A carrying mechanism and conveying device

Abstract

This utility model discloses a conveying mechanism and a transport device. The conveying mechanism includes: a mounting base; a first holding component and a second holding component, the first holding component and the second holding component being spaced apart along the Y direction, the first holding component being disposed on the mounting base; a driving component, the driving component being disposed on the mounting base, the driving component being capable of driving the second holding component to move along the Y direction; and an air knife component, the air knife component being disposed on the first holding component and / or the second holding component. The technical solution provided by this application can save processes and improve efficiency.

Description

Technical Field

[0001] This application belongs to the field of battery processing equipment technology, and in particular relates to a handling mechanism and conveying device. Background Technology

[0002] In the preceding process of the handling mechanism, a silicon wafer is cut into two silicon wafers, namely the first silicon wafer and the second silicon wafer. During the cutting process, water needs to be sprayed onto the cutting position to remove dust and cool down. Therefore, the first and second silicon wafers will have water stains after cutting.

[0003] In the prior art, a drying mechanism is usually set up in the next process after the handling mechanism to heat and dry the first and second silicon wafers. This process will increase the number of actions, which will affect the work efficiency. Utility Model Content

[0004] The purpose of this application is to provide a handling mechanism and a conveying device.

[0005] According to a first aspect of the embodiments of this application, a conveying mechanism is provided, comprising:

[0006] Mounting base;

[0007] A first holding component and a second holding component are arranged at intervals along the Y direction, and the first holding component is disposed on the mounting base;

[0008] A driving component is disposed on the mounting base, and the driving component is capable of driving the second holding component to move along the Y direction;

[0009] An air knife assembly, wherein the air knife assembly is disposed on the first holding assembly and / or the second holding assembly.

[0010] Optionally, the air knife assembly includes a first air knife and a second air knife, wherein the first air knife is disposed on the side of the first holding assembly near the second holding assembly, and the second air knife is disposed on the side of the second holding assembly near the first holding assembly.

[0011] Optionally, the first air knife includes a first end and a second end, the first end and the second end being arranged opposite each other along the X direction, the first holding assembly being located between the first end and the second end in the X direction, and the first air knife having at least one first air outlet, the first air outlet being located between the first end and the second end; and / or

[0012] The second air knife includes a third end and a fourth end, which are arranged opposite to each other along the X direction. The second holding assembly is located between the third end and the fourth end in the X direction. The second air knife has at least one second air outlet, which is located between the third end and the fourth end.

[0013] Optionally, the first air knife includes a first flow channel and a first through hole, the first through hole being formed at the first end, the first through hole communicating with the first flow channel, and the first air outlet communicating with the first flow channel; and / or

[0014] The second air knife includes a second flow channel and a second through hole. The second through hole is opened at the third end and is connected to the second flow channel. The second air outlet is connected to the second flow channel.

[0015] Optionally, the first air knife further includes a third through hole, which is formed at the second end and communicates with the first flow channel; and / or

[0016] The second air knife also includes a fourth through hole, which is located at the fourth end and communicates with the second flow channel.

[0017] Optionally, the first holding component includes a first mounting portion and a first suction cup, wherein the first suction cup is disposed on the first mounting portion, and the first air knife is disposed on the first mounting portion; and / or

[0018] The second holding component includes a second mounting part and a second suction cup, wherein the second suction cup is disposed in the second mounting part and the second air knife is disposed in the second mounting part.

[0019] Optionally, the first mounting portion includes a first mounting plate and a first connecting plate. The first connecting plate includes a first connecting end and a second connecting end. The first connecting end is disposed on the first mounting plate, and the second connecting end protrudes from the first mounting plate in the Y direction. The first air knife is disposed on the second connecting end; and / or

[0020] The second mounting part includes a second mounting plate and a second connecting plate. The second connecting plate includes a third connecting end and a fourth connecting end. The third connecting end is disposed on the second mounting plate, and the fourth connecting end protrudes from the second mounting plate in the Y direction. The second air knife is disposed on the fourth connecting end.

[0021] Optionally, the conveying mechanism further includes a guide assembly disposed on the mounting base, and the second holding assembly is slidably connected to the guide assembly along the Y direction.

[0022] According to a second aspect of the embodiments of this application, a conveying device is provided, comprising:

[0023] A first conveying mechanism and a second conveying mechanism are arranged at intervals along the X direction;

[0024] The aforementioned transport mechanism is located between the first conveying mechanism and the second conveying mechanism.

[0025] Optionally, the conveying device further includes a first driving mechanism and a second driving mechanism, wherein the first driving mechanism is capable of driving the conveying mechanism to move along the X direction, and the second driving mechanism is capable of driving the conveying mechanism to move along the Z direction.

[0026] One technical advantage of this application embodiment is that by integrating the air knife assembly into the conveying mechanism, the work of removing water stains and the work of conveying can be carried out simultaneously, which can save processes and improve efficiency.

[0027] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0028] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0029] Figure 1 This is a schematic diagram of the transport mechanism in the embodiments of this application;

[0030] Figure 2 This is a schematic diagram of the air knife assembly, the first mounting part, and the second mounting part in the embodiments of this application;

[0031] Figure 3 This is a schematic diagram of the conveying device in the embodiments of this application;

[0032] Figure 4 for Figure 3 A magnified view of point D in the image;

[0033] Figure 5 This is a schematic diagram showing the positions of the first silicon wafer, the second silicon wafer, and the water stains in an embodiment of this application.

[0034] Explanation of reference numerals in the drawings: 100 conveying mechanism; 1 first holding assembly; 11 first mounting part; 111 first mounting plate; 112 first connecting plate; 1121 first connecting end; 1122 second connecting end; 12 first suction cup; 2 second holding assembly; 21 second mounting part; 211 second mounting plate; 212 second connecting plate; 22 second suction cup; 3 driving assembly; 31 driving component; 32 connecting seat; 4 air knife assembly; 41 first air knife; 412 first through hole; 43 third through hole. 13; First end 414; Second end 415; Second air knife 42; Second air outlet 421; Second through hole 422; Fourth through hole 423; Third end 424; Fourth end 425; Mounting base 5; Guide assembly 6; First conveying mechanism 200; Second conveying mechanism 300; First drive mechanism 400; Motor 401; Drive wheel 402; Driven wheel 403; Transmission belt 404; Second drive mechanism 500; First silicon wafer a; Second silicon wafer b; Water stain c. Detailed Implementation

[0035] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0036] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0037] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0038] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0039] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0040] First, it should be noted that the X, Y, and Z directions mentioned in the embodiments of this application are referred to in the appendix. Figure 1 , Figure 3 and Figure 5 The marked directions. Among them, the axes in the X direction, Y direction, and Z direction intersect each other.

[0041] like Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, according to a first aspect of the embodiments of this application, a conveying mechanism 100 is provided, including a mounting base 5, a first holding component 1, a second holding component 2, a driving component 3, and an air knife component 4; the first holding component 1 and the second holding component 2 are spaced apart along the Y direction, the first holding component 1 is disposed on the mounting base 5; the driving component 3 is disposed on the mounting base 5, and the driving component 3 is capable of driving the second holding component 2 to move along the Y direction; the air knife component 4 is disposed on the first holding component 1 and / or the second holding component 2.

[0042] like Figure 1 As shown, the conveying mechanism 100 includes a mounting base 5, a first holding component 1, a second holding component 2, a driving component 3, and an air knife component 4. The first holding component 1 and the second holding component 2 are spaced apart along the Y direction. The first holding component 1 is used to hold a first silicon wafer a, and the second holding component 2 is used to hold a second silicon wafer b. The driving component 3 is mounted on the mounting base 5, the first holding component 1 is mounted on the mounting base 5, and the second holding component 2 is mounted on the driving end of the driving component 3. The driving component 3 can drive the second holding component 2 to move along the Y direction to adjust the distance between the second holding component 2 and the first holding component 1 in the Y direction, thereby achieving wafer separation. The air knife component 4 is used to blow air onto the first silicon wafer a and the second silicon wafer b to remove water stains c from the first silicon wafer a and the second silicon wafer b.

[0043] The conveying mechanism 100 of this application, by setting an air knife assembly 4, enables the removal of water stains c from the first silicon wafer a and the second silicon wafer b during the conveying process. Firstly, by integrating the air knife assembly 4 onto the conveying mechanism 100, the removal of water stains c is performed simultaneously with the conveying process, which saves steps and improves efficiency. Secondly, if a heating conveying mechanism is to be set in the next process, the removal of water stains c by the air knife assembly 4 during the conveying process of the first silicon wafer a and the second silicon wafer b reduces the drying pressure of water stains c in the drying device, lowers the drying temperature, and also shortens the length of the heating conveying mechanism, saving space and reducing production costs.

[0044] like Figure 5 As shown, a silicon wafer is divided into two parts. The water stain c on the first silicon wafer a is located on the side closer to the second silicon wafer b, and the water stain c on the second silicon wafer b is located closer to the first silicon wafer a.

[0045] In one alternative implementation, such as Figure 1 and Figure 2As shown, the air knife assembly 4 includes a first air knife 41 and a second air knife 42. The first air knife 41 is disposed on the side of the first holding assembly 1 near the second holding assembly 2, and the second air knife 42 is disposed on the side of the second holding assembly 2 near the first holding assembly 1. Specifically, when the first holding assembly 1 holds the first silicon wafer a, the water stain c on the first silicon wafer a is located near the side of the second holding assembly 2. When the second holding assembly 2 holds the second silicon wafer b, the water stain c on the second silicon wafer b is located near the side of the first holding assembly 1. Therefore, the first air knife 41 is disposed on the side of the first holding assembly 1 near the side of the second holding assembly 2 to accurately remove the water stain c on the first silicon wafer a, and the second air knife 42 is disposed on the side of the second holding assembly 2 near the side of the first holding assembly 1 to accurately remove the water stain c on the second silicon wafer b. In this embodiment, the working efficiency of the air knife assembly 4 can be improved by the placement of the first air knife 41 and the second air knife 42.

[0046] Wherein, the length direction of the side of the first silicon wafer a that is closer to the second holding component 2 is the X direction, and the length direction of the side of the second silicon wafer b that is closer to the first holding component 1 is the X direction.

[0047] In one alternative implementation, such as Figure 2 and Figure 4 As shown, the first air knife 41 includes a first end 414 and a second end 415, which are arranged opposite to each other along the X direction. The first holding assembly 1 is located between the first end 414 and the second end 415 in the X direction. The first air knife 41 has at least one first air outlet (not shown in the figure, please refer to the appendix for details). Figure 2 The first air outlet is located between the first end 414 and the second end 415. Specifically, the first end 414 and the second end 415 are arranged along the X direction, and the first holding component 1 is located between the first end 414 and the second end 415 in the X direction. The first air outlet is located between the first end 414 and the second end 415. The first air outlet can blow along the length direction of the first silicon wafer a, that is, it can blow towards the water stain c, thereby improving the effect of removing the water stain c.

[0048] The first air knife 41 has multiple first air outlets, which are spaced apart along the X direction. By setting multiple first air outlets, the air is blown towards the water stain c along the X direction.

[0049] In one alternative implementation, such as Figure 2 and Figure 4As shown, the second air knife 42 includes a third end 424 and a fourth end 425, which are arranged opposite to each other along the X direction. The second holding assembly 2 is located between the third end 424 and the fourth end 425 in the X direction. The second air knife 42 has at least one second air outlet 421, which is located between the third end 424 and the fourth end 425. Specifically, the third end 424 and the fourth end 425 are arranged along the X direction, and the second holding assembly 2 is located between the third end 424 and the fourth end 425 in the X direction. The second air outlet 421 is located between the third end 424 and the fourth end 425. The second air outlet 421 can blow along the length of the second silicon wafer b, that is, it can blow towards the water stain c, thereby improving the effect of removing the water stain c.

[0050] The second air knife 42 has multiple second air outlets 421, which are spaced apart along the X direction. By setting multiple second air outlets 421, the air is blown towards the water stain c along the X direction.

[0051] In one alternative implementation, such as Figure 1 , such as 2 and Figure 4 As shown, the first air knife 41 includes a first flow channel and a first through hole 412. The first through hole 412 is opened at the first end 414 and communicates with the first flow channel. The first air outlet is also communicated with the first flow channel. Specifically, the first air knife 41 is tubular, and a first flow channel is formed inside the first air knife 41. The first through hole 412 is opened at the first end 414 of the first air knife 41 and communicates with the first flow channel. The first through hole 412 is used to connect with the air blowing device. The first air outlet is also communicated with the first flow channel. Therefore, the air blowing device sends air into the first flow channel through the first through hole 412 and blows it out through the first air outlet. The air blown out from the first air outlet blows towards the water stains c on the first silicon wafer a to remove the water stains c on the first silicon wafer a.

[0052] In one alternative implementation, such as Figure 1 , such as 2 and Figure 4As shown, the second air knife 42 includes a second flow channel and a second through hole 422. The second through hole 422 is opened at the third end 424 and communicates with the second flow channel. The second air outlet 421 communicates with the second flow channel. Specifically, the second air knife 42 is tubular, and a second flow channel is formed inside the second air knife 42. The third end 424 of the second air knife 42 has a second through hole 422, which communicates with the second flow channel. The second through hole 422 is used to connect with a blower. The second air outlet 421 communicates with the second flow channel. Therefore, the blower sends air into the second flow channel through the second through hole 422 and blows it out through the second air outlet 421. The air blown out from the second air outlet 421 blows towards the water stain c on the second silicon wafer b to drive the water stain c on the second silicon wafer b.

[0053] In one alternative implementation, such as Figure 1 , such as 2 and Figure 4 As shown, the first air knife 41 also includes a third through hole 413, which is opened at the second end 415 and communicates with the first flow channel. The third through hole 413 can serve as a return air inlet, that is, the blowing device sends air into the first flow channel through the first through hole 412, part of which is blown out through the first air outlet and the other part is blown out through the third through hole 413. Alternatively, the third through hole 413 can be used to connect to another blowing device, and the two blowing devices send air into the first flow channel through the first through hole 412 and the third through hole 413 respectively, and blown out through the first air outlet.

[0054] In one alternative implementation, such as Figure 1 , such as 2 and Figure 4 As shown, the second air knife 42 also includes a fourth through hole 423, which is opened at the fourth end 425 and communicates with the second flow channel. The fourth through hole 423 can serve as a return air inlet, that is, the blowing device sends air into the second flow channel through the second through hole 422, part of which is blown out through the second air outlet 421 and the other part is blown out through the fourth through hole 423. Alternatively, the fourth through hole 423 can be used to connect to another blowing device, and the two blowing devices send air into the second flow channel through the second through hole 422 and the fourth through hole 423 respectively, and blown out through the second air outlet 421.

[0055] In one alternative implementation, such as Figure 1 , such as 2 and Figure 4As shown, the first holding component 1 includes a first mounting part 11 and a first suction cup 12. The first suction cup 12 is disposed on the first mounting part 11, and the first air knife 41 is disposed on the first mounting part 11. The first mounting part 11 is disposed on the mounting base 5. Specifically, when the conveying mechanism 100 is used to convey silicon wafers, the first suction cup 12 adsorbs the first silicon wafer a. The adsorption method can reduce the damage to the first silicon wafer a. The first mounting part 11 provides mounting support for the first suction cup 12 and the first air knife 41. The first air knife 41 and the first suction cup 12 are spaced apart along the Y direction so that the first air knife 41 blows air onto the first silicon wafer a adsorbed by the first suction cup 12.

[0056] In one alternative implementation, such as Figure 1 , such as 2 and Figure 4 As shown, the second holding component 2 includes a second mounting portion 21 and a second suction cup 22. The second suction cup 22 is disposed on the second mounting portion 21, and the second air knife 42 is disposed on the second mounting portion 21. The second mounting portion 21 is disposed on the driving end of the driving component 3. Specifically, when the conveying mechanism 100 is used to convey silicon wafers, the second suction cup 22 adsorbs the second silicon wafer b. The adsorption method can reduce damage to the second silicon wafer b. The second mounting portion 21 provides mounting support for the second suction cup 22 and the second air knife 42. The second air knife 42 and the second suction cup 22 are spaced apart along the Y direction so that the second air knife 42 blows air onto the second silicon wafer b adsorbed by the second suction cup 22.

[0057] In one alternative implementation, such as Figure 1 , such as 2 and Figure 4 As shown, the first mounting part 11 includes a first mounting plate 111 and a first connecting plate 112. The first connecting plate 112 includes a first connecting end 1121 and a second connecting end 1122. The first connecting end 1121 is disposed on the first mounting plate 111, and the second connecting end 1122 protrudes from the first mounting plate 111 in the Y direction. The first air knife 41 is disposed on the second connecting end 1122. Specifically, the first suction cup 12 is mounted on the first mounting plate 111, and the first connecting end 1121 of the first connecting plate 112 is disposed on the first mounting plate 111. The second connecting end 1122 extends out of the edge of the first mounting plate 111 in the Y direction. It can be understood that the first connecting plate 112 is inclined and the first air knife 41 is located at the second connecting end 1122 of the first connecting plate 112. Therefore, the first air knife 41 extends out of the edge of the first mounting plate 111. In this embodiment, on the one hand, the position of the first air knife 41 can avoid hitting the first silicon wafer a. On the other hand, the edge of the first silicon wafer a also extends to the edge of the first mounting plate 111. Therefore, the first air knife 41 can correspond to the water stain c position of the first silicon wafer a to accurately remove the water stain c of the first silicon wafer a.

[0058] In one alternative implementation, such as Figure 1 , such as 2 and Figure 4 As shown, the second mounting part 21 includes a second mounting plate 211 and a second connecting plate 212. The second connecting plate 212 includes a third connecting end and a fourth connecting end (not shown in the figure, please refer to the appendix for details). Figure 1 The second mounting plate 211 has a first connecting end 1121 and a second connecting end 1122. The third connecting end is located on the second mounting plate 211, and the fourth connecting end protrudes from the second mounting plate 211 in the Y direction. The second air knife 42 is located on the fourth connecting end. Specifically, the second suction cup 22 is mounted on the second mounting plate 211, the third connecting end of the second connecting plate 212 is located on the second mounting plate 211, and the fourth connecting end of the second connecting plate 212 extends out of the edge of the second mounting plate 211 in the Y direction. It can be understood that the second connecting plate 212 is inclined, and the second air knife 42 is located at the fourth connecting end of the second connecting plate 212. Therefore, the second air knife 42 extends out of the edge of the second mounting plate 211. In this embodiment, on the one hand, the position of the second air knife 42 can avoid hitting the second silicon wafer b. On the other hand, the edge of the second silicon wafer b also extends to the edge of the second mounting plate 211. Therefore, the second air knife 42 can correspond to the water stain c position of the second silicon wafer b to accurately remove the water stain c of the second silicon wafer b.

[0059] In one specific embodiment, the mounting base 5 includes a first end face and a second end face opposite each other in the Z direction, the driving component 3 is disposed on the first end face, the first holding component 1 is disposed on the second end face, and the second holding component 2 is located on the side of the mounting base 5 closer to the second end face.

[0060] like Figure 1 and Figure 2 As shown, the mounting base 5 includes a first end face and a second end face, which are arranged opposite to each other in the Z direction. The first end face faces upward in the Z direction, and the second end face faces downward in the Z direction. The driving component 3 is located on the first end face, which can be understood as the driving component 3 being located above the mounting base 5 in the Z direction. Therefore, the mounting base 5 can provide support for the driving component 3, reducing the installation difficulty of the driving component 3 and improving the structural stability of the handling mechanism 100. The first holding component 1 is located on the second end face of the mounting base 5. Both the first holding component 1 and the second holding component 2 are located below the mounting base 5 in the Z direction, which facilitates the first holding component 1 and the second holding component 2 in holding the first silicon wafer a and the second silicon wafer b. In this embodiment, the structural layout of the driving component 3, the first holding component 1, and the second holding component 2 is reasonable, which makes the structure of the handling mechanism 100 more compact and saves space.

[0061] In one alternative implementation, such as Figure 4 As shown, the driving component 3 includes a driving element 31 and a connecting seat 32. The connecting seat 32 connects the driving end of the driving element 31 and the second holding component 2. Specifically, the driving element 31 can be driven to move along the Y direction. Since the driving component 3 is located on the first end face and the second holding component 2 is located below the mounting base 5, the driving element 31 and the second holding component 2 are connected by the connecting seat 32. When the driving element 31 drives the connecting seat 32 to move along the Y direction, the second holding component 2 will also move along the Y direction. In this embodiment, the transport mechanism 100 has a reasonable structural layout, which makes the structure of the transport mechanism 100 more compact and saves space.

[0062] The drive component 31 can be a linear motor, a pneumatic cylinder, or a hydraulic cylinder.

[0063] In one alternative implementation, such as Figure 4 As shown, the conveying mechanism 100 further includes a guide component 6, which is disposed on the mounting base 5. The second holding component 2 is slidably connected to the guide component 6 along the Y direction. Specifically, the guide component 6 is disposed on the second end face of the mounting base 5 and extends in the Y direction. The second holding component 2 is slidably connected to the guide component 6. This can be understood as the second holding component 2 being able to slide relative to the guide component 6 when moving along the Y direction. The guide component 6 can provide guidance and support for the second holding component 2 to prevent the second holding component 2 from deviating during movement.

[0064] like Figure 3 As shown, according to a first aspect of the embodiments of this application, a conveying device is provided, including a first conveying mechanism 200, a second conveying mechanism 300, and a transport mechanism 100, wherein the first conveying mechanism 200 and the second conveying mechanism 300 are spaced apart along the X direction; and the transport mechanism 100 is located between the first conveying mechanism 200 and the second conveying mechanism 300.

[0065] like Figure 3 As shown, the conveying device includes a first conveying mechanism 200, a second conveying mechanism 300, and a transport mechanism 100; wherein, both the first conveyor and the second conveying mechanism 300 are used to convey a first silicon wafer a and a second silicon wafer b, the first conveying mechanism 200 and the second conveying mechanism 300 are spaced apart along the X direction, and in the X direction, the transport mechanism 100 is located between the first conveying mechanism 200 and the second conveying mechanism 300, the transport mechanism 100 is used to transport the first silicon wafer a and the second silicon wafer b located in the first conveying mechanism 200 to the second conveying mechanism 300; during the transport process, the transport mechanism 100 blows air on the first silicon wafer a and the second silicon wafer b to remove water stains c on the first silicon wafer a and the second silicon wafer b.

[0066] In an optional embodiment, the conveying device further includes a first drive mechanism 400 and a second drive mechanism 500, wherein the first drive mechanism 400 is capable of driving the conveying mechanism 100 to move along the X direction, and the second drive mechanism 500 is capable of driving the conveying mechanism 100 to move along the Z direction.

[0067] like Figure 3 As shown, the first driving mechanism 400 can drive the conveying mechanism 100 to move along the X direction. That is, the first driving mechanism 400 can drive the conveying mechanism 100 to move along the X direction between the first conveying mechanism 200 and the second conveying mechanism 300 to convey the first silicon wafer a and the second silicon wafer b located in the first conveying mechanism 200 to the second conveying mechanism 300. Furthermore, during the process of driving the conveying mechanism 100 to move along the X direction, the first driving mechanism 400 can adjust the position of the first silicon wafer a and the second silicon wafer b in the X direction, which greatly increases the positioning accuracy of the silicon wafers and reduces the impact of positioning accuracy problems on the production efficiency of the equipment.

[0068] The second driving mechanism 500 can drive the transport mechanism 100 to move along the Z direction. This can be understood as follows: when the transport mechanism 100 needs to hold the first silicon wafer a and the second silicon wafer b on the first conveying mechanism 200, the second driving mechanism 500 drives the transport mechanism 100 to move closer to the first conveying mechanism 200 along the Z direction, so that the first holding component 1 and the second holding component 2 can hold the silicon wafers on the first conveying mechanism 200. After the first holding component 1 and the second holding component 2 have completed holding, the second driving mechanism 500 drives the transport mechanism 100 to move away from the first conveying mechanism 200 along the Z direction, to avoid movement in the X direction. The first conveying mechanism 200 is not allowed to collide with the second conveying mechanism 300. When the conveying mechanism 100 needs to place the first silicon wafer a and the second silicon wafer b on the second conveying mechanism 300, the second driving mechanism 500 drives the conveying mechanism 100 to move closer to the second conveying mechanism 300 along the Z direction, so that the first holding component 1 and the second holding component 2 can place the silicon wafers on the second conveying mechanism 300. After the first holding component 1 and the second holding component 2 have placed the wafers, the second driving mechanism 500 drives the conveying mechanism 100 to move away from the second conveying mechanism 300 along the Z direction, so as to avoid colliding with the second conveying mechanism 300 during the movement along the X direction.

[0069] In one specific embodiment, the first driving mechanism 400 is located at the driving end of the second driving mechanism 500, and the conveying mechanism 100 is located at the driving end of the first driving mechanism 400.

[0070] In another specific embodiment, the second drive mechanism 500 is located at the drive end of the first drive mechanism 400, and the conveying mechanism 100 is located at the drive end of the second drive mechanism 500.

[0071] The first drive mechanism 400 includes a linear motor, a pneumatic cylinder, or a hydraulic cylinder; preferably, such as Figure 3 As shown, the first drive mechanism 400 includes a motor 401, a drive wheel 402, a driven wheel 403, and a transmission belt 404. The drive wheel 402 and the driven wheel 403 are spaced apart along the X direction. The transmission belt 404 is sleeved on the drive wheel 402 and the driven wheel 403. The output end of the motor 401 is connected to the drive wheel 402. The second drive mechanism 500 is connected to the transmission belt 404. The motor 401 drives the drive wheel 402 to rotate, thereby driving the transmission belt 404 to move along the X direction, so as to drive the second drive mechanism 500 to move along the X direction. The conveying mechanism 100 is provided at the drive end of the second drive mechanism 500.

[0072] The second drive mechanism 500 includes a linear motor, a pneumatic cylinder, or a hydraulic cylinder.

[0073] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A conveying mechanism, characterized in that, include: Mounting base; A first holding component and a second holding component are arranged at intervals along the Y direction, and the first holding component is disposed on the mounting base; A driving component is disposed on the mounting base, and the driving component is capable of driving the second holding component to move along the Y direction; An air knife assembly, wherein the air knife assembly is disposed on the first holding assembly and / or the second holding assembly.

2. The conveying mechanism according to claim 1, characterized in that, The air knife assembly includes a first air knife and a second air knife. The first air knife is disposed on the side of the first holding assembly near the second holding assembly, and the second air knife is disposed on the side of the second holding assembly near the first holding assembly.

3. The conveying mechanism according to claim 2, characterized in that, The first air knife includes a first end and a second end, which are arranged opposite to each other along the X direction. The first holding assembly is located between the first end and the second end in the X direction. The first air knife has at least one first air outlet, which is located between the first end and the second end; and / or The second air knife includes a third end and a fourth end, which are arranged opposite to each other along the X direction. The second holding assembly is located between the third end and the fourth end in the X direction. The second air knife has at least one second air outlet, which is located between the third end and the fourth end.

4. The conveying mechanism according to claim 3, characterized in that, The first air knife includes a first flow channel and a first through hole, the first through hole being formed at the first end, the first through hole communicating with the first flow channel, and the first air outlet communicating with the first flow channel; and / or The second air knife includes a second flow channel and a second through hole. The second through hole is opened at the third end and is connected to the second flow channel. The second air outlet is connected to the second flow channel.

5. The conveying mechanism according to claim 4, characterized in that, The first air knife further includes a third through hole, which is located at the second end and communicates with the first flow channel; and / or The second air knife also includes a fourth through hole, which is located at the fourth end and communicates with the second flow channel.

6. The conveying mechanism according to claim 2, characterized in that, The first holding component includes a first mounting portion and a first suction cup, wherein the first suction cup is disposed on the first mounting portion, and the first air knife is disposed on the first mounting portion; and / or The second holding component includes a second mounting part and a second suction cup, wherein the second suction cup is disposed in the second mounting part and the second air knife is disposed in the second mounting part.

7. The conveying mechanism according to claim 6, characterized in that, The first mounting portion includes a first mounting plate and a first connecting plate. The first connecting plate includes a first connecting end and a second connecting end. The first connecting end is disposed on the first mounting plate, and the second connecting end protrudes from the first mounting plate in the Y direction. The first air knife is disposed on the second connecting end; and / or The second mounting part includes a second mounting plate and a second connecting plate. The second connecting plate includes a third connecting end and a fourth connecting end. The third connecting end is disposed on the second mounting plate, and the fourth connecting end protrudes from the second mounting plate in the Y direction. The second air knife is disposed on the fourth connecting end.

8. The conveying mechanism according to claim 1, characterized in that, The conveying mechanism further includes a guide component, which is disposed on the mounting base, and the second holding component is slidably connected to the guide component along the Y direction.

9. A conveying device, characterized in that, include: A first conveying mechanism and a second conveying mechanism are arranged at intervals along the X direction; The conveying mechanism as described in any one of claims 1-8, wherein the conveying mechanism is located between the first conveying mechanism and the second conveying mechanism.

10. The conveying device according to claim 9, characterized in that, The conveying device further includes a first driving mechanism and a second driving mechanism. The first driving mechanism can drive the conveying mechanism to move along the X direction, and the second driving mechanism can drive the conveying mechanism to move along the Z direction.

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