A silicon wafer processing apparatus
By designing silicon wafer processing equipment that includes feeding, conveying, processing, and unloading devices, direct processing of silicon wafers was achieved, solving the problem of low silicon wafer processing efficiency and improving processing efficiency.
CN224306265UActive Publication Date: 2026-05-29深圳市圭华智能科技有限公司
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 深圳市圭华智能科技有限公司
- Filing Date
- 2025-07-25
- Publication Date
- 2026-05-29
AI Technical Summary
Technical Problem
In the current silicon wafer processing process, the silicon wafers to be processed need to be transferred from the conveyor platform to the processing device, resulting in low processing efficiency.
Method used
Design a silicon wafer processing equipment, including a feeding device, a silicon wafer conveying device, a processing device, and a unloading device, to achieve direct processing of silicon wafers through a conveying drive module and a carrying mechanism, eliminating the need for transfer processes.
Benefits of technology
This improved the processing efficiency of silicon wafers, reduced transfer operations, and increased overall processing efficiency.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224306265U_ABST
Abstract
The application provides a silicon wafer processing equipment, which comprises a feeding device, a silicon wafer conveying device, a processing device and a discharging device. The feeding device is used to provide a silicon wafer to be processed and convey the silicon wafer to a silicon wafer receiving position. The silicon wafer conveying device comprises a conveying drive module and a bearing mechanism. The conveying drive module is connected with the bearing mechanism to drive the bearing mechanism to move. The silicon wafer receiving position, a processing position and a discharging position are arranged along the movement track of the bearing mechanism in sequence. The processing device is used to process the silicon wafer to be processed on the bearing mechanism at the processing position. The discharging device is used to receive the processed silicon wafer to be processed on the bearing mechanism at the discharging position. In this way, the processing device can directly process the silicon wafer to be processed on the bearing mechanism without transferring to other places, thereby reducing the transfer operation of the silicon wafer to be processed and improving the processing efficiency.
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