Wafer edge trimming apparatus
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 宁波芯丰精密科技有限公司
- Filing Date
- 2025-05-14
- Publication Date
- 2026-06-26
Smart Images
Figure CN224419254U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a wafer trimming device. Background Technology
[0002] Wafer trimming is a key technology used in semiconductor manufacturing to process wafer edges. Its main purpose is to improve the quality of wafer edges, prevent debris and defects from affecting subsequent processes or equipment, and ensure the reliability of processes and products.
[0003] Current wafer trimming equipment has obvious efficiency bottlenecks in actual use. Each operating mechanism usually runs in sequence according to a fixed process, but due to the lack of multi-process parallel processing capability, some mechanisms are idle while waiting for other mechanisms to complete their operations, resulting in insufficient resource utilization and significantly reduced overall efficiency. Utility Model Content
[0004] The purpose of this invention is to provide a wafer trimming device to solve the problem in the existing wafer trimming device that allows multiple operating mechanisms to execute different processes in parallel during wafer processing, thereby improving wafer processing efficiency, reducing waiting time, and increasing the resource utilization rate of the equipment.
[0005] To achieve this objective, the present invention adopts the following technical solution:
[0006] Wafer trimming equipment, used for trimming wafers, including:
[0007] Workbench;
[0008] The cutting mechanism is movably mounted on the worktable;
[0009] A wafer stage is used to hold and hold the wafer. The wafer stage is movably disposed on the worktable to switch between a waiting station and a trimming station. The number of wafer stages is at least two, one of which can be moved to the trimming station so that the cutting mechanism can trim the wafer.
[0010] Optionally, the number of wafer stages is two, with one wafer stage in the trimming station and the other wafer stage in the waiting station.
[0011] Optionally, the wafer trimming equipment further includes a water tank for cleaning the wafer, the water tank being movably disposed on the worktable along the Y direction, both wafer carriers being movably disposed on the water tank along the Y direction, and the cutting mechanism being movably disposed on the worktable along the X direction, wherein the Y direction and the X direction are perpendicular to each other.
[0012] Optionally, the water tank includes:
[0013] The water tank body is movably disposed on the worktable along the Y direction, and both wafer carrier stages are movably disposed on the water tank body along the Y direction;
[0014] A suspended cleaning unit is suspended on the water tank body. The wafer stage can move and pass under the suspended cleaning unit. The suspended cleaning unit can spray water and air onto the wafer on the wafer stage.
[0015] Optionally, each of the wafer stages is capable of reciprocating along the Y direction, and the cutting mechanism includes two cutting wheels. When one of the wafer stages moves to the trimming station, both cutting wheels can simultaneously trim the wafer located on the wafer stage.
[0016] Optionally, the wafer trimming device may also include two wafer cassettes.
[0017] Optionally, the wafer trimming equipment further includes a first transport robot, a second transport robot, and a wafer buffer station disposed on the workbench. The first transport robot can transfer a wafer from one of the wafer cassettes to the wafer buffer station, and the wafer buffer station can adjust the wafer to a preset orientation. The second transport robot can transfer the wafer on the wafer buffer station to the wafer carrier located at the waiting station.
[0018] Optionally, the wafer trimming equipment further includes a third transport robot and a wafer cleaning mechanism disposed on the worktable. The third transport robot can transfer the wafer that has exited the wafer stage from the trimming station to the wafer cleaning mechanism, which is used to clean the trimmed wafer.
[0019] Optionally, the wafer cleaning mechanism includes:
[0020] A wafer backside cleaning mechanism is provided on the worktable and is capable of cleaning the backside of the wafer. The third transport robot is capable of transferring the wafer that has exited the wafer carrier on the trimming station to the wafer backside cleaning mechanism.
[0021] A wafer front cleaning mechanism is installed on the worktable and can clean the front side of the wafer. The wafer that has completed back side cleaning can be transferred to the wafer front cleaning mechanism.
[0022] Optionally, the wafer stage includes:
[0023] The supporting body is rotatably mounted on the worktable around its own axis;
[0024] The vacuum adsorption structure is recessed on the upper surface of the support body and arranged circumferentially along the support body.
[0025] Optionally, the cutting mechanism includes at least one cutting wheel;
[0026] The wafer trimming equipment also includes at least one inspection mechanism, and the inspection mechanism and the cutting wheel are respectively movably disposed on both sides of the worktable along the Y direction.
[0027] The beneficial effects of this utility model are:
[0028] The wafer trimming equipment proposed in this invention features at least two wafer carriers movably mounted on the worktable for carrying and holding wafers. These carriers can switch between a waiting station and a trimming station, allowing one carrier to perform trimming while the others remain in their non-trimming positions and continue receiving wafers. Once the wafer at the trimming station is processed, the remaining carriers can sequentially move to that station, reducing the waiting time of the cutting mechanism and improving wafer processing efficiency. This avoids the problem of multiple processes not being able to be processed in parallel in existing technologies, improving wafer processing efficiency and enhancing equipment resource utilization. Attached Figure Description
[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.
[0030] Figure 1 This is a schematic diagram of the wafer trimming device provided in Embodiment 1 of this utility model;
[0031] Figure 2 This is a schematic diagram of the wafer trimming device provided in Embodiment 1 of this utility model with some parts of the structure hidden;
[0032] Figure 3 yes Figure 2 A diagram from another perspective;
[0033] Figure 4 This is a schematic diagram of the cutting wheel trimming the wafer according to Embodiment 1 of this utility model;
[0034] Figure 5 This is a schematic diagram of the tool wheel and the wafer stage in the second embodiment of this utility model.
[0035] Figure 6This is a schematic diagram of the first form of the vacuum adsorption structure provided in Embodiment 2 of this utility model;
[0036] Figure 7 This is a schematic diagram of the second form of the vacuum adsorption structure provided in Embodiment 2 of this utility model;
[0037] Figure 8 This is a schematic diagram of the third form of the vacuum adsorption structure provided in Embodiment 2 of this utility model;
[0038] Figure 9 This is a schematic diagram of the fourth form of the vacuum adsorption structure provided in Embodiment 2 of this utility model;
[0039] Figure 10 This is a schematic diagram of the fifth form of the vacuum adsorption structure provided in Embodiment 2 of this utility model;
[0040] Figure 11 This is a schematic diagram of the sixth form of the vacuum adsorption structure provided in Embodiment 2 of this utility model;
[0041] Figure 12 This is a schematic diagram of the seventh form of the vacuum adsorption structure provided in Embodiment 2 of this utility model.
[0042] In the picture:
[0043] 100. Wafer;
[0044] 1. Workbench; 11. Wafer cleaning mechanism; 111. Wafer back side cleaning mechanism; 1111. Wafer back side cleaning workbench; 1112. Rotating component; 1113. Roller brush; 1114. Roller brush drive motor; 112. Wafer front side cleaning mechanism; 1121. Wafer front side cleaning workbench; 1122. Water shield; 1123. Turntable; 1124. Clamping column; 1125. Liquid nozzle; 1126. Rotary swing arm; 1127. Rotary swing arm drive shaft; 13. Wafer box; 14. Wafer box loading stage;
[0045] 2. Mounting frame; 21. Crossbeam; 22. Mounting column;
[0046] 3. Cutting mechanism; 31. First sliding plate; 32. Cutting wheel; 33. Spindle; 34. Second sliding plate; 341. First sliding plate drive motor; 342. First sliding plate drive screw; 351. Second sliding plate drive motor;
[0047] 41. Water tank; 42. Wafer stage; 421. Support body; 422. Vacuum adsorption structure; 4221. Vent; 423. Base; 43. Water tank drive mechanism; 431. Water tank drive motor; 432. Guide rail slider assembly; 44. Conveyor belt;
[0048] 51. First handling robot; 52. Second handling robot; 53. Third handling robot; 6. Wafer stage mounting plate; 8. Inspection mechanism; 81. Thickness measuring device; 82. Center deviation detection device; 83. Third sliding plate; 84. Fourth sliding plate; 851. Third sliding plate drive motor; 852. Third sliding plate drive screw; 861. Fourth sliding plate drive motor; 9. Wafer buffer stage; 91. Suction cup; 10. Notch detection device. Detailed Implementation
[0049] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0050] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0051] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0052] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0053] Example 1
[0054] See Figures 1-4This embodiment provides a wafer trimming device for trimming wafer 100.
[0055] Specifically, the wafer trimming equipment includes a worktable 1, a cutting mechanism 3, and a wafer stage 42, wherein the cutting mechanism 3 is movably mounted on the worktable 1. The wafer stage 42 is used to hold and hold the wafer 100, and the wafer stage 42 is movably mounted on the worktable 1 to switch between a waiting station and a trimming station. There are at least two wafer stages 42, one of which can be moved to the trimming station so that the cutting mechanism 3 can trim the wafer 100.
[0056] Optionally, each of the 42 wafer stages can reciprocate along the Y direction.
[0057] In the wafer trimming equipment provided in this embodiment, at least two wafer carriers 42 are movably arranged on the worktable 1 for carrying and adsorbing wafers 100. The at least two wafer carriers 42 can switch between the waiting station and the trimming station, so that while one wafer carrier 42 is performing trimming processing at the trimming station, the other wafer carriers 42 can be in a non-trimming station position and can continue to receive wafers 100 to be processed. When the wafer 100 located at the trimming station is processed, the other wafer carriers 42 can move to the trimming station in sequence, reducing the waiting time of the cutting mechanism 3 and improving the processing efficiency of the wafer 100.
[0058] Optionally, the cutting mechanism 3 includes at least one cutter wheel 32. Exemplarily, the number of cutter wheels 32 is one or two. Of course, in other embodiments, the number of cutter wheels 32 can also be set as needed, and no further restrictions are imposed here.
[0059] Specifically, see Figures 2-4 In this embodiment, each wafer stage 42 can reciprocate along the Y direction. The cutting mechanism 3 includes two cutting wheels 32. When one of the wafer stages 42 moves to the trimming station, the two cutting wheels 32 can simultaneously trim the wafer 100 located on the wafer stage 42, making the trimming process faster and improving the trimming efficiency.
[0060] The blade wheel 32 can rotate around its own axis to trim the wafer 100 on the wafer stage 42.
[0061] Optionally, the size of the cutting wheel 32 is not unique, so when trimming the wafer 100, cutting wheels 32 of different thicknesses can be selected and replaced as needed.
[0062] The cutting mechanism 3 also includes a first sliding plate 31, a main shaft 33, and a second sliding plate 34. The first sliding plate 31 is capable of reciprocating along the X direction, and the second sliding plate 34 is reciprocating along the Z direction and is mounted on the first sliding plate 31. The main shaft 33 extends along the X direction, and the cutter wheel 32 is mounted at one end of the main shaft 33.
[0063] Optionally, spindle 33 is an air spindle.
[0064] Specifically, a mounting frame 2 is provided on the workbench 1. The mounting frame 2 is a gantry frame, including two mounting columns 22 and a crossbeam 21. The two mounting columns 22 are vertically arranged on the workbench 1, and the two ends of the crossbeam 21 are fixedly connected to the upper ends of the two mounting columns 22 respectively. The first sliding plate 31 is reciprocating along the X direction on the crossbeam 21.
[0065] To enable the first sliding plate 31 to reciprocate along the X direction on the crossbeam 21, a first sliding plate driving mechanism is provided on the crossbeam 21. The first sliding plate driving mechanism includes a first sliding plate driving motor 341 and a first sliding plate driving screw 342. The first sliding plate driving motor 341 is fixedly mounted on the crossbeam 21, and the first sliding plate driving screw 342 extends along the X direction and is rotatably mounted on the crossbeam 21 around its own axis. The output shaft of the first sliding plate driving motor 341 is connected to the first sliding plate driving screw 342 to drive the first sliding plate driving screw 342 to rotate around its own axis. The first sliding plate 31 is threadedly connected to the first sliding plate driving screw 342 to form a screw-nut structure. When the first sliding plate driving motor 341 drives the first sliding plate driving screw 342 to rotate around its own axis, the first sliding plate 31 can reciprocate along the X direction.
[0066] Furthermore, in order to guide the reciprocating movement of the first sliding plate 31 along the X direction on the crossbeam 21, a slider is fixedly provided on the back of the first sliding plate 31, and a guide rail that slides and engages with the slider is provided on the crossbeam 21 along the X direction.
[0067] To enable the second sliding plate 34 to reciprocate along the Z direction, a second sliding plate driving mechanism is provided on the first sliding plate 31. The second sliding plate driving mechanism includes a second sliding plate driving motor 351 and a second sliding plate driving screw. The second sliding plate driving motor 351 is fixedly mounted on the first sliding plate 31. The second sliding plate driving screw extends along the Z direction and is rotatably mounted on the first sliding plate 31 around its own axis. The output shaft of the second sliding plate driving motor 351 is connected to the second sliding plate driving screw to drive the second sliding plate driving screw to rotate around its own axis. The second sliding plate 34 is threadedly connected to the second sliding plate driving screw to form a screw-nut structure. When the second sliding plate driving motor 351 drives the second sliding plate driving screw to rotate around its own axis, the second sliding plate 34 can reciprocate along the Z direction.
[0068] Specifically, see Figure 1 and Figure 2 In this embodiment, there are two wafer carriers 42. When one wafer carrier 42 is in the trimming station, the other wafer carrier 42 is in the waiting station.
[0069] For ease of description, the two wafer stages 42 are referred to as the first wafer stage and the second wafer stage, respectively. When the wafer trimming equipment is working, both wafer stages 42 are in the non-trimming position at the initial startup of the equipment. At this time, a wafer 100 to be trimmed is placed on the first wafer stage, and then the first wafer stage is controlled to move to the trimming position. During the trimming process of the wafer on the first wafer stage, another wafer 100 to be trimmed can be transferred to the second wafer stage. When the wafer 100 on the first wafer stage has completed trimming and exited the trimming position, the second wafer stage is controlled to immediately move to the trimming position. In this way, the waiting time of the cutting mechanism 3 can be reduced, the processing of the wafer 100 can be seamlessly connected, and the working efficiency of the wafer trimming equipment can be improved.
[0070] Specifically, each wafer stage 42 can reciprocate along the Y direction, and there are two cutting mechanisms 3, so that the wafer trimming equipment includes two cutting wheels 32. When one of the wafer stages 42 moves to the trimming station, the two cutting wheels 32 can simultaneously trim the wafer 100 located on the wafer stage 42.
[0071] Specifically, in this embodiment, in order to realize the reciprocating movement of the wafer stage 42 along the Y direction, the wafer trimming equipment also includes a wafer stage driving mechanism. The wafer stage driving mechanism is set on the worktable 1 and is set in a one-to-one correspondence with the wafer stage 42 to drive the wafer stage 42 to reciprocate along the Y direction.
[0072] Specifically, in this embodiment, the wafer stage driving mechanism includes a drive motor, transmission gears, and a conveyor belt 44. The drive motor is fixedly mounted on the worktable 1, the two transmission gears and the conveyor belt form a gear conveyor belt structure, the wafer stage 42 is fixedly mounted on the conveyor belt 44, and the output shaft of the drive motor is connected to one of the transmission gears.
[0073] Furthermore, in this embodiment, a wafer stage mounting plate 6 is fixedly mounted on the conveyor belt 44, and a wafer stage 42 is fixedly mounted on the wafer stage mounting plate 6. The wafer stage mounting plate 6 is equipped with a cutter wheel diameter detection element and a sample cutter.
[0074] Furthermore, in this embodiment, the wafer trimming equipment also includes at least one detection mechanism 8, which is capable of performing thickness detection and center deviation detection on a wafer 100 on a wafer stage 42.
[0075] Specifically, the wafer stage 42 can be moved to the detection station, and the detection mechanism 8 detects the wafer 100 on the wafer stage 42 located at the detection station. After detecting that the wafer 100 is qualified, the wafer stage 42 is then controlled to move to the trimming station for trimming. Specifically, refer to Figure 2 , in this embodiment, the detection mechanism 8 includes a thickness measuring member 81 and a center deviation detecting member 82. That is, in this embodiment, the number of detection mechanisms 8 is two, and the two detection mechanisms 8 are respectively the thickness measuring member 81 and the center deviation detecting member 82. With such a setting, the thickness measuring member 81 and the center deviation detecting member 82 can move independently, so that the wafer trimming device can process wafers 100 of various sizes.
[0076] Both the thickness measuring member 81 and the center deviation detecting member 82 are movably arranged on the workbench 1. When the wafer stage 42 moves to the detection station, both the thickness measuring member 81 and the center deviation detecting member 82 can move above the wafer stage 42 located at the detection station.
[0077] Specifically, the thickness measuring member 81 can obtain the thickness of the wafer on the wafer stage 42, and the center deviation detecting member 82 can detect the center deviation of the wafer 100 on the wafer stage 42 to detect whether the placement position of the wafer 100 on the wafer stage 42 is accurate.
[0078] Optionally, the thickness measuring member 81 is a distance measuring sensor. When the distance measuring sensor moves to the distance measuring position, it can obtain the distance a between the front surface of the wafer 100 (i.e., the upper surface of the wafer 100) and the distance measuring sensor. The distance b between the distance measuring sensor located at the distance measuring position and the upper surface of the wafer stage 42 located at the detection position is stored in the controller of the wafer trimming device. The value obtained after subtracting a from b is the thickness of the wafer 100.
[0079] Optionally, the center deviation detecting member 82 includes a high-magnification camera and a low-magnification camera. The high-magnification camera and the low-magnification camera can accurately obtain the position of the wafer 100 on the wafer stage 42, and then determine whether the placement position of the wafer 100 meets the center deviation requirements.
[0080] Specifically, when the wafer 100 is trimmed and the wafer stage 42 carrying the wafer 100 exits the trimming station, the trimmed wafer 100 needs to be stored.
[0081] Specifically, in order to avoid interference between the thickness measuring member 81 and the center deviation detecting member 82 during the detection process, in this embodiment, the thickness measuring member 81 and the center deviation detecting member 82 move independently of each other.
[0082] Specifically, in order to realize the movement of the thickness measuring element 81 and the center deviation detection element 82, the detection mechanism 8 also includes a moving component, and each of the thickness measuring element 81 and the center deviation detection element 82 is provided with a corresponding moving component.
[0083] Specifically, the moving assembly includes a third sliding plate 83 and a fourth sliding plate 84. The third sliding plate 83 is movably mounted on the crossbeam 21 along the X direction, and the fourth sliding plate 84 is movably mounted on the third sliding plate 83 along the Z direction. The thickness measuring element 81 and the center deviation detection element 82 are respectively fixedly mounted on their respective fourth sliding plates 84.
[0084] Further, see Figure 2 To enable the third sliding plate 83 to reciprocate along the X-direction on the crossbeam 21, the moving assembly includes a third sliding plate drive motor 851 and a third sliding plate drive screw 852. The third sliding plate drive motor 851 is fixedly mounted on the crossbeam 21, and the third sliding plate drive screw 852 is rotatably mounted on the crossbeam 21 along its own axis in the X-direction. The third sliding plate 83 is threadedly connected to the third sliding plate drive screw 852 to form a screw-nut structure. When the third sliding plate drive screw 852 drives the third sliding plate drive screw 852 to rotate around its own axis, the third sliding plate 83 can move linearly along the third sliding plate drive screw 852.
[0085] Specifically, in order to guide the linear motion of the third sliding plate 83, a slider is fixedly provided on the back of the third sliding plate 83, and a guide rail that slides and engages with the slider is fixedly provided on the crossbeam 21.
[0086] To achieve the reciprocating movement of the fourth sliding plate 84 along the Z direction, the moving assembly includes a fourth sliding plate drive motor 861 and a fourth sliding plate drive screw. The fourth sliding plate drive motor 861 is fixedly mounted on the crossbeam 21, and the fourth sliding plate drive screw is rotatably mounted on the crossbeam 21 along its own axis in the X direction. The fourth sliding plate 84 is threadedly connected to the fourth sliding plate drive screw to form a screw-nut structure. When the fourth sliding plate drive screw drives the fourth sliding plate drive screw to rotate around its own axis, the fourth sliding plate 84 can perform linear motion along the fourth sliding plate drive screw.
[0087] It should be noted that the third slide plate drive motor 851 and the first slide plate drive motor 341 are located on opposite sides of the crossbeam 21.
[0088] Optionally, in some embodiments, the number of detection mechanisms 8 is one. For example, when there is only one detection mechanism 8, the thickness gauge 81 and the center deviation detector 82 are integrated into one detection module, and their movements are synchronized. It is understood that when there is only one detection mechanism 8, the measurement distance of the detection mechanism 8 is constant and cannot be changed. This detection mechanism 8 can only detect wafers 100 of a fixed size, which means that the wafer trimming equipment can only process wafers 100 of a specified size. When the size of the wafer 100 to be processed changes, the detection mechanism 8 also needs to be modified accordingly.
[0089] More specifically, in this embodiment, the cutting mechanism 3 and the tool wheel 32 are respectively movably disposed on both sides of the worktable 1 along the Y direction.
[0090] Specifically, see Figure 1 and Figure 2 The detection mechanism 8 and the cutter wheel 32 are respectively movably mounted on both sides of the mounting frame 2 of the workbench 1 along the Y direction.
[0091] Specifically, the thickness gauge 81 and the center deviation detection element 82 are both movably mounted on one side of the mounting frame 2; the two cutting mechanisms 3 are both movably mounted on the other side of the mounting frame 2, so that the two cutting wheels 32 are also movably mounted on the other side of the mounting frame 2. With this arrangement, when the two cutting wheels 32 are performing edge trimming on one of the wafer stages 42, the thickness gauge 81 and the center deviation detection element 82 located on the other side can detect the other wafer 100 awaiting edge trimming, improving the processing efficiency of the wafer trimming equipment.
[0092] Specifically, during the process of the wafer stage 42 exiting the trimming station, the wafer 100 on the wafer stage 42 needs to undergo preliminary cleaning. To achieve this preliminary cleaning of the trimmed wafer 100, the wafer trimming equipment also includes a water tank 41 for cleaning the wafer 100. The water tank 41 is movably mounted on the worktable 1 along the Y-axis, and both wafer stages 42 are movably mounted on the water tank 41 along the Y-axis. The cutting mechanism 3 is movably mounted on the worktable 1 along the X-axis, with the Y and X directions perpendicular to each other. When the two wafer stages 42 move out of the trimming station along the Y-axis, the cutting mechanism 3 moves along the X-axis to avoid them, ensuring that the trimmed wafer 100 smoothly leaves the trimming area. During the movement of the wafer stage 42, the water tank 41 can perform preliminary cleaning of the wafer 100.
[0093] Specifically, the water tank 41 includes a water tank body and a suspended cleaning component. The water tank body is movably disposed on the workbench 1 along the Y direction, and two wafer stages 42 are movably disposed on the water tank body along the Y direction. The suspended cleaning component is suspended on the water tank body, and the wafer stages 42 can move through the underside of the suspended cleaning component. The suspended cleaning component can spray water and air onto the wafers on the wafer stages.
[0094] More specifically, the suspended cleaning components include a water curtain and an air curtain with selective switching, and the wafer stage 42 is movably disposed within the water tank 41. During the process of the wafer stage 42 retracting from the trimming station, the water curtain circulates water to clean the front side of the wafer 100, and the air curtain circulates air to dry the pre-cleaned front side of the wafer. Specifically, the wafer stage drive mechanism is disposed within the water tank 41.
[0095] Furthermore, in order to enable the wafer stage 42 to move a wider range along the Y direction, the water tank 41 can also reciprocate along the Y direction.
[0096] Specifically, to achieve the reciprocating movement of the water tank 41 along the Y direction, a water tank driving mechanism 43 is also provided on the worktable 1. Specifically, the water tank driving mechanism 43 includes a water tank driving motor 431 and a water tank driving screw. The water tank driving screw is connected along the Y direction and is drively connected to the output shaft of the water tank driving motor 431. The lower surface of the water tank 41 is threadedly connected to the water tank driving screw to form a screw-nut mechanism. When the water tank driving motor 431 drives the water tank driving screw to rotate around its own axis, the water tank 41 can reciprocate along the Y direction. Further, to ensure that the water tank 41 can reciprocate strictly along the Y direction, in this embodiment, the water tank driving mechanism 43 also includes a guide rail slider assembly 432. The guide rail slider assembly 432 includes a slidingly fitted guide rail and a slider. The guide rail extends along the Y direction, and a guide rail is fixedly provided on one of the lower surface of the water tank 41 and the worktable, while a slider is fixedly provided on the other.
[0097] Specifically, see Figure 1 In this embodiment, the wafer trimming equipment also includes wafer cassettes 13 for storing wafers 100. One wafer cassette 13 stores wafers 100 to be trimmed; the other wafer cassette 13 stores wafers 100 that have been trimmed. After the wafer 100 completes the front-side cleaning operation and spin-drying, the wafer 100 is transferred to the wafer cassette 13 used to store the trimmed wafers 100. Each wafer cassette 13 is provided with a wafer cassette loading stage 14.
[0098] Specifically, see Figure 1The wafer trimming equipment also includes a first transport robot 51, a second transport robot 52 and a wafer buffer stage 9 set on the workbench 1. The first transport robot 51 can transfer a wafer 100 in one of the wafer boxes 13 to the wafer buffer stage 9. The wafer buffer stage 9 can adjust the wafer 100 to a preset orientation. The second transport robot 52 can transfer the wafer 100 on the wafer buffer stage 9 to the wafer carrier stage 42 located at the waiting station.
[0099] Optionally, a rotary table is provided on the wafer cache stage 9, and a suction cup 91 is provided on the rotary table. A notch detection element 10 is provided on the worktable 1 next to the suction cup 91.
[0100] Before transferring the wafer to be trimmed from the wafer cassette 13 to the wafer stage 42, the position of the wafer 100 needs to be corrected. Specifically, the wafer 100 to be trimmed in the wafer cassette 13 is first transferred to the chuck 91 with the front side of the wafer 100 facing up and the back side of the wafer 100 being vacuum-adhered to the chuck 91. Then, the rotary table rotates the wafer 100, and when the notch detection device 10 detects a notch on the wafer 100, it controls the rotary table to stop rotating.
[0101] The first handling robot 51 can transfer a wafer 100 from one of the wafer cassettes 13 to the suction cup 91 of the wafer buffer stage 9. The number of second handling robots 52 is the same as the number of wafer stages 42, and the two are set in a one-to-one correspondence. The second handling robot 52 can transfer the wafer 100 on the suction cup 91 to its corresponding wafer stage 42.
[0102] Optionally, the notch detection component 10 can be a ranging sensor. When the ranging sensor detects that the distance between the edge of the wafer 100 and the ranging sensor has increased, it indicates that a notch in the wafer 100 has been detected.
[0103] Preferably, the wafer 100 needs to be cleaned before being stored after trimming. Therefore, in this embodiment, see... Figure 1 The wafer trimming equipment also includes a third transport robot 53 and a wafer cleaning mechanism 11 set on the workbench. The third transport robot 53 can transfer the wafer 100 that has exited the trimming station from the wafer stage 42 to the wafer cleaning mechanism 11. The wafer cleaning mechanism 11 is used to clean the trimmed wafer 100.
[0104] Specifically, the wafer cleaning mechanism 11 includes a back-side wafer cleaning mechanism 111 and a front-side wafer cleaning mechanism 112. The back-side wafer cleaning mechanism 111 is located on the worktable 1 and can clean the back side of the wafer 100. The third transport robot 53 can transfer the wafer 100 from the wafer carrier 42 that has exited the trimming station to the back-side wafer cleaning mechanism 111. The front-side wafer cleaning mechanism 112 is located on the worktable 1 and can clean the front side of the wafer 100. The wafer 100 that has completed back-side cleaning can be transferred to the front-side wafer cleaning mechanism 112.
[0105] Specifically, see Figure 1 In this embodiment, the wafer backside cleaning mechanism 111 includes a wafer backside cleaning worktable 1111. The wafer backside cleaning worktable 1111 has a wafer backside cleaning cavity with an open top. Multiple rotating members 1112 are arranged within the wafer backside cleaning cavity. Each rotating member 1112 can simultaneously carry a wafer 100 and drive the wafer 100 to rotate around the Z-axis. A roller brush 1113 for cleaning the backside of the wafer is also provided on the wafer backside cleaning worktable 1111. The highest point of the roller brush 1113 is approximately flush with the upper surface of the rotating member 1112, so that when the rotating member 1112 carries the wafer 100, the roller brush 1113 contacts the backside of the wafer 100. The roller brush 1113 can rotate around its own axis to clean the backside of the wafer 100. Furthermore, the wafer backside cleaning mechanism 111 also includes a roller brush drive motor 1114, which is mounted on the wafer backside cleaning worktable 1111 and is connected to the roller brush 1113 to drive the roller brush 1113 to rotate around its own axis.
[0106] Specifically, see Figure 1 In this embodiment, the wafer front cleaning mechanism 112 includes a wafer front cleaning stage 1121, a water shield 1122, a turntable 1123, clamping posts 1124, liquid nozzles 1125, a rotating arm 1126, and a two-fluid nozzle. There are two liquid nozzles 1125, and at least three clamping posts 1124, which are evenly spaced along the circumferential edge of the turntable 1123. The water shield 1122 surrounds the turntable 1123 and is vertically and vertically mounted on the wafer front cleaning stage 1121. A rotating arm drive shaft 1127 is provided on the wafer front cleaning stage 1121. The rotating arm drive shaft 1127 extends along the Z direction and is rotatably mounted on the wafer front cleaning stage 1121. One end of the rotating arm 1126 is fixedly connected to the upper end of the rotating arm drive shaft 1127, and the two-fluid nozzle is located at the other end of the rotating arm 1126. The axis of turntable 1123 extends along the Z direction, and turntable 1123 can rotate around its own axis.
[0107] When the wafer front cleaning mechanism 112 is in operation, the wafer 100, after back-side cleaning, is placed on the clamping post 1124, which clamps the wafer 100. The wafer 100 remains in a back-side-down, front-side-up position. The turntable 1123 rotates the wafer 100 around its axis. The water shield 1122 rises until it covers the wafer 100, and two liquid nozzles 1125 spray liquid onto the front of the wafer 100 for rinsing. Simultaneously, the rotating arm drive shaft 1127 drives the rotating arm 1126 to rotate, thereby rotating the two-fluid nozzle mounted on the other end of the rotating arm 1126. The two-fluid nozzle sprays two fluids onto the front of the wafer 100 to rinse it. After cleaning, the two liquid nozzles 1125 and the two-fluid nozzle stop spraying fluid, and the turntable 1123 continues to rotate the wafer 100 around its axis to remove any remaining liquid.
[0108] Specifically, the third handling robot 53 can transfer the trimmed wafer 100 from the wafer stage 42 to the wafer back cleaning mechanism 111. After the wafer back cleaning mechanism 111 completes the cleaning of the back side of the wafer 100, the third handling robot 53 transfers the wafer 100 from the wafer back cleaning mechanism 111 to the wafer front cleaning mechanism 112. After the wafer front cleaning mechanism 112 completes the cleaning of the front side of the wafer 100, the first handling robot 51 transfers the wafer 100 into the wafer cassette 13 for storing the trimmed wafer 100.
[0109] For example, the working process of the wafer trimming device in this embodiment is described below: For ease of description, the two wafer stages 42 are referred to as the first wafer stage and the second wafer stage, respectively.
[0110] Step 1: The wafer cassette loading stage 14 corresponding to the wafer cassette 13 storing the wafer 100 to be trimmed (this wafer 100 is the first wafer) controls the wafer cassette 13 to open. The first handling robot 51 transfers the wafer 100 in the wafer cassette 13 to the suction cup 91, so that the front side of the wafer 100 is facing up and the back side is vacuum-adsorbed on the suction cup 91. The rotary table on the wafer buffer stage 9 drives the wafer 100 to rotate until the notch detection device 10 detects the notch on the wafer 100 and the rotary table stops rotating.
[0111] Step 2: The second handling robot 52 transports the wafer 100 from the suction cup 91 to the first wafer stage. The back side of the wafer 100 is vacuum-adhered to the first wafer stage. The first wafer stage moves the wafer 100 to the inspection station. Then, the thickness measuring device 81 and the center deviation detection device 82 are controlled to move to their respective working positions. The thickness measuring device 81 and the center deviation detection device 82 perform thickness detection and center deviation detection on the wafer 100, respectively, to determine whether the placement position and thickness of the wafer 100 are qualified. If both parameters are qualified, the next step is executed; otherwise, the wafer trimming equipment issues an alarm to remind the operator.
[0112] Step 3: The first wafer stage carrying wafer 100 moves to the trimming station. The two spindles 33 drive the two cutting wheels 32 to a suitable height above the edge of wafer 100 to trim the wafer 100. It should be noted that during the trimming process, the spindles 33 will make fine adjustments along the Z-axis and X-axis according to the data measured in the second step to ensure the dimensional accuracy of the depth and width of the grooves on the wafer 100 after trimming.
[0113] It should be noted that during the trimming process, steps one and two can be performed on the second wafer stage. The wafer 100 on the second wafer stage is referred to as the second wafer.
[0114] Step 4: After the edge trimming of wafer 100 is completed, the first wafer stage exits the trimming station. During the exit process, the water curtain of the suspended cleaning unit circulates water to clean the front side of wafer 100, and the air curtain of the suspended cleaning unit circulates air to dry the front side of the wafer after the initial cleaning.
[0115] It should be noted that after the first wafer stage exits the trimming station, the second wafer stage, which has completed the inspection, can move to the trimming station and perform the third step of the operation.
[0116] Step 5: The third handling robot 53 transfers the wafer 100, which has completed step 4, to the wafer back cleaning mechanism 111, where the wafer back cleaning mechanism 111 completes the cleaning of the back of the wafer 100.
[0117] It should be noted that while performing step five, steps one and two can be performed again on the first wafer stage. After the first wafer stage has completed steps one and two, step three can be performed. At this time, the wafer on the first wafer stage is the third wafer.
[0118] Step 6: The third transport robot 53 transfers the wafer 100, which has completed back-side cleaning, to the wafer front-side cleaning mechanism 112, where the wafer front-side cleaning mechanism 112 completes the cleaning of the front side of the wafer 100.
[0119] It should be noted that while performing step six, the second wafer can perform steps four and five; the third wafer can perform step three.
[0120] Step 7: The wafer 100 that has completed front cleaning is transferred by the first handling robot 51 to the wafer cassette 13 for storing the trimmed wafer 100.
[0121] That is, when the wafer trimming equipment provided in this embodiment trims the wafer 100, its execution sequence is not to trim the first wafer first and then start trimming the second wafer; instead, during the trimming of the first wafer, when the wafer stage 42 is idle, the wafer 100 to be trimmed is placed on the wafer stage 42, so as to reduce the idle time of the cutting mechanism 3 and improve the working efficiency of the wafer trimming equipment.
[0122] Example 2
[0123] See Figures 5 to 12 This embodiment provides a wafer trimming device. It further improves the wafer stage 42 of the wafer trimming device based on Embodiment 1.
[0124] Specifically, see Figure 5 The wafer stage 42 includes a support body 421 and a vacuum adsorption structure 422. The support body 421 is rotatably mounted on the worktable 1 about its own axis. The vacuum adsorption structure 422 is recessed into the upper surface of the support body 421 and is arranged circumferentially along the support body 421. The vacuum adsorption structure 422 is configured to vacuum adsorb the edge of the wafer 100. A cutting mechanism 3 is disposed on the worktable 1. The cutting mechanism 3 includes a cutting wheel 32, which is rotatable about its own axis to trim the edge of the wafer 100 on the wafer stage 42.
[0125] Optionally, the number of wafer stages 42 on the workbench 1 can be one, two, or more, depending on the needs, and no further restrictions are imposed here.
[0126] The size of the cutting wheel 32 is not unique, so when trimming the wafer 100, cutting wheels 32 of different thicknesses can be selected and replaced as needed.
[0127] In the wafer trimming equipment provided in this embodiment, when the wafer stage 42 carries the wafer 100, it places the wafer 100 on the upper surface of the support body 421. The vacuum adsorption structure 422 is connected to an external vacuum pump, which evacuates the vacuum adsorption structure 422, thereby vacuum adsorbing the wafer 100 onto the upper surface of the support body 421. Since the vacuum adsorption structure 422 is arranged along the circumference of the support body 421, it can vacuum adsorb the edge of the wafer 100, preventing the edge of the wafer 100 from curling when the thin blade is replaced with a thick blade during grinding. This avoids the need to adapt the wafer stage when changing blades, as is required in the prior art, and eliminates the need to readjust relevant parameters, thereby improving the processing efficiency of the wafer 100 and ensuring its processing quality.
[0128] Specifically, when designing the wafer stage 42, the shape of the through hole in the middle of the support body 421 can be designed to be as small as possible, so that the support body 421 can provide as much support as possible for the wafer 100 near the center. When the thick cutter wheel is replaced with a thin cutter wheel during the grinding process, although the local pressure on the wafer 100 increases when the thin cutter wheel acts on the wafer 100, the wafer 100 will not break at the position directly opposite the through hole because the support body 421 provides as much support as possible for the wafer 100 near the center.
[0129] For example, the thickness of the cutting wheel 32 includes 5mm and 3mm. When processing the wafer 100 using a 3mm thick cutting wheel 32, although the local pressure on the wafer 100 is relatively large when the cutting wheel 32 acts on the wafer 100, the support body 421 provides as much support as possible for the wafer 100 near the center, so the wafer 100 will not break at the position directly opposite the via. When the 3mm thick cutting wheel 32 is replaced with a 5mm thick cutting wheel 32, since the vacuum adsorption structure 422 is arranged along the circumference of the support body 421, the vacuum adsorption structure 422 can perform vacuum adsorption on the edge of the wafer 100. Therefore, although the cutting wheel 32 processes the wafer 100 thinner in this case, the edge of the wafer 100 will not curl.
[0130] It is understandable that the upper end of the vacuum adsorption structure 422 adsorbs the wafer 100, while the lower end is connected to an external vacuum pump.
[0131] Furthermore, the wafer stage 42 also includes a lifting mechanism (not shown in the figure), the output end of which is disposed in a through hole and can be lifted relative to the support body 421.
[0132] Specifically, see Figure 5The wafer stage 42 also includes a base 423, which is a hollow cylinder. The lifting mechanism includes a lifting drive and a lifting rod. The lifting drive is disposed within the hollow cylinder, and the lifting rod is the output end of the lifting mechanism. The lower end of the lifting rod is connected to the output end of the lifting drive, and the upper end of the lifting rod can be raised and lowered relative to the through hole of the supporting body 421. Optionally, the lifting drive can be a motor or a cylinder.
[0133] When the wafer stage 42 is carrying the wafer 100, the vacuum adsorption structure 422 is connected to an external vacuum pump. The vacuum pump evacuates the vacuum adsorption structure 422, thereby vacuum adsorbing the wafer 100 onto the upper surface of the carrier body 421. At this time, the lifting rod is at its lowest point, and the upper end of the lifting rod is not higher than the upper surface of the carrier body 421 to avoid the upper end of the lifting rod interfering with the placement of the wafer. Preferably, at this time, the upper end of the lifting rod is lower than the upper surface of the carrier body 421.
[0134] When the grinding and trimming of wafer 100 is completed and wafer 100 needs to be transferred away, the vacuum adsorption structure 422 releases the vacuum adsorption of wafer 100, and then controls the lifting rod to rise until the lifting rod lifts wafer 100 from the upper surface of the carrier body 421, so that there is a certain distance between wafer 100 and the upper surface of the carrier body 421, making it easier for the robot to pick up wafer 100.
[0135] Alternatively, in some embodiments, see Figures 6-8 The vacuum adsorption structure 422 has a continuous groove structure. The groove structure includes multiple sub-grooves connected sequentially along the circumference of the support body 421, and the sub-grooves are arc-shaped or sawtooth-shaped. The continuous groove structure of the vacuum adsorption structure 422 can form continuous adsorption points on the circumferential edge of the wafer 100, effectively preventing the edge of the wafer 100 from curling when the thin blade is replaced with a thick blade during grinding.
[0136] Alternatively, the vacuum adsorption structure 422 may be an annular groove. Or, the groove structure may include a plurality of sub-grooves connected sequentially along the circumference of the support body 421, the sub-grooves being arc-shaped or serrated.
[0137] The groove structure includes multiple sub-grooves connected sequentially along the circumference of the support body 421 to ensure that every part of the circumference of the edge of the wafer 100 has a vacuum adsorption point, thus fully preventing the edge of the wafer from curling.
[0138] The slots are arc-shaped or sawtooth-shaped. This design ensures that the adsorption points on the wafer edge are not always at the same distance from the center of the wafer 100. Some adsorption points are farther away from the center of the wafer 100, while others are closer to the center of the wafer 100. The adsorption points that are closer to the center of the wafer 100 can further prevent the edge of the wafer 100 from curling.
[0139] Optionally, see Figure 6 The groove structure includes multiple sub-grooves connected sequentially along the circumference of the supporting body 421, and the sub-grooves are arc-shaped. Further optionally, see... Figure 7 and Figure 8 The groove body is serrated, and the serrations are either straight or oblique.
[0140] It is understandable that when the vacuum adsorption structure 422 is a continuous groove structure, a connecting cavity is provided in the support body 421 that communicates with the lower end of the vacuum adsorption structure 422. The connecting cavity is a columnar cavity or an annular cavity. The upper end of the connecting cavity communicates with the lower end of the vacuum adsorption structure 422, and the lower end of the connecting cavity communicates with the vacuum pump.
[0141] Optionally, see Figures 9-12 In some embodiments, the vacuum adsorption structure 422 includes pores 4221, and the carrier body 421 is provided with an annular cavity communicating with the pores 4221. The annular cavity is configured to communicate with a vacuum pump.
[0142] The carrier body 421 has an annular cavity that communicates with the vent 4221. The annular cavity is configured to communicate with a vacuum pump. The vacuum pump evacuates the annular cavity, thereby creating a vacuum inside the vent 4221, which allows the wafer to be stably adsorbed onto the upper surface of the carrier body 421.
[0143] Furthermore, the vacuum adsorption structure 422 includes a plurality of pores 4221, which are arranged sequentially at intervals along the circumference of the supporting body 421. The lower end of each pore 4221 is connected to an annular cavity.
[0144] Multiple pores 4221 are arranged sequentially and spaced apart along the circumference of the carrier body 421, which can form multi-point adsorption on the wafer 100 along the circumference of the edge of the wafer 100, effectively preventing the edge of the wafer 100 from curling and affecting the processing quality of the wafer 100.
[0145] Optionally, see Figures 9-12 Along the circumference of the supporting body 421, multiple pores 4221 are distributed in a ring-shaped interval. Optionally, the shape of the pores 4221 is circular, elliptical, or polygonal.
[0146] For example, see Figure 9The vents 4221 are circular in shape, and multiple vents 4221 are distributed in a ring-like interval along the circumference of the support body 421. Optionally, in some embodiments, when the vents 4221 are circular, a side adsorption groove communicating with the vents 4221 is provided on the side of the support body 421 away from the center of the vents 4221. The side adsorption groove can provide better adsorption for the edge of the wafer 100, and effectively prevent the edge of the wafer 100 from curling due to being too thin.
[0147] For example, see Figure 10 The pores 4221 are rectangular in shape and are arranged in a ring-like pattern along the circumference of the support body 421. The length of the pores 4221 extends radially along the support body 421. This arrangement allows the end of the pore 4221 furthest from the center of the support body 421 to adhere to a position closer to the edge of the wafer 100, effectively preventing the edge of the wafer 100 from curling.
[0148] For example, see Figure 11 The pores 4221 are elliptical in shape and are arranged in a ring-like pattern along the circumference of the support body 421. The major axis of each pore 4221 extends radially along the support body 421. This arrangement allows the end of the pore 4221 furthest from the center of the support body 421 to adhere to a position closer to the edge of the wafer 100, effectively preventing the edge of the wafer 100 from curling.
[0149] Optionally, see Figure 12 Multiple vents 4221 are sequentially spaced along the circumference of the support body 421. Adjacent vents 4221 are radially offset along the circumference of the support body 421. This arrangement allows some vents 4221 to be positioned closer to the inner ring of the support body 421, while others are positioned closer to the outer ring. The sequential spacing of multiple vents 4221 along the circumference of the support body 421 enables multi-point adsorption of the wafer along the circumferential edge. Simultaneously, the vents 4221 positioned closer to the outer ring of the support body 421 can adsorb the wafer at a more peripheral position, effectively preventing edge curling.
[0150] Specifically, when the vacuum adsorption structure 422 includes multiple pores 4221, an annular cavity is provided inside the support body 421, which is connected to the lower end of each pore 4221. At the same time, a connecting cavity is also provided on the support body 421. The connecting cavity is columnar, with its upper end connected to the lower end of the annular cavity and its lower end connected to the vacuum pump. In this way, the vacuum pump can evacuate the pores 4221, thereby allowing the wafer to be stably adsorbed on the upper surface of the support body 421.
[0151] Further optionally, in some embodiments, a positioning annular flange is provided on the upper surface of the carrier body 421 along the circumference of the carrier body 421, and the inner side of the positioning annular flange can position the wafer placed on the carrier body 421.
[0152] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A wafer trimming device for trimming wafers (100), characterized in that, include: Workbench (1); The cutting mechanism (3) is movably mounted on the worktable (1); A wafer stage (42) is used to carry and hold the wafer (100). The wafer stage (42) is movably disposed on the worktable (1) to switch between a waiting station and a trimming station. There are at least two wafer stages (42), one of which can be moved to the trimming station so that the cutting mechanism (3) trims the wafer (100).
2. The wafer trimming equipment according to claim 1, characterized in that, The number of wafer stages (42) is two, with one wafer stage (42) in the trimming station and the other wafer stage (42) in the waiting station.
3. The wafer trimming equipment according to claim 2, characterized in that, The wafer trimming equipment also includes a water tank (41) for cleaning the wafer (100), the water tank (41) is movably disposed on the worktable (1) along the Y direction, two wafer carriers (42) are movably disposed on the water tank (41) along the Y direction, and the cutting mechanism (3) is movably disposed on the worktable (1) along the X direction, the Y direction and the X direction are perpendicular to each other.
4. The wafer trimming equipment according to claim 3, characterized in that, The water tank (41) includes: The water tank body is movably disposed on the worktable (1) along the Y direction, and both wafer carriers (42) are movably disposed on the water tank body along the Y direction; A suspended cleaning component is suspended on the water tank body. The wafer stage (42) can move through the underside of the suspended cleaning component. The suspended cleaning component can spray water and air onto the wafer (100) on the wafer stage (42).
5. The wafer trimming equipment according to claim 2, characterized in that, Each of the wafer stage (42) is capable of reciprocating along the Y direction. The cutting mechanism (3) includes two cutting wheels (32). When one of the wafer stages (42) moves to the trimming station, the two cutting wheels (32) can simultaneously trim the wafer (100) located on the wafer stage (42).
6. The wafer trimming equipment according to claim 1, characterized in that, The wafer trimming equipment also includes two wafer boxes (13).
7. The wafer trimming equipment according to claim 6, characterized in that, The wafer trimming equipment also includes a first transport robot (51), a second transport robot (52), and a wafer buffer station (9) disposed on the worktable (1). The first transport robot (51) can transfer a wafer (100) in one of the wafer boxes (13) to the wafer buffer station (9). The wafer buffer station (9) can adjust the wafer (100) to a preset orientation. The second transport robot (52) can transfer the wafer (100) on the wafer buffer station (9) to the wafer carrier (42) located at the waiting station.
8. The wafer trimming equipment according to claim 7, characterized in that, The wafer trimming equipment also includes a third transport robot (53) and a wafer cleaning mechanism (11) disposed on the worktable (1). The third transport robot (53) can transfer the wafer (100) that has exited the wafer stage (42) at the trimming station to the wafer cleaning mechanism (11). The wafer cleaning mechanism (11) is used to clean the trimmed wafer (100).
9. The wafer trimming equipment according to claim 8, characterized in that, The wafer cleaning mechanism (11) includes: The wafer backside cleaning mechanism (111) is set on the worktable (1) and can clean the backside of the wafer (100). The third handling robot (53) can transfer the wafer (100) that has exited the trimming station from the wafer carrier (42) to the wafer backside cleaning mechanism (111). A wafer front cleaning mechanism (112) is disposed on the worktable (1) and can clean the front side of the wafer (100). The wafer (100) after back side cleaning can be transferred to the wafer front cleaning mechanism (112).
10. The wafer trimming apparatus according to any one of claims 1-9, characterized in that, The wafer stage (42) includes: The supporting body (421) is rotatably mounted on the worktable (1) around its own axis; The vacuum adsorption structure (422) is recessed on the upper surface of the support body (421) and arranged circumferentially along the support body (421).
11. The wafer trimming apparatus according to any one of claims 1-9, characterized in that, The cutting mechanism (3) includes at least one cutting wheel (32); The wafer trimming equipment also includes at least one inspection mechanism (8), and the inspection mechanism (8) and the cutting wheel (32) are respectively movably arranged on both sides of the worktable (1) along the Y direction.