Heat dissipation structure of a computer system
By using the helical gear mechanism of the assembly cover and assembly seat bolt connection and disassembly device, the computer system heat dissipation device can be conveniently disassembled and positioned, solving the problems of short fan life and inconvenient disassembly, and improving the maintenance efficiency and reliability of heat dissipation equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING ZHONGSHANG SHANGHE TECHNOLOGY CO LTD
- Filing Date
- 2025-06-12
- Publication Date
- 2026-06-26
AI Technical Summary
Existing computer system cooling methods suffer from problems such as short fan lifespan, poor reliability, and inconvenient disassembly and maintenance of the cooling structure.
The heat dissipation structure adopts a bolt connection between the assembly cover and the assembly base. Combined with the sliding plate and helical gear mechanism of the disassembly and assembly device, it realizes convenient disassembly and positioning of the heat dissipation device and the main body of the chassis. The micro motor drives the rotating column to drive the helical gear to rotate, thereby realizing the movement of the sliding plate and the positioning plate, simplifying the installation and disassembly process of the heat dissipation equipment.
It improves the ease of disassembly and maintenance of the heat dissipation device, extends the service life of the cooling fan, reduces maintenance costs, and enhances the stability and reliability of heat dissipation.
Smart Images

Figure CN224417251U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of computer technology, and specifically to a heat dissipation structure for a computer system. Background Technology
[0002] Heat generation in electromechanical equipment is a major factor contributing to equipment damage or performance degradation. The ability of the equipment itself to transfer heat to the environment is a fundamental capability in the design of electromechanical products. Current heat dissipation methods are mostly convection cooling, which uses cooling fans to force airflow to achieve heat dissipation.
[0003] However, this cooling method has obvious drawbacks: the fan has a short lifespan and poor reliability. High-power computers that are used for a long time often malfunction due to excessive temperature caused by fan failure, which increases maintenance cycle and cost.
[0004] Furthermore, since existing heat dissipation structures and computers are fixed with bolts, this positioning method is cumbersome and inconvenient for later disassembly, maintenance, and repair. Therefore, we propose a heat dissipation structure for computer systems. Utility Model Content
[0005] This invention provides a heat dissipation structure for a computer system that solves the problems mentioned in the background section.
[0006] To solve the above-mentioned technical problems, the technical solution of this utility model is as follows:
[0007] An embodiment of this utility model provides a heat dissipation structure for a computer system, comprising:
[0008] Chassis body;
[0009] The assembly cover is located at the top of the chassis body to support the heat dissipation device;
[0010] A heat dissipation device is located on top of the assembly cover to dissipate heat from the inside of the chassis.
[0011] The disassembly and assembly device is located on the outer surface of the chassis body, enabling the disassembly and maintenance of the heat dissipation device.
[0012] Furthermore, the heat dissipation device includes an assembly base, which is bolted to the lower surface of the assembly cover. The lower surface of the assembly base has a mounting groove, and the interior of the mounting groove houses the main body of the cooling fan. The lower surface of the chassis body has evenly distributed ventilation holes.
[0013] The above technical solution uses an assembly cover to bolt the assembly base together, and a mounting slot is used to store and install the cooling fan body. This allows the cooling device to be separated from the chassis body, making it easier to disassemble and maintain.
[0014] Furthermore, the assembly base is movably installed with the main body of the chassis, and a support base is fixedly installed on the lower surface of the main body of the chassis.
[0015] The above technical solution raises the main body of the chassis by setting up a support base, allowing the main body of the chassis to be placed off the ground, thereby preventing moisture from returning to the inside of the chassis and facilitating ventilation and heat dissipation.
[0016] Furthermore, the assembly base is equipped with a separate energy storage plate inside.
[0017] The above technical solution allows for easy disassembly of the assembly base and assembly cover via bolt installation, facilitating the replacement and charging of the individual energy storage board inside the assembly base. Providing a separate power supply for the heat dissipation device ensures stable heat dissipation during operation.
[0018] Furthermore, the disassembly and assembly device includes a disassembly and assembly frame, which is movably mounted on the outer surface of the chassis body. A sliding plate is provided inside the disassembly and assembly frame, and a positioning plate is fixedly connected to the surface of the sliding plate. A threaded rod is threadedly installed at one end of the sliding plate, and a connecting rod is fixedly connected to one end of the threaded rod. A first helical gear is fixedly installed at one end of the connecting rod, and a second helical gear is provided on one side of the first helical gear. A positioning groove is provided on the outer surface of the chassis body, and limit grooves are provided on both sides of the assembly base.
[0019] The above technical solution allows the sliding plate and positioning plate to move via the threaded rod, enabling the positioning plate to enter the positioning groove and then the limiting groove, thereby completing the positioning of the assembly base. Compared with the existing bolt positioning, this method makes it easier to separate and install and disassemble the heat dissipation equipment, thus facilitating its maintenance.
[0020] Furthermore, a rotating column is fixedly connected to the center of the second helical gear, and a micro motor is fixedly installed on the outer surface of the assembly / disassembly frame, with the output end of the micro motor fixedly connected to the rotating column.
[0021] The above technical solution uses a micro motor to drive the rotating column and the second helical gear to rotate, which in turn drives the first helical gear, the connecting rod, and the threaded rod to rotate. This allows the threaded rod to move the sliding plate and the positioning plate.
[0022] Furthermore, the rotating column penetrates the outer shell of the disassembly frame, and the rotating column is rotatably installed with the disassembly frame. A support plate is fixedly installed on the outer surface of the main body of the chassis, and the disassembly frame is set on the upper surface of the support plate.
[0023] The above technical solution allows for convenient support of the disassembly and assembly frame via the provided support plate, thus facilitating the determination of the specific installation location of the disassembly and assembly frame.
[0024] Furthermore, the sliding plate is slidably installed with the disassembly frame, one end of the positioning plate extends into the interior of the positioning groove and is slidably installed with the disassembly frame, the main body of the chassis, and the assembly base, the first helical gear is meshed with the second helical gear, and the threaded rod is rotatably installed with the disassembly frame.
[0025] The above technical solution allows the positioning plate to move into the disassembly frame and then into the limiting groove, thereby enabling the positioning of the heat dissipation device. Reverse movement allows for the disassembly of the heat dissipation device.
[0026] The above-described solution of this utility model has at least the following beneficial effects:
[0027] 1. This utility model uses an assembly cover to bolt the assembly base together, and uses a mounting slot to store and install the cooling fan body. This allows the cooling device to be separated from the chassis body, making it easy to disassemble and maintain.
[0028] 2. This utility model uses a threaded rod to move the sliding plate and the positioning plate, allowing the positioning plate to enter the positioning groove and then the limiting groove, thereby completing the positioning of the assembly base. Compared with the existing bolt positioning, it is more convenient to separate and install and disassemble the heat dissipation equipment, thus facilitating its maintenance. Attached Figure Description
[0029] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0030] Figure 2 This is a utility model Figure 1 Activity diagram;
[0031] Figure 3 This is a sectional view of the assembly / disassembly frame of this utility model;
[0032] Figure 4 This is an enlarged view of Part A of this utility model.
[0033] Explanation of reference numerals in the attached figures:
[0034] 1. Chassis body; 2. Assembly cover; 3. Heat dissipation device; 301. Assembly base; 302. Cooling fan body; 303. Vent hole; 304. Mounting slot; 4. Support base; 5. Disassembly and assembly device; 501. Disassembly and assembly frame; 502. Sliding plate; 503. Positioning plate; 504. Threaded rod; 505. Connecting rod; 506. First helical gear; 507. Second helical gear; 508. Rotating column; 509. Micro motor; 510. Positioning slot; 511. Limiting slot; 6. Support plate. Detailed Implementation
[0035] Exemplary embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
[0036] like Figures 1 to 4 As shown, an embodiment of this utility model provides a heat dissipation structure for a computer system, including: a chassis body 1; an assembly cover 2, disposed on the upper end of the chassis body 1, to support a heat dissipation device 3; a heat dissipation device 3, disposed above the assembly cover 2, to dissipate heat from the inside of the chassis body 1; and a disassembly and assembly device 5, disposed on the outer surface of the chassis body 1, to disassemble and maintain the heat dissipation device 3.
[0037] like Figures 1 to 4 As shown, the heat dissipation device 3 includes an assembly base 301, which is bolted to the lower surface of the assembly cover 2. The lower surface of the assembly base 301 has a mounting groove 304, inside which a cooling fan body 302 is housed. The lower surface of the chassis body 1 has evenly distributed ventilation holes 303. The assembly base 301 is movably mounted to the chassis body 1, and a support base 4 is fixedly mounted to the lower surface of the chassis body 1. A separate energy storage plate is located inside the assembly base 301. The bolted installation of the assembly base 301 to the assembly cover 2 facilitates disassembly, allowing for easy replacement and charging of the individual energy storage plate inside the assembly base 301. Providing a separate power supply for the heat dissipation device 3 ensures stable heat dissipation during operation.
[0038] In this embodiment of the utility model, the assembly base 301 is bolted together by the assembly cover 2, and the cooling fan body 302 is stored and installed by the mounting groove 304. Thus, the heat dissipation device 3 can be separated from the chassis body 1, which facilitates its disassembly, assembly and maintenance.
[0039] like Figures 1 to 4As shown, the disassembly and assembly device 5 includes a disassembly and assembly frame 501, which is movably mounted on the outer surface of the chassis body 1. A sliding plate 502 is provided inside the disassembly and assembly frame 501. A positioning plate 503 is fixedly connected to the surface of the sliding plate 502, and a threaded rod 504 is threaded onto one end of the sliding plate 502. A connecting rod 505 is fixedly connected to one end of the threaded rod 504, and a first helical gear 506 is fixedly mounted onto one end of the connecting rod 505. A second helical gear 507 is provided on one side of the first helical gear 506. A positioning groove 510 is provided on the outer surface of the chassis body 1, and limit grooves 511 are provided on both sides of the assembly base 301. A rotating column 508 is fixedly connected to the center of the second helical gear 507. A micro motor 509 is fixedly mounted on the outer surface of the disassembly and assembly frame 501, and the output end of the micro motor 509 is fixedly connected to the rotating column 508. A rotating column 508 penetrates the outer shell of the disassembly frame 501, and the rotating column 508 is rotatably mounted with the disassembly frame 501. A support plate 6 is fixedly mounted on the outer surface of the chassis body 1, and the disassembly frame 501 is set on the upper surface of the support plate 6. A sliding plate 502 is slidably mounted with the disassembly frame 501. One end of a positioning plate 503 extends into the interior of the positioning groove 510 and is slidably mounted with the disassembly frame 501, the chassis body 1, and the assembly base 301. A first helical gear 506 and a second helical gear 507 are meshed and mounted. A threaded rod 504 is rotatably mounted with the disassembly frame 501. By moving the positioning plate 503 into the disassembly frame 501, and then from the disassembly frame 501 into the limiting groove, the positioning of the heat dissipation device 3 can be achieved. Reverse movement allows for the disassembly of the heat dissipation device 3.
[0040] In this embodiment of the utility model, the threaded rod 504 can drive the sliding plate 502 and the positioning plate 503 to move, so that the positioning plate 503 can enter the positioning groove 510 and then enter the limiting groove, thereby completing the positioning process of the assembly base 301. Compared with the existing bolt positioning, it is more convenient to separate and install and disassemble the heat dissipation equipment, thus facilitating its maintenance.
[0041] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.
Claims
1. A heat dissipation structure for a computer system, characterized in that, include: Chassis body (1); The assembly cover (2) is set at the upper end of the chassis body (1) to support the heat dissipation device (3); A heat dissipation device (3) is installed above the assembly cover (2) to dissipate heat inside the chassis body (1); The disassembly and assembly device (5) is set on the outer surface of the chassis body (1) to realize the disassembly and assembly of the heat dissipation device (3) for maintenance.
2. The heat dissipation structure of a computer system according to claim 1, characterized in that, The heat dissipation device (3) includes an assembly base (301), which is bolted to the lower surface of the assembly cover (2). The lower surface of the assembly base (301) is provided with an installation groove (304), and the interior of the installation groove (304) is provided with a cooling fan body (302). The lower surface of the chassis body (1) is provided with evenly distributed ventilation holes (303).
3. The heat dissipation structure of a computer system according to claim 2, characterized in that, The assembly base (301) is movably installed with the chassis body (1), and a support base (4) is fixedly installed on the lower surface of the chassis body (1).
4. The heat dissipation structure of a computer system according to claim 2, characterized in that, The assembly base (301) is equipped with a separate energy storage plate inside.
5. The heat dissipation structure of a computer system according to claim 2, characterized in that, The disassembly and assembly device (5) includes a disassembly and assembly frame (501), which is movably installed on the outer surface of the chassis body (1). A sliding plate (502) is provided inside the disassembly and assembly frame (501). A positioning plate (503) is fixedly connected to the surface of the sliding plate (502). A threaded rod (504) is threadedly installed at one end of the sliding plate (502). A connecting rod (505) is fixedly connected to one end of the threaded rod (504). A first helical gear (506) is fixedly installed at one end of the connecting rod (505). A second helical gear (507) is provided on one side of the first helical gear (506). A positioning groove (510) is opened on the outer surface of the chassis body (1). Limit grooves (511) are opened on both sides of the assembly base (301).
6. The heat dissipation structure of a computer system according to claim 5, characterized in that, A rotating column (508) is fixedly connected to the center of the second helical gear (507), and a micro motor (509) is fixedly installed on the outer surface of the disassembly frame (501). The output end of the micro motor (509) is fixedly connected to the rotating column (508).
7. The heat dissipation structure of a computer system according to claim 6, characterized in that, The rotating column (508) penetrates the outer shell of the disassembly frame (501), and the rotating column (508) and the disassembly frame (501) are rotatably installed. A support plate (6) is fixedly installed on the outer surface of the chassis body (1), and the disassembly frame (501) is set on the upper surface of the support plate (6).
8. The heat dissipation structure of a computer system according to claim 5, characterized in that, The sliding plate (502) is slidably installed with the disassembly frame (501), one end of the positioning plate (503) extends into the interior of the positioning groove (510) and is slidably installed with the disassembly frame (501), the chassis body (1), and the assembly base (301), the first helical gear (506) and the second helical gear (507) are meshed and installed, and the threaded rod (504) is rotatably installed with the disassembly frame (501).