A sample preparation mold for liquid crystal encapsulation frame adhesive hardness test

Abstract

The utility model relates to a kind of sample preparation mould for liquid crystal encapsulation frame glue hardness test, belong to liquid crystal encapsulation frame glue testing technical field, sample preparation mould includes sample preparation layer, release layer and pressure cover layer, the sample preparation layer is structured as plate structure, and the center is provided with through-hole;Release layer is set to two pieces, respectively laid in the upper and lower two sides of the sample preparation layer;Pressure cover layer, set to two pieces, respectively laid in the other side of the release layer.The sample preparation mould for liquid crystal encapsulation frame glue hardness test provided by the utility model uses common material in each combination layer, and the manufacturing cost is low, and the mould can be repeatedly used;Through the sample preparation mould, the thickness of frame glue coating can be made consistent, shape is neat, UV curing effect is good, and easy to release.

Description

Technical Field

[0001] This utility model relates to the field of liquid crystal packaging frame adhesive testing technology, specifically a sample preparation mold for testing the hardness of liquid crystal packaging frame adhesive. Background Technology

[0002] With rapid economic development, LCD displays are increasingly trending towards larger sizes. Currently, the liquid crystal dispensing (ODF) process has become the mainstream technology in fifth-generation LCD packaging, and the demand for photothermal curable frame adhesives used in the ODF process is also increasing. The role of the frame adhesive is to connect the two glass substrates together, preventing liquid crystal from flowing out of the panel and preventing external impurities such as water and air from entering.

[0003] Hardness is an important indicator for verifying the quality of frame adhesive. Before hardness testing, the frame adhesive needs to be UV cured. However, the UV curing of LCD encapsulation frame adhesive has requirements on the thickness of the adhesive. If the adhesive is too thick, the UV curing will not be complete and the curing effect will not be achieved. At present, without a mold, the thickness and uniformity of the adhesive cannot be controlled by manually applying the adhesive. Moreover, the purchase cost of the adhesive applicator is too high. Therefore, there is an urgent need for a suitable adhesive applicator sample preparation mold. Utility Model Content

[0004] The purpose of this invention is to provide a sample preparation mold for testing the hardness of liquid crystal packaging frame adhesive, which can solve the technical problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a sample preparation mold for testing the hardness of liquid crystal packaging frame adhesive, comprising a sample preparation layer, a release layer, and a pressing layer. The sample preparation layer is constructed as a plate-like structure with a through hole in its center. The release layer consists of two pieces, which are respectively laid on the upper and lower surfaces of the sample preparation layer. The pressing layer consists of two pieces, which are respectively laid on the other side of the release layer.

[0006] In a preferred embodiment, the sample preparation layer is made of stainless steel. This material is hard enough to withstand the pressure of the laminating layer, while also facilitating the removal of the frame adhesive after UV curing.

[0007] In a preferred embodiment, the diameter or length of the through hole is set to 2cm-3cm.

[0008] In a preferred embodiment, the release layer is made of a material that facilitates demolding. By providing a release layer, the cured frame adhesive in the through-holes can be easily separated without leaving residue, while also preventing the frame adhesive from adhering to the bonding layer.

[0009] In a preferred embodiment, the release layer is made of PET film.

[0010] In a preferred embodiment, the planar dimensions of the release layer match or are slightly larger than those of the sample preparation layer to prevent overflowing frame adhesive from adhering to the bonding layer.

[0011] In a preferred embodiment, the overlay layer is a glass plate of uniform thickness. When an external force is applied to the overlay layer, the uniform thickness of the overlay layer ensures that the sealant inside the through-hole is flat, and the transparent material facilitates observation of the sealant condition inside the through-hole and also promotes UV curing.

[0012] In a preferred embodiment, the planar dimensions of the overlay layer should at least fully cover the through-hole.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. The sample preparation mold for testing the hardness of liquid crystal packaging frame provided by this utility model uses common materials for each combination layer, resulting in low manufacturing cost and reusability of the mold;

[0015] 2. This sample preparation mold can ensure that the thickness of the frame adhesive coating is consistent, the shape is regular, the UV curing effect is good, and it is easy to demold. Attached Figure Description

[0016] Figure 1 A schematic diagram of the sample preparation mold for testing the hardness of liquid crystal encapsulation frame adhesive provided in this embodiment of the utility model.

[0017] The meanings of the labels in the diagram are as follows:

[0018] 1. Sample preparation layer; 2. Release layer; 3. Overlay layer; 4. Through hole. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] This embodiment discloses a sample preparation mold for testing the hardness of liquid crystal packaging frame adhesive, which can be used to press frame adhesive samples that can be directly used for UV curing.

[0022] See Figure 1 The sample preparation mold includes a sample preparation layer 1, which has through holes 4. The upper and lower surfaces of the sample preparation layer 1 are respectively covered with release layers 2, and the other side of the release layers 2 is respectively covered with a pressing layer 3.

[0023] Specifically, the sample preparation layer 1 is constructed as a plate-like structure, and its shape can be specifically set according to the requirements. For example, it can be rectangular, circular or other shapes. In order to facilitate processing and to facilitate cooperation with the release layer 2 and the pressing layer 3, the sample preparation layer 1 is preferably a rectangular plate structure.

[0024] The thickness of sample layer 1 is usually set to about 1 mm, but the specific thickness can be set according to the capabilities of the UV curing equipment or other requirements.

[0025] The sample preparation layer 1 is preferably made of stainless steel, which is hard enough to withstand the pressure of the overlay layer 3 and facilitates the removal of the frame adhesive after UV curing.

[0026] The through-hole 4 is roughly located at the center of the sample layer 1. In practical applications, the frame adhesive to be cured is placed in the through-hole 4. The shape of the through-hole 4 can be specifically set according to the required shape of the cured frame adhesive. For example, it can be rectangular, circular, or other shapes. Depending on the testing requirements, the diameter or length of the through-hole 4 is roughly set to 2cm-3cm.

[0027] The release layer 2 is provided in two pieces. In practical applications, the two release layers 2 are respectively laid on the upper and lower surfaces of the sample preparation layer 1. By setting the release layer 2, the cured frame adhesive in the through hole 4 can be easily separated without leaving any residue, while preventing the frame adhesive from sticking to the pressing layer 3. The release layer 2 should be made of a material that is easy to release. For example, PET material or silicone material with a certain degree of light transmittance can be used. Using a light-transmitting material makes it easier to observe the state of the frame adhesive in the through hole 4 and also facilitates UV curing. To reduce costs, in this embodiment, the release layer 2 is preferably a PET film.

[0028] It should be noted that when the pressing layer 3 presses onto the release layer 2 and the sample preparation layer 1, the frame adhesive in the through hole 4 will overflow. In order to prevent the overflowing frame adhesive from sticking to the pressing layer 3, in this embodiment, the planar dimensions of the release layer 2 should match or be slightly larger than those of the sample preparation layer 1.

[0029] The pressing layer 3 is configured as two pieces, and in practical applications, the two pressing layers 3 are respectively pressed onto the other side of the release layer 2. In this embodiment, the pressing layer 3 is constructed as a plate-like structure, and its planar dimensions should at least fully cover the through hole 4. Preferably, its shape and size match the sample preparation layer 1. The pressing layer 3 also needs to have a certain weight and load-bearing capacity. For example, the pressing layer 3 can be a glass plate with a uniform thickness, set at 3-5 mm. When an external force is applied to the pressing layer 3, the opposing pressure of the two pressing layers 3 can ensure that the frame adhesive inside the through hole 4 is flat.

[0030] For ease of understanding, the usage method of the sample preparation mold for testing the hardness of the liquid crystal encapsulation frame provided in this embodiment is described as follows:

[0031] First, place a layer 3 (glass plate) on the platform. Then, lay a release layer 2 (PET film) of similar size on the layer 3. Next, press the sample layer 1 (stainless steel plate) onto the release layer 2, aligning the sample layer 1 as closely as possible with the underlying layer 3. Extrude a certain amount of frame adhesive into the center of the through-hole 4 of the sample layer 1. Lay the release layer 2 (PET film) on top of the frame adhesive, and then place the layer 3 (glass plate) on top of the release layer 2. Press a heavy object onto the layer 3 to fill the through-hole 4 in the center of the sample layer 1 with frame adhesive, while simultaneously squeezing out any excess frame adhesive from the through-hole 4. Clamp the mold with clamping devices around its perimeter and place the mold in a UV curing machine for curing. After curing, demold the frame adhesive from the center of the through-hole 4 and perform a hardness test.

[0032] The sample mold for testing the hardness of the liquid crystal packaging frame adhesive provided in this embodiment has low manufacturing cost and can be reused. It can make the thickness of the frame adhesive coating consistent, the shape regular, and easy to demold, thus laying the foundation for the stability of the subsequent frame adhesive hardness test data.

[0033] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A sample preparation mold for testing the hardness of liquid crystal encapsulation frame adhesive, characterized in that, include: Sample preparation layer (1), wherein the sample preparation layer (1) is constructed as a plate-like structure and has a through hole (4) in the center; The release layer (2) is made of two pieces, which are respectively laid on the upper and lower surfaces of the sample preparation layer (1); The pressing layer (3) is configured as two pieces, which are respectively laid on the other side of the release layer (2).

2. The sample preparation mold for testing the hardness of the liquid crystal encapsulation frame adhesive according to claim 1, characterized in that, The sample preparation layer (1) is made of stainless steel plate.

3. The sample preparation mold for testing the hardness of the liquid crystal encapsulation frame adhesive according to claim 1, characterized in that, The diameter or length of the through hole (4) is set to 2cm-3cm.

4. The sample preparation mold for testing the hardness of the liquid crystal encapsulation frame adhesive according to claim 1, characterized in that, The release layer (2) is made of a material that is easy to release from the mold.

5. The sample preparation mold for testing the hardness of the liquid crystal encapsulation frame adhesive according to claim 4, characterized in that, The release layer (2) is made of PET film.

6. The sample preparation mold for testing the hardness of liquid crystal encapsulation frame adhesive according to claim 1, characterized in that, The planar dimensions of the release layer (2) are matched with or slightly larger than those of the sample preparation layer (1).

7. The sample preparation mold for testing the hardness of the liquid crystal encapsulation frame adhesive according to claim 1, characterized in that, The cladding layer (3) is made of glass plate with uniform thickness.

8. The sample preparation mold for testing the hardness of the liquid crystal encapsulation frame adhesive according to claim 1, characterized in that, The planar dimensions of the overlay layer (3) should at least fully cover the through hole (4).

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