Composite metal-based copper clad plate

Abstract

The utility model provides a kind of composite metal base copper clad plate, comprising: composite copper foil, carbon nanotube heat conduction layer and aluminum-iron composite board are sequentially arranged from top to bottom;The composite copper foil is the composite structure of carrier film and copper foil, the carrier film and the carbon nanotube heat conduction layer are opposite;The aluminum-iron composite board is composed of aluminum plate and iron plate, and the aluminum plate and the carbon nanotube heat conduction layer are opposite.The utility model uses carrier film and copper foil composite copper foil as conductive layer, which can provide high voltage electrical insulation performance guarantee, metal reinforcing material uses aluminum-iron composite board, which can improve the processing delamination problem of traditional iron base copper clad plate, improve the bonding strength of heat insulation layer, and the hardness of composite board structure is lower than that of traditional iron base copper clad plate, which improves the machinability of plate material, and the weight is lighter, the carbon nanotube heat conduction layer between composite copper foil and aluminum-iron composite board can improve the heat conduction performance of system.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board technology, specifically relating to a composite metal-based copper-clad laminate. Background Technology

[0002] Iron-based copper clad laminates possess excellent thermal conductivity, heat resistance, and magnetic permeability, making them widely used in the manufacture of high-power, high-current, high-density, and high-power circuit boards, as well as circuit boards requiring magnetic permeable circuits, such as those for brushless DC micromotors. Traditional iron-based copper clad laminates have high hardness, making them more difficult to manufacture than aluminum-based or copper-based copper clad laminates, and thus more challenging to mass-produce. This is because, firstly, iron materials are prone to moisture absorption and oxidation during processing, leading to poor adhesion between the iron material and the thermally conductive insulating layer, resulting in reduced heat resistance and delamination. Secondly, the untreated surface of iron materials is easily scratched and abraded during production and use, affecting product quality. Furthermore, the high hardness and stress of iron materials also contribute to delamination during the manufacturing process. Utility Model Content

[0003] The purpose of this invention is to provide a composite metal-based copper-clad laminate with strong bonding and resistance to delamination.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A composite metal-based copper-clad laminate includes: a composite copper foil, a carbon nanotube thermally conductive layer, and an aluminum-iron composite plate arranged sequentially from top to bottom; the composite copper foil is a composite structure of a carrier film and a copper foil, with the carrier film and the carbon nanotube thermally conductive layer facing each other; the aluminum-iron composite plate is composed of an aluminum plate and an iron plate, with the aluminum plate and the carbon nanotube thermally conductive layer facing each other.

[0006] In some embodiments, the thickness of the carrier film is 5 to 50 μm; and / or, the thickness of the copper foil is 5 to 70 μm.

[0007] In some embodiments, the carbon nanotube thermally conductive layer includes a semi-cured thermally conductive adhesive insulating layer and a carbon nanotube adhesive layer disposed on the surface of the thermally conductive adhesive insulating layer, wherein the carbon nanotube adhesive layer is opposite to the carrier film, and the thermally conductive adhesive insulating layer is opposite to the aluminum plate.

[0008] In some embodiments, the thickness of the thermally conductive adhesive insulating layer is 10–50 μm.

[0009] In some embodiments, the aluminum-iron composite plate is composed of an iron plate and an aluminum plate, and the thickness of the aluminum-iron composite plate is 0.4 to 3.0 mm.

[0010] In some embodiments, the thickness of the aluminum plate is greater than the thickness of the iron plate.

[0011] In some embodiments, the thickness of the aluminum plate is 0.1 to 2.8 mm.

[0012] In some embodiments, the thickness of the iron plate is 0.2 to 2.9 mm.

[0013] In some embodiments, an insulating layer is provided between the carbon nanotube thermally conductive layer and the aluminum-iron composite plate.

[0014] In some embodiments, the insulating layer is an adhesive film insulating layer or a prepreg insulating layer.

[0015] As can be seen from the above technical solution, this utility model uses a composite copper foil made of a carrier film and copper foil as the conductive layer. The carrier film can provide high voltage resistance and electrical insulation performance. The metal reinforcement material is an aluminum-iron composite plate, with the aluminum plate in the aluminum-iron composite plate as the bonding surface, giving the plate good processability like aluminum. This can improve the delamination problem of traditional iron-based copper clad laminates, improve the bonding strength with the thermally conductive and insulating layer, and the hardness of the composite plate structure is lower than that of traditional iron-based copper clad laminates, improving the processability of the plate and making it lighter. The carbon nanotube thermal conductive layer between the composite copper foil and the aluminum-iron composite plate can improve the thermal conductivity of the system. Attached Figure Description

[0016] To more clearly illustrate the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the composite metal-based copper-clad laminate of Embodiment 1 of this utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the composite metal-based copper-clad laminate of Embodiment 2 of this utility model.

[0019] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. Detailed Implementation

[0020] The present invention will now be described in detail with reference to the accompanying drawings. In the detailed description of the embodiments of the present invention, for ease of explanation, the drawings illustrating the device structure will be partially enlarged without adhering to the general scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. It should be noted that the drawings are in a simplified form and use non-precise scales, solely for the purpose of conveniently and clearly illustrating the embodiments of the present invention. Additionally, in the description of this application, terms such as "first" and "second" are used only to distinguish descriptions and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Terms such as "positive," "negative," "bottom," "upper," "lower," "front," "rear," "left," and "right" indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can also refer to the internal connection of two components; and they can refer to a wireless connection or a wired connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] like Figure 1 As shown, the composite metal-based copper-clad laminate of this embodiment includes, from top to bottom, a composite copper foil 1, a carbon nanotube thermally conductive layer 2, an insulating layer 3, and an aluminum-iron composite plate 4. The composite copper foil 1 is a composite structure comprising a carrier film and a copper foil, which are bonded together physically or chemically. One side of the composite copper foil 1 is a film, and the other side is a copper foil. The aluminum-iron composite plate 4 is composed of an aluminum plate and an iron plate. The film side of the composite copper foil 1 faces the carbon nanotube thermally conductive layer 2, and the aluminum plate and the insulating layer 3 in the aluminum-iron composite plate 4 face each other.

[0023] The composite copper foil 1 of this invention includes a carrier film. This carrier film possesses excellent continuity and flexibility; even with significant stress release from the ferrous material, the insulating carrier film will not tear, ensuring the insulation reliability of the copper-clad laminate. The carrier film can be a polybutylene terephthalate (PBT) film, a polyethylene naphthalate (PEN) film, a polyethylene terephthalate (PET) film, or a polyimide (PI) film. The thickness of the carrier film in the composite copper foil 1 can be 5–50 μm, and the thickness of the copper foil can be 5–70 μm.

[0024] In some embodiments, when fabricating the composite film 1, the carrier film can first undergo surface roughening treatment, followed by surface activation treatment. The purpose of surface roughening treatment is to improve the wettability and specific surface area of ​​the carrier film surface, thereby enhancing its surface adhesion from a physical perspective and improving the heat resistance of the copper-clad laminate. Surface roughening treatment processes include: corona treatment, chemical etching, and plasma treatment. The treated carrier film is required to have a surface tension ≥38 dynes and a surface roughness Ra=0.08~0.16.

[0025] The purpose of surface activation treatment is to increase the surface energy of the carrier film, enhance its wettability and adhesion, thereby improving the heat resistance of the copper clad laminate. In some embodiments, surface activation treatment involves coating a silane coupling agent onto the surface of the carrier film, causing a chemical reaction that forms a new surface layer that can increase the surface energy of the carrier film. The siloxane coupling agent can be a commercially available conventional coupling agent such as vinylsilane, aminosilane, epoxysilane, mercaptosilane, and methacryloxysilane.

[0026] The carbon nanotube thermally conductive layer 2 comprises a thermally conductive adhesive insulating layer and a carbon nanotube adhesive layer. The thermally conductive adhesive insulating layer is formed from a thermally conductive adhesive liquid. A layer of adhesive containing single-arm carbon nanotubes is sprayed onto the surface of the thermally conductive adhesive liquid, and then baked at 155°C for 3–15 minutes to retain a certain degree of fluidity, forming a semi-cured carbon nanotube thermally conductive layer 2. The thickness of the semi-cured thermally conductive adhesive insulating layer is 10–50 μm.

[0027] In some embodiments, an insulating layer 3 is further provided between the carbon nanotube thermal conductive layer 2 and the aluminum-iron composite plate 4. The insulating layer 3 can be an adhesive film insulating layer or a prepreg insulating layer.

[0028] The aluminum-iron composite plate 4 of this invention is a composite structure made of aluminum and iron plates. This invention uses the aluminum-iron composite plate 4 instead of the traditional iron plate as the thermally conductive reinforcing material for copper-clad laminates. The aluminum plate in the aluminum-iron composite plate 2 has low density, good plasticity, and strong adhesion, while the iron plate in the aluminum-iron composite plate 4 has good magnetic permeability and low cost. The combination of these two materials, replacing the traditional iron plate, improves the heat resistance and bonding strength of the plate, while also being lightweight, low-cost, and highly processable. Furthermore, the aluminum-iron composite plate has lower hardness than the iron plate, thus improving the processability of the copper-clad laminate, and offering the advantages of low cost and light weight. The aluminum surface of the aluminum-iron composite plate 4 serves as the bonding surface, improving bonding strength and mitigating the delamination problem encountered in the processing of traditional iron-based copper-clad laminates.

[0029] The thickness of the aluminum-iron composite plate 4 can be 0.4–3.0 mm. The thickness of the aluminum plate can be 0.1–2.8 mm, and the thickness of the iron plate can be 0.2–2.9 mm. To prepare the aluminum-iron composite plate 4, the surface of the aluminum plate is immersed in a 10% NaOH solution, then cleaned with water and dried. The surface of the iron plate is immersed in a 10% HCl solution, then cleaned with water and dried. The aluminum plate and iron plate are then bonded together by cold rolling, hot rolling, explosive rolling, or explosive bonding to form the aluminum-iron composite plate.

[0030] The thicknesses of the aluminum plate and the iron plate can be set in any ratio. In some embodiments, it is preferable to set the thickness of the aluminum plate to be greater than that of the iron plate. Iron has better magnetic permeability than aluminum, which can meet the requirements of magnetic permeability, improve the machinability of the copper-clad laminate, and make it lightweight.

[0031] The composite metal-based copper clad laminate is made by pressing composite copper foil 1, carbon nanotube thermal conductive layer 2 and aluminum-iron composite plate 4 under high temperature and high pressure of 175℃ / 1 hour.

[0032] The present invention will be further described below through specific embodiments. Unless otherwise specified, the reagents, materials and instruments used in the following description are all conventional reagents, materials and instruments, which are commercially available, and the reagents involved can also be synthesized by conventional synthesis methods.

[0033] Example 1

[0034] like Figure 1 As shown, the composite metal-based copper-clad laminate of this embodiment includes a composite copper foil 1, a carbon nanotube thermally conductive layer 2, and an aluminum-iron composite plate 4 arranged sequentially from top to bottom. The carbon nanotube adhesive layer of the carbon nanotube thermally conductive layer 2 faces the carrier film surface of the composite copper foil 1, and the thermally conductive adhesive insulating layer of the carbon nanotube thermally conductive layer 2 faces the aluminum plate in the aluminum-iron composite plate 4. The carbon nanotube adhesive layer in the carbon nanotube thermally conductive layer 2 can achieve good thermal conductivity, and the thermally conductive adhesive insulating layer can ensure good insulation performance.

[0035] In this embodiment, the carrier film of the composite copper foil 1 is a PI film, and the surface of the PI film is roughened using a plasma treatment process. The specific treatment process is as follows: the PI film is subjected to high-voltage (10KV~20KV) and high-frequency (10~25KHz) spark discharge impact, which changes the surface of the PI film from non-polar to polar. At the same time, the high-voltage and high-frequency spark discharge roughens the surface of the PI film material according to the impact. Since the plasma treatment is carried out in air, the gas in the air becomes a weak electrolyte, forming various polar functional groups; the double chains on the carbon bonds of the polyene molecules in the PI film open, and at the moment of discharge, various polar functional groups undergo grafting reactions with the polymer surface, thereby changing the surface of the PI film from non-polar to polar, and further increasing the surface free energy. When the plasma-treated PI film is observed under a high magnification transmission electron microscope, small tubular grooves and unevenness can be seen on the surface of the PI film.

[0036] The treated PI film is composited into a double-sided film. Then, a 15-85nm conductive copper substrate is fabricated on the surface using magnetron sputtering. Finally, the conductive copper substrate is thickened to the required thickness using aqueous electroplating. The stacked carrier PI film is then separated to obtain a composite copper foil with a carrier PI film on one side and a copper foil on the other side.

[0037] Example 2

[0038] like Figure 2 As shown, the difference between this embodiment and Embodiment 1 is that the composite metal-based copper-clad laminate in this embodiment includes, from top to bottom, a composite copper foil 1, a carbon nanotube thermally conductive layer 2, an insulating layer 3, and an aluminum-iron composite plate 4. The insulating layer 3 is an adhesive film insulating layer. The carbon nanotube adhesive layer of the carbon nanotube thermally conductive layer 2 faces the carrier film surface of the composite copper foil 1; the thermally conductive adhesive insulating layer of the carbon nanotube thermally conductive layer 2 faces the insulating layer 3; and the aluminum plate in the aluminum-iron composite plate 4 also faces the insulating layer 3.

[0039] The carbon nanotube thermal conductive layer 2 has excellent thermal conductivity in the latitudinal direction, but its electrical insulation performance is relatively poor. In this embodiment, an insulating layer is added to improve the high voltage breakdown resistance of the plate and the electrical insulation performance of the system.

[0040] The insulating film is formed by drying the resin liquid at high temperature to a semi-cured state. The resin liquid is a commonly used resin liquid with a thermal conductivity of 1.5w in the copper clad laminate manufacturing process. Its components include: epoxy resin, curing agent, toughening agent, thermally conductive powder and solvent.

[0041] Example 3

[0042] The difference between this embodiment and Embodiment 2 is that the insulating layer in this embodiment is a prepreg insulating layer. The electrical insulation performance of the prepreg insulating layer is superior to that of the adhesive film insulating layer, and it further improves the high-voltage breakdown resistance of the board. The prepreg insulating layer is the type of prepreg commonly used in the copper-clad laminate manufacturing process.

[0043] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A composite metal-based copper-clad laminate, characterized in that, include: The composite copper foil, carbon nanotube thermal conductive layer, and aluminum-iron composite plate are arranged from top to bottom; The composite copper foil is a composite structure of a carrier film and a copper foil, with the carrier film and the carbon nanotube thermally conductive layer facing each other. The aluminum-iron composite plate is composed of an aluminum plate and an iron plate, with the aluminum plate and the carbon nanotube thermal conductive layer facing each other.

2. The composite metal-based copper-clad laminate as described in claim 1, characterized in that: The thickness of the carrier film is 5–50 μm; And / or, the thickness of the copper foil is 5 to 70 μm.

3. The composite metal-based copper-clad laminate as described in claim 1, characterized in that: The carbon nanotube thermally conductive layer includes a semi-cured thermally conductive adhesive insulating layer and a carbon nanotube adhesive layer disposed on the surface of the thermally conductive adhesive insulating layer. The carbon nanotube adhesive layer is opposite to the carrier film, and the thermally conductive adhesive insulating layer is opposite to the aluminum plate.

4. The composite metal-based copper-clad laminate as described in claim 3, characterized in that: The thickness of the thermally conductive adhesive insulating layer is 10–50 μm.

5. The composite metal-based copper-clad laminate as described in claim 1, characterized in that: The aluminum-iron composite plate is made of iron plate and aluminum plate, and the thickness of the aluminum-iron composite plate is 0.4 to 3.0 mm.

6. The composite metal-based copper-clad laminate as described in claim 5, characterized in that: The thickness of the aluminum plate is greater than the thickness of the iron plate.

7. The composite metal-based copper-clad laminate as described in claim 5, characterized in that: The thickness of the aluminum plate is 0.1 to 2.8 mm.

8. The composite metal-based copper-clad laminate as described in claim 5, characterized in that: The thickness of the iron plate is 0.2 to 2.9 mm.

9. The composite metal-based copper-clad laminate as described in claim 1, characterized in that: An insulating layer is provided between the carbon nanotube thermally conductive layer and the aluminum-iron composite plate.

10. The composite metal-based copper-clad laminate as described in claim 9, characterized in that: The insulating layer is an adhesive film insulating layer or a semi-cured sheet insulating layer.

Images