A laminated power module circuit board

Abstract

The utility model discloses a kind of laminated power module circuit boards, it is related to circuit board technical field, including circuit board main body, circuit board main body includes power output layer, power conversion layer and power input layer, multiple groups of power output interfaces are provided on power output layer, and first shielding layer is connected between power output layer and power conversion layer, second shielding layer is connected between power conversion layer and power input layer.The utility model in layers by layout, power input, conversion and output function are integrated in different layers respectively, and electrical connection between each layer is realized using metallized via and connecting copper column, effectively shorten the electrical connection path, reduce resistance and inductance, reduce the energy loss in transmission and conversion process of power supply, provide high-quality, stable power supply for load equipment, the setting of double-layer shielding layer effectively blocks the electromagnetic interference between each layer, further improve the stability and reliability of power module, guarantee the normal operation of electronic equipment.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board technology, specifically a multilayer power module circuit board. Background Technology

[0002] With the rapid development of modern electronic technology, electronic devices are constantly evolving towards miniaturization, lightweighting, and high performance. This places extremely stringent requirements on the performance, size, and integration of power modules. In the current electronic device market, whether it is smartphones and tablets used by people every day, automated control systems in industrial production, or satellites and aircraft in the aerospace field, all require power modules to provide stable, efficient, and clean power within a limited space.

[0003] In the past, power modules were largely constructed using single-layer or double-layer circuit board structures. These boards had simple layouts, typically concentrating power input, conversion, and output components on the same or only two layers. For example, some early electronic device power modules placed the power input interface, simple rectification and filtering circuitry, and power output interface on a single-layer circuit board, with components connected by long wires. In slightly more complex double-layer circuit boards, while some power conversion circuitry was arranged on separate layers, the overall integration remained low. To improve integration to some extent, some power modules adopted conventional multi-layer circuit boards. These boards generally have a multi-layer structure, with electrical connections between layers achieved through metallized vias.

[0004] However, traditional single-layer or double-layer circuit boards are limited by the component layout and cannot integrate too many power function modules. Taking portable electronic devices as an example, due to the limited size of the circuit board, after accommodating other necessary electronic components, the space left for the power module is extremely limited. Traditional circuit board structures can hardly meet the requirements of the device for miniaturization of the power module, resulting in the overall size of the device being unable to be further reduced. Utility Model Content

[0005] To overcome the above-mentioned defects, this utility model provides a stacked power module circuit board, which solves the problem that traditional single-layer or double-layer circuit boards are difficult to integrate too many power function modules due to the limited component layout. Taking portable electronic devices as an example, due to the limited size of the circuit board, after accommodating other necessary electronic components, the space left for the power module is extremely limited. Traditional circuit board structures can hardly meet the requirements of the device for miniaturization of the power module, resulting in the problem that the overall size of the device cannot be further reduced.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a multilayer power module circuit board, comprising a circuit board body, the circuit board body including a power output layer, a power conversion layer and a power input layer, the power output layer having multiple sets of power output interfaces and an integrated input filtering circuit, the power conversion layer having multiple sets of power conversion chips, the power input layer having a power input interface, the power conversion layer being fixed between the power output layer and the power input layer, and a first shielding layer connecting the power output layer and the power conversion layer, and a second shielding layer connecting the power conversion layer and the power input layer.

[0007] As a further embodiment of this utility model: multiple sets of connecting copper pillars are welded on the first shielding layer and the second shielding layer, and connecting holes for use with the connecting copper pillars are opened on the power output layer, the power conversion layer and the power input layer, and the inner side of the connecting holes is copper plated.

[0008] As a further embodiment of this utility model: a heat dissipation layer is provided below the bottom of the power input layer, and multiple sets of heat sinks are fixedly connected to the top of the heat dissipation layer, with the power input layer connected to the top of the heat sinks.

[0009] As a further embodiment of this utility model: both the heat sink and the heat dissipation layer are made of aluminum.

[0010] As a further aspect of this utility model: both the first shielding layer and the second shielding layer are made of metallic materials.

[0011] As a further aspect of this utility model: multiple slots are formed in the first shielding layer to cooperate with the power conversion chip.

[0012] As a further embodiment of this invention: the power conversion chip is soldered onto the power conversion layer using surface mount technology.

[0013] As a further embodiment of this utility model, the power input layer also integrates an overvoltage protection circuit and an overcurrent protection circuit.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] 1. By employing a layered layout, power input, conversion, and output functions are integrated into different layers. Metallized vias and connecting copper pillars are used to achieve electrical connections between layers, effectively shortening the electrical connection path, reducing resistance and inductance, minimizing energy loss during power transmission and conversion, and significantly improving power conversion efficiency. Simultaneously, input and output filtering circuits finely process the power supply, reducing ripple voltage and providing high-quality, stable power to the load equipment. Furthermore, the double-layer shielding effectively blocks electromagnetic interference between layers, further enhancing the stability and reliability of the power module and ensuring the normal operation of electronic equipment.

[0016] 2. By using an aluminum heat dissipation layer and heat sink, the excellent thermal conductivity of aluminum can quickly conduct and dissipate the heat generated by the components on the power input layer, preventing the components from degrading or even being damaged due to overheating, thus extending the service life of the circuit board. In addition, the overvoltage protection circuit and overcurrent protection circuit integrated on the power input layer can monitor the power input status in real time and quickly act when the voltage or current exceeds the set threshold, cutting off the circuit or adjusting the voltage and current, effectively protecting the components on the circuit board, enhancing the safety of the power module, and reducing the risk of equipment failure due to abnormal power supply. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a first-person perspective schematic diagram of the power conversion layer splitting effect of this utility model.

[0019] Figure 3 This is a second-view schematic diagram of the power conversion layer splitting effect of this utility model;

[0020] Figure 4 This is a first-person perspective schematic diagram of the power input layer splitting effect of this utility model;

[0021] Figure 5 This is a second-view schematic diagram of the power input layer splitting effect of this utility model.

[0022] In the diagram: 1. Power output layer; 2. Power output interface; 3. Connecting copper pillar; 4. Connecting hole; 5. First shielding layer; 6. Power conversion layer; 7. Second shielding layer; 8. Power input layer; 9. Heat sink; 10. Heat dissipation layer; 11. Power input interface; 12. Power conversion chip; 13. Slot; 14. Main body of the circuit board. Detailed Implementation

[0023] The technical solution of this patent will be further described in detail below with reference to specific embodiments.

[0024] like Figures 1-5 As shown, this utility model provides a technical solution for a multilayer power module circuit board:

[0025] The circuit board body 14 includes a power output layer 1, a power conversion layer 6, and a power input layer 8. The power output layer 1 is provided with multiple power output interfaces 2 and an input filtering circuit is integrated on the power output layer 1. The power conversion layer 6 is provided with multiple power conversion chips 12. The power input layer 8 is provided with a power input interface 11. The power conversion layer 6 is fixed between the power output layer 1 and the power input layer 8. A first shielding layer 5 is connected between the power output layer 1 and the power conversion layer 6. A second shielding layer 7 is connected between the power conversion layer 6 and the power input layer 8.

[0026] Specifically, the external power supply is connected to the circuit board through the power input interface 11 on the power input layer 8. At this time, the input filtering circuit starts to work. The input filtering circuit, composed of capacitors and inductors, performs preliminary processing on the input power supply. The capacitors, utilizing their AC-passing and DC-blocking characteristics, bypass high-frequency noise. The power supply after preliminary filtering is transmitted from the power input layer 8 to the intermediate power conversion layer 6 through metallized vias. In the power conversion layer 6, multiple sets of power conversion chips 12 convert the input power supply into DC power of different voltage levels according to the needs of different electronic devices. The converted power supply is transmitted from the power conversion layer 6 to the power output layer 1 through metallized vias. In the power output layer 1, the output filtering circuit further filters the power supply. The capacitors filter out high-frequency ripple in the power supply again, and the inductors suppress current surges, thereby ensuring that the power output from the power output interface 2 has extremely high stability and purity, meeting the strict power quality requirements of various load devices. At the same time, the first shielding layer 5 is located between the power output layer 1 and the power conversion layer 6, blocking the electromagnetic interference generated by the power conversion layer 6 from propagating to the power output layer 1, avoiding interference that affects the output power supply. For stability and purity, the second shielding layer 7 is located between the power conversion layer 6 and the power input layer 8. It prevents electromagnetic interference generated by the power conversion layer 6 from affecting the normal operation of the power input layer 8, ensuring the stability of the power input. At the same time, it also avoids interference from the power input layer 8 from affecting the conversion efficiency and accuracy of the power conversion layer 6. By integrating the power input, conversion and output functions into different layers, the circuit board structure is compact. Compared with traditional single-layer or double-layer power module circuit boards, it greatly improves the integration and effectively reduces the size of the power module. It can better meet the stringent space requirements of miniaturized electronic devices. Furthermore, the short electrical connection path achieved through layered layout and metallized vias reduces resistance and inductance. This reduces energy loss during power transmission and conversion, and improves power conversion efficiency. At the same time, the output filter circuit's fine processing of the output power significantly reduces ripple voltage, providing high-quality and stable power to the load device, which helps improve the device's performance and reliability. Finally, the cooperation between the first shielding layer 5 and the second shielding layer 7 greatly enhances the circuit board's anti-electromagnetic interference capability.

[0027] Multiple sets of connecting copper pillars 3 are welded on the first shielding layer 5 and the second shielding layer 7. Connecting holes 4 for use with connecting copper pillars 3 are opened on the power output layer 1, the power conversion layer 6 and the power input layer 8. The inner side of the connecting holes 4 is copper plated. A heat dissipation layer 10 is provided below the bottom of the power input layer 8. Multiple sets of heat sinks 9 are fixedly connected to the top of the heat dissipation layer 10. The top of the power input layer 8 is connected to the heat sinks 9.

[0028] Specifically, during the circuit board assembly stage, multiple sets of connecting copper pillars 3 are pre-soldered on the first shielding layer 5 and the second shielding layer 7. Simultaneously, connecting holes 4 are opened at corresponding positions on the power output layer 1, power conversion layer 6, and power input layer 8, and the inner sides of the connecting holes 4 are copper-plated. Subsequently, the circuit boards are stacked, ensuring that the connecting copper pillars 3 are precisely inserted into the corresponding connecting holes 4. Because the inner sides of the connecting holes 4 are copper-plated, they form a good electrical connection with the connecting copper pillars 3, further enhancing the electrical conductivity between layers. Compared to simply relying on metallized vias, this connection method adds additional conductive paths, ensuring more stable current transmission between layers. The connecting copper pillars 3 increase the reliability and stability of the electrical connection between layers. In high-current or complex circuit environments, metallized vias may experience conductive bottlenecks due to excessive current or other factors. The connecting copper pillars 3 provide more parallel conductive paths, effectively distributing current and reducing... Low resistance reduces problems such as unstable signal transmission and excessive voltage drop caused by poor electrical connection, thereby ensuring stable operation of the entire power module circuit board under different operating conditions and improving the overall electrical performance and anti-interference capability of the circuit board. A heat dissipation layer 10 is set below the bottom of the power input layer 8, and multiple heat sinks 9 are fixedly connected to the top of the heat dissipation layer 10. When the power module is working, the components on the power input layer 8, such as inductors and capacitors in the input filter circuit, will generate heat during the power input process. This heat is transferred to the bottom of the power input layer 8 through thermal conduction, and then to the heat dissipation layer 10 that is closely connected to it. The heat dissipation layer 10 is usually made of high thermal conductivity material, which can quickly absorb and evenly distribute heat. The heat sinks 9 have a large surface area. After the heat is transferred from the heat dissipation layer 10 to the heat sinks 9, the heat is dissipated to the surrounding environment through air convection, thereby achieving heat dissipation and cooling of the power input layer 8 and the entire circuit board.

[0029] The heat sink 9 and heat dissipation layer 10 are both made of aluminum, and the first shielding layer 5 and the second shielding layer 7 are both made of metal. The first shielding layer 5 has multiple slots 13 that work with the power conversion chip 12. The power conversion chip 12 is soldered onto the power conversion layer 6 using surface mount technology. The power input layer 8 also integrates overvoltage protection circuit and overcurrent protection circuit.

[0030] Specifically, the aluminum heat sink 9 and the heat dissipation layer 10 work together to effectively improve heat dissipation efficiency. Aluminum has a high thermal conductivity, which helps to quickly conduct heat from the heat-generating element and dissipate it, preventing the element from overheating and causing performance degradation or even damage, thereby extending the service life of the circuit board. When the external power supply voltage connected to the power input interface 11 exceeds the set threshold, the overvoltage protection circuit is activated. It monitors the input voltage in real time through the detection circuit. Once the voltage rises abnormally, the overvoltage protection circuit will act quickly.

[0031] The working principle of this utility model is as follows:

[0032] First, the external power supply is connected to the circuit board through the power input interface 11 of the power input layer 8. Then, the input filter circuit located in the power output layer 1 starts to work. This circuit consists of capacitors and inductors. The capacitors use their AC and DC blocking characteristics to bypass high-frequency noise, and the inductors impede rapid changes in current. Together, they perform preliminary filtering of the input power supply to improve the purity of the power supply.

[0033] Secondly, the pre-filtered power supply is transmitted from the power input layer 8 to the intermediate power conversion layer 6 through metallized vias. In the power conversion layer 6, multiple power conversion chips 12 convert the input power supply into DC power of different voltage levels according to the needs of different electronic devices. The power inductor and the chip work together to ensure the stability of the conversion process. The converted power supply is then transmitted to the power output layer 1 through metallized vias. In the power output layer 1, the output filter circuit filters the power supply again. The capacitor filters out high-frequency ripple, and the inductor suppresses current surges, ensuring that the power supply output from the power output interface 2 has extremely high stability and purity, meeting the strict requirements of the load equipment for power quality.

[0034] It is worth mentioning that the first shielding layer 5 is located between the power output layer 1 and the power conversion layer 6, blocking the electromagnetic interference generated by the power conversion layer 6 from propagating to the power output layer 1; the second shielding layer 7 is located between the power conversion layer 6 and the power input layer 8, preventing the electromagnetic interference generated by the power conversion layer 6 from affecting the normal operation of the power input layer 8 in the reverse direction, and at the same time avoiding the interference of the power input layer 8 from affecting the conversion efficiency and accuracy of the power conversion layer 6. Multiple sets of connecting copper pillars 3 are soldered on the first shielding layer 5 and the second shielding layer 7. Connecting holes 4 are opened at corresponding positions of the power output layer 1, the power conversion layer 6 and the power input layer 8, and the inner side is plated with copper. During assembly, the connecting copper pillars 3 are inserted into the connecting holes 4 to form a good electrical connection. Compared with simple metallized vias, this increases the conductive path, improves the reliability and stability of the electrical connection of each layer, and ensures the stable operation of the circuit board under different operating conditions.

[0035] Finally, an aluminum heat dissipation layer 10 is installed below the bottom of the power input layer 8, and an aluminum heat sink 9 is fixed on top. When the power module is working, the heat generated by the components on the power input layer 8 is transferred to the heat dissipation layer 10 through heat conduction, and then dissipated by the heat sink 9 through air convection, thereby achieving heat dissipation and cooling of the power input layer 8 and the entire circuit board, preventing the components from degrading or being damaged due to overheating, and extending the service life of the circuit board. When the external power supply voltage connected to the power input interface 11 exceeds the set threshold, the overvoltage protection circuit is activated. The detection circuit monitors the input voltage in real time and acts quickly when it rises abnormally. Similarly, the overcurrent protection circuit will also respond quickly when it detects that the input current exceeds the set value, cutting off the circuit or limiting the current to protect the circuit board components and ensure the safe operation of the power module.

[0036] The preferred embodiments of this patent have been described in detail above. However, this patent is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this patent.

Claims

1. A multilayer power module circuit board, comprising a circuit board body (14), characterized in that: The main body (14) of the circuit board includes a power output layer (1), a power conversion layer (6) and a power input layer (8). The power output layer (1) is provided with multiple sets of power output interfaces (2) and an input filtering circuit is integrated on the power output layer (1). The power conversion layer (6) is provided with multiple sets of power conversion chips (12). The power input layer (8) is provided with a power input interface (11). The power conversion layer (6) is fixed between the power output layer (1) and the power input layer (8). A first shielding layer (5) is connected between the power output layer (1) and the power conversion layer (6). A second shielding layer (7) is connected between the power conversion layer (6) and the power input layer (8).

2. The multilayer power module circuit board according to claim 1, characterized in that: Multiple sets of connecting copper pillars (3) are welded on the first shielding layer (5) and the second shielding layer (7). The power output layer (1), the power conversion layer (6) and the power input layer (8) are all provided with connecting holes (4) for use with the connecting copper pillars (3). The inner side of the connecting holes (4) is copper plated.

3. The multilayer power module circuit board according to claim 2, characterized in that: A heat dissipation layer (10) is provided below the bottom of the power input layer (8), and multiple heat sinks (9) are fixedly connected to the top of the heat dissipation layer (10). The power input layer (8) is connected to the top of the heat sinks (9).

4. A multilayer power module circuit board according to claim 3, characterized in that: Both the heat sink (9) and the heat dissipation layer (10) are made of aluminum.

5. A multilayer power module circuit board according to claim 4, characterized in that: Both the first shielding layer (5) and the second shielding layer (7) are made of metallic materials.

6. A multilayer power module circuit board according to claim 5, characterized in that: The first shielding layer (5) has multiple slots (13) for use with the power conversion chip (12).

7. A multilayer power module circuit board according to claim 6, characterized in that: The power conversion chip (12) is soldered onto the power conversion layer (6) using surface mount technology.

8. A multilayer power module circuit board according to claim 7, characterized in that: The power input layer (8) also integrates overvoltage protection circuit and overcurrent protection circuit.

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