-sectional view of the adhesive coating component in a chip mounting apparatus for semiconductor chip fabrication.

[0018] In the diagram: 1. Support base; 2. Drive assembly; 201. Servo motor; 202. Reinforcing support plate; 203. Bearing seat; 204. Rotating shaft; 3. Rotary disk; 4. Positioning seat; 5. Supporting upright plate; 6. Supporting recess; 7. Transmission plate; 8. Glue application component; 801. Carrier plate; 802. Glue application pump; 803. Drain pipe; 804. Solenoid valve; 805. Glue application tray; 806. Storage tank; 807. Injection hole; 9. Patch mounting mechanism; 10. Controller; 11. Electric cylinder; 12. Feeding push plate; 13. Feeding through hole. Detailed Implementation

[0019] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0020] In terms of circuit structure, the drive and control circuits of this utility model are common and mature technologies. Those skilled in the art can select appropriate circuit components to build the circuit according to the power requirements and control requirements of the equipment. For the power supply components, common general power supply equipment on the market can be used, as long as the voltage and current requirements of the equipment are met. No special design is required. In addition, the electrical components in this application are all common electrical equipment in the prior art. This application will not elaborate on their models or internal structures.

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figures 1-4In this utility model, a chip mounting device for semiconductor chip processing includes a support base 1. A drive assembly 2 is fixedly installed on the upper surface of the support base 1. A support plate 5 is fixedly installed on the upper surface of the support base 1. An adhesive applicator 8 is fixedly installed on the top of the support plate 5. A support recess 6 is fixedly installed on one side of the support plate 5. An electric cylinder 11 is fixedly installed on the inner wall of the support recess 6. A transmission plate 7 is fixedly installed on the telescopic end of the electric cylinder 11. A feeding pusher 12 is fixedly connected to one side of the transmission plate 7. A rotating disk 3 is provided above the support base 1. A chip mounting mechanism 9 is fixedly installed on the upper surface of the support base 1. The chip mounting mechanism 9 is the core component for achieving precise chip positioning and mounting. It typically includes the following key components: a suction module, a vacuum nozzle that uses vacuum negative pressure to adsorb the chip to ensure that the chip is stable and does not fall off during transportation, an electric lifting device that controls the up and down movement of the nozzle to realize the chip picking and placement actions, and a positioning calibration module. The unit is equipped with a high-definition camera to capture images of the chip and substrate. Algorithms calculate offsets to ensure precise chip placement. Force sensors monitor the pressure applied to the chip in real time during placement, preventing damage from excessive pressure or poor adhesion from insufficient pressure. A controller 10 is fixedly mounted on the outer surface of the support plate 5. The controller 10 is a programmable logic controller with a built-in central processing unit that executes logic control and motion planning algorithms to achieve timing control and logical linkage of processes such as gluing, feeding, rotation, and placement. The drive component 2 drives the rotation disk 3 and other components to move. The support plate 5 provides vertical support, fixing components such as the gluing component 8 and support recess 6 at appropriate heights and positions. The rotation disk 3 carries the substrate and facilitates its transfer between different workstations. The placement mechanism 9 places the chip onto the substrate. The controller 10 coordinates the operation of all components to ensure an orderly placement process.

[0023] In a further embodiment, the adhesive applicator 8 includes a carrier plate 801 fixedly mounted on the upper surface of the supporting plate 5. A storage tank 806 is fixedly mounted on the upper surface of the carrier plate 801. An adhesive applicator pump 802 is fixedly mounted on the bottom surface of the carrier plate 801. The output end of the adhesive applicator pump 802 is fixedly connected to a drain pipe 803. The bottom end of the drain pipe 803 is fixedly connected to an adhesive applicator tray 805. A solenoid valve 804 is fixedly connected to the outer surface of the drain pipe 803. The input end of the adhesive applicator pump 802 extends into the interior of the storage tank 806. The upper surface is provided with an injection hole 807. The carrier plate 801 can provide a mounting carrier for the storage tank 806 and the glue pump 802. The storage tank 806 can store glue, and the glue can be replenished through the injection hole 807. The glue pump 802 draws out the glue from the storage tank 806 and delivers it to the glue application tray 805 through the drain pipe 803. The solenoid valve 804 on the drain pipe 803 can accurately control the flow rate and flow of the glue, thereby ensuring the uniformity and accuracy of the glue application. The glue application tray 805 can evenly coat the glue on the surface of the substrate.

[0024] In a further embodiment, a servo motor 201 is fixedly mounted on the upper surface of the support base 1, and a rotating shaft 204 is fixedly mounted on the output end of the servo motor 201. The top end of the rotating shaft 204 is fixedly connected to the bottom surface of the rotating disk 3. A reinforcing plate 202 is fixedly connected to the upper surface of the support base 1, and a bearing seat 203 is fixedly connected to one side of the reinforcing plate 202. The inner ring of the bearing seat 203 is rotatably connected to the outer surface of the rotating shaft 204. A plurality of positioning seats 4 are fixedly mounted on the upper surface of the rotating disk 3. A feeding through hole 13 is opened on one side of the support plate 5, and a transmission plate 7 is located inside the feeding through hole 13 for feeding. The push plate 12 is located on one side of one of the positioning seats 4. The servo motor 201 drives the rotating disk 3 to rotate through the rotating shaft 204, realizing the cyclic conversion of the substrate between different work stations such as gluing and bonding. The reinforcing support plate 202 and bearing seat 203 can support and reinforce the rotating shaft 204, ensuring the stability and accuracy of the rotating disk 3. In addition, the multiple positioning seats 4 on the rotating disk 3 are used to accurately position the substrate, ensuring the consistency of gluing and bonding operations. The feeding through hole 13 on the support plate 5 can provide a movement channel for the transmission plate 7, allowing the feeding push plate 12 to push the substrate into the interior of the positioning seat 4 for feeding.

[0025] The working principle of this utility model is as follows: First, the substrate to be processed is placed in a suitable position above the support recess 6 so that the feeding push plate 12 can push it. Then, the controller 10 starts the glue pump 802. The glue pump 802 draws glue from the storage tank 806 and delivers it to the glue coating tray 805 through the drain pipe 803. The solenoid valve 804 on the drain pipe 803 can control the flow rate and flow of the glue as needed. Then, the glue flows out from the glue coating tray 805 and coats the substrate.

[0026] Next, the controller 10 starts the retraction movement of the electric cylinder 11. The extension end of the electric cylinder 11 pushes the transmission plate 7 and the feeding push plate 12 to move, so that the feeding push plate 12 can push the chip from the initial position to the inside of the positioning seat 4 at the rotary disk 3, completing the feeding operation of the substrate before chip placement. Then, the servo motor 201 starts, which can drive the rotating shaft 204 to rotate. The rotating shaft 204 makes the rotary disk 3 rotate, which can send the substrate to the placement position of the placement mechanism 9. Then, the chip is placed on the substrate by the placement mechanism 9. During this time period, the glue applicator 8 and the electric cylinder 11 will perform glue application and loading operations on the next substrate, and then repeat the above steps to realize continuous glue application and placement processing.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0028] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A chip mounting apparatus for semiconductor chip processing, characterized in that: The system includes a support base (1), a drive assembly (2) fixedly mounted on the upper surface of the support base (1), a support plate (5) fixedly mounted on the upper surface of the support base (1), an adhesive applicator (8) fixedly mounted on the top of the support plate (5), a support recess (6) fixedly mounted on one side of the support plate (5), an electric cylinder (11) fixedly mounted on the inner wall of the support recess (6), a transmission plate (7) fixedly mounted on the telescopic end of the electric cylinder (11), a feeding push plate (12) fixedly connected to one side of the transmission plate (7), a rotating disk (3) provided above the support base (1), a patching mechanism (9) fixedly mounted on the upper surface of the support base (1), and a controller (10) fixedly mounted on the outer surface of the support plate (5).

2. The semiconductor chip fabrication mounting apparatus according to claim 1, characterized in that: The adhesive application component (8) includes a carrier plate (801) fixedly installed on the upper surface of the support plate (5), a storage tank (806) fixedly installed on the upper surface of the carrier plate (801), an adhesive application pump (802) fixedly installed on the bottom surface of the carrier plate (801), a drain pipe (803) fixedly connected to the output end of the adhesive application pump (802), and an adhesive application tray (805) fixedly connected to the bottom end of the drain pipe (803).

3. The semiconductor chip fabrication mounting apparatus according to claim 2, characterized in that: The outer surface of the drain pipe (803) is fixedly connected to a solenoid valve (804), the input end of the glue pump (802) extends into the interior of the storage tank (806), and the upper surface of the storage tank (806) is provided with an injection hole (807).

4. The semiconductor chip fabrication mounting apparatus according to claim 1, characterized in that: A servo motor (201) is fixedly installed on the upper surface of the support base (1), and a rotating shaft (204) is fixedly installed at the output end of the servo motor (201). The top end of the rotating shaft (204) is fixedly connected to the bottom surface of the rotating disk (3).

5. The semiconductor chip fabrication mounting apparatus according to claim 1, characterized in that: A reinforcing plate (202) is fixedly connected to the upper surface of the support base (1), and a bearing seat (203) is fixedly connected to one side of the reinforcing plate (202). The inner ring of the bearing seat (203) is rotatably connected to the outer surface of the rotating shaft (204).

6. The semiconductor chip fabrication mounting apparatus according to claim 1, characterized in that: The upper surface of the rotating disk (3) is fixedly equipped with multiple positioning seats (4), and one side of the support plate (5) is provided with a feeding through hole (13). The transmission plate (7) is located inside the feeding through hole (13), and the feeding push plate (12) is located on one side of one of the positioning seats (4).

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