An explosive foil for in-line initiator

Abstract

The utility model discloses a kind of explosion foils for in-line initiator, belong to pyrotechnics technical field, including ceramic substrate (1), metal bridge foil (2) and pin (6), the metal bridge foil (2) is set in the front of ceramic substrate (1), the ceramic substrate (1) and two pins (6) are welded on the back of ceramic substrate (1) by soldering tin (5), two through holes are provided in the position corresponding to the welding of two pins (6) of the ceramic substrate (1), metal powder (3) is filled in the through hole, metal plating (4) is further provided between the soldering tin (5) and ceramic substrate (1);The explosion foil of the utility model is relative to prior art, volume reduces more than 40%, manufacturing cost reduces more than 60%.

Description

Technical Field

[0001] This utility model relates to the field of pyrotechnics technology, and in particular to an explosive foil for a linear detonator. Background Technology

[0002] Explosive foil, as a core component of an in-line detonation system, currently has a typical structure as follows: Figure 1 As shown, it includes a ceramic substrate 1, a metal bridge foil 2 is disposed on the upper end of the ceramic substrate 1, and pins 6 are disposed on both sides of the ceramic substrate 1 and the metal bridge foil 2. The pins 6 are soldered to the side of the ceramic substrate 1 by soldering 5. This traditional sheet-type explosive foil occupies a lot of space and the electrode plug explosive foil is expensive. It can no longer meet the increasingly high requirements of low cost and miniaturization of similar technologies such as inline detonation and ignition, resulting in a large overall system volume and high cost.

[0003] Another type of explosive foil structure is as follows: Figure 2 As shown, the device includes a ceramic substrate 1, a metal bridge foil 2, and a pin 6. The manufacturing process involves first forming a sintered electrode plug from the pin 6 and the ceramic substrate 1, and then plating the metal bridge foil. This manufacturing process and structure suffer from drawbacks such as high plating difficulty and low yield. The reasons are as follows: The sintered electrode plug cannot be plated on the entire ceramic substrate 1 and then cut into individual components; it can generally only be plated individually, resulting in extremely low efficiency. Furthermore, it is difficult to achieve a surface finish of Ra0.05 on the ceramic substrate 1 and the pin 6 of the sintered electrode plug, leading to uneven thickness and inconsistent resistance after the metal bridge foil 2 is plated on the surface of the ceramic substrate 1. This results in a yield rate far lower than that of directly plating on the ceramic substrate 1. Summary of the Invention

[0004] The purpose of this invention is to provide an explosive foil for an inline detonator to solve the above-mentioned problems.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: an explosive foil for an inline detonator, comprising a ceramic substrate, a metal bridge foil, and pins, wherein the metal bridge foil is disposed on the front side of the ceramic substrate, the ceramic substrate and two pins are soldered to the back side of the ceramic substrate, two through holes are provided on the ceramic substrate at positions corresponding to the soldering of the two pins, the through holes are filled with metal powder, and a metal plating layer is also provided between the solder and the ceramic substrate.

[0006] As a preferred technical solution, the diameter of the through hole is Φ0.3mm to Φ1.0mm. A hole diameter that is too small will affect the resistance, while a hole diameter that is too large will affect the structural strength.

[0007] As a preferred technical solution, the two through holes are symmetrically arranged.

[0008] As a preferred technical solution, the metal powder is selected from copper powder, preferably with a particle size ≤ 5 μm.

[0009] As a preferred technical solution, the metal coating is copper foil, or Cu / Ni foil can also be used. The coating thickness is generally 3μm to 5μm. If the coating is too thin or too thick, the energy utilization rate will be low, and the peak power will be reduced by more than 12% compared with the optimal thickness.

[0010] The above-mentioned method for preparing the explosive foil for the inline detonator is as follows: First, two through holes are drilled on both sides of the ceramic substrate. Then, metal powder is tightly filled into the two through holes. Next, a metal bridge foil is plated on the front side of the ceramic substrate and a metal coating is plated on the back side, so that the metal bridge foil on the front side of the ceramic substrate and the metal coating on the back side are conductive. When the resistance of the metal bridge foil is measured directly at both ends of the front side and when the resistance of the metal coating is measured again through both ends of the back side, the resistance increase is ≤1mΩ. The smaller the resistance increase, the lower the energy loss in the detonation circuit can be. The via resistance is achieved by sputtering dense copper powder in the through holes to avoid excessive resistance increase, so that the energy loss (about 1%) is within an acceptable range and the component volume can be minimized to a great extent. Finally, the metal coating plated on the ceramic substrate and the pin are connected by reflow soldering after being coated with solder.

[0011] It should be noted that the above-mentioned metal bridge foil, metal coating, and reflow soldering all employ methods known in the art.

[0012] Compared with the prior art, the advantages of this utility model are as follows: This utility model achieves reliable conductivity of the copper foil on both sides by opening holes in the ceramic substrate and filling them with copper powder, and controls the resistance range so that the pins can be arranged at the bottom of the ceramic substrate, thereby significantly reducing the volume; This utility model changes the method of sintering the pins and the ceramic substrate into sintered electrode plugs and then plating the foil to plating the foil on the ceramic substrate and then welding the pins at the bottom, thereby significantly improving the yield and effectively reducing the manufacturing cost. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of an explosive foil in the prior art;

[0014] Figure 2 This is a schematic diagram of the overall structure of an embodiment of the present utility model;

[0015] Figure 3 A schematic diagram of the overall structure of the sintered electrode plug-type explosive foil;

[0016] In the diagram: 1. Ceramic substrate; 2. Metal bridge foil; 3. Metal powder; 4. Metal plating; 5. Solder; 6. Pin. Detailed Implementation

[0017] The present invention will be further described below with reference to the embodiments.

[0018] Example:

[0019] See Figure 3 An explosive foil for an inline detonator includes a ceramic substrate 1, a metal bridge foil 2, and pins 6. The metal bridge foil 2 is disposed on the front side of the ceramic substrate 1. The ceramic substrate 1 and two pins 6 are soldered to the back side of the ceramic substrate 1 by solder 5. Two through holes are provided on the ceramic substrate 1 at positions corresponding to the soldering of the two pins 6. The through holes are filled with metal powder 3. A metal plating layer 4 is also provided between the solder 5 and the ceramic substrate 1.

[0020] In this embodiment, the diameter of the through hole is Φ0.5mm.

[0021] The preparation method is as follows: First, two through holes are drilled on both sides of the ceramic substrate 1. Then, metal powder 3 is tightly filled into the two through holes. Then, metal bridge foil 2 is plated on the front side of the ceramic substrate 1 and metal plating layer 4 is plated on the back side, so that the metal bridge foil 2 on the front side of the ceramic substrate 1 and the metal plating layer 4 on the back side are connected. Finally, the metal plating layer 4 plated on the ceramic substrate 1 and the pin 6 are connected by reflow soldering after being coated with solder 5, and thus the product is obtained.

[0022] In this embodiment, after coating the metal plating layer 4 on the back of the ceramic substrate 1 with solder 5, the pin 6 is installed at the corresponding position of the solder 5, and then high-temperature soldering is performed to finally achieve reliable conduction between the pin 6 and the metal bridge foil 2. Compared with the prior art, this method is more efficient. Figure 1 The pin 6 is soldered on the side of the ceramic substrate 1, which reduces the space occupied by more than 40% in this embodiment.

[0023] In this embodiment, the pin 6 and the metal plating layer 4 are connected by high-temperature welding, which is different from the prior art. Figure 2 The process of first fabricating the pin 6 and ceramic substrate 1 into sintered electrode plugs, followed by metal foil plating, in this embodiment is simple to prepare and significantly reduces the difficulty of coating. Statistical analysis shows that... Figure 2 The yield rate of the finished products is approximately 25% to 28%. Figure 3 The yield rate of the process is about 85% to 90%, and the invention reduces the manufacturing cost by more than 60%.

[0024] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An exploding foil for an in-line initiator, comprising a ceramic substrate (1), a metal bridge foil (2) and a pin (6), the metal bridge foil (2) being arranged on the front side of the ceramic substrate (1), characterized in that The ceramic substrate (1) is welded with two pins (6) through solder (5) on the back of the ceramic substrate (1), two through holes are arranged on the ceramic substrate (1) corresponding to the welding position of the two pins (6), metal powder (3) is filled in the through holes, and a metal plating layer (4) is further arranged between the solder (5) and the ceramic substrate (1).

2. The exploding foil for in-line initiator according to claim 1, characterized by, The diameter of the through hole is Φ0.3mm-Φ1.0mm.

3. The exploding foil for in-line initiator according to claim 1, wherein The two through holes are symmetrically arranged.

4. The exploding foil for in-line initiator according to claim 1, wherein The metal powder is copper powder.

5. The exploding foil for in-line initiator according to claim 1, wherein The metal plating layer (4).

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