Power module
By increasing the aspect ratio of the power module's plastic package and increasing the distance in the X direction of the package, the problem of insufficient output current capability of power devices in a limited area of the power module is solved, and the output current capability of the power devices is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU SILAN MICROELECTRONICS CO LTD
- Filing Date
- 2025-01-16
- Publication Date
- 2026-06-12
AI Technical Summary
Existing power modules struggle to improve the output current capability of power devices within a limited area.
By increasing the aspect ratio of the power module's plastic package and increasing the distance in the X direction of the package, more power devices or larger devices can be added, thereby improving the output current capability.
Within the same area, the power device's output current capability is increased by 20%.
Smart Images
Figure CN224356638U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of packaging technology, and in particular to a power module. Background Technology
[0002] With the advancement of power electronics technology, power modules, including power modules, have developed rapidly. However, the area of power modules is often limited by the operating environment, which also restricts their current output capability. Therefore, it is necessary to solve how to improve the output current capability of power devices in power modules within a limited area. Utility Model Content
[0003] In view of this, the purpose of this utility model is to provide a power module, which includes a power module. By increasing the width-to-length ratio of the power module's plastic package, the power module can have more power devices or a larger area of power devices, thereby improving the output current capability of the power devices in the power module.
[0004] This utility model provides a power module, which includes:
[0005] Second substrate;
[0006] At least six power modules are located on the second substrate;
[0007] Furthermore, the power module includes:
[0008] First substrate;
[0009] At least one power device is located on a first surface of a first substrate;
[0010] A molding compound encapsulates a first substrate and a power device. The molding compound includes opposing first and second sides, as well as opposing third and fourth sides. The first and third sides of the molding compound are perpendicular. The distance from the third to the fourth side of the molding compound is the distance in the X direction of the molding compound, and the distance from the first to the second side of the molding compound is the distance in the Y direction of the molding compound.
[0011] The first power terminal extends from the first side of the plastic package and is electrically connected to the power device in the plastic package.
[0012] A second power terminal extends from the second side of the molding compound and is electrically connected to a power device within the molding compound; and
[0013] The signal terminal extends from the first side of the plastic package and is electrically connected to the power device in the plastic package.
[0014] The distance in the X direction of the encapsulated body is 80%-140% of the distance in the Y direction of the encapsulated body.
[0015] Preferably, the distance in the X direction of the encapsulation body is 80%-110% of the distance in the Y direction of the encapsulation body.
[0016] Preferably, the distance between the encapsulated parts in the Y direction is 25mm-31mm, and the distance between the encapsulated parts in the X direction is 22mm-28mm.
[0017] Preferably, the first substrate includes a heat dissipation base plate exposed on the lower surface of the molding compound. The heat dissipation base plate includes opposing fifth and sixth sides and opposing seventh and eighth sides. The fifth and seventh sides of the heat dissipation base plate are perpendicular to each other. The fifth side of the heat dissipation base plate is parallel to the first side of the molding compound. The distance between the seventh and eighth sides of the heat dissipation base plate is the distance in the X direction of the heat dissipation base plate. The distance between the fifth and sixth sides of the heat dissipation base plate is the length of the heat dissipation base plate in the Y direction. The distance in the Y direction of the heat dissipation base plate is 90% to 150% of the distance in the X direction of the heat dissipation base plate.
[0018] Preferably, the distance in the Y direction of the heat dissipation base plate is 90%-120% of the distance in the X direction of the heat dissipation base plate.
[0019] Preferably, the distance in the X direction of the heat dissipation base plate is 17mm-23mm, which is less than the distance in the X direction of the encapsulation.
[0020] Preferably, the number of power devices is 1, 2, 3 or 4.
[0021] Preferably, when the number of power devices is 1, the length of the power device is 13mm~20mm and the width of the power device is 10mm~19mm.
[0022] Preferably, when the number of power devices is 4, the power devices are SiC MOS, and the surface size of the SiC MOS is at least one of 5mm x 4mm, 5mm x 5mm, and 5mm x 6mm.
[0023] Preferably, there are six power modules, all of which are in the same row, and adjacent power modules are arranged alternately in opposite directions on the second substrate.
[0024] Preferably, there are six power modules, arranged in two rows of three, with adjacent power modules in the same row arranged at intervals in the same direction on the second substrate.
[0025] Preferably, the power module further includes an insulating layer located between the second substrate and the power module. The insulating layer has an opening, through which the power module passes to be located on the second substrate. The insulating layer has a certain distance from the first power terminal, the second power terminal, and the signal terminal of the power module so that the first power terminal, the second power terminal, and the signal terminal of the power module are insulated from the second substrate.
[0026] This utility model embodiment provides a molding compound for a power module, covering a first substrate and a power device. The molding compound includes opposing first and second sides, as well as opposing third and fourth sides. The first and third sides of the molding compound are perpendicular. The distance from the third to the fourth side of the molding compound is the distance in the X-direction of the molding compound, and the distance from the first to the second side of the molding compound is the distance in the Y-direction of the molding compound. The distance in the X-direction of the molding compound is 80%-140% of the distance in the Y-direction of the molding compound.
[0027] This invention improves the output current capability of power devices within a limited power module size. Specifically, by increasing the X-direction distance of the power module's encapsulation while maintaining the same Y-direction distance, more power devices or larger power devices can be incorporated into the power module, thereby increasing the output current capability of the power devices. Compared to traditional technologies, the power module proposed in this invention achieves a 20% increase in the output current capability of its power devices. Attached Figure Description
[0028] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which:
[0029] Figure 1 This is a schematic diagram of the power module provided in an embodiment of the present utility model;
[0030] Figure 2 This is a schematic diagram of the power module provided in an embodiment of the present utility model;
[0031] Figure 3 This is a schematic diagram of the power device in the power module provided in this embodiment of the utility model.
[0032] Figure 4 This is a schematic diagram of the first power module provided in this embodiment of the present invention.
[0033] Figure 5 This is a schematic diagram of the second power module provided in this embodiment of the utility model.
[0034] 21-First power terminal; 22-Second power terminal; 23-Signal terminal; 24-Encapsulation; 25-First substrate (including heat sink); 26-Power device; 27-Sintered material
[0035] 31-Insulating layer; 32-Second substrate Detailed Implementation
[0036] The present application is described below based on embodiments, but it is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without these details. To avoid obscuring the substance of the present application, well-known methods, processes, flows, elements, and circuits are not described in detail.
[0037] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.
[0038] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0039] For ease of explanation, spatially related terms such as “inside,” “outside,” “below,” “below,” “lower,” “above,” “upper,” etc., are used herein to describe the relationship between one element or feature illustrated in the figure and another. It will be understood that spatially related terms may be intended to encompass different orientations of the device in use or operation besides those depicted in the figure. For example, if the device in the figure is flipped, an element described as “below” or “below” another element or feature would then be positioned “above” that other element or feature. Thus, the exemplified term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially related descriptive terms used herein should be interpreted accordingly.
[0040] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".
[0041] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0042] This utility model embodiment also provides a power module, such as Figure 4 , 5 The following are included:
[0043] Second substrate 32;
[0044] At least six power modules are located on the second substrate 32;
[0045] See Figure 1 , Figure 2 The power module of this utility model includes:
[0046] First substrate 25, see Figure 3 As shown;
[0047] At least one power device 26, see Figure 3 As shown, the power device 26 is located on the first surface of the first substrate 25;
[0048] The molding compound 24 covers the first substrate 25 and the power device 26. The molding compound 24 includes opposing first and second sides and opposing third and fourth sides. The first and third sides of the molding compound 24 are perpendicular. The distance from the third side to the fourth side of the molding compound 24 is the X-direction distance of the molding compound 24, and the distance from the first side to the second side of the molding compound 24 is the Y-direction distance of the molding compound 24.
[0049] The first power terminal 21 extends from the first side of the plastic encapsulation 24 and is electrically connected to the power device 26 in the plastic encapsulation 24.
[0050] A second power terminal 22 extends from the second side of the molding compound 24, and is electrically connected to a power device 26 within the molding compound; and
[0051] Signal terminal 23 extends from the first side of the plastic package 24 and is electrically connected to power device 26 in the plastic package 24.
[0052] The distance in the X direction of the encapsulated body 24 is 80%-140% of the distance in the Y direction of the encapsulated body 24.
[0053] The distance in the X direction of the encapsulated body 24 is 80%-110% of the distance in the Y direction of the encapsulated body 24.
[0054] The Y-direction distance of the encapsulated body 24 is 25mm-31mm, and the X-direction distance of the encapsulated body 24 is 22mm-28mm.
[0055] The first substrate 25 includes a heat dissipation base plate exposed on the lower surface of the molding compound 24. The heat dissipation base plate includes opposing fifth and sixth sides, as well as opposing seventh and eighth sides. The fifth and seventh sides of the heat dissipation base plate are perpendicular to each other. The fifth side of the heat dissipation base plate is parallel to the first side of the molding compound 24. The distance between the seventh and eighth sides of the heat dissipation base plate is the distance in the X direction of the heat dissipation base plate. The distance between the fifth and sixth sides of the heat dissipation base plate is the length of the heat dissipation base plate in the Y direction. The distance in the Y direction of the heat dissipation base plate is 90% to 150% of the distance in the X direction of the heat dissipation base plate.
[0056] The distance in the Y direction of the heat sink base plate is 90%-120% of the distance in the X direction of the heat sink base plate.
[0057] The distance in the X direction of the heat sink base plate is 17mm-23mm, which is less than the distance in the X direction of the plastic encapsulation.
[0058] The number of power devices 26 can be 1, 2, 3 or 4.
[0059] When there is only one power device 26, the length of the power device 26 is 13mm~20mm and the width of the power device 26 is 10mm~19mm.
[0060] Traditional power module molded enclosures have a spacing of 18.9 mm in the X direction and 28 mm in the Y direction, with the X-direction spacing being 67.5% of the Y-direction spacing. In contrast, the molded enclosure of this application has an X-direction spacing of 80%-140% of the Y-direction spacing, significantly larger than traditional power modules. This allows for more power devices or larger device sizes within the molded enclosure of the power module of this application. For example, with one power device, the power device in this application is 13 mm to 20 mm long and 10 to 19 mm wide, while the width of power devices in traditional power modules is limited to less than 14 mm. With four power devices, specifically SiC MOS, the SiC surface dimensions in this application are at least one of 5 mm x 4 mm, 5 mm x 5 mm, or 5 mm x 6 mm, while the surface dimensions of power devices in traditional power modules cannot be 5 mm x 6 mm.
[0061] There are six power modules, such as Figure 4 As shown, all power modules are in the same row, and adjacent power modules are arranged alternately in opposite directions on the second substrate.
[0062] There are six power modules, such as Figure 5 As shown, six power modules are arranged in two rows, and three power modules are arranged in one row. In the same row, two adjacent power modules are arranged at intervals in the same direction on the second substrate.
[0063] The power module also includes an insulating layer 31, which is located between the second substrate 32 and the power module. The insulating layer 31 has an opening, through which the power module passes to be located on the second substrate 32. The insulating layer 31 has a certain distance from the first power terminal 21, the second power terminal 22 and the signal terminal 23 of the power module so that the first power terminal 21, the second power terminal 22 and the signal terminal 23 of the power module are insulated from the second substrate.
[0064] This utility model embodiment provides a power module, which includes a power module, a molding compound for the power module, a first substrate and power devices, and the molding compound includes opposing first and second sides, as well as opposing third and fourth sides. The first and third sides of the molding compound are perpendicular. The distance from the third to the fourth side of the molding compound is the distance in the X direction, and the distance from the first to the second side of the molding compound is the distance in the Y direction. The distance in the X direction is 80%-140% of the distance in the Y direction.
[0065] This invention improves the output current capability of power devices within a limited power module size. Specifically, by increasing the X-direction distance of the power module's encapsulation while maintaining the same Y-direction distance, more power devices or larger power devices can be incorporated into the power module, thereby increasing the output current capability of the power devices. Compared to traditional technologies, the power module proposed in this invention achieves a 20% increase in the output current capability of its power devices.
[0066] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A power module, comprising: Second substrate; At least six power modules are located on the second substrate; The power module is characterized by comprising: First substrate; At least one power device, said power device being located on a first surface of the first substrate; A molding compound covers the first substrate and the power device. The molding compound includes opposing first and second sides, as well as opposing third and fourth sides. The first and third sides of the molding compound are perpendicular to each other. The distance from the third to the fourth side of the molding compound is the distance in the X direction of the molding compound, and the distance from the first to the second side of the molding compound is the distance in the Y direction of the molding compound. A first power terminal extends from a first side of the encapsulation body and is electrically connected to the power device in the encapsulation body. A second power terminal extends from a second side of the molding compound, and the second power terminal is electrically connected to the power device within the molding compound; and A signal terminal extends from a first side of the molding compound and is electrically connected to the power device in the molding compound. The distance in the X direction of the encapsulation is 80%-140% of the distance in the Y direction of the encapsulation.
2. The power module according to claim 1, characterized in that, The distance in the X direction of the encapsulation is 80%-110% of the distance in the Y direction of the encapsulation.
3. The power module according to claim 1 or 2, characterized in that, The distance between the molded bodies in the Y direction is 25mm-31mm, and the distance between the molded bodies in the X direction is 22mm-28mm.
4. The power module according to claim 1, characterized in that, The first substrate includes a heat dissipation base plate exposed on the lower surface of the molding compound. The heat dissipation base plate includes opposing fifth and sixth sides, as well as opposing seventh and eighth sides. The fifth and seventh sides of the heat dissipation base plate are perpendicular to each other. The fifth side of the heat dissipation base plate is parallel to the first side of the molding compound. The distance between the seventh and eighth sides of the heat dissipation base plate is the distance in the X direction of the heat dissipation base plate. The distance between the fifth and sixth sides of the heat dissipation base plate is the length of the heat dissipation base plate in the Y direction. The distance in the Y direction of the heat dissipation base plate is 90% to 150% of the distance in the X direction of the heat dissipation base plate.
5. The power module according to claim 4, characterized in that, The distance in the Y direction of the heat dissipation base plate is 90%-120% of the distance in the X direction of the heat dissipation base plate.
6. The power module according to claim 5, characterized in that, The distance in the X direction of the heat dissipation base plate is 17mm-23mm, which is less than the distance in the X direction of the molding compound.
7. The power module according to claim 1, characterized in that, The number of power devices is 1, 2, 3 or 4.
8. The power module according to claim 1, characterized in that, When the number of power devices is 1, the length of the power device is 13mm~20mm and the width of the power device is 10mm~19mm.
9. The power module according to claim 1, characterized in that, When the number of power devices is 4, the power devices are SiC MOS, and the surface size of the SiC MOS is at least one of 5mm x 4mm, 5mm x 5mm, and 5mm x 6mm.
10. The power module according to claim 9, characterized in that, There are six power modules, all of which are arranged in the same row, with adjacent power modules arranged alternately in opposite directions on the second substrate.
11. The power module according to claim 9, characterized in that, There are six power modules, arranged in two rows, with three power modules in one row. In the same row, two adjacent power modules are arranged at intervals in the same direction on the second substrate.
12. The power module according to claim 10 or 11, characterized in that, The power module further includes an insulating layer located between the second substrate and the power module. The insulating layer has an opening through which the power module passes to be located on the second substrate. The insulating layer has a certain distance from the first power terminal, the second power terminal, and the signal terminal of the power module to insulate the first power terminal, the second power terminal, and the signal terminal of the power module from the second substrate.