Anti-interference processing equipment for IC chip

Abstract

The utility model discloses an IC chip anti -interference processing equipment relates to chip processing technical field, including the processing station, the top of processing station is equipped with a plurality of equidistance distribution's positioning slot, the inside of positioning slot places has the folding frame for bearing IC chip, the back of processing station is fixedly installed with electric guide rail, the point gum mechanism of slidingly being provided on electric guide rail, the point gum mechanism includes the hanger of sliding installation on electric guide rail, the front side of hanger is slidably installed with the lifting frame, the inside fixed mounting of lifting frame is a pair of fixed sleeve, the utility model discloses through setting point gum mechanism, can increase a point gum procedure for the production of IC chip, and the IC chip automatic point gum adds a layer of non - transparent epoxy resin black glue on the IC chip surface and will IC chip completely wrap up, and the anti -light interference performance of receiving head has been improved greatly.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to an IC chip anti-interference processing equipment. Background Technology

[0002] Currently, mass-produced through-hole receivers are available on the market. These products contain PD chips and integrated circuit (IC) chips. Since external light sources significantly affect the IC chip, the receiver's reception function is greatly impacted in the presence of interference. Therefore, improving the receiver's resistance to light interference has become a crucial indicator of its performance. Currently, receivers on the market primarily mitigate light interference by designing a shielding structure on the bracket. This structure is bent using equipment, placing it directly above the IC chip to block external light sources. While this method can address light interference directly above the IC chip to some extent, it is insufficient to effectively shield interference light from around the chip. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides an IC chip anti-interference processing device, which solves the technical problems mentioned in the background section.

[0004] To solve the above technical problems, the present invention provides the following technical solution: an IC chip anti-interference processing equipment, including a processing table, the top of the processing table having a plurality of equally spaced positioning slots, the inside of the positioning slots having a folding frame for supporting IC chips, and an electric guide rail fixedly installed on the back of the processing table, with a dispensing mechanism slidably arranged on the electric guide rail;

[0005] The dispensing mechanism includes a bracket slidably mounted on an electric guide rail. A lifting frame is slidably mounted up and down on the front side of the bracket. A pair of fixed sleeves are fixedly mounted inside the lifting frame. A glue bucket is fixedly mounted between the pair of fixed sleeves. Epoxy resin black glue is added inside the glue bucket. A stirring rod is rotatably mounted inside the glue bucket. A servo motor that acts on the stirring rod is fixedly mounted at the front end of the lifting frame. A drying component is provided on one side of the fixed sleeve.

[0006] Furthermore, the air-drying component includes a rotating shaft rotatably mounted on one side of the fixed sleeve, with a fan blade fixedly mounted at the lower end of the rotating shaft, and a transmission component provided between the upper end of the rotating shaft and the stirring rod.

[0007] Furthermore, the transmission component includes a pulley one fixedly installed on the upper end of the stirring rod and a pulley two fixedly installed on the upper end of the rotating shaft, and a synchronous belt is installed on the outside of both pulley one and pulley two.

[0008] Furthermore, an air pump is fixedly installed on the top of the lifting frame, and a hose is connected to the output end of the air pump. A conduit is connected to one side of the rubber bucket, and the lower end of the hose extends into the conduit. Fasteners are installed between the hose and the conduit.

[0009] Furthermore, a hydraulic cylinder that acts on the lifting frame is fixedly installed on the top of the bracket.

[0010] Furthermore, the distance between the centerline of the glue bucket and the centerline of the fan blade is equal to the distance between the centerlines of the two adjacent positioning grooves.

[0011] By employing the above technical solution, this utility model provides an IC chip anti-interference processing device, which has at least the following beneficial effects:

[0012] 1. This utility model adds a dispensing process to the production of IC chips by setting up a dispensing mechanism. It automates the dispensing of IC chips and adds a layer of opaque epoxy resin black glue to the surface of the IC chip to completely wrap the IC chip, ensuring that the IC chip is not affected by external light sources, thereby greatly improving the anti-light interference performance of the receiver head.

[0013] 2. By setting up a stirring rod and a transmission component, this utility model can drive the fan blade to rotate while the stirring rod rotates. As the glue bucket moves to dispense glue, the fan blade can follow the glue bucket. While the glue bucket dispenses glue to the next folding frame, the fan blade dries the previously dispensed folding frame. In this way, the epoxy resin black glue on the folding frames is dried one by one, which can accelerate the curing of epoxy resin black glue and improve the dispensing efficiency. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0015] Fig. 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Fig. 2 This is a schematic diagram of the dispensing mechanism of this utility model;

[0017] Fig. 3 This is a cross-sectional view of the dispensing mechanism of this utility model.

[0018] In the diagram: 1. Processing table; 2. Positioning slot; 3. Folding frame; 4. Electric guide rail; 5. Dispensing mechanism; 51. Hanger; 52. Lifting frame; 53. Fixing sleeve; 54. Glue bucket; 55. Stirring rod; 56. Air drying component; 561. Rotating shaft; 562. Fan blade; 563. Pulley 1; 564. Pulley 2; 565. Synchronous belt; 57. Servo motor; 58. Air pump; 59. Hose; 510. Conduit; 511. Fastener; 512. Hydraulic cylinder. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Currently, most receivers on the market mitigate the problem of light interference from IC chips by designing a shielding structure on the bracket. This structure is bent by the equipment and placed directly above the IC chip to block external light sources. While this method can solve the problem of light interference directly above the IC chip to some extent, it is difficult to effectively shield the interference light around the chip.

[0021] To resolve the defects in the aforementioned IC chips during the manufacturing process, please refer to [link / reference needed]. Figs. 1-3The present invention provides an IC chip anti-interference processing equipment that can add a layer of opaque epoxy resin black glue to the surface of the IC chip, so that the IC chip is completely wrapped and the IC chip is not affected by external light sources, thereby greatly improving the anti-light interference performance of the receiver head. The processing equipment uses a processing table 1 as its base. Multiple equally spaced positioning slots 2 are provided on the top of the processing table 1. Folding frames 3, used to hold IC chips, are placed inside the positioning slots 2. The dimensions of the positioning slots 2 are adapted to the folding frames 3 to position them. An electric guide rail 4 is fixedly installed on the back of the processing table 1. A dispensing mechanism 5 is slidably mounted on the electric guide rail 4. Driving the electric guide rail 4 causes the dispensing mechanism 5 to slide, allowing it to dispense adhesive onto each of the folding frames 3 in the positioning slots 2. To enable the dispensing operation of the dispensing mechanism 5, it is designed as a hanging bracket 51 slidably mounted on the electric guide rail 4. A lifting frame 52 is slidably mounted up and down on the front side of the hanging bracket 51. A pair of fixing sleeves 53 are fixedly installed inside the lifting frame 52, and a glue tank 54 is fixedly installed between the pair of fixing sleeves 53. Epoxy resin is added inside the glue tank 54. When applying the epoxy resin glue, the electric guide rail 4 drives the hanging bracket 51 to slide directly above the designated positioning slot 2. A hydraulic cylinder 512 that acts on the lifting frame 52 is fixedly installed on the top of the hanging bracket 51. Driving the hydraulic cylinder 512 drives the lifting frame 52 to slide downwards, and the lifting frame 52 drives the glue tank 54 to slide downwards. An air pump 58 is fixedly installed on the top of the lifting frame 52. The output end of the air pump 58 is connected to a hose 59. A conduit 510 is connected to one side of the glue tank 54. The lower end of the hose 59 extends into the conduit 510. Driving the air pump 58 can pump air into the glue tank 54 through the hose 59 and the conduit 510 to increase the air pressure inside the glue tank 54. The epoxy resin glue in the glue tank 54 can be extruded to apply glue to the IC chip on the folding frame 3, wrapping the IC chip and ensuring that the IC chip is not interfered with by external light sources. The glue application process is automated, improving work efficiency.

[0022] To improve the smoothness of dispensing glue from the glue bucket 54, a stirring rod 55 is installed inside the glue bucket 54. A servo motor 57 that acts on the stirring rod 55 is fixedly installed at the front end of the lifting frame 52. When dispensing glue, the servo motor 57 drives the stirring rod 55 to rotate. The rotation of the stirring rod 55 can continuously stir the epoxy resin black glue. Appropriate stirring can reduce the thixotropy of the epoxy resin black glue and make the dispensing process smoother.

[0023] To facilitate the addition of epoxy resin black glue into the glue container 54, a fastener 511 is installed between the hose 59 and the conduit 510. The fastener 511 can separate the hose 59 from the conduit 510, allowing epoxy resin black glue to be added into the glue container 54 through the conduit 510, thus facilitating the replenishment operation.

[0024] Example 2

[0025] After the epoxy resin is applied, it will not cure completely immediately. To increase the curing speed of the epoxy resin, a drying component 56 is provided on one side of the fixed sleeve 53. The drying component 56 includes a rotating shaft 561 rotatably mounted on one side of the fixed sleeve 53. A fan blade 562 is fixedly mounted on the lower end of the rotating shaft 561. A transmission component is provided between the upper end of the rotating shaft 561 and the stirring rod 55. The servo motor 57 drives the stirring rod 55 to rotate, and at the same time, it can drive the fan blade 562 to rotate through the transmission component. The transmission component includes a pulley 563 fixedly mounted on the upper end of the stirring rod 55 and a pulley 56 fixedly mounted on the upper end of the rotating shaft 561. 4. A synchronous belt 565 is installed on the outside of pulley 1 563 and pulley 2 564. The rotation of the stirring rod 55 drives pulley 1 563 to rotate. The rotation of pulley 1 563 drives pulley 2 564 to rotate through the synchronous belt 565. Pulley 2 564 drives the fan blade 562 to rotate. As the glue bucket 54 moves to dispense glue, the fan blade 562 can move with the glue bucket 54. While the glue bucket 54 dispenses glue to the next folding frame 3, the fan blade 562 dries the folding frame 3 that has been dispensed. This can dry the epoxy resin black glue on the folding frame 3 one by one, accelerate the curing of the epoxy resin black glue, and further improve the dispensing efficiency.

[0026] To ensure the drying effect of the fan blade 562, the distance between the center line of the glue bucket 54 and the center line of the fan blade 562 needs to be equal to the distance between the center lines of the two adjacent positioning slots 2. In this way, when the glue bucket 54 is aligned with the folding frame 3 for applying glue, the fan blade 562 can be aligned with the adjacent folding frame 3, ensuring the drying effect of the fan blade 562 on the folding frame 3.

[0027] The control method of this utility model is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art. The power supply is also common knowledge in the field. Since this utility model is mainly used to protect mechanical devices, the control method and circuit connection will not be explained in detail.

[0028] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An IC chip anti-interference processing device, comprising a processing table (1), characterized in that: The top of the processing table (1) is provided with multiple equally spaced positioning slots (2). A folding frame (3) for carrying IC chips is placed inside the positioning slots (2). An electric guide rail (4) is fixedly installed on the back of the processing table (1). A dispensing mechanism (5) is slidably provided on the electric guide rail (4). The dispensing mechanism (5) includes a bracket (51) slidably mounted on an electric guide rail (4). A lifting frame (52) is slidably mounted on the front side of the bracket (51). A pair of fixed sleeves (53) are fixedly mounted inside the lifting frame (52). A glue bucket (54) is fixedly mounted between the pair of fixed sleeves (53). Epoxy resin black glue is added inside the glue bucket (54). A stirring rod (55) is rotatably mounted inside the glue bucket (54). A servo motor (57) acting on the stirring rod (55) is fixedly mounted at the front end of the lifting frame (52). A drying component (56) is provided on one side of the fixed sleeve (53).

2. The IC chip anti-interference processing equipment according to claim 1, characterized in that: The air-drying component (56) includes a rotating shaft (561) rotatably mounted on one side of the fixed sleeve (53), a fan blade (562) is fixedly mounted on the lower end of the rotating shaft (561), and a transmission component is provided between the upper end of the rotating shaft (561) and the stirring rod (55).

3. The IC chip anti-interference processing equipment according to claim 2, characterized in that: The transmission component includes a pulley one (563) fixedly installed on the upper end of the stirring rod (55) and a pulley two (564) fixedly installed on the upper end of the rotating shaft (561). A synchronous belt (565) is installed on the outside of the pulley one (563) and the pulley two (564).

4. The IC chip anti-interference processing equipment according to claim 1, characterized in that: An air pump (58) is fixedly installed on the top of the lifting frame (52). A hose (59) is connected to the output end of the air pump (58). A conduit (510) is connected to one side of the rubber bucket (54). The lower end of the hose (59) extends into the conduit (510), and a fastener (511) is installed between the hose (59) and the conduit (510).

5. The IC chip anti-interference processing equipment according to claim 1, characterized in that: A hydraulic cylinder (512) that acts on the lifting frame (52) is fixedly installed on the top of the bracket (51).

6. The IC chip anti-interference processing equipment according to claim 1, characterized in that: The distance between the centerline of the glue bucket (54) and the centerline of the fan blade (562) is equal to the distance between the centerlines of the two adjacent positioning grooves (2).

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