A bend-resistant double-sided circuit board

By introducing a carbon fiber frame and silicone buffer pad structure into the circuit board, combined with flexible conductive pillars and conductive adhesive, the stress concentration problem of traditional circuit boards during bending is solved, thereby improving the stability of circuit connections and heat dissipation performance.

CN224419004UActive Publication Date: 2026-06-26SANYUAN INTELLIGENT TECHNOLOGY (HUAIAN) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SANYUAN INTELLIGENT TECHNOLOGY (HUAIAN) CO LTD
Filing Date
2025-07-28
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Traditional double-sided circuit boards are prone to circuit breakage and solder joint detachment during frequent bending or twisting, affecting the reliability and lifespan of electronic devices. Existing flexible circuit boards have complex processes, high costs, and unstable signal transmission when double-sided layout is required.

Method used

It adopts a carbon fiber frame and silicone cushioning structure, with an internal cushioning layer and circuit layer. The circuit layer is connected by flexible conductive pillars and conductive adhesive. The copper foil circuit board through-holes are coated with a nano silver wire conductive coating, and a mesh heat dissipation channel is set to improve flexibility and heat dissipation performance.

Benefits of technology

It effectively buffers bending stress, ensures circuit connection stability, reduces production costs, and improves the circuit board's resistance to bending and heat dissipation performance.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224419004U_ABST
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Abstract

The utility model discloses a kind of bending-resistant double-sided circuit boards, it is related to circuit board technical field, including carbon fiber frame, the inside of carbon fiber frame is fixed with buffer layer, the two sides of buffer layer are provided with circuit layer, in the utility model, two circuit layers are electrically connected by flexible conductive glue and flexible conductive column, buffer layer effectively buffers bending stress, flexible conductive column and flexible conductive glue ensure the stability of circuit connection in the bending process, improve the bending-resistant number of times of circuit board, heat can be rapidly transferred to the two sides of silica gel buffer pad through heat dissipation channel in mesh distribution being provided at the two ends of silica gel buffer pad, and heat dissipation channel is filled with heat-conducting silica gel, again pass through heat dissipation plate to be transferred to circuit board outside, improve the heat dissipation performance of circuit board, the manufacturing process of this double-sided circuit board is relatively simple, without complex multilayer wiring and special packaging technology, reduce production cost.
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