Silicon wafer horizontal transfer mechanism

Abstract

The utility model relates to silicon wafer transmission technical field, concretely relates to a silicon wafer horizontal conveying mechanism. The mechanism includes frame and the conveying roller set on it, and the conveying roller is divided into the carrier roller below and the press roll above, is equipped with the support seat of installation carrier roller and the first mounting bracket of installation press roll on the frame, and the carrier roller is located between two press rolls. Every conveying roller is equipped with several conveying channels, and every conveying channel both sides are equipped with the guide limiting ring, and the lower side is equipped with several evenly distributed support rings, and the guide limiting ring diameter is longer than the support ring. The conveying roller includes the transmission gear of central shaft and end portion, and the support ring and guide limiting ring are all set on the central shaft, and the conveying channel inlet end below is equipped with the rectification mechanism. The mechanism is through the guide limiting ring transverse limiting, the stable support of support ring, cooperates the rectification mechanism, improves the silicon wafer transmission precision, stability and adaptability, reduces the damage rate, and is applicable to high-precision silicon wafer production.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer transmission technology, specifically to a silicon wafer horizontal transmission mechanism. Background Technology

[0002] In silicon wafer production and processing, the horizontal conveyor mechanism is a key piece of equipment for achieving continuous wafer transfer, but it has extremely high requirements for conveying accuracy, stability, and adaptability. Traditional silicon wafer conveyor mechanisms suffer from insufficient guiding and limiting, making it easy for wafers to shift laterally during transport due to vibration or positioning deviations, leading to edge damage or misalignment in subsequent processing. Inadequate support structures also contribute to problems; thin and fragile wafers are susceptible to bending deformation or even breakage due to uneven support, affecting product quality. Furthermore, poor adaptability to different wafer specifications and cumbersome replacement of guiding or supporting components hinder rapid switching to meet production needs. The lack of real-time correction functionality means that wafer shifts cannot be adjusted promptly, easily causing batch processing defects. These problems severely restrict the efficiency and accuracy of silicon wafer conveying, making it difficult to meet the demands of high-precision semiconductor manufacturing. Utility Model Content

[0003] Therefore, it is necessary to provide a silicon wafer horizontal transport mechanism to address the problems of existing technologies.

[0004] To solve the problems of the existing technology, the technical solution adopted by this utility model is as follows:

[0005] This utility model provides a horizontal silicon wafer conveying mechanism, including a frame and conveying rollers mounted thereon. The conveying rollers are divided into a lower support roller and an upper pressure roller. The frame is provided with a support seat for mounting the support roller and a first mounting bracket for mounting the pressure roller. The support roller is located between the two pressure rollers. Each conveying roller is provided with several conveying channels for conveying silicon wafers. Each conveying channel is provided with a guide limiting ring on both sides. Several evenly distributed support rings are provided below each conveying channel. The diameter of the guide limiting ring is greater than the diameter of the support ring. The conveying roller also includes a central shaft and a transmission gear mounted on the end of the central shaft. The support rings and guide limiting rings are both sleeved on the central shaft. A correction mechanism is also provided below the feed end of the conveying channel.

[0006] Preferably, a positioning collar is provided between the guide limiting rings of two adjacent conveying channels, and the two ends of the positioning collar abut against the side walls of the two guide limiting rings respectively. Plastic collars sleeved on the central shaft are provided between the two support rings and between the support rings and the guide limiting rings.

[0007] To address the issue of the guide positioning ring easily sliding along the central axis and causing positioning failure after long-term use, an annular positioning groove for positioning the guide positioning ring is provided on the central axis, and an annular positioning washer is provided on the inner wall of the guide positioning ring.

[0008] To reduce the possibility of damage caused by the edge of the silicon wafer colliding with the right-angle side of the guide ring during silicon wafer feeding, inclined guide surfaces are provided on both sides of the guide ring.

[0009] To address the issues of uncorrectable misalignment during silicon wafer transport and low efficiency of manual adjustments, the alignment mechanism includes a connecting frame, alignment rods, a second mounting frame, a vision detector, a mounting plate, a rotary drive, and a lifting device. The connecting frame is mounted on the machine frame. The alignment rods are vertically slidably positioned below the carrying rollers and directly below the transmission channel. Both the rotary drive and the lifting device are connected to the mounting plate. The second mounting frame is mounted above the machine frame. The vision detector is fixedly mounted on the second mounting frame, vertically downward, and directly above the transport channel. There are four alignment rods, each positioned at one of the four ends of the mounting plate.

[0010] Preferably, the rotary drive device includes a rotary driver and a rotary telescopic shaft. The rotary driver is fixedly mounted on the connecting frame, one end of the rotary telescopic shaft is fixedly connected to the center of the mounting plate, and the other end of the rotary telescopic shaft is fixedly connected to the output end of the rotary driver.

[0011] Preferably, the lifting device includes a linear driver, a lifting frame, and a spring. The linear driver is fixedly mounted on the connecting frame, and the horizontally positioned lifting frame is slidably positioned above the connecting frame. The output end of the linear driver is fixedly connected to the lifting frame, and the lifting frame is axially connected to the top end of the rotary telescopic shaft. The spring is sleeved on the rotary telescopic shaft, with one end of the spring fixedly connected to the frame and the other end connected to the top end of the rotary telescopic shaft.

[0012] To address the problem of long equipment downtime caused by cumbersome installation, maintenance, and replacement processes for conveyor rollers, both the first mounting frame and the support base are equipped with upward-opening mounting slots. Bearing seats are slidably installed in the mounting slots, and the ends of the conveyor rollers are rotatably connected to the bearing seats.

[0013] The advantages of this utility model compared to the prior art are:

[0014] 1. The conveyor rollers, in conjunction with the support rollers and pressure rollers, form a clamping and conveying mechanism. Guide rings (with a diameter greater than the support rings) on both sides of each conveyor channel provide precise lateral positioning. The silicon wafer rests on the support rings, moving along the guide rings with its sides in contact with them, thus preventing wafer misalignment. Evenly distributed support rings below provide stable support, preventing the silicon wafer from bending under its own weight. The inclined guide surfaces of the guide rings facilitate a smooth transition during wafer feeding, reducing the risk of edge impacts and effectively protecting the integrity of the silicon wafer.

[0015] 2. The positioning collar and plastic collar ensure stable spacing between adjacent guide limit rings and between support rings. The annular positioning groove cooperates with the annular limiting washer to achieve precise positioning of the guide limit rings and prevent loosening or displacement. This structure can be quickly adapted to silicon wafers of different sizes by replacing positioning collars or guide limit rings with different spacings, improving the equipment's versatility.

[0016] 3. The alignment mechanism monitors the silicon wafer position in real time using a visual detector. When a misalignment is detected, the lifting device drives the alignment rod to lift the silicon wafer, and the rotation drive device rotates the mounting plate and alignment rod to adjust the angle, achieving precise alignment. The four sets of alignment rods work together to ensure uniform force on the silicon wafer, a stable and damage-free alignment process, and effectively avoid subsequent processing defects caused by misalignment. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of a horizontal silicon wafer conveying mechanism;

[0018] Figure 2 This is a front view of a horizontal silicon wafer transport mechanism;

[0019] Figure 3 This is a top view of a horizontal silicon wafer transport mechanism;

[0020] Figure 4 This is a partial three-dimensional structural diagram of a horizontal silicon wafer conveying mechanism;

[0021] Figure 5 This is a three-dimensional exploded view of the conveyor rollers in a horizontal silicon wafer conveying mechanism;

[0022] Figure 6 This is a three-dimensional structural diagram of a correction mechanism in a horizontal silicon wafer conveying system.

[0023] The numbers on the map are:

[0024] 1. Frame; 2. Conveyor roller; 3. Support base; 4. First mounting bracket; 5. Guide limit ring; 6. Support ring; 7. Central shaft; 8. Transmission gear; 9. Correction mechanism; 10. Positioning collar; 11. Plastic collar; 12. Annular positioning groove; 13. Annular limit washer; 14. Inclined guide surface; 15. Connecting bracket; 16. Correction rod; 17. Second mounting bracket; 18. Vision detector; 19. Mounting plate; 20. Rotary actuator; 21. Rotary telescopic shaft; 22. Linear actuator; 23. Lifting frame; 24. Spring; 25. Mounting groove; 26. Bearing seat. Detailed Implementation

[0025] To further understand the features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments.

[0026] like Figures 1-6 The silicon wafer horizontal conveying mechanism shown includes a frame 1 and a conveying roller 2 mounted thereon. The conveying roller 2 is divided into a lower support roller and an upper pressure roller. The frame 1 is provided with a support seat 3 for mounting the support roller and a first mounting bracket 4 for mounting the pressure roller. The support roller is located between the two pressure rollers. Each conveying roller 2 is provided with several conveying channels for conveying silicon wafers. Each conveying channel is provided with a guide limiting ring 5 on both sides. Each conveying channel is provided with several evenly distributed support rings 6 below it. The diameter of the guide limiting ring 5 is greater than the diameter of the support ring 6. The conveying roller 2 also includes a central shaft 7 and a transmission gear 8 mounted on the end of the central shaft 7. The support rings 6 and the guide limiting rings 5 ​​are both sleeved on the central shaft 7. A correction mechanism 9 is also provided below the feed end of the conveying channel.

[0027] The mechanism uses a frame 1 as its basic support structure. The support rollers are located below, primarily responsible for bearing the weight of the silicon wafers and providing bottom support for horizontal wafer transport. Pressure rollers are installed above, working in conjunction with the support rollers to apply pressure to the silicon wafers, ensuring stability during transport by preventing them from bouncing due to vibration or other external forces. Each transport roller 2 has multiple transport channels, with guide rings 5 ​​on both sides of the channels acting like "tracks" to restrict lateral movement of the silicon wafers during transport, preventing collisions due to misalignment. Evenly distributed support rings 6 below the transport channels act like multiple small pillars, uniformly supporting the bottom of the silicon wafers and preventing bending deformation due to their own weight. The central shaft 7 of the transport roller 2 is connected to a transmission gear 8. When an external power source drives the transmission gear 8 to rotate, the central shaft 7 rotates synchronously, thereby rotating the entire transport roller 2 and achieving horizontal wafer transport. The correction mechanism 9, located below the feed end of the conveyor channel, functions as the silicon wafer approaches. By detecting the wafer's position, it determines if there is any misalignment and adjusts it promptly to ensure accurate entry. The cooperation between the support roller and the pressure roller achieves stable horizontal conveying of the silicon wafer, effectively reducing wafer jitter and improving conveying smoothness. The design of the guide ring 5 and support ring 6 protects the silicon wafer from both lateral limiting and bottom support, preventing misalignment and bending deformation, ensuring wafer integrity, and reducing the defect rate caused by improper conveying. The multi-conveyor channel configuration allows the mechanism to convey multiple silicon wafers simultaneously, significantly improving conveying efficiency and meeting the needs of large-scale production. The correction mechanism 9 ensures accurate wafer conveying, correcting wafer misalignment at the feed end, laying a solid foundation for subsequent conveying and processing stages, and improving the accuracy and reliability of the entire production process.

[0028] like Figure 5As shown, a positioning collar 10 is provided between the guide limiting rings 5 ​​of the two adjacent conveying channels. The two ends of the positioning collar 10 abut against the side walls of the two guide limiting rings 5 ​​respectively. Plastic collars 11 sleeved on the central shaft 7 are provided between the two support rings 6 and between the support ring 6 and the guide limiting ring 5.

[0029] Positioning collars 10 are installed between the guide limiting rings 5 ​​of adjacent conveying channels. Plastic collars 11 are fitted between the support rings 6 and between the support rings 6 and the guide limiting rings 5. The two ends of the positioning collars 10 tightly abut against the guide limiting rings 5, acting as a rigid connector to ensure that the distance between adjacent guide limiting rings 5 ​​remains constant, thereby ensuring that the width of each conveying channel remains consistent. The plastic collars 11 ensure that the distance between the support rings 6 and between the support rings 6 and the guide limiting rings 5 ​​remains stable. The positioning collars 10 ensure the stability of the conveying channel dimensions, enabling the mechanism to accurately adapt to silicon wafers of different specifications. During production, it is not necessary to frequently adjust the equipment structure to quickly switch between tasks producing silicon wafers of different sizes, greatly improving the versatility and production efficiency of the equipment.

[0030] To address the issue of the guide positioning ring 5 easily sliding along the central axis 7 and causing positioning failure after long-term use, an annular positioning groove 12 for positioning the guide positioning ring 5 is provided on the central axis 7, and an annular positioning washer 13 is provided on the inner wall of the guide positioning ring.

[0031] An annular positioning groove 12 is pre-cut on the central shaft 7. When the guide limiting ring 5 is installed, the annular limiting washer 13 on the inner wall of the guide limiting ring 5 fits precisely into the annular positioning groove 12. This fit creates a circumferential fixed constraint. When the conveyor roller 2 rotates, the annular limiting washer 13 and the annular positioning groove 12 are tightly engaged, restricting the guide limiting ring 5 from sliding along the axial direction of the central shaft 7, thereby ensuring that the guide limiting ring 5 always remains in the predetermined position. This ensures that the guide limiting ring 5 can continuously and stably limit the silicon wafer laterally, providing a reliable guarantee for the accurate transfer of the silicon wafer, further improving the accuracy and stability of silicon wafer transfer, and reducing the risk of abnormal silicon wafer transfer due to changes in the position of the guide limiting ring 5.

[0032] To reduce the possibility of damage caused by the edge of the silicon wafer colliding with the right-angle side of the guide ring 5 during silicon wafer feeding, inclined guide surfaces 14 are provided on both sides of the guide ring 5.

[0033] Inclined guide surfaces 14 are provided on both sides of the guide limiting ring 5. When the silicon wafer enters the conveying channel, the edge of the silicon wafer first contacts the inclined guide surface 14. Due to the slope of the inclined guide surface 14, the silicon wafer, under its own weight and the conveying force of the conveying roller 2, will gradually slide along the inclined guide surface 14 into the center of the conveying channel, instead of directly colliding rigidly with the right-angle side of the guide limiting ring 5. The inclined guide surface 14 makes the silicon wafer feeding process smoother, reduces the adverse effects caused by collisions, protects the integrity of the silicon wafer, and improves the product yield. At the same time, the smooth feeding process also helps to improve the conveying efficiency and reduce equipment jamming caused by poor feeding.

[0034] like Figure 3 and Figure 6 As shown, in order to solve the problems of non-real-time correction of offset during silicon wafer transfer and low efficiency of manual adjustment, the offset correction mechanism 9 includes a connecting frame 15, an offset correction rod 16, a second mounting frame 17, a vision detector 18, a mounting plate 19, a rotary drive device, and a lifting device. The connecting frame 15 is mounted on the frame 1. The offset correction rod 16 is vertically slidably disposed below the bearing roller and located directly below the transmission channel. The rotary drive device and the lifting device are both connected to the mounting plate 19. The second mounting frame 17 is mounted above the frame 1. The vision detector 18 is fixedly mounted on the second mounting frame 17. The vision detector 18 is vertically downward and located directly above the transfer channel. There are four offset correction rods 16, which are respectively disposed at the four ends of the mounting plate 19.

[0035] When the vision detector 18 detects a misalignment in the silicon wafer, it transmits the position deviation information to the control system. Upon receiving the information, the control system activates the lifting device. The linear actuator 22 in the lifting device pushes the lifting frame 23 upward. The lifting frame 23 is pivotally connected to the top of the rotary telescopic shaft 21, thereby causing the rotary telescopic shaft 21 and the mounting plate 19 mounted on top of it to rise. The mounting plate 19 has four correction rods 16 at its four ends. As the mounting plate 19 rises, the correction rods 16 also gradually rise until they lift the silicon wafer. Simultaneously, the rotary drive device starts operating. The rotary actuator 20 outputs torque, which drives the mounting plate 19 to rotate via the rotary telescopic shaft 21. The rotation of the mounting plate 19 causes the four correction rods 16 to rotate synchronously, adjusting the angle of the silicon wafer. Once the silicon wafer is in the correct position, the lifting device reverses its direction. The linear actuator 22 retracts, and under the tension of the spring 24, the rotary telescopic shaft 21 and the mounting plate 19 descend. The correction rods 16 fall back, and the silicon wafer returns to the conveyor channel for continued transport. Adjusting the silicon wafer angle ensures uniform force distribution, preventing deformation caused by excessive localized stress. This automatic alignment function effectively ensures the positional accuracy of the silicon wafer during transport, reduces subsequent processing defects caused by wafer misalignment, improves product quality and production efficiency, and lowers the scrap rate.

[0036] The rotary drive device includes a rotary driver 20 and a rotary telescopic shaft 21. The rotary driver 20 is fixedly mounted on the connecting frame 15. One end of the rotary telescopic shaft 21 is fixedly connected to the center of the mounting plate 19, and the other end of the rotary telescopic shaft 21 is fixedly connected to the output end of the rotary driver 20.

[0037] When the rotary drive device is working, the rotary driver 20 starts, and the torque output by the rotary driver 20 is transmitted to the mounting plate 19 through the rotary telescopic shaft 21, causing the mounting plate 19 to rotate around its central axis 7. When the lifting device is working, the rotary telescopic shaft 21 can extend and retract synchronously with the rise or fall of the mounting plate 19, ensuring stable transmission of rotational power at different heights.

[0038] The lifting device includes a linear driver 22, a lifting frame 23, and a spring 24. The linear driver 22 is fixedly mounted on the connecting frame 15. The horizontally arranged lifting frame 23 is slidably arranged above the connecting frame 15. The output end of the linear driver 22 is fixedly connected to the lifting frame 23. The lifting frame 23 is axially connected to the top end of the rotary telescopic shaft 21. The spring 24 is sleeved on the rotary telescopic shaft 21. One end of the spring 24 is fixedly connected to the frame 1, and the other end is connected to the top end of the rotary telescopic shaft 21.

[0039] When the lifting device is in operation, the linear actuator 22 initiates the lifting frame 23 to slide horizontally above the connecting frame 15. As the lifting frame 23 rises, the rotary telescopic shaft 21 and the mounting plate 19 mounted on top of it are simultaneously lifted, causing the alignment rods 16 at the four ends of the mounting plate 19 to rise and lift the silicon wafer. After alignment is completed, the linear actuator 22 retracts, and the tension of the spring 24 pulls the rotary telescopic shaft 21 downward, which in turn causes the mounting plate 19 and the alignment rods 16 to fall back, returning the silicon wafer to the conveying channel.

[0040] like Figure 4 As shown, in order to solve the problem of long equipment downtime caused by the complicated installation, maintenance and replacement process of the conveyor roller 2, both the first mounting frame 4 and the support base 3 are provided with upward-opening mounting grooves 25. A bearing seat 26 is slidably installed in the mounting groove 25, and the end of the conveyor roller 2 is rotatably connected to the bearing seat 26.

[0041] Both the first mounting frame 4 and the support base 3 are provided with upward-opening mounting grooves 25, within which the bearing housing 26 can slide. When installing the conveyor roller 2, the bearing housing 26 is first slid into the mounting groove 25, and then the end of the conveyor roller 2 is rotatably connected to the bearing housing 26. When maintenance, replacement, or position adjustment of the conveyor roller 2 is required, simply slide the bearing housing 26 out along the mounting groove 25 for easy operation of the conveyor roller 2 without disassembling the entire first mounting frame 4 or support base 3. This open mounting groove 25 combined with the sliding bearing housing 26 design simplifies the installation, maintenance, and replacement process of the conveyor roller 2. During routine equipment maintenance or when different specifications of conveyor rollers 2 need to be replaced due to production needs, operations can be completed quickly, greatly reducing equipment downtime and improving equipment efficiency.

[0042] The above embodiments only illustrate one or more implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A silicon wafer horizontal transfer mechanism, characterized by, The machine includes a frame (1) and a conveyor roller (2) mounted thereon. The conveyor roller (2) is divided into a lower bearing roller and an upper pressure roller. The frame (1) is provided with a support seat (3) for mounting the bearing roller and a first mounting frame (4) for mounting the pressure roller. The bearing roller is located between the two pressure rollers. Each conveyor roller (2) is provided with several conveying channels for conveying silicon wafers. Each conveying channel is provided with a guide limiting ring (5) on both sides. Each conveying channel is provided with several evenly distributed support rings (6) below it. The diameter of the guide limiting ring (5) is greater than the diameter of the support ring (6). The conveyor roller (2) also includes a central shaft (7) and a transmission gear (8) mounted on the end of the central shaft (7). The support ring (6) and the guide limiting ring (5) are both sleeved on the central shaft (7). A correction mechanism (9) is also provided below the feed end of the conveying channel.

2. A silicon wafer horizontal transfer mechanism according to claim 1, wherein A positioning collar (10) is provided between the guide limiting rings (5) of two adjacent conveying channels. The two ends of the positioning collar (10) abut against the side walls of the two guide limiting rings (5) respectively. Plastic collars (11) are provided between the two support rings (6) and between the support ring (6) and the guide limiting ring (5) on the central shaft (7).

3. The silicon wafer horizontal conveying mechanism according to claim 1, characterized in that, An annular positioning groove (12) for positioning the guide positioning ring (5) is provided on the central shaft (7), and an annular limiting washer (13) is provided on the inner wall of the guide positioning ring.

4. A silicon wafer horizontal conveying mechanism according to claim 1, characterized in that, The guide limit ring (5) has inclined guide surfaces (14) on both sides of its sidewalls.

5. A silicon wafer horizontal conveying mechanism according to claim 1, characterized in that, The correction mechanism (9) includes a connecting frame (15), a correction rod (16), a second mounting frame (17), a vision detector (18), a mounting plate (19), a rotary drive device, and a lifting device. The connecting frame (15) is mounted on the frame (1). The correction rod (16) is vertically slidably positioned below the bearing roller and directly below the transmission channel. The rotary drive device and the lifting device are both connected to the mounting plate (19) for transmission. The second mounting frame (17) is mounted above the frame (1). The vision detector (18) is fixedly mounted on the second mounting frame (17). The vision detector (18) is vertically downward and directly above the transmission channel. There are four correction rods (16), which are respectively positioned at the four ends of the mounting plate (19).

6. A silicon wafer horizontal conveying mechanism according to claim 5, characterized in that, The rotary drive device includes a rotary driver (20) and a rotary telescopic shaft (21). The rotary driver (20) is fixedly mounted on the connecting frame (15). One end of the rotary telescopic shaft (21) is fixedly connected to the center of the mounting plate (19), and the other end of the rotary telescopic shaft (21) is fixedly connected to the output end of the rotary driver (20).

7. A silicon wafer horizontal conveying mechanism according to claim 6, characterized in that, The lifting device includes a linear driver (22), a lifting frame (23), and a spring (24). The linear driver (22) is fixedly installed on the connecting frame (15). The horizontally arranged lifting frame (23) is slidably arranged above the connecting frame (15). The output end of the linear driver (22) is fixedly connected to the lifting frame (23). The lifting frame (23) is axially connected to the top end of the rotary telescopic shaft (21). The spring (24) is sleeved on the rotary telescopic shaft (21). One end of the spring (24) is fixedly connected to the frame (1), and the other end is connected to the top end of the rotary telescopic shaft (21).

8. A silicon wafer horizontal conveying mechanism according to claim 1, characterized in that, The first mounting bracket (4) and the support base (3) are both provided with an upward-opening mounting groove (25). A bearing seat (26) is slidably installed in the mounting groove (25), and the end of the conveyor roller (2) is rotatably connected to the bearing seat (26).

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