Chip press device for photolithography machine and chip correction device

Abstract

This utility model belongs to the field of semiconductor chip processing technology, specifically relating to a chip pressing device and a chip straightening device for a lithography machine, comprising: a pressing arm; a pressing mechanism including a central connecting member; and several buffer springs disposed between the pressing arm and the central connecting member; each of the buffer springs is adapted to contract when the pressing arm drives the central connecting member to adhere to the chip surface; by adding several buffer springs between the pressing arm and the central connecting member, after the central connecting member is pressed onto the chip surface, the pressing arm continues to press down, at which time the buffer springs are compressed. The buffer springs absorb impact energy in the initial stage, and subsequently maintain a constant pressure through gradual elastic deformation, absorbing part of the pressure from the pressing arm, and preventing the chip from being crushed due to excessive pressure.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor chip processing technology, specifically relating to a chip bonding device and a chip correction device for lithography machines. Background Technology

[0002] Currently, the lithography machine arm clamping ring and the arm are made of hard metal material and are directly rigidly connected. When the chip is transferred to the exposure area platform of the lithography machine, the vacuum of the platform cannot adsorb the edge of the chip, and the arm clamping ring needs to press down to assist. When the chip warpage is >50μm, the existing equipment pressing pressure >80N / cm² will cause the silicon wafer breakage rate to be >3%.

[0003] Therefore, a chip pressing device and a chip straightening device for a lithography machine are designed to solve the technical problem in the prior art where the hard connection between the arm pressing ring and the arm causes the chip to break when the pressing ring presses the chip surface.

[0004] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content

[0005] This disclosure provides at least one chip bonding device and a chip correction device for a lithography machine.

[0006] In a first aspect, embodiments of this disclosure provide a chip bonding apparatus for a lithography machine, comprising:

[0007] Press-fit arm;

[0008] A tablet compression mechanism, including a central connecting component;

[0009] Several buffer springs are disposed between the pressing arm and the central connecting member;

[0010] Each of the aforementioned buffer springs is adapted to contract when the pressing arm drives the central connector to adhere to the chip surface.

[0011] In some embodiments, a plurality of corrective elements are provided on the outside of the central connector;

[0012] Each of the aforementioned corrective components is slidably connected to the central connecting component;

[0013] The central connector contains a drive mechanism; wherein

[0014] The drive mechanism is adapted to drive the corrector to expand radially after the central connector contacts the chip surface.

[0015] In some embodiments, the drive mechanism includes:

[0016] Several driving components, each of which is divided into upper and lower parts;

[0017] The upper half of the drive component is connected to the pressing arm, and the lower half of the drive component is located within a central cavity opened inside the central connector; and

[0018] The active component is located at the bottom of the driving component;

[0019] The driven component is connected to the driving component; wherein

[0020] The driven component is adapted to drive each corrective component to expand radially when the active component moves toward the central connector.

[0021] In some embodiments, the driven component includes:

[0022] A driven member, disposed within the central cavity and engaging with the driving member; and

[0023] The sliding rod has its two ends connected to the driven member and the straightening member, respectively; wherein

[0024] The driven member is adapted to drive the slide rod to slide within the central cavity when the driving member moves toward the central connecting member, thereby driving the corresponding corrective member to expand radially.

[0025] Secondly, embodiments of this disclosure also provide a chip correction device, comprising:

[0026] The central connector has several corrective components on its exterior.

[0027] Each of the aforementioned corrective components is slidably connected to the central connecting component;

[0028] The drive mechanism is located inside the central connector; wherein

[0029] The drive mechanism is adapted to drive the corrector to expand radially after the central connector contacts the chip surface.

[0030] In some embodiments, the drive mechanism includes:

[0031] Several driving components, each of which is divided into upper and lower parts;

[0032] The upper half of the drive component is connected to the pressing arm, and the lower half of the drive component is located within a central cavity opened inside the central connector; and

[0033] The active component is located at the bottom of the driving component;

[0034] The driven component is connected to the driving component; wherein

[0035] The driven component is adapted to drive the corrector to expand radially as the active component moves toward the central connector.

[0036] In some embodiments, the driven component includes:

[0037] A driven member, disposed within the central cavity and engaging with the driving member; and

[0038] The sliding rod has its two ends connected to the driven member and the straightening member, respectively; wherein

[0039] The driven member is adapted to drive the slide bar to slide within the central cavity when the driving member moves toward the central connecting member, thereby causing each corrective member to expand radially.

[0040] The beneficial effect of this utility model is that by adding several buffer springs between the pressing arm and the central connector, when the central connector is pressed onto the chip surface, the pressing arm continues to press down. At this time, the buffer springs are compressed. The buffer springs absorb the impact energy in the initial stage, and then maintain a constant pressure through gradual elastic deformation, absorbing part of the pressure of the pressing arm, thus preventing the chip from being crushed due to excessive pressure.

[0041] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0042] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0043] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0044] Figure 1 An overall perspective view provided for an embodiment of this disclosure;

[0045] Figure 2 This is a schematic cross-sectional view of an embodiment of the present disclosure.

[0046] In the picture:

[0047] 1. Pressing arm;

[0048] 2. Tablet compression mechanism; 20. Central connecting component; 200. Central cavity; 21. Correcting component; 23. Buffer spring;

[0049] 3. Chips;

[0050] 4. Drive mechanism; 40. Drive component; 41. Driving component; 42. Driven assembly; 420. Driven component; 421. Slide rod;

[0051] F1, direction of movement of the pressing arm. Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0053] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of the components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0054] In this document, when an element or layer is referred to as “located,” “joined to,” “connected to,” “attached to,” or “coupled to” another element or layer, it may be directly located, joined, connected, attached to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” “directly attached to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0055] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0056] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0057] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0058] Research has revealed that the current lithography machine arm has a rigid connection between the pressure ring and the arm. When the chip is transferred to the exposure area platform of the lithography machine, due to the warping of the chip, the vacuum of the platform cannot hold the chip edge. The pressure ring of the arm needs to press down to assist. When the arm drives the pressure ring to press the chip surface, it is easy to crush the chip.

[0059] Based on the above research, this disclosure provides a chip pressing device and a chip straightening device for a lithography machine. By adding several buffer springs between the pressing arm and the central connector, when the central connector is pressed onto the chip surface, the pressing arm continues to press down. At this time, the buffer springs are compressed, which continuously buffers the central connector to flatten the warped chip. At the same time, the compression of the buffer springs absorbs part of the pressure of the pressing arm, preventing the chip from being crushed due to excessive pressure.

[0060] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.

[0061] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0062] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0063] In some embodiments, such as Figure 1 As shown, one end of the pressing arm 1 is connected to a corresponding external driver, while the central connector 20 and the surrounding corrective components 21 are located at the other end of the pressing arm 1. As the driver is activated, the pressing arm 1 moves toward the chip 3. When the central connector 20 and the corrective components 21 abut against the surface of the chip 3, the driver continues to move the pressing arm 1. At this time, the buffer spring 23 between the pressing arm 1 and the central connector 20 is compressed. The buffer spring 23 is preferably made of 65Mn material, with a wire diameter d=2mm, an effective number of turns n=10, a free height H0=50mm, and a stiffness k=400N / mm. The buffer spring 23 continuously provides pressure to the central connector 20 to press the chip, while the buffer spring 23 buffers part of the pressure of the pressing arm 1 on the central connector 20, preventing the pressure of the pressing arm 1 from being directly applied to the surface of the chip 3 through the central connector 20, which would cause the chip 3 to break (the driver includes, but is not limited to, the use of a motor, etc. The connection method between the driver and the pressing arm is existing technology and will not be described in detail here).

[0064] In some embodiments, such as Figure 2As shown, several driving components 40 are evenly fixed on the pressing arm 1. The bottom of the driving component 40 is inserted into the central cavity 200 opened in the center of the central connector 20. When the end face of the central connector 20 is in contact with the surface of the chip 3, the pressing arm 1 drives each driving component 40 to move continuously. The driving component 40 slides on the central connector 20. As shown in the figure, the surfaces of the active component 41 and the driven component 420 that are in contact are both inclined surfaces, and the two fit together. When the active component 41 moves continuously downward, it pushes the corresponding driven component 420 to move horizontally. Each driven component 420 drives the corresponding slide rod 421 and the correction component 21 connected to the slide rod 421 to move. At this time, each corrector 21 moves away from each other to correct the surface of the chip 3 and flatten the warped areas on the chip 3. To facilitate the reset of each corrector 21, a reset spring (not shown in the figure) can be added between each slide rod 421 and the central connector 20. After the chip 3 is pressed, the pressing arm 1 moves upward, driving the driving member 40 and the active member 41 to move upward. Each slide rod 421 is reset under the action of the reset spring. At this time, each corrector 21 is reset so as to press the surface of the next chip 3 (the reset spring driving the slide rod to reset is the prior art, and the connection method and installation position of the reset spring and the slide rod will not be described in detail here).

[0065] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0066] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as the second element, component, region, layer, or segment.

[0067] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0068] In the above discussion, unless otherwise stated, when used to describe numerical values, the terms “about,” “approximately,” “basically,” etc., indicate a change of + / - 10% in that value.

[0069] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A chip bonding device for a photolithography machine, characterized in that, include: Press-fit arm (1); Tableting mechanism (2), which includes a central connector (20); Several buffer springs (23) are disposed between the pressing arm (1) and the central connector (20); Each of the buffer springs (23) is adapted to retract when the pressing arm (1) drives the central connector (20) to adhere to the surface of the chip (3).

2. The chip bonding apparatus for a lithography machine as described in claim 1, characterized in that, The central connector (20) is provided with several corrective elements (21) on its exterior. Each of the aforementioned corrective components (21) is slidably connected to the central connecting component (20); The central connector (20) contains a drive mechanism (4); wherein The drive mechanism (4) is adapted to drive the corrector (21) to expand radially after the central connector (20) contacts the surface of the chip (3).

3. The chip bonding apparatus for a lithography machine as described in claim 2, characterized in that, The drive mechanism (4) includes: Several driving components (40), each of which is divided into upper and lower parts; The upper half of the drive member (40) is connected to the pressing arm (1), and the lower half of the drive member (40) is located within the central cavity (200) opened inside the central connector (20); and An active component (41) is disposed at the bottom of the driving component (40); The driven component (42) is connected to the driving component (41); wherein The driven component (42) is adapted to drive each corrector (21) to expand radially when the active component (41) moves toward the central connector (20).

4. The chip bonding apparatus for a lithography machine as described in claim 3, characterized in that, The driven component (42) includes: The driven member (420) is disposed within the central cavity (200) and engages with the driving member (41); and The slide bar (421) has its two ends connected to the driven member (420) and the straightening member (21) respectively; wherein The driven member (420) is adapted to drive the slide rod (421) to slide in the central cavity (200) when the driving member (41) moves toward the central connector (20), thereby driving the corresponding corrective member (21) to expand radially.

5. A chip correction device, characterized in that, include: The central connector (20) has several corrective components (21) on its exterior. Each of the aforementioned corrective components (21) is slidably connected to the central connecting component (20); The drive mechanism (4) is disposed inside the central connector (20); wherein The drive mechanism (4) is adapted to drive the corrector (21) to expand radially after the central connector (20) contacts the surface of the chip (3).

6. The chip correction device as described in claim 5, characterized in that, The drive mechanism (4) includes: Several driving components (40), each of which is divided into upper and lower parts; The upper half of the drive member (40) is connected to the pressing arm (1), and the lower half of the drive member (40) is located within the central cavity (200) opened inside the central connector (20); and An active component (41) is disposed at the bottom of the driving component (40); The driven component (42) is connected to the driving component (41); wherein The driven component (42) is adapted to drive the corrector (21) to expand radially when the active component (41) moves toward the central connector (20).

7. The chip correction device as described in claim 6, characterized in that, The driven component (42) includes: The driven member (420) is disposed within the central cavity (200) and engages with the driving member (41); and The slide bar (421) has its two ends connected to the driven member (420) and the straightening member (21) respectively; wherein The driven member (420) is adapted to drive the slide bar (421) to slide in the central cavity (200) when the driving member (41) moves toward the central connector (20), thereby causing each corrective member (21) to expand radially.

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