A silicon wafer on-line cutting waste collecting device
By designing an online silicon cutting waste collection device, the efficient separation and regeneration of silicon fragments and cutting fluid were achieved using filtration and circulation components. This solved the problems of low solid-liquid separation efficiency and difficulty in reusing cutting fluid in traditional wire cutting machines, thereby reducing production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- INNER MONGOLIA XINGGU TECH CO LTD
- Filing Date
- 2025-06-13
- Publication Date
- 2026-06-12
AI Technical Summary
Traditional wire cutting machines are not convenient for solid-liquid separation of mixed waste materials of silicon fragments and cutting fluid. Cutting fluid is difficult to purify and reuse, and the efficiency of extracting silicon fragments from mixed waste materials is low.
An online silicon cutting waste collection device was designed, comprising a filtration component, a feeding component, and a circulation component. It utilizes activated carbon plates and microporous filters for solid-liquid separation, and uses cylinders and water pumps to circulate, purify, and reuse the cutting fluid.
This technology enables efficient solid-liquid separation of silicon cutting waste and recycling of cutting fluid, reducing production costs and improving processing efficiency.
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