An optical receiving module
By setting up a TIA circuit on the external circuit board of the optical receiver module and using a heat-conducting plate and thermally conductive silicone for heat dissipation, the problem of poor heat dissipation of the optical receiver module is solved, achieving good heat dissipation effect and convenient replacement of photodiodes.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YIZHA OPTOELECTRONICS (HANGZHOU) CO LTD
- Filing Date
- 2025-07-30
- Publication Date
- 2026-06-09
AI Technical Summary
The existing optical receiver module integrates TIA on the internal chip of the PD, which has the problem of poor heat dissipation.
The TIA circuit is placed on an external circuit board, and heat is transferred to the housing through a heat-conducting plate and thermal silicone. Combined with the detachable photodiode design, good heat dissipation is achieved.
This improves the heat dissipation of the optical receiver module and facilitates the replacement of the photodiode.
Smart Images
Figure CN224343206U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical communication, and in particular to an optical receiving module. Background Technology
[0002] The optical receiver module is a core component in fiber optic communication systems that converts optical signals into electrical signals. Its composition must meet performance requirements such as high sensitivity, low noise, and wide bandwidth. Existing optical receiver modules typically integrate a transimpedance amplifier (TIA) on a chip within the photodiode (PD), which places high demands on manufacturing processes and results in poor heat dissipation. Summary of the Invention
[0003] This invention mainly solves the above-mentioned problems by providing a light receiving module that places the TIA circuit on an external circuit board, has good heat dissipation, and allows the photodiode to be replaced as needed.
[0004] The technical solution adopted by this utility model to solve its technical problem is an optical receiving module, including a housing, a circuit board, a photodiode, an optical signal interface and an radio frequency signal interface. The circuit board integrates a transimpedance amplifier circuit, the photodiode is detachably mounted on the circuit board, the circuit board is mounted in the housing, and the housing is provided with through holes for the optical signal interface and the radio frequency signal interface.
[0005] As a preferred embodiment of the above solution, the circuit board is provided with a photodiode socket, the photodiode socket includes a plug-in part and a fixing ear, the fixing ear is provided on both sides of the plug-in part, and the fixing ear is fixed on the circuit board by screws, the input end of the photodiode is connected to the optical signal interface, and the output end of the photodiode is connected to the plug-in part.
[0006] As a preferred embodiment of the above solution, the housing includes a front panel, a frame and a rear panel. Each of the four corners of the front and rear ends of the frame is provided with a first screw hole. The front panel and the rear panel are provided with first fixing holes corresponding to the first screw holes. The front panel and the rear panel are fixedly mounted on the front and rear ends of the frame by screws.
[0007] As a preferred embodiment of the above solution, the left and right inner walls of the frame are each provided with a first limiting edge and a second limiting edge, and the first limiting edge and the second limiting edge form a first limiting groove for limiting the circuit board.
[0008] As a preferred embodiment of the above solution, the first screw hole forms a raised edge in the frame, and the raised edge and the first limiting edge form a second limiting groove.
[0009] As a preferred embodiment of the above solution, a heat-conducting plate is provided in the second limiting groove, and a support column is provided at each of the four corners of the upper surface of the heat-conducting plate. A limiting column is provided at the upper end of the support column, and a limiting hole matching the limiting column is provided on the circuit board. A second screw hole is provided on the lower surface of the heat-conducting plate corresponding to the support column, and a second fixing hole is provided on the bottom surface of the frame corresponding to the second screw hole.
[0010] As a preferred embodiment of the above solution, thermally conductive silicone is provided between the heat-conducting plate and the circuit board, and between the heat-conducting plate and the bottom surface of the frame.
[0011] As a preferred embodiment of the above solution, the heat-conducting plate is provided with vertical plates on its front and rear sides, and thermally conductive silicone is provided between the vertical plates and the front and rear panels.
[0012] As a preferred embodiment of the above solution, mounting ears are provided on the front panel and the rear panel.
[0013] The advantages of this invention are: the transimpedance amplifier circuit is set on the circuit board, which facilitates heat dissipation; together with the heat-conducting plate and thermal silicone, the heat generated by the circuit operation on the circuit board can be transferred to the housing, resulting in good heat dissipation; and the photodiode can be replaced as needed. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the optical receiver module.
[0015] Figure 2 This is a schematic diagram of the internal structure of the optical receiver module.
[0016] Figure 3 for Figure 2 A magnified view of a portion of region A in the middle.
[0017] Figure 4 This is a cross-sectional view of the heat-conducting plate.
[0018] 1-Housing 2-Optical signal interface 3-RF signal interface 4-Mounting ear 5-Frame 6-Circuit board 7-Photodiode 8-Photodiode socket 9-Fixing ear 10-First limiting edge 11-Second limiting edge 12-Raised edge 13-First screw hole 14-Limiting post 15-Support post 17-Heat-conducting plate 18-Thermoconducting silicone 19-Vertical plate 20-Second screw hole Detailed Implementation
[0019] The technical solution of this utility model will be further described below through embodiments and in conjunction with the accompanying drawings.
[0020] Example:
[0021] This embodiment provides an optical receiving module, such as... Figure 1 and Figure 2 As shown, the device includes a housing 1, a circuit board 6, a photodiode 7, an optical signal interface 2, and an radio frequency signal interface 3. The circuit board 6 integrates a transimpedance amplifier circuit. The photodiode 7 is detachably mounted on the circuit board 6. The circuit board 6 is housed within the housing 1, and the housing has through holes for the optical signal interface and the radio frequency signal interface. The circuit board 6 has a photodiode connector 8, which includes a connector portion and mounting ears 9. The mounting ears 9 are located on both sides of the connector portion and are fixed to the circuit board 6 by screws. The input terminal of the photodiode 7 is connected to the optical signal interface 2, and the output terminal of the photodiode 7 is connected to the connector portion. In this embodiment, the photodiode connector allows the photodiode to be replaced as needed.
[0022] like Figure 3 and Figure 4 As shown, the housing 1 includes a front panel, a frame 5, and a rear panel. The front and rear panels are provided with mounting ears 4. Each of the four corners at both ends of the frame is provided with a first screw hole 13. The front and rear panels are provided with first fixing holes corresponding to the first screw holes. The front and rear panels are fixed to the front and rear ends of the frame 5 by screws. The left and right inner walls of the frame 5 are each provided with a first limiting edge 10 and a second limiting edge 11, forming a first limiting groove for limiting the circuit board. The first screw hole 13 forms a protruding edge 12 within the frame, and the protruding edge 12 and the first limiting edge 10 form a second limiting groove. A heat-conducting plate 17 is provided in the second limiting groove. Each of the four corners of the upper surface of the heat-conducting plate 17 is provided with a support post 15. The upper end of each support post 15 is provided with a limiting post 14. The circuit board 6 is provided with limiting holes matching the limiting posts. The lower surface of the heat-conducting plate 17 is provided with a second screw hole 20 corresponding to the support post, and the bottom surface of the frame 5 is provided with a second fixing hole corresponding to the second screw hole. Vertical plates 19 are provided on the front and rear sides of the heat-conducting plate 17. Thermally conductive silicone 18 is provided between the heat-conducting plate 17 and the circuit board 6, between the heat-conducting plate 17 and the bottom surface of the frame 5, and between the vertical plates 19 and the front and rear panels. In this embodiment, the first limiting groove and the second limiting groove are used to limit the circuit board 6 and the heat-conducting plate 17 in the vertical direction, respectively. The support column 15 on the heat-conducting plate is used to support the circuit board 6, ensuring that the gap between the circuit board and the heat-conducting plate matches the height of the first limiting edge 10. The limiting column 14 is used to limit the circuit board in the horizontal direction. The heat-conducting plate is fixed to the frame by screws. The thermally conductive silicone on the heat-conducting plate is used for heat transfer, transferring the heat on the circuit board 6 to the frame and the front and rear panels. The frame and the front and rear panels should be made of metal to ensure that the frame and the front and rear panels can dissipate heat.
[0023] In this embodiment, the optical receiving module places the transimpedance amplifier circuit on the circuit board for easy heat dissipation. Combined with the heat-conducting plate and thermal silicone, the heat generated by the circuit operation on the circuit board can be transferred to the housing, resulting in good heat dissipation. Furthermore, the photodiode can be replaced as needed.
[0024] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.
Claims
1. An optical receiver module, comprising a housing, a circuit board, a photodiode, an optical signal interface, and a radio frequency signal interface, characterized in that: The circuit board integrates a transimpedance amplifier circuit, the photodiode is detachably mounted on the circuit board, the circuit board is mounted in a housing, and the housing is provided with through holes for optical signal interface and radio frequency signal interface.
2. The optical receiving module according to claim 1, characterized in that: The circuit board is provided with a photodiode socket, which includes a plug-in part and a fixing ear. The fixing ear is located on both sides of the plug-in part and is fixed on the circuit board by screws. The input end of the photodiode is connected to the optical signal interface, and the output end of the photodiode is connected to the plug-in part.
3. The optical receiving module according to claim 1, characterized in that: The housing includes a front panel, a frame, and a rear panel. Each of the four corners at the front and rear ends of the frame is provided with a first screw hole. The front panel and the rear panel are provided with first fixing holes corresponding to the first screw holes. The front panel and the rear panel are fixedly mounted at the front and rear ends of the frame by screws.
4. The optical receiving module according to claim 3, characterized in that: The left and right inner walls of the frame are each provided with a first limiting edge and a second limiting edge, which form a first limiting groove for limiting the circuit board.
5. The optical receiving module according to claim 3, characterized in that: The first screw hole forms a raised edge in the frame, and the raised edge and the first limiting edge form a second limiting groove.
6. The optical receiving module according to claim 5, characterized in that: A heat-conducting plate is provided in the second limiting groove. A support column is provided at each of the four corners of the upper surface of the heat-conducting plate. A limiting column is provided at the upper end of the support column. A limiting hole matching the limiting column is provided on the circuit board. A second screw hole is provided at the lower end of the heat-conducting plate corresponding to the support column. A second fixing hole is provided at the bottom of the frame corresponding to the second screw hole.
7. The optical receiving module according to claim 6, characterized in that: Thermally conductive silicone is provided between the heat-conducting plate and the circuit board, and between the heat-conducting plate and the bottom surface of the frame.
8. The optical receiving module according to claim 6, characterized in that: The heat-conducting plate has vertical plates on its front and rear sides, and thermally conductive silicone is provided between the vertical plates and the front and rear panels.
9. The optical receiving module according to claim 3, characterized in that: Mounting ears are provided on the front panel and the rear panel.