Liquid cooling module for GPU

Abstract

The utility model relates to GPU heat dissipation technical field, GPU liquid cooling module passes through brand -new structure design and promotes heat dissipation efficiency and saves space, this efficient compact module includes: mounting panel and the GPU display card of setting on mounting panel, be connected with the GPU display card parallelly arranged GPU heat conduction plate on the mounting panel, be equipped with the GPU cold plate that inlayed groove is on the heat conduction plate, inlayed groove inlay has GPU cold plate. GPU cold plate is tightly fitted on the heat conduction plate through inlayed groove, and the upper surface of GPU cold plate and heat conduction plate is flush, and the overall volume is smaller, and the heat conduction plate carries out heat dissipation to the heating element of GPU display card, secondly as GPU cold plate mounting support, realize GPU cold plate fixed on the top of GPU display card, and the overall structure is compact and the volume space is smaller, and the heat dissipation performance is superior to traditional air cooling heat dissipation technology.

Description

Technical Field

[0001] This utility model relates to the field of GPU heat dissipation technology, specifically a GPU liquid cooling module. Background Technology

[0002] A graphics processing unit (GPU), also known as a graphics core, display chip, or visual processor, is a processor used for processing images and graphics calculations. It is widely used in personal computers, workstations, large-scale computing centers, and some mobile devices. GPUs generate heat during normal operation. If the GPU is not cooled effectively and promptly, it can cause computer lag or crashes, reduce the GPU's lifespan, and in severe cases, even burn out the GPU. Liquid cooling is a cooling method with higher efficiency than air cooling. Liquid cooling solutions can significantly reduce the PUE (Power Usage Effectiveness) of data centers, while effectively reducing noise, dust, and vibration. Liquid cooling uses a liquid cooling plate in direct contact with the chip. The coolant flows through channels inside the cold plate, absorbing the heat emitted by the chip. The coolant then flows to a cooling tower or heat exchanger and recirculates back to the cold plate. This process is repeated continuously, constantly removing heat from the heat-generating components.

[0003] To meet the high computational demands brought about by the iterative upgrades of GPU graphics card technology, heat dissipation performance has become a key bottleneck restricting its operating efficiency, and air cooling is insufficient to meet these demands. Based on this technical pain point, this application proposes a GPU liquid cooling module solution, aiming to overcome the limitations of traditional heat dissipation methods and provide efficient and stable heat dissipation for high-performance graphics cards. Utility Model Content

[0004] The purpose of this invention is to provide a GPU liquid cooling module that uses liquid cooling to efficiently cool the GPU, avoids the noise generated by air cooling, and has a smaller overall size, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a GPU liquid cooling module, comprising: a mounting plate and a GPU graphics card mounted on the mounting plate. A GPU heatsink plate, parallel to the GPU graphics card, is connected to the mounting plate. The heatsink plate has an embedded groove, in which a GPU cold plate is embedded. The GPU cold plate is tightly fitted to the heatsink plate via the embedded groove. This tight-fitting structure not only ensures a good heat conduction path but also eliminates the need for additional fixing components, simplifying the assembly process. To further reinforce the GPU cold plate, it can be pressed into the embedded groove of the heatsink plate by welding or locking. The upper surface of the GPU cold plate is flush with the heatsink plate, resulting in a small overall volume. The heatsink plate not only dissipates heat from the GPU graphics card's heat-generating components but also serves as a mounting bracket for the GPU cold plate, fixing it above the GPU graphics card. The overall structure is compact and occupies little space, while its heat dissipation performance is superior to traditional air-cooling technology.

[0006] Preferably, the upper surface of the GPU heat dissipation plate has a plurality of heat dissipation fins around the outer periphery of the embedded groove, and the lower surface of the GPU heat dissipation plate has a plurality of heat dissipation sheets.

[0007] Preferably, the GPU cold plate includes a cold plate body installed in an embedded slot, the cold plate body is provided with a liquid flow channel for the flow of liquid cooling medium, the upper surface of the cold plate body is provided with a cover plate, and one end of the lower surface of the cold plate body is provided with at least one bottom frame, and a heat shunt for absorbing heat from the GPU chip is provided in the bottom frame.

[0008] Preferably, the cold plate body includes a substrate, and a locking block is integrally formed on one end of the lower surface of the substrate, and the bottom frame is fixedly connected to the end of the lower surface of the substrate away from the locking block.

[0009] Preferably, the flow divider includes a heat absorber plate and multiple flow dividers, each set of flow dividers is disposed on one side of the heat absorber plate, and the multiple flow dividers are arranged at equal intervals, arranged in parallel, and each set of flow dividers is a heat sink.

[0010] Preferably, the liquid flow channel includes an inlet channel and an outlet channel formed on the upper surface of the substrate, and an inlet hole connected to the inlet channel is formed on one side of the card block, and an outlet hole connected to the outlet channel is formed on one side of the card block.

[0011] Preferably, the liquid flow channel further includes a separating tank and a merging tank. The separating tank is located at the end of the inlet channel away from the inlet hole, and the bottom frame is connected to the inlet channel through the separating tank. The merging tank is located at the end of the outlet channel away from the outlet hole, and the bottom frame is connected to the outlet channel through the merging tank.

[0012] Preferably, a unidirectional heat exchange chamber for liquid cooling medium to pass through is formed between the bottom frame, the heat absorber plate and the multi-component flow plate, and the heat absorber plate is positioned above the GPU chip of the GPU graphics card.

[0013] Preferably, the lower surface of the cover plate is provided with two sets of sealing gaskets, which are respectively positioned above the liquid inlet channel and the liquid outlet channel.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This invention primarily utilizes the cooperation between the GPU heat sink and the GPU cold plate. The shunt component increases the contact area with the GPU, allowing the liquid cooling medium to fully absorb the GPU's heat. The liquid flow channel ensures smooth circulation of the liquid cooling medium, efficiently removing heat. Highly efficient heat dissipation is achieved through indirect contact between the liquid cooling medium and the GPU. Compared to traditional air cooling solutions, liquid cooling can significantly reduce the energy consumption of data centers while effectively reducing noise, dust, vibration, and other issues. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present utility model;

[0017] Figure 2 This is a schematic diagram of the cold plate after the cover plate is removed in Embodiment 1 of this utility model;

[0018] Figure 3 This is a schematic diagram of the substrate structure in Embodiment 1 of this utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the cold plate body in Embodiment 1 of this utility model;

[0020] Figure 5 This is a schematic diagram of the substrate structure from another angle in Embodiment 1 of this utility model;

[0021] Figure 6 This is a schematic diagram of the flow divider structure in Embodiment 1 of this utility model;

[0022] Figure 7 This is a schematic diagram of the GPU heat dissipation plate structure in Embodiment 1 of this utility model;

[0023] Figure 8 This is a schematic diagram of the structure of Embodiment 2 of this utility model;

[0024] Figure 9 This is a schematic diagram of the structure of Embodiment 2 of this utility model from another angle;

[0025] Figure 10 This is a schematic diagram of the structure of Embodiment 3 of this utility model;

[0026] Figure 11 This is a schematic diagram of the explosion in Embodiment 3 of this utility model;

[0027] Figure 12 This is a schematic diagram of the GPU heat dissipation plate structure in Embodiment 3 of this utility model;

[0028] Figure 13 This is a schematic diagram of the cold plate body structure in Embodiment 3 of this utility model;

[0029] Figure 14 This is a schematic diagram of the GPU cold plate structure in Embodiment 3 of this utility model.

[0030] In the diagram: 1. Mounting plate; 2. GPU graphics card; 3. GPU heatsink; 31. Heat sink fins; 32. Heatsink plate; 4. Embedded groove; 41. Through hole; 5. GPU cold plate; 51. Cold plate body; 511. Base plate; 512. Card block; 513. Liquid inlet hole; 514. Liquid inlet channel; 515. Liquid distribution tank; 516. Merging tank; 517. Liquid outlet channel; 518. Liquid outlet hole; 52. Cover plate; 53. Sealing gasket; 54. Base frame; 55. Diverter; 551. Heat absorber plate; 552. Diverter plate. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Example 1

[0033] Please see Figure 1-7 This utility model provides a technical solution: a GPU liquid cooling module, comprising:

[0034] Mounting plate 1 and GPU graphics card 2 mounted on mounting plate 1. GPU heat dissipation plate 3 is connected to mounting plate 1 and is arranged parallel to GPU graphics card 2. GPU heat dissipation plate 3 absorbs the heat generated by the components on GPU graphics card 2. GPU heat dissipation plate 3 dissipates heat through heat dissipation fins on its surface and conducts heat to GPU cold plate 5 at the same time. GPU cold plate 5 mainly absorbs the heat generated by the GPU chip on GPU graphics card 2 and transfers the heat generated by heat sources (such as chips, power devices, etc.) to the coolant in GPU cold plate 5, thereby achieving efficient heat dissipation.

[0035] The upper surface of the GPU heat-conducting plate 3 has several heat dissipation fins 31 around the outer periphery of the embedded groove 4, and the lower surface of the GPU heat-conducting plate 3 has several heat-conducting sheets 32 protruding. The heat-conducting sheets 32, the heat dissipation fins 31 and the GPU heat-conducting plate 3 are integrally formed. The heat-conducting sheets 32 absorb the heat generated by the components on the GPU graphics card 2 and conduct it to the GPU cold plate 5. At the same time, the heat dissipation fins 31 dissipate heat simultaneously.

[0036] The GPU heat dissipation plate 3 has an embedded groove 4 for mounting the GPU cold plate 5. The GPU cold plate 5 is assembled through the embedded groove 4. The embedded groove 4 has a through hole 41. The shunt 55 of the GPU cold plate 5 passes through the through hole 41 and contacts the GPU chip located on the GPU graphics card 2 to achieve GPU chip cooling.

[0037] The GPU cold plate 5 includes a cold plate body 51 installed in the embedded groove 4. The cold plate body 51 is provided with a liquid flow channel for the flow of liquid cooling medium. A cover plate 52 is provided on the upper surface of the cold plate body 51. A bottom frame 54 is provided at one end of the lower surface of the cold plate body 51. A heat shunt 55 for absorbing heat from the GPU is provided in the bottom frame 54.

[0038] The flow divider 55 includes a heat absorber plate 551 and multiple flow dividers 552. The multiple flow dividers 552 are all disposed on one side of the heat absorber plate 551, and the multiple flow dividers 552 are arranged at equal intervals and in parallel. The multiple flow dividers 552 are all heat dissipation fins. The flow dividers 552 form a flow channel for the liquid, thereby increasing the heat exchange area and improving the heat dissipation effect on the GPU.

[0039] The cold plate body 51 includes a substrate 511. A locking block 512 is integrally formed on one end of the lower surface of the substrate 511. The bottom frame 54 is fixedly connected to the end of the lower surface of the substrate 511 away from the locking block 512. When the cold plate body 51 is embedded in the inner groove 4, the bottom frame 54 is embedded in the through hole, and the locking block 512 is just locked on the edge of the GPU heat conduction plate 3, which improves the assembly strength of the GPU heat conduction plate 3 and the GPU cold plate 5, thereby improving the service life.

[0040] The liquid flow channel includes an inlet channel 514 and an outlet channel 517 formed on the upper surface of the substrate 511. One side of the block 512 has an inlet hole 513 connected to the inlet channel 514, and one side of the block 512 has an outlet hole 518 connected to the outlet channel 517, thereby enabling the coolant in the GPU cold plate to flow to the cooling tower or heat exchanger for cooling and then flow back to the GPU cold plate.

[0041] The liquid flow channel also includes a distribution tank 515 and a confluence tank 516. The distribution tank 515 is located at the end of the inlet channel 514 away from the inlet hole 513. The bottom frame 54 is connected to the inlet channel 514 through the distribution tank 515. The confluence tank 516 is located at the end of the outlet channel 517 away from the outlet hole 518. The bottom frame 54 is connected to the outlet channel 517 through the confluence tank 516. Coolant is introduced into the distribution tank 515 through the inlet channel 514. The coolant is then diverted by the diverter 55 and the diverter plate 552 dissipates heat. The coolant that has absorbed heat is then discharged in a concentrated manner through the confluence tank 516, thus realizing the recycling of the coolant.

[0042] A unidirectional heat exchange chamber for liquid cooling medium is formed between the bottom frame 54, the heat absorber plate 551 and the multi-component flow plate 552. The heat absorber plate 551 is in close contact with the GPU chip surface of the GPU graphics card 2. The GPU chip is cooled down quickly through direct contact between the heat absorber plate 551 and the GPU chip.

[0043] The GPU cold plate 5 also includes a cover plate 52 mounted on the upper surface of the substrate 511. Two sets of sealing gaskets 53 are provided on the lower surface of the cover plate 52. The two sets of sealing gaskets 53 are respectively located above the liquid inlet channel 514 and the liquid outlet channel 517. The cover plate 52 can accelerate the heat dissipation effect of the coolant, thereby ensuring the heat absorption effect of the GPU. At the same time, the sealing gaskets 53 can prevent coolant leakage and ensure the safe operation of the GPU cold plate 5.

[0044] In use, the coolant is introduced into the substrate 511 through the inlet hole 513, and then enters the bottom frame 54 through the inlet channel 514 and the diversion channel. The coolant is diverted by the multi-component diversion plate 552 of the diversion component 55, so that the heat absorbed by the GPU chip by the heat exchange plate is dispersed to the diversion plate 552 and absorbed by the coolant. The coolant after absorbing heat enters the outlet channel 517 through the confluence channel 516, and flows to the cooling tower or heat exchanger through the outlet hole 518, and then recirculates back to the substrate 511, thereby improving the efficient heat dissipation of the GPU chip.

[0045] Example 2

[0046] Please see Figure 8-9 The difference between Embodiment 2 and Embodiment 1 is that the GPU graphics card 2 is provided with a fixing fastener 21 for fixing the GPU chip.

[0047] Example 3

[0048] Please see Figure 10-14The difference between Example 3 and Example 1 is that the GPU graphics card 2 has a dual GPU chip structure. To accommodate the dual GPU chips, the embedded slot 4 has two through holes 41, and the GPU cooling plate 5 has dual shunts 55 to dissipate heat from the two GPU chips respectively, ensuring heat dissipation effect. If the GPU graphics card 2 has multiple GPU chips, the embedded slot 4 has multiple through holes 41 according to the number of GPU chips, and the GPU cooling plate 5 is correspondingly equipped with multiple dual shunts 55 to cool the GPU chips respectively.

[0049] In summary, the number of bottom frames, shunts, and liquid inlet channels can be increased according to the number of GPUs, and the liquid inlet channels can connect multiple bottom frames in series to provide liquid cooling for different numbers of GPUs, thereby improving the heat dissipation efficiency of the GPUs.

[0050] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. GPU liquid cooling module, including: The mounting plate (1) and the GPU graphics card (2) mounted on the mounting plate (1) are characterized in that: a GPU heat-conducting plate (3) is connected to the mounting plate (1) and is arranged parallel to the GPU graphics card (2); an embedded groove (4) is provided on the heat-conducting plate (3); and a GPU cold plate (5) is embedded in the embedded groove (4). The upper surface of the GPU heat-conducting plate (3) is provided with several heat dissipation fins (31) around the outer periphery of the embedded groove (4), and the lower surface of the GPU heat-conducting plate (3) is provided with several heat-conducting sheets (32). The GPU cold plate (5) includes a cold plate body (51) installed in an embedded groove (4). The cold plate body (51) is provided with a liquid flow channel for the flow of liquid cooling medium. A cover plate (52) is provided on the upper surface of the cold plate body (51). At least one bottom frame (54) is provided at one end of the lower surface of the cold plate body (51). A heat shunt (55) for absorbing heat from the GPU chip is provided in the bottom frame (54). The cold plate body (51) includes a substrate (511), and a locking block (512) is integrally formed on one end of the lower surface of the substrate (511). The bottom frame (54) is fixedly connected to the end of the lower surface of the substrate (511) away from the locking block (512). The flow divider (55) includes a heat absorption plate (551) and multiple flow dividers (552). The multiple flow dividers (552) are all disposed on one side of the heat absorption plate (551), and the multiple flow dividers (552) are arranged at equal intervals and in parallel. The multiple flow dividers (552) are all heat sinks. The liquid flow channel includes an inlet channel (514) and an outlet channel (517) provided on the upper surface of the substrate (511). One side of the card block (512) is provided with an inlet hole (513) communicating with the inlet channel (514), and one side of the card block (512) is provided with an outlet hole (518) communicating with the outlet channel (517). The liquid flow channel further includes a separating tank (515) and a merging tank (516). The separating tank (515) is located at one end of the inlet channel (514) away from the inlet hole (513). The bottom frame (54) is connected to the inlet channel (514) through the separating tank (515). The merging tank (516) is located at one end of the outlet channel (517) away from the outlet hole (518). The bottom frame (54) is connected to the outlet channel (517) through the merging tank (516). A unidirectional heat exchange chamber for liquid cooling medium to pass through is formed between the bottom frame (54), the heat absorber plate (551) and the multi-component flow plate (552), and the heat absorber plate (551) is positioned above the GPU chip of the GPU graphics card (2).

2. The GPU liquid cooling module according to claim 1, characterized in that: The lower surface of the cover plate (52) is provided with two sets of sealing gaskets (53), which are respectively located above the liquid inlet channel (514) and the liquid outlet channel (517).

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