Lead structure of a capacitor and capacitor
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FOSHAN SHUNDE CHUANGGE ELECTRONIC IND CO LTD
- Filing Date
- 2025-07-07
- Publication Date
- 2026-06-26
AI Technical Summary
When the leads of existing capacitors are connected to the capacitor body, the effective contact area of the soldering is limited, which makes the solder joints prone to cracking and the leads to fall off. In addition, the conductive area is insufficient and the current carrying capacity is poor.
The design adopts a lead body with the connecting section extending circumferentially around the center of the lead section and surrounding the outer perimeter, forming a ring or polygonal contact surface, making multiple contacts with the capacitor end face, increasing the contact area and dispersing stress, and using copper material to ensure conductivity and connection strength.
It improves the connection strength between the lead and the capacitor, reduces the risk of detachment due to external forces, enhances the current carrying capacity of the current conduction path, and reduces heat loss and uneven current density.
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Figure CN224417639U_ABST