A loudspeaker diaphragm
By using a vacuum electroplating process to form conductive circuits on the speaker diaphragm and bonding them to the solder pad frame, the problems of large solder pad frame size and wear of conductive coating are solved, achieving the effects of speaker miniaturization and extended service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 东莞市真思电子有限公司
- Filing Date
- 2025-06-18
- Publication Date
- 2026-06-23
AI Technical Summary
Traditional speaker diaphragms have large pad frames, which makes it impossible to miniaturize sound-producing electronic products. Furthermore, the conductive coating is prone to wear during long-term vibration, affecting its service life.
Conductive circuits are formed on the diaphragm using a vacuum electroplating process, and the pad frame is bonded to the diaphragm as a whole. The pad frame consists of a frame body, a support frame, and a connecting part. The conductive circuits are set on a metal layer and a protective layer is added. A PEEK composite layer and an adhesive layer are used to enhance the structural stability.
It achieves miniaturized speaker diaphragm design, makes conductive circuits less prone to wear and tear, extends service life, and meets the miniaturization requirements of sound-producing electronic products.
Smart Images
Figure CN224401659U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of loudspeaker technology, specifically to a loudspeaker diaphragm. Background Technology
[0002] The diaphragm is a crucial component of a loudspeaker's vibration system and a vital part for electroacoustic conversion. Traditional loudspeaker diaphragms are mounted on a solder pad frame, typically made of plastic. The diaphragm vibrates by bonding a coil to it and utilizing the conductive pads for conduction. However, this connection method is prone to failure because the diaphragm floats up and down during vibration. The conductive wires connecting the coil to the solder pads (the coil's input and output wires) are easily broken due to vibration, affecting the loudspeaker's lifespan. To address this, a conductive layer has been designed on the diaphragm, connecting to the loudspeaker coil via solder joints on the solder pad frame to achieve sound production. For example, utility model patent application CN202020645709.8 uses this structure. However, this design still has the following drawbacks: 1. The solder pad frame is bulky, failing to meet the miniaturization needs of electronic products; 2. The conductive coating wears down during long-term vibration, leading to a short product lifespan. To address these issues, the inventor of this utility model has improved the structure of the loudspeaker diaphragm. Utility Model Content
[0003] The purpose of this utility model is to provide a loudspeaker diaphragm that has the advantages of simple structure, reasonable design, small size, meeting the development needs of miniaturization of sound-producing electronic products, and long service life without wear on the conductive circuit during long-term vibration of the diaphragm. This solves the problems mentioned in the above technical background.
[0004] To achieve the above objectives, this utility model provides the following technical solution: a loudspeaker diaphragm, comprising a pad frame, a diaphragm, and a conductive circuit. The pad frame consists of a frame body, a support frame, and connecting parts. Multiple connecting parts are provided, spaced apart between the frame body and the support frame. One end of each connecting part is connected to the frame body, and the other end is connected to the support frame. The conductive circuit is formed on the diaphragm using a vacuum electroplating process. The diaphragm is bonded to the pad frame as a single unit. The diaphragm includes a first composite layer, a second composite layer, a third composite layer, and a metal layer. The second composite layer is located between the first and third composite layers, and a first adhesive layer is provided between the second and first composite layers and between the second and third composite layers. A second adhesive layer is applied to the end face of the third composite layer away from the second composite layer. The metal layer is formed on the second adhesive layer using a room-temperature vacuum plating process. The conductive circuit is formed on the metal layer, and a protective layer is provided on the conductive circuit.
[0005] Preferably, the frame body, support frame and connecting parts are integrally formed by stamping process.
[0006] Preferably, the thickness of the frame body and the support frame is the same, both between 0.01mm and 3mm.
[0007] Preferably, the cross-section of the connecting portion is U-shaped, and the connecting portion is electrically connected to the conductive circuit, forming a conductive connection area in the connecting portion.
[0008] Preferably, the pad frame is made of a conductive material.
[0009] Preferably, the thickness values of the first composite layer, the second composite layer and the third composite layer are all between 3 and 12 μm, and the first composite layer, the second composite layer and the third composite layer are all made of PEEK material.
[0010] Preferably, the metal layer is gold, silver, copper, or aluminum.
[0011] Preferably, the thickness of the first adhesive layer and the second adhesive layer is 5-10 μm, and the first adhesive layer and the second adhesive layer are acoustic damping adhesive or acrylic adhesive.
[0012] Preferably, the conductive circuit is a flexible circuit with a thickness between 0.05 mm and 1 mm.
[0013] Preferably, the protective layer is silver oxide.
[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0015] 1. This utility model provides a loudspeaker diaphragm, which includes a pad frame, a diaphragm, and a conductive circuit. The pad frame consists of a frame body, a support frame, and a connecting part, with a simple overall structure and reasonable design. The conductive circuit is formed on the diaphragm using a vacuum electroplating process, and the diaphragm is bonded to the pad frame as a whole. In this way, the diaphragm drives the pad frame to vibrate together during vibration. The thickness of the frame body and the support frame is between 0.01mm and 3mm, which allows the loudspeaker diaphragm to be very thin and small, facilitating the miniaturization of sound-producing electronic products. In addition, the conductive circuit is designed by first forming a metal layer on the diaphragm using a vacuum electroplating process, and then forming the conductive circuit on the metal layer, while simultaneously washing away excess conductive layer. Compared with traditional conductive coatings, the conductive circuit designed in this way will not wear during use and has a longer service life, making it worthy of widespread promotion and application. Attached Figure Description
[0016] Figure 1 This is an overall structural diagram of the present invention;
[0017] Figure 2 This is a structural diagram of the pad frame of this utility model;
[0018] Figure 3 This is a structural diagram of the diaphragm of this utility model;
[0019] Figure 4 This is a partial cross-sectional view of the diaphragm of this utility model.
[0020] The reference numerals and names in the figure are as follows:
[0021] 1. Pad frame; 11. Frame body; 12. Support frame; 13. Connecting part; 14. Hole; 2. Diaphragm; 21. First composite layer; 22. Second composite layer; 23. Third composite layer; 24. Metal layer; 25. First adhesive layer; 26. Second adhesive layer; 27. Protective layer; 3. Conductive circuit. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] In the description of the embodiments of this utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the embodiments of this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this utility model, "multiple" means two or more, unless otherwise explicitly specified.
[0024] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.
[0025] Please see Figures 1 to 3 This utility model provides an embodiment of a loudspeaker diaphragm, which includes a pad frame 1, a diaphragm 2, and a conductive circuit 3. The overall structure is simple and reasonably designed. The pad frame 1 is made of conductive material, and the conductive circuit 3 is a flexible circuit with a thickness between 0.05mm and 1mm. The conductive circuit 3 is formed on the diaphragm 2 using a vacuum electroplating process. The diaphragm 2 and the pad frame 1 are bonded together. Compared with traditional conductive coatings, the conductive circuit 3 has a longer service life.
[0026] Specifically, the pad frame 1 is composed of a frame body 11, a support frame 12, and a connecting part 13. The support frame 12 is located inside the frame body 11. Multiple connecting parts 13 are provided, and the multiple connecting parts 13 are spaced apart between the frame body 11 and the support frame 12. One end of each connecting part 13 is connected to the frame body 11, and the other end is connected to the support frame 12. A hollow hole 14 is formed between the frame body 11 and the support frame 12. The frame body 11, the support frame 12, and the connecting parts 13 are integrally formed by stamping. The thickness of the frame body 11 and the support frame 12 is the same, both between 0.01mm and 3mm. In this way, the pad frame 1 has a smaller volume, which is conducive to the development of miniaturization of electronic products.
[0027] Specifically, the cross-section of the connecting part 13 is U-shaped, and the connecting part 13 is electrically connected to the conductive circuit 3, forming a conductive connection area in the connecting part 13. The speaker coil (not shown in the figure) is in contact with the conductive connection area to achieve conduction.
[0028] Please see Figure 4The diaphragm 2 in the figure includes a first composite layer 21, a second composite layer 22, a third composite layer 23, and a metal layer 24. The second composite layer 22 is located between the first composite layer 21 and the third composite layer 23. A first adhesive layer 25 is respectively disposed between the second composite layer 22 and the first composite layer 21 and between the second composite layer 22 and the third composite layer 23. A second adhesive layer 26 is coated on the end face of the third composite layer 23 away from the second composite layer 22. The metal layer 24 is formed on the second adhesive layer 26 by a room temperature vacuum plating process, and the metal layer 24 is gold, silver, copper, or aluminum.
[0029] Specifically, the thicknesses of the first composite layer 21, the second composite layer 22, and the third composite layer 23 are all between 3 and 12 μm, and all three are made of PEEK material.
[0030] Specifically, the thickness of the first adhesive layer 25 and the second adhesive layer 26 is 5-10 μm, and the first adhesive layer 25 and the second adhesive layer 26 are acoustic damping adhesives or acrylic adhesives.
[0031] More specifically, the conductive circuit 3 is formed on the metal layer 24. In order to protect the conductive circuit 3, a protective layer 27 is provided on the outside of the conductive circuit 3. The protective layer 27 is silver oxide.
[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A loudspeaker diaphragm, characterized in that: The device includes a pad frame (1), a diaphragm (2), and a conductive circuit (3). The pad frame (1) is composed of a frame body (11), a support frame (12), and connecting parts (13). Multiple connecting parts (13) are provided, and the multiple connecting parts (13) are spaced apart between the frame body (11) and the support frame (12). One end of each connecting part (13) is connected to the frame body (11), and the other end is connected to the support frame (12). The conductive circuit (3) is formed on the diaphragm (2) by vacuum electroplating. The diaphragm (2) is bonded to the pad frame (1) as a whole. The diaphragm (2) includes a first composite layer (21) and a second composite layer (22). The third composite layer (23) and the metal layer (24) are provided, wherein the second composite layer (22) is located between the first composite layer (21) and the third composite layer (23), and a first adhesive layer (25) is provided between the second composite layer (22) and the first composite layer (21) and between the second composite layer (22) and the third composite layer (23). The end face of the third composite layer (23) away from the second composite layer (22) is coated with a second adhesive layer (26). The metal layer (24) is formed on the second adhesive layer (26) by a room temperature vacuum plating process. The conductive circuit (3) is formed on the metal layer (24), and a protective layer (27) is provided on the conductive circuit (3).
2. A loudspeaker diaphragm according to claim 1, characterized in that: The main frame (11), support frame (12) and connecting part (13) are integrally formed by stamping process.
3. A loudspeaker diaphragm according to claim 2, characterized in that: The thickness of the frame body (11) and the support frame (12) is the same, both between 0.01mm and 3mm.
4. A loudspeaker diaphragm according to claim 1, characterized in that: The cross-section of the connecting part (13) is U-shaped, and the connecting part (13) is electrically connected to the conductive circuit (3), and a conductive connection area is formed in the connecting part (13).
5. A loudspeaker diaphragm according to claim 1, characterized in that: The pad frame (1) is made of conductive material.
6. A loudspeaker diaphragm according to claim 1, characterized in that: The thickness values of the first composite layer (21), the second composite layer (22) and the third composite layer (23) are all between 3 and 12 μm, and the first composite layer (21), the second composite layer (22) and the third composite layer (23) are all PEEK materials.
7. A loudspeaker diaphragm according to claim 1, characterized in that: The metal layer (23) is gold, silver, copper, or aluminum.
8. A loudspeaker diaphragm according to claim 1, characterized in that: The thickness of the first adhesive layer (25) and the second adhesive layer (26) is 5-10 μm, and the first adhesive layer (25) and the second adhesive layer (26) are acoustic damping adhesive or acrylic adhesive.
9. A loudspeaker diaphragm according to claim 1, characterized in that: The conductive circuit (3) is a flexible circuit with a thickness between 0.05 mm and 1 mm.
10. A loudspeaker diaphragm according to claim 1, characterized in that: The protective layer (27) is silver oxide.