A pressing device for wafer sorting machine

Abstract

The utility model relates to wafer sorting machine field especially relates to a kind of pressing device for wafer sorting machine. Including pedestal body, pedestal body is along vertical direction and is provided with lifting rod, lifting rod can be relative to pedestal body and is along vertical direction and is lifted movement;The bottom end of lifting rod is connected with pressure head mechanism, the pressure head mechanism is provided with buffer connected with pedestal body, pressure head mechanism forms first interval between pedestal body in normal state, first interval is configured as the buffer space for the deformation of buffer.This application can effectively absorb and buffer the pressure that pressure head exerts on suction nozzle by setting buffer and reserved buffer space, reduce the risk of wafer fragmentation in the process of pressing adsorption due to impact, also protect suction nozzle itself. Still through preset safety stroke and overshoot sensor, once buffer is excessively compressed, the top end of lifting rod will trigger sensor alarm, timely remind operator, avoid equipment core component damage due to overload.

Description

Technical Field

[0001] This utility model relates to the field of wafer sorting machines, and more particularly to a pressing device for wafer sorting machines. Background Technology

[0002] In turret-type equipment, several pressing mechanisms are typically arranged around the turret to press the suction nozzle. Most current pressing mechanisms use voice coil motors, cam mechanisms, or ball screw mechanisms as the Z-axis to press the nozzle. Normally, the pressing head of the mechanism directly contacts the pressure-bearing part of the nozzle. However, if the location where the nozzle picks up material is supported, directly pressing the nozzle with the pressing mechanism may cause excessive pressure on the support surface, damaging the product. Utility Model Content

[0003] The purpose of this invention is to provide a pressing device for a wafer sorting machine to solve the problem that the suction nozzle can easily damage materials and products when driven by the pressing mechanism in the prior art.

[0004] The technical solution of this utility model is: a pressing device for a wafer sorting machine, including a base body, a lifting rod is provided through the base body in a vertical direction, the lifting rod can move up and down relative to the base body in a vertical direction; the bottom end of the lifting rod is connected to a pressing head mechanism, the pressing head mechanism is provided with a buffer connected to the base body, and the pressing head mechanism forms a first gap with the base body under normal conditions, the first gap is constructed as a buffer space for the deformation of the buffer.

[0005] Preferably, the parallel lifting rod is provided with a guide mechanism, the guide mechanism including a guide rod, the guide rod being fixed to one end of the pressure head mechanism near the base body, and the base body having a guide hole corresponding to the guide rod; while the buffer deforms, the guide rod moves up and down synchronously in the guide hole.

[0006] Preferably, an overshoot sensor is provided at the top of the base body corresponding to the lifting rod. Under normal conditions, a second gap is formed between the lifting rod and the overshoot sensor, and the second gap corresponds to the safe stroke of the lifting rod. When the top of the lifting rod moves to the detection end of the overshoot sensor, the overshoot sensor is triggered.

[0007] Preferably, the base body is equipped with a linear bearing that fits into the lifting rod and guide rod. One end of any linear bearing abuts against the stepped surface inside the base body, and the other end is fitted with a clamping screw.

[0008] Preferably, the pressure head mechanism includes a pressure head mounting base, and the ends of the lifting rod and the guide rod away from the base body are both fixed on the pressure head mounting base, and a pressure head is provided at the end of the pressure head mounting base away from the base body.

[0009] Preferably, the pressure head is connected to the pressure head mounting base via a connecting block. The pressure head and the connecting block are made of ferrous and magnetic materials, respectively, and the pressure head can be separated from the connecting block under the action of external radial force.

[0010] Preferably, the buffer is a spring, the buffer is sleeved on the lifting rod, and the two ends of the buffer abut against the base body and the pressure head mounting seat, respectively.

[0011] Compared with the prior art, the advantages of this utility model are:

[0012] (1) By setting up a buffer and reserving a buffer space, this application can effectively absorb and buffer the pressure applied by the pressure head to the nozzle, reducing the risk of the wafer breaking due to impact during the pressing and adsorption process, and also protecting the nozzle itself. In addition, by setting a safe stroke and an overshoot sensor, once the buffer is over-compressed, the top of the lifting rod will trigger a sensor alarm, promptly reminding the operator and avoiding damage to the core components of the equipment due to overload.

[0013] (2) The pressure head and the connecting block are connected by magnetic attraction. When the pressure head is accidentally hit from the side, it can automatically separate from the mounting base, thereby isolating the destructive radial impact force and protecting the internal precision lifting and guiding mechanism from damage. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0015] Figure 1 This is a schematic diagram illustrating the application scenario of the pressing device described in this utility model;

[0016] Figure 2 This is a structural diagram of the pressing device described in this utility model;

[0017] Figure 3 This is a cross-sectional view of the pressing device described in this utility model;

[0018] The components are: 1. Base body, 2. Lifting rod, 3. Pressing head mechanism, 31. Pressing head mounting seat, 32. Pressing head, 33. Connecting block, 4. Buffer, 5. Guide mechanism, 51. Guide rod, 52. Guide hole, 6. Overshoot sensor, 7. Linear bearing, 8. Clamping screw, 100. Pressing device, 200. Lifting screw assembly. Detailed Implementation

[0019] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0020] The present invention will be further described in detail below with reference to specific embodiments:

[0021] like Figure 1 and Figure 2 As shown, a pressing device 100 for a wafer sorting machine is mounted on the wafer sorting machine via a lifting screw assembly 200, and can be raised and lowered under the drive of the lifting screw assembly 200. The pressing device 100 includes a base body 1, and a lifting rod 2 is vertically disposed through the base body 1. The lifting rod 2 can move up and down relative to the base body 1 in the vertical direction. The bottom end of the lifting rod 2 is connected to a pressing head mechanism 3, which is used to connect to an external suction nozzle device and drive it to perform a pressing and suction action.

[0022] In order to buffer the pressure applied to the nozzle device, the pressure head mechanism 3 is provided with a buffer 4 connected to the base body 1. In the normal state (i.e., when the nozzle device is not driven to press), a first gap is formed between the pressure head mechanism 3 and the base body 1. The first gap is constructed as a buffer space for the deformation of the buffer 4, so that the pressure head mechanism 3 can compress the buffer 4 and move towards the base body 1.

[0023] Furthermore, in combination Figure 3 As shown, to ensure smooth operation of the pressure head mechanism 3 during pressing, the parallel lifting rod 2 is equipped with a guide mechanism 5. The guide mechanism 5 includes a guide rod 51, which is fixed to one end of the pressure head mechanism 3 near the base body 1. The base body 1 has a guide hole 52 corresponding to the guide rod 51. When the buffer 4 deforms during the pressing action, the guide rod 51 moves synchronously along the guide hole 52, thereby maintaining the stability of the pressure head mechanism 3.

[0024] As the buffer 4 is compressed, the top of the lifting rod 2 moves upward, passing through the base body 1. This application includes an overshoot sensor 6 at the top of the base body 1 corresponding to the lifting rod 2 to detect the movement stroke of the top of the lifting rod 2. Under normal conditions, a second gap is formed between the overshoot sensor 6 and the top of the lifting rod 2, corresponding to the safe travel stroke of the lifting rod 2. When the compression of the buffer 4 exceeds a preset value, the top of the lifting rod 2 will move to the detection end of the overshoot sensor 6, triggering an alarm.

[0025] Specifically, a linear bearing 7 is installed inside the base body 1 to cooperate with the lifting rod 2 and the guide rod 51, in order to reduce the running resistance of the lifting rod 2 and the guide rod 51. One end of the linear bearing 7 abuts against the stepped surface of the inner hole of the base body 1, and the other end is fitted with a clamping screw 8. The clamping screw 8 is tightened on the base body 1, and part of its nut presses the other end of the linear bearing 7, thereby fixing the linear bearing 7 to the base body 1.

[0026] The pressure head mechanism 3 includes a pressure head mounting base 31. The lifting rod 2 and the guide rod 51 are both fixed to the pressure head mounting base 31 at their ends away from the base body 1. A pressure head 32 is provided at the end of the pressure head mounting base 31 away from the base body 1. In this embodiment, the pressure head 32 is connected to the pressure head mounting base 31 through a connecting block 33. The pressure head 32 and the connecting block 33 are made of ferrous and magnetic materials, respectively, so that the pressure head 32 and the connecting block 33 are fixed by magnetic adsorption. The pressure head 32 can be separated from the connecting block under the action of external radial force such as impact, thereby playing a protective role.

[0027] In this application, the buffer 4 is a spring, the buffer 4 is sleeved on the lifting rod 2, and the two ends of the buffer 4 abut against the base body 1 and the pressure head mounting seat 31 respectively.

[0028] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and therefore, all changes falling within the meaning and scope of the equivalents of the claims are intended to be included within this utility model.

Claims

1. A pressing device for a wafer sorting machine, characterized in that, The system includes a base body (1), a lifting rod (2) is provided through the base body (1) in the vertical direction, the lifting rod (2) can move up and down relative to the base body (1) in the vertical direction; the bottom end of the lifting rod (2) is connected to a pressure head mechanism (3), the pressure head mechanism (3) is provided with a buffer (4) connected to the base body (1), the pressure head mechanism (3) forms a first gap with the base body (1) under normal conditions, the first gap is constructed as a buffer space for the deformation of the buffer (4).

2. The pressing device for a wafer sorting machine according to claim 1, characterized in that, The parallel lifting rod (2) is provided with a guide mechanism (5), which includes a guide rod (51). The guide rod (51) is fixed to one end of the pressure head mechanism (3) near the base body (1). The base body (1) has a guide hole (52) corresponding to the guide rod (51). While the buffer (4) deforms, the guide rod (51) moves up and down synchronously in the guide hole (52).

3. A pressing device for a wafer sorting machine according to claim 2, characterized in that, The base body (1) is provided with an overshoot sensor (6) at the top of the lifting rod (2). Under normal conditions, the lifting rod (2) forms a second gap with the overshoot sensor (6), and the second gap corresponds to the safe stroke of the lifting rod (2). When the top of the lifting rod (2) runs to the detection end of the overshoot sensor (6), the overshoot sensor (6) is triggered.

4. A pressing device for a wafer sorting machine according to claim 2, characterized in that, The base body (1) is equipped with a linear bearing (7) in conjunction with the lifting rod (2) and the guide rod (51). One end of any linear bearing (7) abuts against the step surface inside the base body (1), and the other end is equipped with a clamping screw (8).

5. A pressing device for a wafer sorting machine according to claim 2, characterized in that, The pressure head mechanism (3) includes a pressure head mounting base (31). The ends of the lifting rod (2) and the guide rod (51) away from the base body (1) are both fixed on the pressure head mounting base (31). A pressure head (32) is provided at the end of the pressure head mounting base (31) away from the base body (1).

6. A pressing device for a wafer sorting machine according to claim 5, characterized in that, The pressure head (32) is connected to the pressure head mounting base (31) via a connecting block (33). The pressure head (32) and the connecting block (33) are made of ferrous and magnetic materials, respectively. The pressure head (32) can be separated from the connecting block (33) under the action of external radial force.

7. A pressing device for a wafer sorting machine according to claim 5, characterized in that, The buffer (4) is made of spring and is sleeved on the lifting rod (2). The two ends of the buffer (4) abut against the base body (1) and the pressure head mounting seat (31) respectively.

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