A multi-layer circuit board press device

Abstract

The utility model discloses a kind of multilayer circuit board pressing devices, comprising: pressing component, the pressing component includes device seat, top plate, vertical rod, collar, support plate and hydraulic pump, the vertical rod is fixed in the top of device seat, stick removal component, the stick removal component includes processing frame, bonding roller, vertical board, tank, inner groove, carousel, motor, lead screw, cross plate, nut and processing plate, the processing frame is located above processing plate, processing plate is welded in the top of device seat.The utility model under current production environment, dust and fine particles diffused in external air are extremely easy to adhere to the surface of multilayer circuit board to be pressed, these impurities size is small, but have great harm, if not timely and thoroughly clean these adhering impurities before pressing, when entering pressing link, dust and particles will penetrate into circuit board inside under the action of high temperature and high pressure, greatly increase production cost, reduce production efficiency.

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