A PCB anti-soldering process vertical plugboard carrier device

Abstract

The utility model discloses a PCB anti -soldering process vertical plug -in board carrier device, including base, support plate, connecting rod and support frame subassembly, the base length direction is equipped with two parallel support plate of each other, and two support plates are fixedly connected through the connecting rod, the equal interval of support plate is equipped with a plurality of baseboard clamping slot for placing PCB base plate, and the side wall of baseboard clamping slot is provided with the inclined surface of avoidance, still equal interval mounting has support frame subassembly on the base, and support frame subassembly is staggered with baseboard clamping slot, support frame subassembly is the door type, and support frame subassembly is inclined and sets up and the inclination direction is identical with the inclined surface of avoidance, and PCB base plate is placed between two adjacent support frame subassembly, and PCB base plate bottom plug -in is installed in baseboard clamping slot, and PCB base plate upper part leans in support frame subassembly top portion. Through above -mentioned mode, the utility model discloses vertical plug -in board, satisfies different board size insertion, and the contact surface of board and carrier is the two lines of board vertical direction, and the rest position does not contact, and protects the board surface ink.

Description

Technical Field

[0001] This utility model relates to the field of carrier technology, and in particular to a vertical insertion carrier device for PCB solder mask process. Background Technology

[0002] In the PCB solder mask process, the ink on the board surface is a very important part of the production process. Boards cannot be directly stacked, otherwise the ink on the two boards will stick together. Currently, the carriers used in the industry to store PCB substrates are mostly flat or inclined board racks. Flat carriers cause boards to be directly stacked, while inclined board racks cause the ink-covered board surface to come into contact with the board rack surface, inevitably affecting the ink on the board surface. Based on the above defects and shortcomings, it is necessary to improve the existing technology and design a vertical board insertion carrier device for the PCB solder mask process. Utility Model Content

[0003] The main technical problem solved by this utility model is to provide a vertical board insertion carrier device for PCB solder mask manufacturing process. The vertical board can accommodate the insertion of different board sizes, and the contact surfaces between the board and the carrier are two vertical lines of the board, with no contact at other positions, thus protecting the ink on the board surface.

[0004] To solve the above-mentioned technical problems, the present invention provides a PCB solder mask process vertical insertion carrier device, which includes a base, a support plate, a connecting rod, and a support frame assembly. Two parallel support plates are installed along the length of the base, and the two support plates are fixedly connected by the connecting rod. Several substrate slots for placing PCB substrates are equidistantly arranged on the support plates. One side wall of each substrate slot has a clearance slope. Support frame assemblies are also equidistantly installed on the base, offset from the substrate slots. The support frame assemblies are gate-shaped and inclined in the same direction as the clearance slope. The PCB substrate is placed between two adjacent support frame assemblies, with the bottom of the PCB substrate inserted into the substrate slot and the upper part of the PCB substrate resting against the top of the support frame assembly.

[0005] Preferably, the support frame assembly includes fiberglass rods, stainless steel round tubes, and Teflon sleeves. Two fiberglass rods are inserted into the base, and the upper ends of the two fiberglass rods are connected by a stainless steel round tube. The fiberglass rods and stainless steel round tubes form a door shape, and Teflon sleeves are also fitted on the two fiberglass rods and the stainless steel round tubes.

[0006] Preferably, the distance between two adjacent substrate slots is 30mm, and the distance between two adjacent support frame assemblies is 30mm.

[0007] Preferably, the support frame assembly has an 86° tilt angle with the horizontal plane.

[0008] Preferably, the support plate is made of Teflon.

[0009] Preferably, a PCB solder mask process vertical insertion board carrier device further includes an aluminum strip, a limiting cover plate, and a baffle. An aluminum strip for fixing the support frame assembly is installed on the outside of the base. A limiting cover plate for limiting and locking the support frame assembly is also installed on the aluminum strip. The limiting cover plate is set to prevent the support frame assembly from tipping over. Baffles are installed at both ends of the base in the width direction.

[0010] Preferably, the baffle is provided with a handle groove for easy hand gripping.

[0011] Preferably, the base has several openings.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] Vertical storage of PCB substrates to accommodate different board sizes, with a range of 300*300mm to 630*830mm. The boards are angled to the horizontal plane and spaced 30mm apart, effectively separating the substrates and preventing direct contact between them, thus protecting the ink on the board surface.

[0014] The substrate slot and support frame assembly work together to support the substrate. The contact interface between the substrate and the carrier device is the upper and lower lines, and the other positions do not contact each other, further protecting the ink on the board surface. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a vertical insertion board carrier device for PCB solder mask manufacturing.

[0016] Figure 2 for Figure 1 Enlarged view of a specific area.

[0017] Figure 3 This is a side view of a vertical insert board carrier device for PCB solder mask manufacturing.

[0018] Figure 4 This is a front view of a vertical insertion board carrier device for PCB solder mask manufacturing.

[0019] Figure 5 This is a schematic diagram of the working state of a vertical insertion board carrier device for PCB solder mask manufacturing process.

[0020] Among them, 1. base, 2. support plate, 20. base plate slot, 21. clearance slope, 3. connecting rod, 4. support frame assembly, 41. fiberglass rod, 42. stainless steel round tube, 43. Teflon sleeve, 5. aluminum strip, 6. limit cover plate, 7. baffle, 70. handle groove. Detailed Implementation

[0021] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0022] Please see Figures 1 to 5 The embodiments of this utility model include:

[0023] A vertical insertion carrier device for PCB solder mask process includes a base 1, a support plate 2, a connecting rod 3, a support frame assembly 4, an aluminum strip 5, a limiting cover plate 6, and a baffle 7.

[0024] The base 1 has two parallel support plates 2 installed along its length, and the two support plates 2 are fixedly connected by a connecting rod 3. Several substrate slots 20 for placing PCB substrates are equidistantly arranged on the support plates 2, with a spacing of 30mm between adjacent substrate slots 20. One side wall of each substrate slot 20 has a clearance slope 21 to avoid tilted PCB substrates. Support frame assemblies 4 are also equidistantly installed on the base 1. The support frame assemblies 4 are offset from the substrate slots 20 and are gate-shaped. The support frame assemblies 4 are tilted, and the tilt direction is consistent with the clearance slope 21. The B substrate is placed between two adjacent support frame assemblies 4. The bottom of the PCB substrate is inserted into the substrate slot 20, and the upper part of the PCB substrate rests against the top of the support frame assembly 4. The PCB substrate is placed at a certain angle to the support frame assembly 4. Specifically, the contact interface between the PCB substrate and the carrier device is two lines, which effectively protects the ink on the substrate surface. An aluminum strip 5 for fixing the support frame assembly 4 is installed on the outside of the base 1. A limiting cover 6 for limiting and locking the support frame assembly 4 is also installed on the aluminum strip 5. The limiting cover 6 is set to prevent the support frame assembly 4 from tipping over. Baffles 7 are installed at both ends of the width direction of the base 1.

[0025] The support frame assembly 4 includes fiberglass rods 41, stainless steel round tubes 42, and Teflon sleeves 43. Two fiberglass rods 41 are inserted into the base 1, and the upper ends of the two fiberglass rods 41 are connected by stainless steel round tubes 42. The fiberglass rods 41 and stainless steel round tubes 42 form a door shape. Teflon sleeves 43 are also fitted on the two fiberglass rods 41 and stainless steel round tubes 42.

[0026] The base 1 has several openings and is designed for lightweight use.

[0027] The support plate 2 is made of Teflon.

[0028] The support frame assembly 4 has an 86° tilt angle with the horizontal plane.

[0029] The baffle 7 has a handle groove 70 for easy hand gripping.

[0030] This utility model discloses a vertical insertion carrier device for PCB solder mask manufacturing. When in operation, it vertically stores PCB substrates 01 to accommodate different board sizes, ranging from 300*300mm to 630*830mm. The boards are angled to the horizontal plane, and there is a 30mm gap between the boards, which effectively separates the substrates and prevents direct contact between them, thus protecting the ink on the board surface. Furthermore, the contact interface between the board and the carrier device is only at the top and bottom lines, with no contact at other positions, further protecting the ink on the board surface.

[0031] This utility model discloses a vertical insertion carrier device for PCB solder mask manufacturing process. The vertical insertion allows for the insertion of different board sizes, and the contact surfaces between the board and the carrier are the two vertical lines of the board, with no contact at other positions, thus protecting the ink on the board surface.

[0032] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A vertical insertion board carrier device for PCB solder mask manufacturing process, characterized in that: The system includes a base (1), a support plate (2), a connecting rod (3), and a support frame assembly (4). The base (1) has two parallel support plates (2) installed along its length. The two support plates (2) are fixedly connected by the connecting rod (3). The support plates (2) are provided with several substrate slots (20) for placing PCB substrates at equal intervals. One side wall of the substrate slot (20) is provided with a clearance slope (21). The base (1) is also provided with support frame assemblies (4) at equal intervals. The support frame assembly (4) is offset from the substrate slot (20). The support frame assembly (4) is in the shape of a door. The support frame assembly (4) is inclined and the inclination direction is consistent with the clearance slope (21). The PCB substrate is placed between two adjacent support frame assemblies (4). The bottom of the PCB substrate is inserted into the substrate slot (20), and the upper part of the PCB substrate rests against the top of the support frame assembly (4).

2. The PCB solder mask process vertical insertion board carrier device according to claim 1, characterized in that: The support frame assembly (4) includes fiberglass rods (41), stainless steel round tubes (42), and Teflon sleeves (43). Two fiberglass rods (41) are inserted into the base (1), and the upper ends of the two fiberglass rods (41) are connected by stainless steel round tubes (42). The fiberglass rods (41) and stainless steel round tubes (42) form a door shape. Teflon sleeves (43) are also fitted on the two fiberglass rods (41) and stainless steel round tubes (42).

3. The PCB solder mask process vertical insertion board carrier device according to claim 1, characterized in that: The distance between two adjacent substrate slots (20) is 30mm, and the distance between two adjacent support frame assemblies (4) is 30mm.

4. The PCB solder mask process vertical insertion board carrier device according to claim 1, characterized in that: The support frame assembly (4) has an 86° tilt angle with the horizontal plane.

5. A vertical insertion board carrier device for PCB solder mask process according to claim 1, characterized in that: The support plate (2) is made of Teflon.

6. The PCB solder mask process vertical insertion board carrier device according to claim 1, characterized in that: It also includes aluminum strips (5), limiting cover plates (6) and baffles (7). An aluminum strip (5) for fixing the support frame assembly (4) is installed on the outside of the base (1). A limiting cover plate (6) for limiting and locking the support frame assembly (4) is also installed on the aluminum strip (5). The setting of the limiting cover plate (6) prevents the support frame assembly (4) from tipping over. Baffles (7) are installed at both ends of the base (1) in the width direction.

7. A vertical insertion board carrier device for PCB solder mask process according to claim 6, characterized in that: The baffle (7) is provided with a handle groove (70) for easy hand gripping.

8. A vertical insertion board carrier device for PCB solder mask process according to claim 1, characterized in that: The base (1) has several openings.

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